CN203800046U - Combined diver board type LED packaging device - Google Patents
Combined diver board type LED packaging device Download PDFInfo
- Publication number
- CN203800046U CN203800046U CN201420174630.6U CN201420174630U CN203800046U CN 203800046 U CN203800046 U CN 203800046U CN 201420174630 U CN201420174630 U CN 201420174630U CN 203800046 U CN203800046 U CN 203800046U
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- Prior art keywords
- packaging
- chip
- led
- drives
- led luminescence
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The utility model discloses a combined diver board type LED packaging device comprising a drive chip, LED light-emitting chips, a packaging substrate and packaging adhesive. The packaging substrate is provided with a drive chip and four groups of LED light-emitting chips correspondingly. The drive chip is installed at the central portion of the upper surface of the rectangular packaging substrate. The four groups of LED light-emitting chips are distributed on four corners of the upper surface of the packaging substrate. Each group of LED light-emitting chips comprises a red LED light-emitting chip, a green LED light-emitting chip and a blue LED light-emitting chip. The packaging adhesive covers the upper surface of the whole packaging device. After the packaging adhesive packaging process, an LED light-emitting device of which the pixel pitch is fixed is formed. The drive chip includes 12 drive output ports which can be adjusted independently, wherein the drive output ports are connected with the LED light-emitting chips in a one-to-one manner. The combined diver board type LED packaging device of the utility model is suitable for a high-resolution LED display screen, not only the traditional process difficulty can be reduced, and but also the cost can be reduced.
Description
Technical field
The utility model relates to LED packaging field, more specifically, relates to the LED packaging that a kind of lamp drives unification.
Background technology
LED display develops rapidly in recent years, from the open air demonstration of initial a little bigger distance, low definition, develops into present little spacing, the indoor high-end demonstration of ultra high-definition, and technical difficulty is constantly upgraded, and client is also more and more higher to the requirement of display performance.The general mode that adopts discrete LED lamp pearl device paster, drives chip scanning to drive of tradition high density LED display realizes, as illustrated in fig. 1 and 2, the LED luminescence chip of R, G, tri-kinds of colors of B is encapsulated on pcb board front, pcb board back side correspondence arranges anode and the ground interface electrode of three LED luminescence chips, but this mode exists the problems such as the external contact of LED lamp pearl (pin) is too much, wiring density is too high, process complexity is high, to producing the aspects such as yield, product quality and cost of manufacture, bring many difficulties and risk.Simultaneously, LED display unit is turntable driving at present, by an output channel, drive a plurality of LED luminescence chips, thereby be unfavorable for each LED chip consistency adjustment, industry is generally carried out pointwise correction by software mode at present, but this way will cause showing the sacrifice of GTG, the reduction of refreshing frequency, cannot realize optimization display effect.
Utility model content
The utility model is at least one defect (deficiency) overcoming described in above-mentioned prior art, provides a kind of encapsulation simpler, and the better lamp of display effect drives the LED packaging of unification.
For solving the problems of the technologies described above, the technical solution of the utility model is as follows:
A kind of lamp drives the LED packaging of unification, comprise and drive chip, LED luminescence chip, base plate for packaging and packing colloid, a corresponding driving chip and the 4 groups of LED luminescence chips installed on base plate for packaging, drive chip to be arranged on the central authorities of base plate for packaging upper surface, 4 groups of LED luminescence chips are distributed in four jiaos of base plate for packaging upper surface, every group of LED luminescence chip comprises three LED luminescence chips that form three kinds of color of light of red, green, blue, packing colloid covers the upper surface of whole packaging, after packing colloid encapsulation, forms the fixing LED luminescent device of pixel interval;
Wherein, described driving chip includes 12 independent adjustable driver output ports, and driver output port is connected with LED luminescence chip in the mode of 1 pair 1.
