CN111180431A - Double-sided display packaging structure - Google Patents
Double-sided display packaging structure Download PDFInfo
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- CN111180431A CN111180431A CN202010010332.3A CN202010010332A CN111180431A CN 111180431 A CN111180431 A CN 111180431A CN 202010010332 A CN202010010332 A CN 202010010332A CN 111180431 A CN111180431 A CN 111180431A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000009434 installation Methods 0.000 claims abstract description 9
- 230000009977 dual effect Effects 0.000 claims 9
- 230000001360 synchronised effect Effects 0.000 abstract description 9
- 239000011521 glass Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The application provides a two-sided display packaging structure, including the base plate that has first installation face and second installation face, install a plurality of first luminous bodies on first installation face, install a plurality of second luminous bodies and the control chip on the second installation face, be equipped with first anodal conductive region and first negative pole conductive region on the first installation face, be equipped with second anodal conductive region and second negative pole conductive region on the second installation face. The first positive conductive area is electrically connected with the second positive conductive area, and the first negative conductive area is electrically connected with the second negative conductive area, so that the electric connection of each first luminous body and each second luminous body with the control chip is realized. The control chip can respectively control each first luminous body and each second luminous body, and double-sided and synchronous display of the substrate is achieved. Therefore, two or more sets of display systems are not needed, and the double-sided synchronous display function can be realized by only one set of display system, so that the overall thickness and the production cost of the display equipment can be greatly reduced.
Description
Technical Field
The application belongs to the field of display equipment, and particularly relates to a double-sided display packaging structure.
Background
The conventional LED (Light Emitting Diode) display screen is mounted on a single-sided display package LED to realize single-sided display. If the effect of double-sided display is to be realized, two substrates which are arranged in a stacked manner are needed, the light-emitting units and the circuit arrangement structures are respectively arranged on the opposite side surfaces of the two substrates, namely, the double-sided display can be realized only after two or more sets of display systems are combined and packaged. However, this design has the following disadvantages: the number of display systems increases, increasing the overall thickness and production cost of the display device.
Disclosure of Invention
An object of the embodiment of the present application is to provide a double-sided display package structure, so as to solve the problems of large thickness and high cost of a display screen with double-sided display in the related art.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: a dual-sided display package structure is provided, including:
the front surface of the substrate is a first mounting surface, a first positive conductive area and a first negative conductive area are arranged on the first mounting surface, the back surface of the substrate is a second mounting surface, a second positive conductive area and a second negative conductive area are arranged on the second mounting surface, the first positive conductive area is electrically connected with the second positive conductive area, and the first negative conductive area is electrically connected with the second negative conductive area;
a plurality of first light emitters mounted on the first mounting surface, each of the first light emitters electrically connecting the first positive conductive region and the first negative conductive region, respectively;
the plurality of second luminous bodies are arranged on the second installation surface, and each second luminous body is electrically connected with the second positive electrode conductive area and the second negative electrode conductive area respectively;
and the control chip is arranged on the substrate, is electrically connected with each first luminous body and each second luminous body and is used for controlling each first luminous body and each second luminous body to emit light.
In one embodiment, the first positive conductive region is directly over the second positive conductive region.
In one embodiment, a plurality of the first light emitters are disposed in the first positive conductive region, and a plurality of the second light emitters are disposed in the second positive conductive region.
In one embodiment, the first negative conductive region is directly above the second negative conductive region.
In one embodiment, the first light emitters comprise a first red light emitting unit, a first green light emitting unit and a first blue light emitting unit, and the first negative conductive region comprises a first red negative conductive region, a first green negative conductive region and a first blue negative conductive region; the first red light emitting unit is electrically connected with the first red light cathode conductive region, the first green light emitting unit is electrically connected with the first green light cathode conductive region, the first blue light emitting unit is electrically connected with the first blue light cathode conductive region, and the first red light cathode conductive region, the first green light cathode conductive region and the first blue light cathode conductive region are respectively electrically connected with the control chip.
