CN216213448U

CN216213448U - Integrated RGB packaging structure of little integrated wick

Info

Publication number: CN216213448U
Application number: CN202122600483.7U
Authority: CN
Inventors: 杜尚昆
Original assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-04-05
Anticipated expiration: 2031-10-28

Abstract

The utility model belongs to the technical field of RGB lamp beads, and particularly relates to a micro-integrated lamp wick integrated RGB packaging structure which comprises a substrate, wherein a driving IC is connected to the center of the upper surface of the substrate; the driving IC can realize independent control of each pixel point, and the traditional display screen IC is integrated and packaged in the lamp bead, so that not only are the IC devices protected from water vapor intrusion and the reliability is improved, but also the ultra-thinness of the display screen is realized; the design of a drive IC drive 12 luminescence chips has make full use of the space, makes the wick integration design can reduce the interval between the pixel to realize the booth apart from the practicality that high definition shows that the wick integration lamp pearl has been realized, compare with a set of RGB chip of IC drive, greatly reduced product cost.

Description

Integrated RGB packaging structure of little integrated wick

Technical Field

The utility model belongs to the technical field of RGB lamp beads, and particularly relates to a micro-integrated lamp wick integrated RGB packaging structure.

Background

With the continuous development of LED display technology, the integration level of RGB lamp beads is higher and higher, but the current technology is limited to a group of RGB light emitting chips packaged together with a driving IC.

In the existing technology for packaging a group of RGB chips and a drive IC together, the drive IC occupies a large space, so that the product has overlarge size, cannot be used on a small-spacing display screen, and is lack of practicability; and the product cost is too high because one driving IC is required for one set of RGB chips.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems in the prior art, the utility model provides a micro-integrated lamp wick integrated RGB packaging structure which has the characteristics of realizing miniaturization of lamp beads and high-definition display.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a little integrated wick integral type RGB packaging structure, includes the base plate, base plate upper surface center department is connected with drive IC, base plate upper surface four corners department is connected with luminous chipset, the drive IC upper surface has 12 output ports, every the upper end of luminous chipset 4 all is connected with each one of R/G/B three-color light chip.

As the preferred technical scheme of the integrated RGB packaging structure with the micro-integrated lamp wick, 12 light-emitting chips are respectively controlled by 12 output ports and are arranged in four groups of three groups.

As the preferable technical scheme of the integrated RGB packaging structure with the micro-integrated lamp wick, the upper surface of the substrate is provided with a solid crystal area used for being connected with the driving IC and four solid crystal areas used for being connected with the luminous chip set.

As the optimized technical scheme of the integrated RGB packaging structure of the micro-integrated lamp wick, the pins on the back of the substrate and the functional areas on the front are conducted through the copper columns.

As the optimized technical scheme of the integrated RGB packaging structure with the micro-integrated lamp wick, the substrate, the driving IC and the light emitting chip set are electrically conducted.

Compared with the prior art, the utility model has the beneficial effects that: the utility model creates a method for sharing the packaging of the driving IC after the multiple groups of RGB light-emitting chips are integrated, realizes the miniaturization of the lamp beads, and integrally packages the IC of the display screen in the lamp beads, thereby realizing high-definition display and simplifying the structure of the display screen, and having the characteristics of ultra-thinness and high reliability; the driving IC can realize independent control of each pixel point, and the traditional display screen IC is integrated and packaged in the lamp bead, so that not only are the IC devices protected from water vapor intrusion and the reliability is improved, but also the ultra-thinness of the display screen is realized; the design of a drive IC drive 12 luminescence chips has make full use of the space, makes the wick integration design can reduce the interval between the pixel to realize the booth apart from the practicality that high definition shows that the wick integration lamp pearl has been realized, compare with a set of RGB chip of IC drive, greatly reduced product cost.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic structural view of a front view of the present invention;

FIG. 2 is a schematic top view of the present invention;

in the figure: 1. a substrate; 2. a driver IC; 3. an output port; 4. a light emitting chip set.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-2, the present invention provides the following technical solutions: the utility model provides a micro-integrated lamp wick integrated RGB (Red, Green and blue) packaging structure, which comprises a substrate 1, wherein the center of the upper surface of the substrate 1 is connected with a driving IC2, four corners of the upper surface of the substrate 1 are connected with light emitting chip groups 4, the upper surface of a driving IC2 is provided with 12 output ports 3, and the upper end of each light emitting chip group 4 is connected with one R/G/B three-color light chip.

Specifically, 12 output ports 3 respectively control 12 light emitting chips, and the light emitting chips are arranged in four groups of three groups.

Specifically, the upper surface of the substrate 1 is provided with one solid crystal area for being connected with the driving IC2 and four solid crystal areas for being connected with the light emitting chip set 4, in the embodiment, the driving IC2 can realize independent control of each pixel point, and integrally package the traditional display screen IC into the lamp bead, so that not only are the IC devices protected from water vapor intrusion and the reliability is improved, but also the display screen is ultra-thin; the design that a drive IC2 driven 12 luminescence chips, make full use of the space, make the wick integration design can reduce the interval between the pixel to realize the booth apart from the practicality that high definition shows that the wick integration lamp pearl has been realized, compare with a 2 a set of RGB chips of IC drive, greatly reduced product cost.

Specifically, the pins on the back surface of the substrate 1 are conducted with the functional regions on the front surface through copper pillars, and the copper pillars have good conductivity in the embodiment, so that the use stability is ensured.

Specifically, the substrate 1, the driving IC2, and the light emitting chip set 4 are all electrically connected.

The working principle and the using process of the utility model are as follows: the whole layout of the utility model is a substrate 1, a drive IC2 and a light-emitting chip group 4, wherein the substrate 1 is provided with an IC die bonding area and 4 light-emitting chip die bonding areas, and a back pin is conducted with a front functional area through a copper column; the driver IC2 has 12 output ports 3 for respectively controlling 12 light emitting chips; the light emitting chip group 412 is divided into 4 groups, and each group of chips is provided with one R/G/B three-color light chip, so that a complete light emitting pixel point is realized.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a little integrated wick integral type RGB packaging structure which characterized in that: including base plate (1), base plate (1) upper surface center department is connected with drive IC (2), base plate (1) upper surface four corners department is connected with luminous chipset (4), drive IC (2) upper surface has 12 output ports (3), every the upper end of luminous chipset (4) all is connected with one each of the R/G/B three-color light chip.

2. The integrated RGB package structure of claim 1, wherein: the 12 output ports (3) respectively control 12 light-emitting chips, and the light-emitting chips are arranged in four groups of three groups.

3. The integrated RGB package structure of claim 1, wherein: the upper surface of the substrate (1) is provided with a die bonding area used for being connected with the driving IC (2) and four die bonding areas used for being connected with the light emitting chip set (4).

4. The integrated RGB package structure of claim 1, wherein: and the pins on the back surface of the substrate (1) are conducted with the functional area on the front surface through copper columns.

5. The integrated RGB package structure of claim 1, wherein: the substrate (1), the driving IC (2) and the light emitting chip set (4) are all electrically conducted.