Compared with prior art, the beneficial effect of technical solutions of the utility model comprises:
(1) in the utility model, a LED packaging is that a driving chip and 4 groups of LED luminescence chips are encapsulated on base plate for packaging, drive chip layout in the central authorities of base plate for packaging, 4 groups of LED luminescence chips are distributed in four angles of base plate for packaging, being evenly distributed of chip is regular, the dot spacing of pixel-matrix is fixed, can avoid because of each LED luminescence chip group and the bonding wire reliability that drives chip distance to differ the to cause problem that differs, reduced the difficulty of Wiring technique, facilitated driving chip to be connected with LED luminescence chip bonding wire, and the length of bonding wire is even, improve reliability of technology, also be the preferred plan of considering to improve stock utilization simultaneously.
(2) with respect to 1 of traditional employing, drive 1 group of LED luminescence chip of chip drives, 1 of the present utility model drives the packaged type of 4 groups of LED luminescence chips of chip drives more to save cost and power consumption; With respect to one, drive 6 groups of LED luminescence chips of chip drives or more groups of LED luminescence chips, one of the present utility model drives 4 groups of LED luminescence chips of chip drives can guarantee each LED luminescence chip and drives the distance between chip to equate, when LED luminescence chip is installed on base plate for packaging with driving chip, be more prone to control the package position of each chip, and can overcome due to the problem that the different reliabilities that cause of distance are different, the distant technology difficulty that cause are high, easily occur bad or bad lamp.
(3) traditional LED packaging adopts turntable driving mode, an output channel drives a plurality of LED luminescence chips, be unfavorable for the luminous consistency adjustment of each LED luminescence chip, and one non-scanning type driving is driven in the utility model employing one, can realize little current/low voltage static drive.And the man-to-man type of drive of the utility model makes each LED luminescence chip all can regulate separately it luminous by corresponding driver output port, without sacrificing, show GTG, reduce refreshing frequency, thereby realize optimization, show.
Accompanying drawing explanation
Fig. 1 is the LED schematic diagram of conventional package.
Fig. 2 is the LED backplate distribution schematic diagram of conventional package.
The luminescence unit structural representation of Fig. 3 for making by formal dress technique (wired bonding).
The luminescence unit structural representation of Fig. 4 for making by reverse installation process (wireless bonding).
Fig. 5 is lamp pearl 1 backplate distribution schematic diagram.
Fig. 6 is the LED lamp pearl structure vertical view of embodiment 2.
Fig. 7 is the LED lamp pearl side structure schematic diagram of embodiment 2.
Fig. 8 is the LED lamp pearl structure vertical view of embodiment 3.
Fig. 9 is the LED lamp pearl side structure schematic diagram of embodiment 3.
Figure 10 is the LED lamp pearl structure vertical view of embodiment 4.
Figure 11 is the LED lamp pearl side structure schematic diagram of embodiment 4.
Wherein, the 1st, LED packaging (LED lamp pearl), the 2nd, red LED luminescence chip, the 3rd, green LED luminescence chip, the 4th, blue led luminescence chip, the 5th, drive chip (IC), the 6th, base plate for packaging, the 7th, electrode, the 8th, connecting line, the 9th, red LED luminescence chip anode, the 10th, green LED luminescence chip anode, the 11st, blue led luminescence chip anode, the 12nd, luma data interface electrode, the 13rd, GTG clock interface electrode, the 14th, PWM clock interface electrode, the 15th, data latch signal interface electrode, the 16th, luma data loop output interface electrode, the 17th, power interface electrode, the 18th, ground interface electrode (negative electrode), the 19th, isolation channel, the 20th, lattice gear, the 21st, lens.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
For better explanation the present embodiment, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing some known configurations and explanation thereof may to omit be understandable.
Below in conjunction with drawings and Examples, the technical solution of the utility model is described further.