In one embodiment, the plurality of second light emitters includes a second red light emitting unit, a second green light emitting unit, and a second blue light emitting unit, and the second negative conductive region includes a second red light negative conductive region located directly under the first red light negative conductive region and electrically connected to the first red light negative conductive region, a second green light negative conductive region located directly under the first green light negative conductive region and electrically connected to the first green light negative conductive region, and a second blue light negative conductive region located directly under the first blue light negative conductive region and electrically connected to the first blue light negative conductive region; the second red light emitting unit is electrically connected with the second red light cathode conductive region, the second green light emitting unit is electrically connected with the second green light cathode conductive region, the second blue light emitting unit is electrically connected with the second blue light cathode conductive region, and the second red light cathode conductive region, the second green light cathode conductive region and the second blue light cathode conductive region are respectively electrically connected with the control chip.
In one embodiment, the dual-sided display package structure further includes a first pin assembly mounted on the first mounting surface and a second pin assembly mounted on the second mounting surface, the number of pins included in the first pin assembly is equal to the number of pins included in the second pin assembly, and the pins of the first pin assembly are electrically connected and located opposite to the pins of the second pin assembly.
In one embodiment, the first mounting surface is provided with a first groove, the first lead assembly is exposed out of the outer periphery of the first groove, and the first light emitters are arranged in the first groove; the second mounting surface is provided with a second groove, the second pin assembly is exposed out of the outer periphery of the second groove, and the plurality of second luminous bodies and the control chip are arranged in the second groove.
In one embodiment, one of the pins of the second pin component is electrically connected to the second positive conductive region and is for electrical connection to an external power source.
In one embodiment, the control chip is electrically connected to the second positive conductive region and the remaining pins of the second pin assembly.
One or more technical solutions in the embodiments of the present application have at least one of the following technical effects:
the double-sided display packaging structure provided by the embodiment of the application has the beneficial effects that: compared with the prior art, the first positive conductive area is electrically connected with the second positive conductive area, and the first negative conductive area is electrically connected with the second negative conductive area, so that the electric connection of each first luminous body and each second luminous body with the control chip is realized. When the control chip is connected with an external circuit, the first light-emitting bodies and the second light-emitting bodies can be respectively controlled, and double-sided and synchronous display of the substrate is realized. Therefore, two or more sets of display systems are not needed, and the double-sided synchronous display function can be realized by only one set of display system, so that the overall thickness and the production cost of the display equipment can be greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic front-side structure diagram of a dual-sided display package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a backside structure of a dual-sided display package structure according to an embodiment of the present disclosure;
fig. 3 is a schematic side view of a dual-sided display package structure according to an embodiment of the present disclosure;
fig. 4 is a schematic side view of a double-sided display package structure and a glass substrate according to an embodiment of the present disclosure.
Wherein, in the drawings, the reference numerals are mainly as follows:
1-double-sided display package structure; 11-a substrate; 111-a first mounting face; 112-a second mounting surface; 113-a first groove; 114-a second groove; 12-a first positive conductive region; 13-first negative conductive region; 131-a first red negative conductive region; 132-a first green negative conductive region; 133-a first blue negative conductive region; 14-a second positive conductive region; 15-a second negative conductive region; 151-second red negative conductive region; 152-a second green negative conductive region; 153-a second blue negative conducting region; 16-control chip negative conductive area;
21-a first light emitter; 211-a first red light emitting unit; 212-a first green light emitting unit; 213-a first blue light emitting unit; 22-a second light emitter; 221-a second red light emitting unit; 222-a second green light emitting unit; 223-a second blue light-emitting unit;
31-a first pin; 32-a second pin; 33-a third pin; 34-a fourth pin;
4-a control chip; 5-glass bottom plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 and fig. 2, a dual-sided display package 1 provided in the present application will now be described. The double-sided display packaging structure 1 comprises a substrate 11, wherein the front surface of the substrate 11 is a first mounting surface 111, and a first positive conductive region 12 and a first negative conductive region 13 are arranged on the first mounting surface 111; the back of the substrate 11 is a second mounting surface 112, a second positive conductive area 14 and a second negative conductive area 15 are arranged on the second mounting surface 112, the first positive conductive area 12 is electrically connected with the second positive conductive area 14, and the first negative conductive area 13 is electrically connected with the second negative conductive area 15; the LED lamp further comprises a plurality of first light emitters 21 mounted on the first mounting surface 111, a plurality of second light emitters 22 mounted on the second mounting surface 112, and a control chip 4 for controlling the first light emitters 21 and the second light emitters 22 to emit light. Each of the first light emitters 21 is electrically connected to the first positive conductive region 12 and the first negative conductive region 13, respectively, and each of the second light emitters 22 is electrically connected to the second positive conductive region 14 and the second negative conductive region 15, respectively. The control chip 4 is mounted on the substrate 11, and each of the first light emitters 21 and each of the second light emitters 22 are electrically connected to the control chip 4. The method specifically comprises the following steps: the control chip 4 is electrically connected to the second positive conductive area 14 and the second negative conductive area 15, respectively. The substrate 11 may be a plate material containing metal blocks, which facilitates electrical connection between the first light emitters 21 on the first mounting surface 111, the second light emitters 22 on the second mounting surface 112, and the control chip 4. Wherein the dotted lines in the figure represent metal wires, which realize the electrical connection. With this structure, the first positive conductive region 12 is electrically connected to the second positive conductive region 14, and the first negative conductive region 13 is electrically connected to the second negative conductive region 15, thereby electrically connecting each of the first light emitters 21 and each of the second light emitters 22 to the control chip 4. When the control chip 4 is connected to an external circuit, the first light emitters 21 and the second light emitters 22 can be controlled respectively, so that the substrate 11 can display images on both sides synchronously. Therefore, two or more sets of display systems are not needed, and the double-sided synchronous display function can be realized by only one set of display system, so that the overall thickness and the production cost of the display equipment can be greatly reduced.
