CN109860163A - A kind of double-side wick one LED - Google Patents
A kind of double-side wick one LED Download PDFInfo
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- CN109860163A CN109860163A CN201910090883.2A CN201910090883A CN109860163A CN 109860163 A CN109860163 A CN 109860163A CN 201910090883 A CN201910090883 A CN 201910090883A CN 109860163 A CN109860163 A CN 109860163A
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Abstract
The present invention relates to a kind of double-side wick one LED, be equipped with four laminar substrates, full-color LED lamp and IC chip, every laminar substrate just/back side is welded with pin, it is same pin that just/back side pin, which symmetrically be connected,；An IC and full-color LED lamp are pasted in second layer substrate front side and third layer substrate back, the IC metal wire is connect with the 2nd electrode of red, green, blue LED wafer in full-color LED lamp, the IC receives working power by power input, and after by clock pulse and data input pin receiving a control signal, red, green, blue LED wafer is controlled, and the control signal is spread out of through clock pulse data output end and serial data output terminal, time pulse/data signal pass order and sequence of light are to reach the back side from front, then reach next LED.LED structure of the invention is simple, and double-side is small in size, is suitable for Double-side Synchronous or asynchronous display and lamp bar.
Description
Technical field
It is specifically a kind of to drive 2 full-color LED lamps and 2 the present invention relates to a kind of double-side wick one LED
The double-side wick one LED that dynamic IC chip is packaged as a whole.
Background technique
It is general to be pasted on substrate using the LED that single side shines in the technology of existing LED, such as China in 2013
Patent announcement number is CN202930380U, " Full-color LED encapsulation structure for integrating driving mechanism " technology of announcement, the all-colour LED
In be a three primary colors (RGB) LED, wherein including driving chip, and feux rouges (R) chip, green light (G) chip, blue light (B) chip
(LEDdice) can directly die bond on extension, each chip can save current limliting electricity group, be directly connected with an external power supply, drive
Driving mechanism is then provided in dynamic chip to control red (R) green (G) blue (B) trichromatic LED chip, while by internal each member
Part is arranged, and composable tightness is high, light mixing effect is good and high-resolution LED, and effectively reduces use space in turn
Reduce production cost." a kind of five foot all-colour LEDs encapsulation that also just like 2018 Chinese Patent Application No. are 201810025040.X
Structure ", the LED encapsulation structure and above-mentioned technology it is common it is existing be disadvantageous in that, the all-colour LED be single side issue it is complete
Glory effect, the LED that this single side sends out light full-color have been far from satisfying the requirement that people use.
China discloses number of patent application within 2017 are as follows: 2017105595958 " a kind of double-side LED chip and its
Production method ", the double-side LED chip, comprising: the transparent substrates with the first and second surfaces, two surfaces are by throwing
Light or graphical treatment；First and second surface epitaxial growth the first and second chips epitaxial structure layers, the first chip epitaxy junction
Structure layer includes the first p type semiconductor layer and the first n type semiconductor layer, and the second chip epitaxial structure layer includes the second P-type semiconductor
Layer and the second n type semiconductor layer；It is provided with p-type current-diffusion layer on first chip epitaxial structure layer, is set on p-type current-diffusion layer
It is equipped with first P-type electrode of small area, is provided with the first N-type electrode on the first n type semiconductor layer；Second chip epitaxial structure layer
The second p type semiconductor layer on be provided with second P-type electrode of large area, be provided with one second N-type on the second n type semiconductor layer
Electrode.Epitaxial light emission structure preparation is carried out by the upper and lower surface to transparent substrates piece, light efficiency can be improved out with double-side
Rate changes encapsulation mode and improves heat dissipation.The shortcoming of the technology be the light issued be it is monochromatic, this chip is although can be two-sided
It shines, but monochromatic luminous LED chip has also been far from satisfying the requirement that people use.
Currently available technology for double-side wick one LED still without preferable solution, for this purpose, necessary
A kind of double-side wick one LED is developed, is drawn with meeting the display screen that people realize that double-sided display is bright in luster, three-dimensional sense is strong
The demand in face.