Embodiment 1
As shown in Figures 3 and 5, a kind of lamp drives the LED packaging 1 of unification, comprise and drive chip 5, LED luminescence chip, base plate for packaging 6 and packing colloid, a corresponding driving chip 5 and the 4 groups of LED luminescence chips installed in encapsulation 6, drive chip 5 to be arranged on the central authorities of base plate for packaging 6 upper surfaces, 4 groups of LED luminescence chips are distributed in four jiaos of base plate for packaging 6 upper surfaces, every group of LED luminescence chip comprises that three formation are red, green, the LED luminescence chip of blue three-color light, one group of LED luminescence chip represents a rgb pixel, packing colloid covers the upper surface of whole LED packaging 1, after packing colloid encapsulation, form the fixing LED luminescent device of pixel interval, drive chip 5 to include 12 independent adjustable driver output ports, driver output port is connected with LED luminescence chip in the mode of 1 pair 1.
Be different from the traditional LED packaging shown in Fig. 1-2, the utility model drives chip 5 and 4 groups of LED luminescence chips to be integrated on a base plate for packaging 6 by one, drive chip 5 to be integrated into LED luminescence unit inner, can driving LED luminescence chip luminous, the method has been avoided lamp and has been driven the intensive difficulty of 5 wirings of chip, is more conducive to realize high-resolution.And encapsulation time drives chip 5 to be arranged in the central authorities of base plate for packaging 6,4 groups of LED luminescence chips are distributed in four angles of base plate for packaging 6, and being evenly distributed of chip is regular, make the wiring on base plate for packaging simpler, reduce the difficulty of packaging technology, also reduced cost.The utility model drives a LED luminescence chip to realize static demonstration by a driver output port simultaneously, display effect is better than using the display screen of traditional LED packaging, and man-to-man type of drive makes each LED luminescence chip all can by corresponding driver output port, regulate separately it luminous, without sacrificing, show GTG, reduce refreshing frequency, thereby realize optimization, show.
In specific implementation process, in every group of LED luminescence chip, three LED luminescence chips can be that R, G, tri-kinds of colour light emitting chips of B form, and can be also that 3 blue-light-emitting chips obtain three kinds of glow colors of RGB by Color Conversion material (as fluorescent material, quantum dot etc.).
In specific implementation process, drive chip 5 to adopt and customize driving chip, driving the output signal of each driver output port of chip 5 is current value or magnitude of voltage.For the ease of driving chip pins to each drive output port, in it, can be provided with a current regulator or voltage regulator, current regulator or voltage regulator regulate each output current value that drives defeated port or output voltage values, utilize current regulator or voltage regulator can realize the independence of each drive output port output current value or output voltage values adjustable, if current value adjustment scope can be 0-2mA.The proportional driving LED luminescence chip of drive output port output current or voltage group during work, can carry out stepping adjustment or finely tune with shelves current value or magnitude of voltage simultaneously, makes LED luminescence chip obtain good luminosity, colour consistency.Time period, to the power supply of LED luminescence chip, is realized static drive to drive output port entirely; The time of the driving chip 5 simultaneously using for the utility model increases and brings power consumption to increase problem, can adopt dormancy battery saving mode to solve, and can carry out time sharing power supply to LED luminescence chip, and part-time enters resting state, saves device power consumption.
In specific implementation process, the LED packaging of this specific embodiment is chip-shaped (CHIP) surface mount device (SMD), and CHIP type SMD device is applicable to little spacing high density LED display.By SMT technology, be processed into.Conventionally on a pcb board, make the matrix of said structure, then cut into single led packaging (LED lamp pearl).
In specific implementation process, the anode of each LED luminescence chip and negative electrode connected mode can be in the following way:
The anode of each LED luminescence chip is connected with driving chip 5 driver output ports, and the negative electrode of each LED luminescence chip is connected altogether with base plate for packaging 6.Or the negative electrode of each LED luminescence chip is connected with driving the driver output port of chip 5, the anode of each LED luminescence chip is connected common source with base plate for packaging 6.
In specific implementation process, driving chip 5 signal ports of the present embodiment are connected by formal dress technique (wired bonding) or reverse installation process (wireless bonding) with base plate for packaging 6 corresponding ports contacts, in like manner, LED luminescence chip group with drive between chip 5 be connected and LED luminescence chip and base plate for packaging between welding also can pass through formal dress technique (wired bonding) or reverse installation process (wireless bonding) realization.As shown in Figure 3 and Figure 4, specifically can select wherein a kind of mode to connect according to practical application, wherein use reverse installation process can save connecting line, thus the spacing of light emitting pixel and luminescence unit are done less, realize more high-resolution.
