CN108615726A - A kind of lamp bead of built-in IC - Google Patents
A kind of lamp bead of built-in IC Download PDFInfo
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- CN108615726A CN108615726A CN201810764529.9A CN201810764529A CN108615726A CN 108615726 A CN108615726 A CN 108615726A CN 201810764529 A CN201810764529 A CN 201810764529A CN 108615726 A CN108615726 A CN 108615726A
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- 239000011324 bead Substances 0.000 title claims abstract description 29
- 238000004020 luminiscence type Methods 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000005516 engineering process Methods 0.000 claims abstract description 28
- 238000007493 shaping process Methods 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000009514 concussion Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 5
- 238000012856 packing Methods 0.000 abstract description 2
- 238000013486 operation strategy Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 12
- 230000005611 electricity Effects 0.000 description 4
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- 230000001105 regulatory effect Effects 0.000 description 4
- 230000003760 hair shine Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000003487 anti-permeability effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- 230000008054 signal transmission Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of lamp beads of built-in IC, including insulating body and the first conducting terminal, the second conducting terminal, third conducting terminal, the 4th conducting terminal, tri- color full-color light-emitting chips of RGB, driving IC, covering colloid；Insulating body and four conducting terminals are integrated produced by insert molding planar substrates, four conducting terminals include four pads and four pins, each luminescence chip die bond is in corresponding pad, it is connected by electric wire between the driving IC and each luminescence chip, each conductive pin of PLC technology, simplify manufacture craft, reduce number of devices, reduce production cost, improves production efficiency and yields；Meanwhile using chip packing forms, light emitting angle is can be controlled between 30 180 degrees；In addition its small volume, light emitting angle is adjustable, convenient for arrangement, effectively saves space, and encapsulate different light emitting angles according to the luminous demand of difference, operation strategies are extensive.
Description
Technical field
The invention belongs to LED LED technologies fields, more particularly to a kind of lamp bead of built-in IC.
Background technology
LED is the abbreviation of English Light Emitting Diode, i.e. light emitting diode, is that a kind of semiconducting solid is luminous
Device, it is using solid semiconductor chip as luminescent material, and when both ends add forward voltage, the carrier in semiconductor is sent out
Life is compound to cause photon to emit and generate light, and LED can directly send out red, yellow, blue, green, green, orange, purple, white light.At present
Market routine three-color LED lamp bead includes the stake body of square, is connected to 6 metal pins of stake body both sides and is set to holder
Circular mold cavity on body, cavity is interior to be equipped with multiple solder joints independent of each other, and each pin end is rolled over down after being pierced by from cavity lateral
Curved and be fitted in stake body bottom face, bending pin increases the height and thickness of holder, has limited to the application market of lamp bead, together
When bending structure be unfavorable for combining closely for supporting structure, the anti-permeability of holder is insufficient, and bending pin leads to production process
Increase, yields accordingly reduces, and then the production cost increases；Routine TOP encapsulation in market refers to that top surface shines, is flat luminous
LED, the i.e. surface of LED not instead of semicircle, plane, limit to the light emitting angle of LED in this way, and colloid is combined with cup body
It is irregular；Its conventional monochromatic or multi-colored led color can only be independent or whole while luminous, and color is single, and it is complete to can not achieve LED
Coloured silk shines, such as：Chinese Patent Application No. is 201720067996.7, discloses a kind of bonded LED lamp, wherein using LED
Luminescent wafer and one group of positive pin and negative pin being mutually matched can only realize the control to shine to LED wafer, and can not
Realize the full-color light-emitting of LED.
Therefore, how solve the above problems the emphasis studied as those skilled in the art.
Invention content
It is an object of the invention to provide a kind of lamp bead of built-in IC, can effectively solve above-mentioned to can not achieve the full-color hairs of LED
The shortcoming of light.