Summary of the invention
The invention aims to solve in existing LED technology existing for single side full-color light-emitting or monochromatic double-side technology
Problem, and it is simple to provide a kind of structure, small in size and easy to use, the energy equipped with substrate, driving IC chip and full-color LED lamp is double
Surface electroluminescent lamp core one LED, wherein driving IC chip hereinafter referred to as IC.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of double-side wick one LED is provided, if
There are four laminar substrates, full-color LED lamp and IC, the four laminar substrate front/backs are welded with pin；The full-color LED lamp
In feux rouges, green light, blue LED wafers there are two electrode, feux rouges, green light, the 1st electrode of blue LED wafers and power supply are defeated
Enter end connection, the 2nd electrode is connect by metal wire with IC；The IC is equipped with driving mechanism, receives work by power input
Power supply, and after receiving a control signal by clock input and data input pin, feux rouges, green light, blue LED wafers are controlled
System, and the control clock pulse and data signals are spread out of through clock pulse data output end and data output end；
Four laminar substrates are square substrate, and plane frame size is identical, the pin of every laminar substrate front/back
Symmetrical conducting is same pin；Each pin is designed with a pin central aperture, and is filled with metallic conduction in the aperture
Medium；The full-color LED lamp and IC respectively has 2；
Four laminar substrates are sequentially from top to bottom the first laminar substrate, the second laminar substrate, third laminar substrate and the 4th layer
Substrate, every laminar substrate side is packaged with enclosure wall, for avoiding side light leakage；
First laminar substrate, the 4th laminar substrate structure are identical, in a substrate between be all provided with square orifice, the two sides of substrate
Side is welded with 6 pins；It is the data output that the 1st pin is the 2nd IC respectively；2nd pin is GND；3rd pin is the 1st
The data input of IC；The clock pulse input that 4th pin is the 1st IC；5th pin is VCC；6th pin is the clock pulse of the 2nd IC
Output；And it is equipped with front mark in first layer substrate front side, the 4th laminar substrate back side is equipped with back side mark；
Second laminar substrate and third layer substrate front side/back side are welded with and the first laminar substrate, the 4th laminar substrate
6 the same pins, are additionally provided with the 7th, the 8th, the 9th, the 10th pin, the second laminar substrate, third laminar substrate for wiring and
Die bond bonding wire, is pasted with the 1st full-color LED lamp and the 1st IC in second layer substrate front side, and third layer substrate back is pasted with
2nd full-color LED lamp and the 2nd IC；
The red, green, blue three primary colours mixed light that 1st full-color LED lamp issues after the 1st IC drives passes through the
Square orifice concentration is given out light upwards among one laminar substrate；2nd full-color LED lamp issued after the 2nd IC drives it is red,
Green, blue three primary colours mixed light is given out light downwards by square orifice concentration among the 4th laminar substrate；It is put upwards by the 1st full-color LED lamp
Light and the 2nd full-color LED lamp give out light to form double-side up and down downwards；
The four laminar substrate front sequence heap poststacks, the gold that identical pin is inserted by the pin central aperture
Belong to conducting medium, realize four laminar substrate pins between connection and electrically conduct, the pin according to show demand patch in LED
The insulating cement encapsulation of wherein one side, four laminar substrate light-permeables constitutes double-side wick one LED.
It is equipped with the supporting part of GND in the 2nd pin of the second layer substrate front side, for pasting the 1st IC, the 5th
Extension of the pin equipped with VCC is for pasting the 1st full-color LED lamp, while the 3rd, the 4th, the 7th, the 8th in the second laminar substrate is drawn
Foot is respectively provided with extension, the metal wire connecting for shortening the 1st IC with pin each on substrate.
It is equipped with the supporting part of GND in the 2nd pin of the third layer substrate back, for pasting the 2nd IC, the 5th
Extension of the pin equipped with VCC is respectively set for pasting the 2nd full-color LED lamp in the 7th, the 8th, the 9th, the 10th pin
Extension；In the front of third laminar substrate by the line of one article of the 1st pin and the 9th pin of setting, make the 1st pin and the
The conducting of 9 pins, and the line of setting one article of the 6th pin and the 10th pin, are connected the 6th pin with the 10th pin, described
The extension of third layer substrate back and positive 2 articles of lines are used to shorten the metal that the 2nd IC is connect with each pin of substrate
Line.