In specific implementation process, base plate for packaging 6 is printed circuit board (PCB), and its upper surface carrying drives chip 5 and LED luminescence chip, and provide the external electrical connection that drives chip 5 and LED luminescence chip, lower surface is provided with device bonding pad, and pad is connected with driving chip 5, for device provides external interface.
In specific implementation process, drive the driver output port on chip 5 preferably to adopt constant current output port, but be not limited to adopt constant current output port, also can adopt other forms of driver output port.External interface comprises accordingly: luma data interface electrode 12, GTG clock interface electrode 13, PWM clock interface electrode 14, data latch signal interface electrode 15, luma data loop output interface electrode 16, power interface electrode 17, ground interface electrode 18.Traditional LED packaging, its 4 pixels have 16 external interface electrodes, even if use chip directly placed (COB) technique, its 4 pixels also need 13 external interface electrodes, and LED packaging of the present utility model only has 7 external interface electrodes, greatly reduced difficult wiring, alleviated the technology difficulty of pcb board, also reduced cost, be more conducive to realize high-resolution and show.
In specific implementation process, packing colloid is transparent or semitransparent colloid, and packing colloid covers the upper surface of whole LED packaging, and it can be epoxide-resin glue body, silica gel colloid, silicones colloid etc., also Ke Yi Miserable enters melanin or dyestuff, improves the contrast of device.
The present embodiment is to drive R, G, the B luminescence chip 2,3,4 of chip 5 and four groups of three kinds of different colours to be fixed on pcb board; by formal dress technique (wired bonding) or reverse installation process (wireless bonding), will determine R, the G of driving chip 5 and three kind of different colours and make it form path, the electrode of BLED luminescence chip 2,3,4 is connected on pcb board, then with packing colloid, R, the G of the driving chip 5 on pcb board and three kind of different colours, BLED luminescence chip 2,3,4 are sealed and protected.When the driving chip 5 in this luminescence unit is powered and during the operation such as data-signal input, R, G, the BLED luminescence chip 2,3,4 that just can control its four groups of 12 different colours are luminous, drive each driver output port of chip 5 only to drive a LED luminescence chip, therefore can be by regulating the current value of corresponding driver output port to regulate the brightness of LED luminescence chip, without sacrificing, show GTG, reduce refreshing frequency, thereby realized the static state demonstration of better effects if.The LED display unit of conventional package, its 4 pixels have 16 external interface electrodes, even if use COB technique, its 4 pixels also need 13 external interface electrodes, and LED packaging of the present utility model only has 7 external interface electrodes, traditional LED luminescence chip and the difficult wiring that drives chip chamber have greatly been reduced, reduced the technology difficulty of pcb board, more being conducive to realize high-resolution shows, and 4 light emitting pixels are integrated in a LED lamp pearl, the method also can be saved material, raises the efficiency, and reduces costs.
Embodiment 2
Because contain four groups of R, G, tri-kinds of luminescence chips of B in embodiment 1 in LED lamp pearl, every group of luminescence chip spacing is compared with little and unobstructed and easily produce light and invade profit, and the packing colloid inside that can respectively organize between luminescence chip at LED lamp bead surface for this problem is provided with shelter.Particularly, as shown in Figures 6 and 7, can partly make that cross raceway groove 19 is kept apart four groups of luminescence chips and by raceway groove blacking at packing colloid, channel shape can be square or " V " shape etc., and manufacture method can directly be produced by revising the mould in Molding sealing adhesive process.The method solves light and invades profit problem, has increased the contrast of single pixel.
Other structures of the present embodiment are similar to embodiment 1, do not repeat them here.