The purpose of the present invention is realized by following technical proposals：
A kind of lamp bead of built-in IC, including the first lead the sub- ﹑ in electric end the 2nd and lead the sub- ﹑ in electric end the 3rd to lead the sub- ﹑ the 4th in electric end conductive
Terminal and insulating body, insulating body and four conducting terminals are set into planar substrates, and four conducting terminals include four pads
With four pins, first conducting terminal, third conducting terminal, is respectively equipped on the 4th conducting terminal the second conducting terminal
The 2nd weldering disk ﹑ thirds pads of first weldering disk ﹑, the 4th pad, the first pin, second pin, third pin, the 4th pin, first
Pad connects the first pin, and the second pad connects second pin, and third pad connects third pin, and the 4th pad connection the 4th is drawn
Foot, first pad are equipped with the first luminescence chip, and the 4th pad is equipped with the second luminescence chip and third luminescence chip, the
Three pads are equipped with the driving IC of PLC technology, have seven solder joints, PLC technology on the driving IC of the PLC technology
Driving IC connect with each pad by four solder joints, first luminescence chip, the second luminescence chip, third luminescence chip
Cathode is separately connected the other three solder joint, the anode connection of first luminescence chip, the second luminescence chip, third luminescence chip
To the 4th pad.
Preferably, the patch type that first pin, second pin, third pin and the 4th pin are no bending is drawn
Foot.
Preferably, the first pin is located at the planar substrates bottom upper left corner, second pin is located at planar substrates lower left
Angle, third pin are located at the planar substrates bottom lower right corner, and the 4th pin is located at the planar substrates upper right corner, and each pin is isolated from each other.
Preferably, the area of the 4th conducting terminal>The area of third conducting terminal>The area of first conducting terminal
>The area of second conducting terminal.
Preferably, the planar substrates are equipped with covering colloid, planar substrates use chip formula moulded packages.
Preferably, first pin is data output pins DOUT, second pin is grounding pin GND, and third is drawn
Foot is power pins VDD, and the 4th pin is data-out pin DIN.
Preferably, the driving IC of the PLC technology includes power supply generation module, constant current generation module, PWM modulation
Module, ring oscillator module, signal decoder module and shaping output module, the power supply generation module connection constant current generate mould
Block, the constant current generation module connect PWM modulation module, the PWM modulation module connection annular concussion module, the annular shake
Module connection signal decoder module and shaping output module are swung, the signal decoder module connects shaping output module.
Compared with prior art, the beneficial effects of the present invention are：
The present invention reduces the polychrome temp effect of plurality of LEDs composition reached, reduces cost and reached by IC package
Illusion-colour acts on, and the different colours within five kinds can be sent out in single LED by IC and LED integration packagings, improves traditional more
The problems such as packaging cost caused by LED and external IC is high, attachment is cumbersome, area occupied by finished product is big, each conducting terminal root
Differ according to practical application request and cooling requirements conducting terminal size, each conducting terminal size is：Conducting terminal 4
(being equipped with VDD power supplys and two luminescence chips) ＞ conducting terminals 3 (it is that data input DIN pins to be equipped with IC) ＞ conducting terminals 1 (are set
It is data output pins DOUT to have a luminescence chip) ＞ conducting terminals 2 (being equipped with GND grounding pins), meet practical heat dissipation and wants
Ask, be conducive to lamp bead heat dissipation, and then extend lamp bead service life, this lamp bead can use the soft or hard lamp bar of LED illusion-colours, LED guardrail tube,
LED appearances, scene lighting, LED point light source, LED pixel screen, LED abnormity screens, various electronic products, electrical equipment horse race lamp.
Description of the drawings
Fig. 1 is the planar structure schematic diagram of the present invention；
Fig. 2 is the Pin locations figure of the present invention；
Fig. 3 and Fig. 4 is covering colloid structure chart；
Fig. 5 is the electric wire connection diagram of the present invention；
Fig. 6 is triple channel constant-current drive circuit figure.