In one embodiment, referring to fig. 1 and fig. 2, as an embodiment of the dual-sided display package structure 1 provided in the present application, the first positive conductive region 12 is located right above the second positive conductive region 14. In this structure, the first positive conductive region 12 and the second positive conductive region 14 are electrically connected by a copper block disposed in the substrate 11, where the side of the copper block on the first mounting surface 111 side is the first positive conductive region 12, and the side of the copper block on the second mounting surface 112 side is the second positive conductive region 14. The first positive conductive area 12 and the second positive conductive area 14 are arranged oppositely, so that the first light emitters 21 and the second light emitters 22 can be mounted correspondingly, one-to-one correspondence is realized, and double-sided synchronous display is realized.
In an embodiment, referring to fig. 1 and fig. 2, as a specific implementation of the dual-sided display package structure 1 provided in the present application, a plurality of first light emitters 21 are disposed in the first positive conductive region 12, and a plurality of second light emitters 22 are disposed in the second positive conductive region 14. With this structure, the first light emitters 21 are directly disposed in the first positive electrode conductive region 12, so that the amount of wires used for connecting each first light emitter 21 to the first positive electrode conductive region 12 can be reduced, and the wiring of each first light emitter 21 is facilitated. Similarly, the second light emitters 22 are directly disposed in the second positive conductive area 14, so that the amount of wires connecting the second light emitters 22 and the second positive conductive area 14 can be reduced, and the second light emitters 22 can be conveniently wired.
In an embodiment, referring to fig. 1 and fig. 2, as a specific implementation of the dual-sided display package structure 1 provided in the present application, the first negative conductive region 13 is located directly above the second negative conductive region 15. In this structure, the first negative conductive region 13 and the second negative conductive region 15 are electrically connected by a plurality of copper pillars disposed in the substrate 11, a side surface of the plurality of copper pillars on the first mounting surface 111 side is the first negative conductive region 13, and a side surface of the plurality of copper pillars on the second mounting surface 112 side is the second negative conductive region 15. The first negative conductive region 13 and the second negative conductive region 15 are arranged oppositely, so that the first light emitters 21 and the second light emitters 22 can be mounted correspondingly, one-to-one correspondence is realized, and double-sided synchronous display is realized.
In an embodiment, referring to fig. 1, as a specific implementation of the dual-sided display package structure 1 provided in the present application, the first light emitters 21 include a first red light emitting unit 211, a first green light emitting unit 212, and a first blue light emitting unit 213, and the first negative conductive region 13 includes a first red negative conductive region 131, a first green negative conductive region 132, and a first blue negative conductive region 133; the first red light emitting unit 211 is electrically connected to the first red light cathode conductive region 131, the first green light emitting unit 212 is electrically connected to the first green light cathode conductive region 132, the first blue light emitting unit 213 is electrically connected to the first blue light cathode conductive region 133, and the first red light cathode conductive region 131, the first green light cathode conductive region 132 and the first blue light cathode conductive region 133 are electrically connected to the control chip 4, respectively. In this structure, the first light emitters 21 are divided into the first red light emitting unit 211, the first green light emitting unit 212 and the first blue light emitting unit 213, and are respectively electrically connected to the first red light cathode conductive region 131, the first green light cathode conductive region 132 and the first blue light cathode conductive region 133, so that the control chip 4 can respectively control the first red light emitting unit 211, the first green light emitting unit 212 and the first blue light emitting unit 213, and further respectively control the light emission of the first red light emitting unit 211, the first green light emitting unit 212 and the first blue light emitting unit 213, so as to combine to form color lights of different colors, thereby displaying different display images.