Embodiment 3
Different from embodiment 1, for the light existing in embodiment 1, invade profit problem, the present embodiment is on the basis of embodiment 1, and the packing colloid inside between each group luminescence chip arranges shelter.During concrete making; as shown in FIG. 8 and 9; can be on LED lamp pearl not before sealing; on its surface, make lattice gear 20; then by packing colloid, device is protected; lattice gear 20 can be for compared with the opaque box dam plastic structure of thickness or participate in melanic colloid etc., and manufacture method can be used point gum machine that opaque colloid is directly drawn to lines on the device surface of not sealing and directly make offscale gear 20.
Other structures of the present embodiment are similar to embodiment 1, do not repeat them here.
Embodiment 4
On the basis of embodiment 1 or embodiment 2 or embodiment 3, in order to strengthen the display effect of the utility model device, the packing colloid of the present embodiment luminescence chip group bright dipping place is set to lens shape.Particularly, as shown in FIG. 10 and 11, make 4 corresponding lens 21 with it on can 4 pixels on LED lamp pearl 1, can be when sealing the disposable lens 21 of producing, only original Molding mould need to be modified.The method can strengthen the utility model LED lamp pearl uniformity of luminance, improves its lighting angle.
The structural similarity of other structures of the present embodiment and embodiment 1 or embodiment 2 or embodiment 3, does not repeat them here.
The corresponding same or analogous parts of same or analogous label;
In accompanying drawing, describe the term of position relationship only for exemplary illustration, can not be interpreted as the restriction to this patent;
Obviously, above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.All any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in the protection range of the utility model claim.
Claims (10)
1. a lamp drives the LED packaging of unification, comprise driving chip, LED luminescence chip, base plate for packaging and packing colloid, it is characterized in that, a corresponding driving chip and the 4 groups of LED luminescence chips installed on base plate for packaging, drive chip to be arranged on the central authorities of rectangle base plate for packaging upper surface, 4 groups of LED luminescence chips are distributed in four jiaos of base plate for packaging upper surface, every group of LED luminescence chip comprises that three formation are red, green, the LED luminescence chip of blue three-color light, packing colloid covers the upper surface of whole packaging, after packing colloid encapsulation, form the fixing LED luminescent device of pixel interval,
Described driving chip includes 12 independent adjustable driver output ports, and driver output port is connected with LED luminescence chip in the mode of 1 pair 1.
2. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, each packing colloid surface of organizing between luminescence chip offers opaque raceway groove.
3. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, each packing colloid inside of organizing between luminescence chip is provided with shelter.
4. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, the packing colloid of luminescence chip group bright dipping place is set to lens shape.
5. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, the output signal of each driver output port of described driving chip is current value or magnitude of voltage.
6. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, the anode of each LED luminescence chip is connected with driving chip drives output port, and the negative electrode of each LED luminescence chip is connected altogether with base plate for packaging; Or the negative electrode of each LED luminescence chip is connected with driving chip drives output port, and the anode of each LED luminescence chip is connected common source with base plate for packaging.
7. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, described base plate for packaging is printed circuit board (PCB), and the carrying of printed circuit board (PCB) upper surface drives chip and LED luminescence chip, and the external electrical connection that drives chip and LED luminescence chip is provided; Its lower surface is provided with device bonding pad, for device provides external interface.
8. lamp according to claim 7 drives the LED packaging of unification, it is characterized in that, described driver output port is constant current output port, and described external interface comprises luma data interface, GTG clock interface, PWM clock interface, data latch signal interface, luma data loop output interface, power interface and ground interface.
9. lamp according to claim 1 drives the LED packaging of unification, it is characterized in that, described LED packaging is chip-shaped surface mount device.