Reference sign：The first conducting terminals of 1-, the second conducting terminals of 2-, 3- third conducting terminals, 4- the 4th are conductive
Terminal, 5- insulating bodies, the first luminescence chips of 6-, the second luminescence chips of 7-, 8- third luminescence chips, the drive of 9- PLC technologies
Dynamic IC, 10- covering colloids, 11- planar substrates, first electric wire of 12-, the second electric wires of 13-, 14- third conductor wires
Material, the 4th electric wires of 15-, the 5th electric wires of 16-, the 6th electric wires of 17-, the 7th electric wires of 18-, 19- the 8th are led
Electric wire material, the 9th electric wires of 20-, the first pins of 21-, 22- second pins, 23- third pins, the 4th pins of 24-, 31-
One pad, the second pads of 32-, 33- third pads, the 4th pads of 34-, 91- power supply generation modules, 92- constant current generation modules,
93-PWM modulation modules, 94- ring oscillator modules, 95- signal decoder modules, 96- shaping output modules.
Specific implementation mode
With reference to specific embodiments and the drawings, the present invention is further illustrated.
Embodiment one
As shown in Figures 1 to 6, a kind of lamp bead of built-in IC, including 1 the second conducting terminals of ﹑ of the first conducting terminal, 2 ﹑ thirds
The 4th conducting terminals 4 of 3 ﹑ of conducting terminal and insulating body 5, insulating body 5 and four conducting terminals are set into planar substrates 11, put down
Face substrate and four conducting terminals are integrated produced by insert molding planar substrates, and four conducting terminals include that four pads and four draw
Foot, first conducting terminal 1, third conducting terminal 3, are respectively equipped with first on the 4th conducting terminal 4 at second conducting terminal 2
31 the second pads of ﹑ of pad, 32 ﹑ thirds pad 33, the 4th pad 34, the first pin 21, second pin 22, third pin the 23, the 4th
Pin 24, the first pad 31 connect the first pin 21, and the second pad 32 connects second pin 22, and third pad 33 connects third and draws
Foot 23, the 4th pad 34 connect the 4th pin 24, and first pad 31 is equipped with the first luminescence chip 6, on the 4th pad 34
Equipped with the second luminescence chip 7 and third luminescence chip 8, first luminescence chip, the second luminescence chip, third luminescence chip are
Tri- color full-color light-emitting chips of RGB, third pad 33 are equipped with the driving IC9 of PLC technology, first luminescence chip 6, the
Two luminescence chips 7 and third luminescence chip 8 are located at the upside of planar substrates 11, and the driving IC9 of PLC technology is located at plane base
The downside of plate 11, the driving IC9 of the PLC technology are equipped with seven electric wires, are the first electric wire 12 connection the respectively
Four pads 34, the second electric wire 13 connect third pad 33, and third electric wire 14 connects the second pad 32, the 4th conductor wire
Material 15 connects the first pad 31, and the 5th electric wire 16 connects the first luminescence chip 6, and the 6th electric wire 17 connection second shines
Chip 7, the 7th electric wire 18 connect third luminescence chip 8, first luminescence chip 6, the second luminescence chip 7 and third hair
Optical chip 8 is connected with the 4th pad 34, and the first luminescence chip 6 and third luminescence chip 8 pass through the 8th electric wire 19 and
Nine electric wires 20 connect the 4th pad 34, and the driving IC is a triple channel LED constant current driving, integrated by chip interior
It is permanent to form a complete triple channel for 5.4V power supplys, interface control circuit, LED constant current generation circuit and PWM brightness regulating circuits
Driving circuit is flowed, principle is as shown in fig. 6, the generation 5.4V power supplys of power supply generation module 91 generate simultaneously to entire chip power supply
1.25V voltages give constant current generation module 92 and do reference, and constant current generation module 92 is then used for generating 12mA constant currents
Output, base when the generation chip operation of ring oscillator module 94 is required is main there are three effect, and one is used for DIN letters
It number is demodulated, second effect is that the signal shaping after demodulation is output to DOUT, and it is by the constant current of 12mA that third, which acts on,
PWM modulation module 93 is carried out to export, to control the display brightness of R/G/B LED light, meanwhile, change driving IC and reverse connecting protection electricity is inscribed
Road, in reverse power connection, driving IC will not be burnt, and the present invention is by by the driving IC collection of three luminescence chips and PLC technology
At in LED lamp bead, to realize a completely integrated full-color circuit, IC is built in inside lamp bead, an IC is realized
A lamp bead is controlled, conventional RGB is solved and needs to go here and there IC in the circuit board to control change color.
