CN203312292U - Miniaturized full-color surface mounting LED - Google Patents

Miniaturized full-color surface mounting LED Download PDF

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Publication number
CN203312292U
CN203312292U CN2013203394218U CN201320339421U CN203312292U CN 203312292 U CN203312292 U CN 203312292U CN 2013203394218 U CN2013203394218 U CN 2013203394218U CN 201320339421 U CN201320339421 U CN 201320339421U CN 203312292 U CN203312292 U CN 203312292U
Authority
CN
China
Prior art keywords
wafer
chips
resin
resin plate
color surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2013203394218U
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Chinese (zh)
Inventor
龚文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Jingtai Co ltd
Original Assignee
Shenzhen Jingtai Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Jingtai Optoelectronics Co Ltd filed Critical Shenzhen Jingtai Optoelectronics Co Ltd
Priority to CN2013203394218U priority Critical patent/CN203312292U/en
Application granted granted Critical
Publication of CN203312292U publication Critical patent/CN203312292U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

The utility model discloses a miniaturized full-color surface mounting LED which comprises black BT resin plates and light emitting chips which are fixed on the BT resin plate through chip adhesives of fixed chips. Gold wires are connected between the light emitting chips and the BT resin plate. Packaging adhesives for sealing and protection are packaged on the gold wires and the light emitting chips. A plurality of the black BT resin plates are combined to form a rectangular BT resin integral plate, the length of which is 1.0 millimeter and the width of which is 1.0 millimeter. The light emitting chips contain red light chips, green light chips or blue light chips which are arranged in a row. The miniaturized full-color surface mounting LED provided by the utility model has a simple structure. Through size microminiaturization, high definition of the LED can be provided, high contrast after production of a display screen is realized, and image fidelity is greatly raised.

Description

The full-color surface attaching type LED of a kind of miniaturization
Technical field
The utility model relates to LED manufacturing technology field, relates in particular to a kind of be used to the full-color surface attaching type LED of the miniaturization that high definition, high-contrast display screen are provided.
Background technology
LED (light-emitting diode) application is very extensive, full-color SMD (the surface attaching type provided due to prior art, Surface Mounted Devices), contrast, definition are not high, and the image fidelity degree is not high, can only be applied to the less demanding LED display of definition, LED size for the SMD technology is larger, and general corresponding image definition is lower, for the high definition LED display, pixel request is higher, just needs further to reduce the size of SMD LED.
The utility model content
The purpose of this utility model is for the deficiencies in the prior art, provides a kind of miniaturization full-color surface attaching type LED.
To achieve these goals; the technical scheme that the utility model provides is: the full-color surface attaching type LED of a kind of miniaturization; comprise that the crystal-bonding adhesive that black BT resin plate reaches by fixed wafer is fixed on the luminescent wafer on described BT resin plate; between described luminescent wafer and BT resin plate, be connected with gold thread; on described gold thread and luminescent wafer, be packaged with the packing colloid for seal protection; described a plurality of black BT resin plate is combined to form a rectangle BT resin integral slab; described rectangle BT resin integral slab length is 1.0 millimeters, 1.0 millimeters of width.
Described luminescent wafer comprises red wafer, green wafer or blue light wafer, and described red wafer, green wafer or blue light wafer are pressed the yi word pattern order and arranged.
Compared with prior art, the utility model is simple in structure, by realizing the size microminaturization, the high definition of LED can be provided, realize high-contrast after making display screen, three kinds of color wafers adopt yi word pattern die bond mode simultaneously, therefore the coupling consistency height in three kinds of brightness of different angles red, green, blue is consistent, thereby make LED display the brightness matching consistency is fine at any angle, greatly improve the image fidelity degree.
The accompanying drawing explanation
Below utilize accompanying drawing to be further detailed the utility model, but the embodiment in accompanying drawing does not form any restriction of the present utility model.
Fig. 1 is the structural representation of the full-color surface attaching type LED of miniaturization described in the utility model.
Fig. 2 is surface attaching type LED chip encapsulating structure schematic diagram described in the utility model.
Embodiment
In order better to understand the technical solution of the utility model, describe below in conjunction with accompanying drawing the embodiment that the utility model provides in detail.
As depicted in figs. 1 and 2, the utility model embodiment provides a kind of miniaturization full-color surface attaching type LED, comprise the black BT resin plate 104 that conduction and supporting role are provided and be fixed on the luminescent wafer 101 on described BT resin plate 104, described luminescent wafer 101 is fixed on black BT resin plate 104 by the crystal-bonding adhesive of fixed wafer 105, between described luminescent wafer 101 and BT resin plate 104, be connected with the gold thread 102 for the chip surface electrode is connected with support, on described gold thread 102 and luminescent wafer 101, be packaged with the packing colloid 103 for seal protection, described a plurality of black BT resin plate 104 is combined to form a rectangle BT resin integral slab, described rectangle BT resin integral slab length is 1.0 millimeters, 1.0 millimeters of width, very miniaturization.
Described luminescent wafer comprises red wafer, green wafer or blue light wafer, described red wafer, green wafer or blue light wafer are pressed the yi word pattern order and are arranged, therefore the coupling consistency height in three kinds of brightness of different angles red, green, blue is consistent, thereby make LED display the brightness matching consistency is fine at any angle, reach better color vivid effect.
The utility model is simple in structure, by realizing the size microminaturization, can provide the high definition of LED, realize high-contrast after making display screen, greatly improves the image fidelity degree.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.