In an embodiment, referring to fig. 2, as a specific implementation manner of the dual-sided display package structure 1 provided by the present application, the plurality of second light emitters 22 include a second red light emitting unit 221, a second green light emitting unit 222, and a second blue light emitting unit 223, the second negative conductive region 15 includes a second red negative conductive region 151 located directly below the first red negative conductive region 131 and electrically connected to the first red negative conductive region 131, a second green negative conductive region 152 located directly below the first green negative conductive region 132 and electrically connected to the first green negative conductive region 132, and a second blue negative conductive region 153 located directly below the first blue negative conductive region 133 and electrically connected to the first blue negative conductive region 133; the second red light emitting unit 221 is electrically connected to the second red light cathode conductive region 151, the second green light emitting unit 222 is electrically connected to the second green light cathode conductive region 152, the second blue light emitting unit 223 is electrically connected to the second blue light cathode conductive region 153, and the second red light cathode conductive region 151, the second green light cathode conductive region 152 and the second blue light cathode conductive region 153 are electrically connected to the control chip 4, respectively. In this structure, the plurality of second light emitters 22 are divided into the second red light emitting unit 221, the second green light emitting unit 222 and the second blue light emitting unit 223, and are respectively electrically connected to the second red light cathode conductive region 151, the second green light cathode conductive region 152 and the second blue light cathode conductive region 153, so that the control chip 4 can respectively control the second red light emitting unit 221, the second green light emitting unit 222 and the second blue light emitting unit 223 to combine to form color lights with different colors, thereby displaying different display images. The electrical connection between the first red negative conductive area 131 and the second red negative conductive area 151, the electrical connection between the first green negative conductive area 132 and the second green negative conductive area 152, and the electrical connection between the first blue negative conductive area 133 and the second blue negative conductive area 153 are implemented by copper pillars disposed in the substrate 11, wherein the side surfaces of the copper pillars on the first mounting surface 111 side are the first red negative conductive area 131, the first green negative conductive area 132, and the first blue negative conductive area 133, and the side surfaces of the copper pillars on the second mounting surface 112 side are the second red negative conductive area 151, the second green negative conductive area 152, and the second blue negative conductive area 153.
In an embodiment, please refer to fig. 1 and fig. 2, as a specific implementation manner of the dual-sided display package structure 1 provided in the present application, the dual-sided display package structure 1 further includes a first pin assembly mounted on the first mounting surface 111 and a second pin assembly mounted on the second mounting surface 112, a number of pins included in the first pin assembly is equal to a number of pins included in the second pin assembly, the pins of the first pin assembly are electrically connected to and located opposite to the pins of the second pin assembly, and the pins of the second pin assembly are electrically connected to the control chip 4. In the structure, the first pin assembly and the second pin assembly are respectively arranged on the first mounting surface 111 and the second mounting surface 112, so that the first pin assembly on the first mounting surface 111 can be attached to the glass bottom plate 5, and the second pin assembly on the second mounting surface 112 can be attached to the glass bottom plate 5, thereby realizing the attachment of the front or back surface of the double-sided display packaging structure 1 to the glass bottom plate 5.
In one embodiment, the first lead assembly includes a first lead 31, a second lead 32, a third lead 33, and a fourth lead 34 mounted on the first mounting surface 111, and the second lead assembly includes a first lead 31, a second lead 32, a third lead 33, and a fourth lead 34 mounted on the second mounting surface 112. The two first pins 31, the two second pins 32, the two third pins 33 and the two fourth pins 34 are respectively and electrically connected, and the first pin 31, the second pin 32, the third pin 33 and the fourth pin 34 on the second mounting surface 112 are respectively and electrically connected with the control chip 4. The first pin 31 may be a power pin for connecting with an external power supply, the second pin 32 may be a data pin for data input, the third pin 33 may be a ground pin for ground protection, and the fourth pin 34 may be a data function pin for data transmission. The double-sided display packaging structure 1 can be matched and connected with an external functional part through the pins. The pins of the first pin assembly are electrically connected to the pins of the second pin assembly through copper pillars respectively disposed in the substrate 11.