In the present embodiment, one piece of luminescence chip is controlled by an IC, realizes the full-color light-emitting of LED.
Embodiment two
As shown in Figures 1 to 6, a kind of lamp bead of built-in IC, including 1 the second conducting terminals of ﹑ of the first conducting terminal, 2 ﹑ thirds
The 4th conducting terminals 4 of 3 ﹑ of conducting terminal and insulating body 5, insulating body 5 and four conducting terminals are set into planar substrates 11, institute
It states planar substrates 11 and is equipped with 31 the second pads of ﹑ of the first pad, 32 ﹑ thirds pad 33 and the 4th pad 34, the first pad 31 connection the
One pin 21, the second pad 32 connect second pin 22, and third pad 33 connects third pin 23, the 4th pad 34 connection the 4th
Pin 24, first pad 31 are equipped with the first luminescence chip 6, and the 4th pad 34 is equipped with the second luminescence chip 7 and third
Luminescence chip 8, third pad 33 are equipped with the driving IC9 of PLC technology, first luminescence chip 6, the second luminescence chip 7
It is located at the upside of planar substrates 11 with third luminescence chip 8, the driving IC9 of PLC technology is located at the downside of planar substrates 11,
The driving IC9 of the PLC technology is equipped with seven electric wires, is that the first electric wire 12 connects the 4th pad 34 respectively, the
Two electric wires 13 connect third pad 33, and third electric wire 14 connects the second pad 32, the 4th electric wire 15 connection the
One pad 31, the 5th electric wire 16 the first luminescence chip 6 of connection, the 6th electric wire 17 the second luminescence chip 7 of connection, the 7th
Electric wire 18 connects third luminescence chip 8, and first luminescence chip 6, the second luminescence chip 7 and third luminescence chip 8 are equal
It is connected with the 4th pad 34, the first luminescence chip 6 and third luminescence chip 8 pass through the 8th electric wire 19 and the 9th electric wire
20 the 4th pads 34 of connection, the driving IC are that a triple channel LED constant current drives, by chip interior integrate 5.4V power supplys,
Interface control circuit, LED constant current generation circuit and PWM brightness regulating circuits form a complete triple channel constant current driving electricity
Road, principle is as shown in fig. 6, power supply generation module 91 generates 5.4V power supplys to entire chip power supply, while generating 1.25V voltages
It gives constant current generation module 92 and does reference, and constant current generation module 92 is then used for generating the output of 12mA constant currents, annular
Base when the generation chip operation of oscillator module 94 is required, main there are three effect, one is used for solving DIN signals
It adjusts, second effect is that the signal shaping after demodulation is output to DOUT, and third effect is that the constant current of 12mA is carried out PWM tune
Molding block 93 exports, to control the display brightness of R/G/B LED light, meanwhile, change driving IC and reverse-connection protection circuit is inscribed, in power supply
When reversal connection, driving IC will not be burnt, and the present invention by the driving IC of three luminescence chips and PLC technology by being integrated in LED light
In pearl, to realize that one completely integrates full-color circuit, and IC is built in inside lamp bead, realizes an IC and control a lamp
Pearl solves conventional RGB and needs to go here and there IC in the circuit board to control change color, first pin 21, second pin 22,
Third pin 23 and the 4th pin 24 are the patch type pin of no bending, are conducive to combining closely for supporting structure, anti-permeability
Enhance, while being conducive to the miniaturization of holder without bending pin, the first pin 21 is located at the planar substrates bottom upper left corner, and second draws
Foot 22 is located at planar substrates lower left angle, and third pin position 23 is located at flat in the planar substrates bottom lower right corner, the 4th pin 24
The face substrate upper right corner, each pin are isolated from each other, and do not interfere with each other the transmission of signal and the realization of electrical functionality.
It in the present embodiment, is spaced from each other by insulation board between each pin, avoids the interference of signal, to reduce failure
Rate, improves reliability, and the patch type pin of no bending reduces finished-product volume, keeps lamp bead application field of the present invention more extensive.