Claims (2)

1. full-color surface attaching type LED of miniaturization; it is characterized in that: comprise that the crystal-bonding adhesive that black BT resin plate reaches by fixed wafer is fixed on the luminescent wafer on described BT resin plate; between described luminescent wafer and BT resin plate, be connected with gold thread; on described gold thread and luminescent wafer, be packaged with the packing colloid for seal protection; described a plurality of black BT resin plate is combined to form a rectangle BT resin integral slab; described rectangle BT resin integral slab length is 1.0 millimeters, 1.0 millimeters of width.
2. the full-color surface attaching type LED of miniaturization as claimed in claim 1, it is characterized in that: described luminescent wafer comprises red wafer, green wafer or blue light wafer, described red wafer, green wafer or blue light wafer are pressed the yi word pattern order and are arranged.
CN2013203394218U 2013-06-07 2013-06-07 Miniaturized full-color surface mounting LED Expired - Lifetime CN203312292U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013203394218U CN203312292U (en) 2013-06-07 2013-06-07 Miniaturized full-color surface mounting LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013203394218U CN203312292U (en) 2013-06-07 2013-06-07 Miniaturized full-color surface mounting LED

Publications (1)

Publication Number Publication Date
CN203312292U true CN203312292U (en) 2013-11-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013203394218U Expired - Lifetime CN203312292U (en) 2013-06-07 2013-06-07 Miniaturized full-color surface mounting LED

Country Status (1)

Country Link
CN (1) CN203312292U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377293A (en) * 2014-11-29 2015-02-25 木林森股份有限公司 Support for small-size multi-color LEDs
CN104409618A (en) * 2014-12-05 2015-03-11 木林森股份有限公司 Small-sized colorful LED lamp bead
CN104979338A (en) * 2014-04-10 2015-10-14 光宝光电(常州)有限公司 Light-emitting diode packaging structure
CN105591013A (en) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 SMD outer package type LED

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979338A (en) * 2014-04-10 2015-10-14 光宝光电(常州)有限公司 Light-emitting diode packaging structure
CN104979338B (en) * 2014-04-10 2018-07-27 光宝光电(常州)有限公司 Light-emitting diode encapsulation structure
CN104377293A (en) * 2014-11-29 2015-02-25 木林森股份有限公司 Support for small-size multi-color LEDs
CN104409618A (en) * 2014-12-05 2015-03-11 木林森股份有限公司 Small-sized colorful LED lamp bead
CN105591013A (en) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 SMD outer package type LED
CN105591013B (en) * 2016-03-25 2018-11-13 深圳市九洲光电科技有限公司 A kind of SMD outer packages formula LED

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

CP03 Change of name, title or address

Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (Fu Garden Road on the west side) run Heng Industrial Plant No. 4 factory floor third, fourth, fifth

Patentee after: SHENZHEN JINGTAI Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: SHENZHEN JINGTAI OPTOELECTRONICS Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20131127