1st IC, the 1st foot are connect with the 5th pin VCC of second layer substrate front side；2nd foot empties；3rd foot
It is connect with the 7th pin of the back side of positive 7th pin of the second laminar substrate, third laminar substrate, the back side the 7th of third laminar substrate is drawn
The 6th foot clock pulse of foot and the 2nd IC, which input, to be connected, the 6th foot clock pulse of the 3rd foot the clock pulse output and the 2nd IC of as the 1st IC
Input connection；4th foot is connect with the 8th pin of the back side of the 8th pin of front of the second laminar substrate, third laminar substrate, third layer base
The 5th foot data of the 8th pin of the back side of plate and the 2nd IC, which input, to be connected, and the 4th foot data of as the 1st IC export and the 2nd
The 5th foot data of IC input connection；5th foot is connect with the 3rd pin of front of the second laminar substrate, the 5th foot of as the 1st IC with
The data of 1st IC input connection；6th foot is connect with the 4th pin of front of the second laminar substrate, as the 6th foot and the 1st IC's
Clock pulse input connection；7th foot is connect with the 2nd pin GND of front of the second laminar substrate；8th, the 9th, the 10th foot respectively with positive face paste
2nd electrode of red, green, blue LED wafer connects.
2nd IC, the 1st foot are connect with the 5th pin VCC of the back side of third laminar substrate；2nd foot empties；3rd foot
It is connect with the 10th pin of the back side of third laminar substrate, since the 10th pin is connected with the 6th pin, as the 3rd foot and the 2nd IC's
Clock pulse output connection；4th foot is connect with the 9th pin of the back side of third laminar substrate, since the 9th pin is connected with the 1st pin, as
The data of 4th foot and the 2nd IC, which export, to be connected；5th foot is connected to the 8th pin of the back side of third laminar substrate, i.e. the 5th foot is and the
The data of 1 the 4th foot of IC export connection；6th foot is connect with the 7th pin of the back side of third laminar substrate, as the 6th foot and the 1st
The output connection of the 3rd foot clock pulse of IC；7th foot is connect with the 2nd pin GND of the back side of third laminar substrate；The 8th, the 9th, the of 2nd IC
10 feet are connect with the 2nd electrode of back side patch red, green, blue LED wafer respectively.
The clock pulse and data signals pass order controlled in the double-side wick one LED is from every laminar substrate
Front is sent to the back side, is resent to next double-side wick one LED；Sequence of light is also same.
The course of work of double-side wick one LED of the invention is: first by power input VCC input service electricity
Source, is sent to the 1st IC of second layer substrate front side, while being supplied to red, green, blue LED wafer in the 1st full-color LED lamp
Required working power, it is ensured that the three primary colours light generated when red, green, blue LED wafer light mixing；Clock pulse data input pin CLK1_
IN and serial data input D1_IN by control signal be sent to the 1st IC, the driving mechanism in the 1st IC then to it is red, green,
It is different photochromic to be mixed into that blue LED wafers generate the pressure drop of control, working power through power output end GND outflow, and
Control signal is then to be sent to the 2nd IC through clock pulse data output end CLK1_OUT and serial data output terminal D1_OUT, together
When working power input terminal VCC red, green, blue LED into the 2nd IC and the 2nd full-color LED lamp of third layer substrate back it is brilliant
Piece provide needed for working power, when red, green, blue LED wafer light mixing generates three primary colours light；Clock pulse data input pin CLK2_
IN and serial data input D2_IN by control signal be sent to the 2nd IC, the driving mechanism in the 2nd IC then to it is red, green,
The control pressure drop that blue LED wafers generate is different photochromic to be mixed into, working power through power output end GND outflow, and
Control signal then penetrates clock pulse data output end CLK2_OUT and serial data output terminal D2_OUT and is sent to next two-sided hair
Light wick one LED.