Embodiment three
As shown in Figures 1 to 6, a kind of lamp bead of built-in IC, including 1 the second conducting terminals of ﹑ of the first conducting terminal, 2 ﹑ thirds
The 4th conducting terminals 4 of 3 ﹑ of conducting terminal and insulating body 5, insulating body 5 and four conducting terminals are set into planar substrates 11, institute
It states planar substrates 11 and is equipped with 31 the second pads of ﹑ of the first pad, 32 ﹑ thirds pad 33 and the 4th pad 34, the first pad 31 connection the
One pin 21, the second pad 32 connect second pin 22, and third pad 33 connects third pin 23, the 4th pad 34 connection the 4th
Pin 24, first pad 31 are equipped with the first luminescence chip 6, and the 4th pad 34 is equipped with the second luminescence chip 7 and third
Luminescence chip 8, third pad 33 are equipped with the driving IC9 of PLC technology, first luminescence chip 6, the second luminescence chip 7
It is located at the upside of planar substrates 11 with third luminescence chip 8, the driving IC9 of PLC technology is located at the downside of planar substrates 11,
The driving IC9 of the PLC technology is equipped with seven electric wires, is that the first electric wire 12 connects the 4th pad 34 respectively, the
Two electric wires 13 connect third pad 33, and third electric wire 14 connects the second pad 32, the 4th electric wire 15 connection the
One pad 31, the 5th electric wire 16 the first luminescence chip 6 of connection, the 6th electric wire 17 the second luminescence chip 7 of connection, the 7th
Electric wire 18 connects third luminescence chip 8, and first luminescence chip 6, the second luminescence chip 7 and third luminescence chip 8 are equal
It is connected with the 4th pad 34, the first luminescence chip 6 and third luminescence chip 8 pass through the 8th electric wire 19 and the 9th electric wire
20 the 4th pads 34 of connection, the driving IC are that a triple channel LED constant current drives, by chip interior integrate 5.4V power supplys,
Interface control circuit, LED constant current generation circuit and PWM brightness regulating circuits form a complete triple channel constant current driving electricity
Road, principle is as shown in fig. 6, power supply generation module 91 generates 5.4V power supplys to entire chip power supply, while generating 1.25V voltages
It gives constant current generation module 92 and does reference, and constant current generation module 92 is then used for generating the output of 12mA constant currents, annular
Base when the generation chip operation of oscillator module 94 is required, main there are three effect, one is used for solving DIN signals
It adjusts, second effect is that the signal shaping after demodulation is output to DOUT, and third effect is that the constant current of 12mA is carried out PWM tune
Molding block 93 exports, to control the display brightness of R/G/B LED light, meanwhile, change driving IC and reverse-connection protection circuit is inscribed, in power supply
When reversal connection, driving IC will not be burnt, and the present invention by the driving IC of three luminescence chips and PLC technology by being integrated in LED light
In pearl, to realize that one completely integrates full-color circuit, and IC is built in inside lamp bead, realizes an IC and control a lamp
Pearl solves conventional RGB and needs to go here and there IC in the circuit board to control change color, heat, therefore root are will produce when LED is lighted
According to each device heating condition, each conducting terminal is not of uniform size, and each conducting terminal size is：The area of 4th conducting terminal 4>
The area of third conducting terminal 3>The area of first conducting terminal 1>The area of second conducting terminal 2.
In the present embodiment, the heat dissipation that different size of conducting terminal is conducive to each device is set.