10. according to the lamp described in claim 1 to 9 any one, drive the LED packaging of unification, described driving chip signal port is connected by formal dress technique or reverse installation process with base plate for packaging corresponding ports contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420174630.6U CN203800046U (en) | 2014-04-11 | 2014-04-11 | Combined diver board type LED packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420174630.6U CN203800046U (en) | 2014-04-11 | 2014-04-11 | Combined diver board type LED packaging device |
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| CN203800046U true CN203800046U (en) | 2014-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420174630.6U Expired - Fee Related CN203800046U (en) | 2014-04-11 | 2014-04-11 | Combined diver board type LED packaging device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050240A (en) * | 2015-05-26 | 2015-11-11 | 复旦大学 | Integrated-type spectrum adjustment LED device |
| WO2017020300A1 (en) * | 2015-08-06 | 2017-02-09 | 林谊 | Led pixel point, light-emitting component, light-emitting panel and display screen |
| CN108140694A (en) * | 2015-10-05 | 2018-06-08 | 索尼半导体解决方案公司 | Light-emitting device |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| US10388638B2 (en) | 2015-07-09 | 2019-08-20 | Shuling Li | LED light-emitting assembly, LED light-emitting panel, and LED display screen |
| JP2019149547A (en) * | 2018-02-26 | 2019-09-05 | 山東晶泰星光電科技有限公司Ｓｈａｎｄｏｎｇ Ｐｒｏｓｐｅｒｏｕｓ Ｓｔａｒ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | RGB-LED package module and display thereof |
| CN110957312A (en) * | 2019-11-29 | 2020-04-03 | 深圳极光王科技股份有限公司 | Four-pin LED lamp bead with built-in chip and LED display module |
| CN112201670A (en) * | 2020-09-10 | 2021-01-08 | 汕头超声显示器技术有限公司 | LED display screen based on thin film circuit |
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- 2014-04-11 CN CN201420174630.6U patent/CN203800046U/en not_active Expired - Fee Related
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050240A (en) * | 2015-05-26 | 2015-11-11 | 复旦大学 | Integrated-type spectrum adjustment LED device |
| US10388638B2 (en) | 2015-07-09 | 2019-08-20 | Shuling Li | LED light-emitting assembly, LED light-emitting panel, and LED display screen |
| US10515581B2 (en) | 2015-08-06 | 2019-12-24 | Shuling Li | LED pixel, LED component, LED panel and LED display screen |
| WO2017020300A1 (en) * | 2015-08-06 | 2017-02-09 | 林谊 | Led pixel point, light-emitting component, light-emitting panel and display screen |
| CN107710424A (en) * | 2015-08-06 | 2018-02-16 | 林谊 | LED pixel point, luminescence component, luminescent panel and display screen |
| KR20180018712A (en) * | 2015-08-06 | 2018-02-21 | 이 린 | LED pixel point, light emitting member, luminescent panel and display screen |
| US20180261149A1 (en) * | 2015-08-06 | 2018-09-13 | Yi Lin | Led pixel,led component ,led panel and led display screen |
| KR102104126B1 (en) * | 2015-08-06 | 2020-04-23 | 이 린 | LED pixel point, light emitting member, light emitting panel and display screen |
| EP3333906A4 (en) * | 2015-08-06 | 2019-03-06 | Yi Lin | Led pixel point, light-emitting component, light-emitting panel and display screen |
| CN107710424B (en) * | 2015-08-06 | 2019-07-12 | 林谊 | LED pixel point, luminescence component, luminescent panel and display screen |
| CN108140694A (en) * | 2015-10-05 | 2018-06-08 | 索尼半导体解决方案公司 | Light-emitting device |
| US10840226B2 (en) | 2015-10-05 | 2020-11-17 | Sony Semiconductor Solutions Corporation | Light-emitting apparatus |
| JP2019149547A (en) * | 2018-02-26 | 2019-09-05 | 山東晶泰星光電科技有限公司Ｓｈａｎｄｏｎｇ Ｐｒｏｓｐｅｒｏｕｓ Ｓｔａｒ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | RGB-LED package module and display thereof |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN110957312A (en) * | 2019-11-29 | 2020-04-03 | 深圳极光王科技股份有限公司 | Four-pin LED lamp bead with built-in chip and LED display module |
| CN112201670A (en) * | 2020-09-10 | 2021-01-08 | 汕头超声显示器技术有限公司 | LED display screen based on thin film circuit |
| CN112201670B (en) * | 2020-09-10 | 2023-04-07 | 汕头超声显示器技术有限公司 | LED display screen based on thin film circuit |
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