Double-side wick one LED of the invention has the advantage that compared with prior art:
(1), double-side wick one LED of the invention is equipped with front mark in the front of the first laminar substrate,
The 4th laminar substrate back side is equipped with back side mark, this two is simply denoted as user's use and provides a great convenience, Yong Hu
It can be easy to distinguish each Pin locations of packaged LED element by front/back mark when use, avoid
Mistake is caused when wiring.
(2), double-side wick one LED of the invention, design has four laminar substrates, in the first laminar substrate, the 4th laminar substrate
Centre be all provided with square orifice, product encapsulation when by full-color LED lamp and driving IC chip be pasted onto second layer substrate front side and
Third layer substrate back, the square orifice of the first laminar substrate of position face of stickup, the 4th laminar substrate, such design can be fine
Full-color LED lamp and driving IC chip are protected in ground, and the light that 2 full-color LED lamps can be made to issue more is concentrated, and respectively from first substrate
Front, tetrabasal back side illuminated form the light source of two-sided full-color light-emitting.
(3), double-side wick one LED of the invention uses integral packaging structure, and every laminar substrate front/back is welded
There is pin, it is same pin that the pin of front/back, which is symmetrically connected, and each pin does not set bracket, and pin is according to display demand patch
In LED wherein one side, while the high integrated LED of tightness is formed by being arranged for each element in substrate, therefore the present invention
The overall dimension of integrated LED is small, can be further reduced LED display overall power dissipation, while it is close to increase display screen matrix
Degree, can effectively be the producer and user's save the cost.
(4), double-side wick one LED structure of the invention is simple, and full-color with driving mechanism in the prior art
LED technology is compared, and LED of the invention does not have the LED Chips for Communication of feux rouges, green light, blue-ray LED in all-colour LED route
Collocation current-limiting resistance is arranged driving mechanism by driving IC chip and completes to control the trichromatic chip of red, green, blue.This hair
Bright LED is easy to use, is suitable for Double-side Synchronous or asynchronous display and lamp bar etc..
Detailed description of the invention
Surface structure schematic diagram when Fig. 1 is double-side wick one LED of the invention face-up.
Fig. 2 be the bottom surface double-side wick one LED of the invention upward when surface structure schematic diagram.
Fig. 3 is that planar structure schematic diagram is decomposed at the front of the first, second laminar substrate of the invention and the back side.
Fig. 4 is third of the invention, front and the back side decomposition planar structure schematic diagram of the 4th laminar substrate.
Fig. 5 is double-side wick one LED internal circuit diagram of the invention.
Fig. 6 is that double-side wick one LED signal of the invention transmits display order schematic diagram.
In above-mentioned figure: the 1-the first laminar substrate；2-the second laminar substrate；3-third laminar substrates；4-the four laminar substrate；11—
1st pin: the data output of the 2nd IC；12-the 2 pin: GND；13-the 3 pin: the data input of the 1st IC；14—
4th pin: the clock pulse input of the 1st IC；15-the 5 pin: VCC；16-the 6 pin: the clock pulse output of the 2nd IC；17—
7th pin: the clock pulse output of the 1st IC；18-the 8 pin: the 1st IC data output；19-the 9 pin: the 2nd IC data
Output；20-the 10 pin: the 2nd IC clock pulse output；21-pin central apertures；22-metal wires；51-positive face paste feux rouges
LED wafer；52-positive face paste green light LED chips；53-positive face paste blue LED wafers；Paste red-light LED chip in the 81-back sides；
Paste green light LED chip in the 82-back sides；Paste blue LED wafers in the 83-back sides；100-front marks；101-the 1 IC；
The line of 112-the 1 pin and the 9th pin；The supporting part of 121-the 2 pin GND；The extension of 151-VCC；162-the 6
The line of pin and the 10th pin；200-back side marks；201-the 2 IC.
Specific embodiment
Double-side wick one LED of the invention is described further in the following with reference to the drawings and specific embodiments, but
Implementation of the invention is without being limited thereto.