Example IV
As shown in Figures 1 to 6, a kind of lamp bead of built-in IC, including 1 the second conducting terminals of ﹑ of the first conducting terminal, 2 ﹑ thirds
The 4th conducting terminals 4 of 3 ﹑ of conducting terminal and insulating body 5, insulating body 5 and four conducting terminals are set into planar substrates 11, institute
It states planar substrates 11 and is equipped with 31 the second pads of ﹑ of the first pad, 32 ﹑ thirds pad 33 and the 4th pad 34, the first pad 31 connection the
One pin 21, the second pad 32 connect second pin 22, and third pad 33 connects third pin 23, the 4th pad 34 connection the 4th
Pin 24, first pad 31 are equipped with the first luminescence chip 6, and the 4th pad 34 is equipped with the second luminescence chip 7 and third
Luminescence chip 8, third pad 33 are equipped with the driving IC9 of PLC technology, first luminescence chip 6, the second luminescence chip 7
It is located at the upside of planar substrates 11 with third luminescence chip 8, the driving IC9 of PLC technology is located at the downside of planar substrates 11,
The driving IC9 of the PLC technology is equipped with seven electric wires, is that the first electric wire 12 connects the 4th pad 34 respectively, the
Two electric wires 13 connect third pad 33, and third electric wire 14 connects the second pad 32, the 4th electric wire 15 connection the
One pad 31, the 5th electric wire 16 the first luminescence chip 6 of connection, the 6th electric wire 17 the second luminescence chip 7 of connection, the 7th
Electric wire 18 connects third luminescence chip 8, and first luminescence chip 6, the second luminescence chip 7 and third luminescence chip 8 are equal
It is connected with the 4th pad 34, the first luminescence chip 6 and third luminescence chip 8 pass through the 8th electric wire 19 and the 9th electric wire
20 the 4th pads 34 of connection, the driving IC are that a triple channel LED constant current drives, by chip interior integrate 5.4V power supplys,
Interface control circuit, LED constant current generation circuit and PWM brightness regulating circuits form a complete triple channel constant current driving electricity
Road, principle is as shown in fig. 6, power supply generation module 91 generates 5.4V power supplys to entire chip power supply, while generating 1.25V voltages
It gives constant current generation module 92 and does reference, and constant current generation module 92 is then used for generating the output of 12mA constant currents, annular
Base when the generation chip operation of oscillator module 94 is required, main there are three effect, one is used for solving DIN signals
It adjusts, second effect is that the signal shaping after demodulation is output to DOUT, and third effect is that the constant current of 12mA is carried out PWM tune
Molding block 93 exports, to control the display brightness of R/G/B LED light, meanwhile, change driving IC and reverse-connection protection circuit is inscribed, in power supply
When reversal connection, driving IC will not be burnt, and the present invention by the driving IC of three luminescence chips and PLC technology by being integrated in LED light
In pearl, to realize that one completely integrates full-color circuit, and IC is built in inside lamp bead, realizes an IC and control a lamp
Pearl solves conventional RGB and needs to go here and there IC in the circuit board to control change color, and the planar substrates are equipped with covering colloid
10, planar substrates 11 use chip formula moulded packages, and chip formula moulded packages are that potting resin or silica gel pass through height in mold
Warm high pressure makes it combine closely with planar substrates, can change shape and the angle of covering colloid according to the different shape of cavity body of mould
The different shape of degree, covering colloid forms a secondary optical lens, and then realizes the different light emitting angles of the LED.
In the present embodiment, chip packing forms make light emitting angle that can regulate and control according to demand, and light emitting angle can be controlled in 30-
Between 180 degree；In addition its small volume, light emitting angle is adjustable, convenient for arrangement, effectively saves space, and according to the luminous need of difference
Ask the different light emitting angles of encapsulation, utilization more extensive.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (7)
1. a kind of lamp bead of built-in IC, it is characterised in that：Including the first conducting terminal, (1 the second conducting terminals of) ﹑ (lead by 2) ﹑ thirds
(the 4th conducting terminals (4) of 3) ﹑ and insulating body (5), insulating body (5) are set into plane base to electric terminal with four conducting terminals
Plate (11), four conducting terminals include four pads and four pins, first conducting terminal (1), the second conducting terminal
(2), third conducting terminal (3), being respectively equipped with the first pad on the 4th conducting terminal (4), (31 the second pads of) ﹑ (weld by 32) ﹑ thirds
Disk (33), the 4th pad (34), the first pin (21), second pin (22), third pin (23), the 4th pin (24), first
Pad (31) connects the first pin (21), and the second pad (32) connects second pin (22), and third pad (33) connection third is drawn
Foot (23), the 4th pad (34) connect the 4th pin (24), and first pad (31) is equipped with the first luminescence chip (6), the
Four pads (34) are equipped with the second luminescence chip (7) and third luminescence chip (8), and third pad (33) is equipped with PLC technology
Driving IC (9), there are seven solder joints, the driving IC (9) of PLC technology to pass through four on the driving IC (9) of the PLC technology
A solder joint is connect with each pad, first luminescence chip (6), the second luminescence chip (7), third luminescence chip (8) cathode
It is separately connected the other three solder joint, first luminescence chip (6), the second luminescence chip (7), third luminescence chip (8) are just
Pole is connected to the 4th pad (34).
2. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：First pin (21), second are drawn
Foot (22), third pin (23) and the 4th pin (24) are the patch type pin of no bending.
3. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：First pin position (21) is in planar substrates
(11) the bottom upper left corner, second pin (22) are located at planar substrates (11) lower left angle, and third pin (23) is located at plane base
Plate (11) bottom lower right corner, the 4th pin (24) are located at planar substrates (11) upper right corner, and each pin is isolated from each other.
4. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：The face of 4th conducting terminal (4)
Product>The area of third conducting terminal (3)>The area of first conducting terminal (1)>The area of second conducting terminal (2).
5. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：The planar substrates (11) are equipped with outer
Adhesive body (10), planar substrates (11) use chip formula moulded packages.
6. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：First pin (21) is that data are defeated
Go out pin DOUT, second pin (22) is grounding pin GND, and third pin (23) is power pins VDD, and the 4th pin (24) is
Data-out pin DIN.
7. the lamp bead of built-in IC according to claim 1 a kind of, it is characterised in that：The driving IC of the PLC technology
(9) include power supply generation module (91), constant current generation module (92), PWM modulation module (93), ring oscillator module (94),
Signal decoder module (95) and shaping output module (96), power supply generation module (91) the connection constant current generation module (92),
Constant current generation module (92) the connection PWM modulation module (93), PWM modulation module (93) the connection annular concussion module
(94), described annular concussion module (94) connection signal decoder module (95) and shaping output module (96), the signal decoding
Module (95) connects shaping output module (96).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810764529.9A CN108615726A (en) | 2018-07-12 | 2018-07-12 | A kind of lamp bead of built-in IC |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810764529.9A CN108615726A (en) | 2018-07-12 | 2018-07-12 | A kind of lamp bead of built-in IC |
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| Publication Number | Publication Date |
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| CN108615726A true CN108615726A (en) | 2018-10-02 |
Family
ID=63666316
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810764529.9A Pending CN108615726A (en) | 2018-07-12 | 2018-07-12 | A kind of lamp bead of built-in IC |
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| CN (1) | CN108615726A (en) |
Cited By (6)
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| CN110410699A (en) * | 2019-08-23 | 2019-11-05 | 上犹县嘉亿灯饰制品有限公司 | Copper wire lamp and copper wire lamp control method |
| CN110957312A (en) * | 2019-11-29 | 2020-04-03 | 深圳极光王科技股份有限公司 | Four-pin LED lamp bead with built-in chip and LED display module |
| CN111768721A (en) * | 2020-07-22 | 2020-10-13 | 大连集思特科技有限公司 | LED lamp pearl of four-wire inner seal IC with two-way data transmission |
| CN112968023A (en) * | 2021-02-05 | 2021-06-15 | 浙江英特来光电科技有限公司 | LED full-color display device |
| CN114001286A (en) * | 2021-11-05 | 2022-02-01 | 深圳市彩立德照明光电科技有限公司 | Packaging structure for realizing LED lamp bead and lamp driving integration |
| CN117594737A (en) * | 2024-01-17 | 2024-02-23 | 深圳市天成照明有限公司 | Lamp bead |
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| CN114001286A (en) * | 2021-11-05 | 2022-02-01 | 深圳市彩立德照明光电科技有限公司 | Packaging structure for realizing LED lamp bead and lamp driving integration |
| CN117594737A (en) * | 2024-01-17 | 2024-02-23 | 深圳市天成照明有限公司 | Lamp bead |
| CN117594737B (en) * | 2024-01-17 | 2024-04-16 | 深圳市天成照明有限公司 | Lamp bead |
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