Embodiment 1: the present invention provides a kind of double-side wick one LED, and surface structure is as shown in Figure 1, 2, is equipped with
Four laminar substrates, 2 full-color LED lamps and 2 driving IC chips, the front/back of every laminar substrate is welded in four laminar substrates
It is connected to pin, there are two electrode, feux rouges, green light, blue lights for the feux rouges, green light, blue LED wafers in the full-color LED lamp
1st electrode of LED wafer is connect with power input, and the 2nd electrode is connect by metal wire 22 with IC.The IC is equipped with driving
Mechanism receives working power by power input, and after receiving a control signal by clock input and data input pin, to red
Light, green light, blue LED wafers are controlled, and by the control clock pulse and data signals through clock pulse data output end and
Data output end outflow.
Referring to Fig. 1,2, four laminar substrates are from top to bottom sequentially the first laminar substrate 1, the second laminar substrate 2, third layer
Substrate 3 and the 4th laminar substrate 4；It is same pin that the pin of every laminar substrate front/back, which is symmetrically connected, and each pin is designed with one
A pin central aperture 21, inserts metallic conducting media in the aperture；Four laminar substrate front sequence heap poststacks pass through aperture
In metallic conducting media realize connection between the pin of four laminar substrate same orientations and electrically conduct that the pin is according to aobvious
Show demand patch in LED wherein one side.Front mark 100, the back of the 4th laminar substrate 4 are equipped in 1 front of the first laminar substrate
Face is equipped with back side mark 200.
Referring to Fig. 3,4, the first laminar substrate 1, the 4th laminar substrate 4 substrate among be all provided with square orifice, the two of every laminar substrate
Surface side side is welded with 6 pins, is respectively: the data that the 1st pin 11 is the 2nd IC export D2_OUT；2nd pin 12 is
GND；The data that 3rd pin 13 is the 1st IC input D1_IN；The clock pulse that 4th pin 14 is the 1st IC inputs CLK1_IN；5th
Pin 15 is VCC；The clock pulse that 6th pin 16 is the 2nd IC exports CLK2_OUT.
Referring to Fig. 3, second laminar substrate 2, third laminar substrate 3 are wiring and die bond bonding wire layer, second layer base
The front/back of plate and third laminar substrate is welded with 6 pins as the first laminar substrate, the 4th laminar substrate, is additionally provided with the 7th
Pin 17, the 8th pin 18, the 9th pin 19, the 10th pin 20.The supporting part of the 2nd foot GND is equipped in the front of the second laminar substrate
121, for pasting the 1st IC 101, in extension 151 of the 5th pin equipped with VCC for pasting the 1st full-color LED lamp, and
The second laminar substrate the 3rd, the 4th, the 7th, the 8th pin be respectively provided with extension, for shortening the 1st IC and each pin of substrate
The metal wire 22 of connection, so that the volume of double-side wick one LED is sufficiently small.
Positive face paste red-light LED chip 51, positive face paste green light LED chip 52, just are equipped in 1st full-color LED lamp
Face paste blue LED wafers 53, the feux rouges issued after the 1st IC 101 drives, green light, blue light three primary colours mixed light pass through the
Square orifice concentration is given out light upwards among one laminar substrate.
Referring to Fig. 3,5, the 1st foot of the 1st IC 101 is connect with the extension 151 of the VCC of the second laminar substrate 2；
The 2nd foot of 1st IC empties；The 3rd foot of 1st IC is connect with the 7th pin 17 of second layer substrate front side, also with third layer base
The 7th pin of the back side of plate connects, and the 6th foot clock pulse of the 7th pin of the back side of third laminar substrate and the 2nd IC, which input, to be connected, as
The 3rd foot clock pulse output of 1st IC and the 6th foot clock pulse of the 2nd IC are inputted and are connected；The 4th foot and the second laminar substrate of 1st IC
The 8th pin 18 of front connection, also connect with the 8th pin of the back side of third laminar substrate, the 8th pin of the back side of third laminar substrate and
The 5th foot connection of 2nd IC, the 4th foot data output of as the 1st IC are connected with the 2nd the 5th foot data of IC input；1st
The 5th foot of IC is connect with the 3rd pin 13 of the second laminar substrate, and the data input of the 5th foot and the 1st IC of as the 1st IC connects
It connects；The 6th foot of 1st IC is connect with the 4th pin 14 of second layer substrate front side, the 6th foot and the 1st IC of as the 1st IC
Clock pulse input connection；The 7th foot of 1st IC is connect with the 2nd pin GND12 of front of the second laminar substrate；1st IC the 8th,
9th, the 10th foot is connect with the 2nd electrode of positive face paste red, green, blue LED wafer respectively.
Referring to fig. 4, the supporting part 121 of the 2nd pin GND is again provided on the back side of third laminar substrate 3, for pasting the
2 IC 201, in extension 151 of the 5th pin equipped with VCC for pasting the 2nd full-color LED lamp, while in third laminar substrate
The back side the 7th, the 8th, the 9th, the 10th pin be respectively provided with extension, the front of third laminar substrate by setting one
The 1st pin is connected with the 9th pin in the line 112 of 1st pin and the 9th pin, and one article of the 6th pin of setting draws with the 10th
The line 162 of foot, is connected the 6th pin with the 10th pin, extension on the third layer substrate back and 2 positive
Line is used to shorten the metal wire 22 that the 2nd IC is connect with each pin of substrate.
2nd full-color LED lamp and the 2nd IC 201 is pasted onto 3 back side of third laminar substrate, the 2nd full-color LED lamp
Red-light LED chip 81 is pasted equipped with the back side；Paste green light LED chip 82 in the back side；Paste blue LED wafers 83 in the back side；It is driven by the 2nd IC
Feux rouges, green light, the blue light three primary colours mixed light issued after dynamic is given out light downwards by the intermediate square orifice concentration of the 4th laminar substrate 4；1st
Full-color LED lamp, which gives out light to give out light downwards to be formed with the 2nd full-color LED lamp upwards, two-sided up and down sends out light full-color.
Referring to fig. 4, the extension 151 of the VCC of the 1st foot and 3 back side of third laminar substrate of 5, the 2nd IC 201 connects
It connects；The 2nd foot of 2nd IC empties；The 3rd foot of 2nd IC is connect with 20 extension of the 10th pin of third layer substrate back, due to
10th pin 20 is connected to the 6th pin 16, and the clock pulse output of the 3rd foot and the 2nd IC of as the 2nd IC connects；2nd
The 4th foot of IC is connect with the 9th pin 19 of third laminar substrate, since the 9th pin is connected to the 1st pin 11, as the 2nd
The data of the 4th foot of IC and the 2nd IC, which export, to be connected；The 5th foot of 2nd IC and the 8th pin 18 of third layer substrate back connect
It connects, the data of as the 5th foot and the 1st IC, which export, to be connected；The 6th foot of 2nd IC and the 7th pin 17 of third layer substrate back
The clock pulse output of connection, the 6th foot and the 1st IC of as the 2nd IC connects；The 7th foot and third layer substrate back of 2nd IC
The 2nd pin 12 connection, as connect with GND；2nd IC the 8th, the 9th, the 10th foot respectively with the back side paste red, green, blue
2nd electrode of LED wafer connects.
The 1st described IC and the 2nd IC is provided with driving mechanism, receives working power by power input VCC, and
After receiving a control signal by clock input and serial data input, feux rouges, green light, blue LED wafers are controlled,
And the clock pulse of the control and data signals are spread out of through clock pulse data output end and data output end.
Described every layer of side of four laminar substrates is packaged with enclosure wall, avoids side light leakage, the first laminar substrate, the 4th when encapsulation
The side enclosure wall height of laminar substrate is to protect the height of crystal grain and welding metal conducting wire, and the insulation of light-permeable is used after encapsulation enclosure wall
Glue completes encapsulation and constitutes double-side wick one LED.
Double-side wick one LED of the invention, the time pulse/data signal pass order of control be every laminar substrate just
Face is sent to the back side, is resent to next LED；Sequence of light is also same.For details, reference can be made to Fig. 6, are double-side of the invention
The transmission of wick one LED signal and display order:
The front the R1_1 → back side the R1_1 → front R1_2 → back side the R1_2 → front --- --- → R1_n-1 → R1_n-1 back
Face → the front the R1_n → back side the R1_n → front the R2_n → back side the R2_n → front R2_n-1 → back side R2_n-1 → --- --- →
The front the R2_2 → back side the R2_2 → front R2_1 → back side R2_1 → --- ---.That is the clock pulse and data signals controlled in LED passes
The front that sequence is passed as every laminar substrate from the R1_1 double-side wick one LED is sent to the back side, is resent to next
The front of R1_2 double-side wick one LED, --- --- is until be sent to last double-side wick one LED's
The back side；Sequence of light is also same.Line layout is designed using S type, wiring can be completed with single sided board, design is simple, saves cost.
Double-side wick one LED structure of the invention is simple, easy to operate, is suitable for Double-side Synchronous or asynchronous
Display and lamp bar etc..
Claims (6)
1. a kind of double-side wick one LED, equipped with four laminar substrates, full-color LED lamp and IC, the four laminar substrates front/
The back side is welded with pin；Feux rouges, green light, blue LED wafers in the full-color LED lamp are feux rouges, green there are two electrode
Light, blue LED wafers the 1st electrode connect with power input, the 2nd electrode is connect by metal wire with IC；The IC is set
There is driving mechanism, working power is received by power input, and a control signal is received by clock input and data input pin
Afterwards, feux rouges, green light, blue LED wafers are controlled, and the control clock pulse and data signals is defeated through clock pulse data
Outlet and data output end outflow；It is characterized by:
Four laminar substrates are square substrate, and plane frame size is identical, and the pin of every laminar substrate front/back is symmetrical
Conducting is same pin；Each pin is designed with a pin central aperture, and is filled with metallic conducting media in the aperture；
The full-color LED lamp and IC respectively has 2；
Four laminar substrates are sequentially from top to bottom the first laminar substrate, the second laminar substrate, third laminar substrate and the 4th laminar substrate,
Every laminar substrate side is packaged with enclosure wall, for avoiding side light leakage；
First laminar substrate, the 4th laminar substrate structure are identical, in a substrate between be all provided with square orifice, the two sides side of substrate
It is welded with 6 pins；It is the data output that the 1st pin is the 2nd IC respectively；2nd pin is GND；3rd pin is the 1st IC
Data input；The clock pulse input that 4th pin is the 1st IC；5th pin is VCC；6th pin is that the clock pulse of the 2nd IC is defeated
Out；And it is equipped with front mark in first layer substrate front side, the 4th laminar substrate back side is equipped with back side mark；
Second laminar substrate and third layer substrate front side/back side are welded with as the first laminar substrate, the 4th laminar substrate
6 pins, be additionally provided with the 7th, the 8th, the 9th, the 10th pin, the second laminar substrate, third laminar substrate are used for wiring and die bond
Bonding wire, is pasted with the 1st full-color LED lamp and the 1st IC in second layer substrate front side, and third layer substrate back is pasted with the 2nd
Full-color LED lamp and the 2nd IC；
The red, green, blue three primary colours mixed light that 1st full-color LED lamp issues after the 1st IC drives passes through first layer
Square orifice concentration is given out light upwards among substrate；2nd full-color LED lamp issued after the 2nd IC drives it is red, green,
Blue three primary colours mixed light is given out light downwards by square orifice concentration among the 4th laminar substrate；By the 1st full-color LED lamp give out light upwards with
2nd full-color LED lamp gives out light to form double-side up and down downwards；
The four laminar substrate front sequence heap poststacks, identical pin are led by the metal that the pin central aperture is inserted
Dielectric, realize four laminar substrate pins between connection and electrically conduct, the pin according to show demand patch in LED wherein
On one side, the insulating cement encapsulation of four laminar substrate light-permeables constitutes double-side wick one LED.
2. double-side wick one LED according to claim 1, it is characterised in that: second laminar substrate just
2nd pin in face is equipped with the supporting part of GND, for pasting the 1st IC, in extension of the 5th pin equipped with VCC for pasting the
1 full-color LED lamp, at the same the second laminar substrate the 3rd, the 4th, the 7th, the 8th pin be respectively provided with extension, for shortening the
The metal wire that 1 IC is connect with pin each on substrate.
3. double-side wick one LED according to claim 1, it is characterised in that: carried on the back in the third laminar substrate
2nd pin in face is equipped with the supporting part of GND, for pasting the 2nd IC, in extension of the 5th pin equipped with VCC for pasting the
2 full-color LED lamps, while extension is respectively provided in the 7th, the 8th, the 9th, the 10th pin；It is logical in the front of third laminar substrate
The line for crossing one article of the 1st pin and the 9th pin of setting, is connected the 1st pin with the 9th pin, and one article of the 6th pin of setting
With the line of the 10th pin, the 6th pin is connected with the 10th pin, the extension of the third layer substrate back and positive
2 articles of lines are used to shorten the metal wire that the 2nd IC is connect with each pin of substrate.
4. double-side wick one LED according to claim 1, it is characterised in that: the 1st IC, the 1st foot
It is connect with the 5th pin VCC of second layer substrate front side；2nd foot empties；Positive 7th pin of 3rd foot and the second laminar substrate,
The 7th pin of the back side of third laminar substrate connects, and the 6th foot clock pulse of the 7th pin of the back side of third laminar substrate and the 2nd IC, which input, to be connected
It connects, the 3rd foot clock pulse output of as the 1st IC and the 6th foot clock pulse of the 2nd IC are inputted and connected；4th foot and the second laminar substrate
The 5th of the 8th pin of the back side connection of positive 8th pin, third laminar substrate, the 8th pin of the back side of third laminar substrate and the 2nd IC
The input connection of foot data, the 4th foot data output of as the 1st IC and the 5th foot data of the 2nd IC input connection；5th foot with
The 3rd pin of front of second laminar substrate connects, and the data input of the 5th foot and the 1st IC of as the 1st IC connects；6th foot with
The 4th pin of front of second laminar substrate connects, and the clock pulse of as the 6th foot and the 1st IC, which input, to be connected；7th foot and second layer base
The 2nd pin GND connection of front of plate；8th, the 9th, the 10th foot respectively with the 2nd electrode of positive face paste red, green, blue LED wafer connect
It connects.
5. double-side wick one LED according to claim 1, it is characterised in that: the 2nd IC, the 1st foot
It is connect with the 5th pin VCC of the back side of third laminar substrate；2nd foot empties；The 10th pin of the back side of 3rd foot and third laminar substrate connects
It connects, since the 10th pin is connected with the 6th pin, the clock pulse of as the 3rd foot and the 2nd IC, which export, to be connected；4th foot and third layer base
The 9th pin of the back side of plate connects, and since the 9th pin is connected with the 1st pin, the data of as the 4th foot and the 2nd IC, which export, to be connected
It connects；5th foot is connected to the 8th pin of the back side of third laminar substrate, i.e. the 5th foot is to export to connect with the data of the 1st the 4th foot of IC；
6th foot is connect with the 7th pin of the back side of third laminar substrate, and as the 6th foot and the 1st the 3rd foot clock pulse of IC output connect；7th foot
It is connect with the 2nd pin GND of the back side of third laminar substrate；2nd IC the 8th, the 9th, the 10th foot respectively with the back side paste red, green, blue
2nd electrode of light LED wafer connects.
6. double-side wick one LED according to claim 1, it is characterised in that: the double-side wick one
The clock pulse and data signals pass order controlled in body LED is to be sent to the back side from the front of every laminar substrate, is resent to next
Double-side wick one LED；Sequence of light is also same.
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| CN111180431A (en) * | 2020-01-06 | 2020-05-19 | 弘凯光电(深圳)有限公司 | Double-sided display packaging structure |
| CN112968023A (en) * | 2021-02-05 | 2021-06-15 | 浙江英特来光电科技有限公司 | LED full-color display device |
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