In an embodiment, referring to fig. 3, as a specific implementation of the dual-sided display package structure 1 provided in the present application, a first groove 113 is formed on the first mounting surface 111, the first lead assembly is exposed outside an outer periphery of the first groove 113, for example, an outer periphery of a top surface of the first groove 113, and the plurality of first light emitters 21 are disposed in the first groove 113; the second mounting surface 112 is formed with a second groove 114, the second lead assembly is exposed outside an outer periphery of the second groove 114, for example, an outer periphery of a top surface of the second groove 114, and the plurality of second light emitters 22 and the control chip 4 are disposed in the second groove 114. With the structure, accurate positioning and installation of each first luminous body 21 and each second luminous body 22 can be realized; on the other hand, the overall thickness of the dual-sided display package structure 1 can be effectively reduced.
In one embodiment, the dual-sided display package structure 1 further includes a first transparent packaging adhesive (not shown) for packaging the first recess 113 and a second transparent packaging adhesive (not shown) for packaging the second recess 114. With the structure, the first light emitters 21, the second light emitters 22 and the control chip 4 can be packaged and fixed respectively, so that the risk of damage caused by leakage of the first light emitters 21, the second light emitters 22 and the control chip 4 is avoided.
In an embodiment, referring to fig. 2, as an embodiment of the dual-sided display package structure 1 provided in the present application, one of the pins of the second pin assembly is electrically connected to the second positive conductive region 14 and is used for being electrically connected to an external power source. With this structure, the first lead 31 of the second lead assembly is electrically connected to the second positive conductive region 14 on the second mounting surface 112, so that the second lead assembly can be electrically connected to an external power source. Thereby also electrically connecting the first positive conductive region 12 to an external power source.
In an embodiment, referring to fig. 2, as an embodiment of the dual-sided display package structure 1 provided in the present application, the control chip 4 is electrically connected to the second positive conductive region 14 and the remaining pins of the second pin assembly. In the structure, on the second mounting surface 112, the control chip 4 is electrically connected with the second pin 32, the third pin 33 and the fourth pin 34 of the second pin assembly respectively; the control chip 4 is electrically connected to the second positive conductive area 14, and the second positive conductive area 14 is electrically connected to the first pin 31 of the second pin assembly, so that the control chip 4 is electrically connected to the first pin 31 of the second pin assembly. In addition, a control chip negative electrode conductive area 16 can be disposed on the second mounting surface 112, the control chip 4 is mounted on the control chip negative electrode conductive area 16, the control chip negative electrode conductive area 16 is connected to the third pin 33, and the control chip 4 is electrically connected to the control chip negative electrode conductive area 16 through a metal wire, so as to be electrically connected to the third pin 33.
Referring to fig. 4, the present application further provides a display panel, which employs a plurality of the above dual-sided display package structures 1, specifically, a plurality of dual-sided display package structures 1 are mounted on a glass substrate 5 at intervals. In fig. 4, the solid line indicates the exit direction of the light.
The application provides a two-sided display packaging structure 1 has following beneficial effect:
1. the double-sided display package structure 1 can simultaneously control the plurality of first light emitters 21 on the first mounting surface 111 and the plurality of second light emitters 22 on the second mounting surface 112 of the substrate 11 through the control chip 4, so as to realize double-sided synchronous display of the double-sided display package structure 1. Compared with the traditional double-sided display system, the double-sided display packaging structure has the advantages that the use number of the luminous sources and the control system can be reduced, double-sided synchronous display can be realized by one set of display system, and further the overall thickness and the production cost of the double-sided display packaging structure 1 and the display panel can be reduced.
2. The display panel is provided with a plurality of double-sided display packaging structures 1 on a glass bottom plate 5, and double-sided display can be realized on the glass bottom plate 5 through one glass bottom plate 5 with a single-sided circuit.
3. Double-sided display can be realized through one glass bottom plate 5 and the double-sided display packaging structures 1, reflection of a light emitting surface between the two glass bottom plates 5 can be effectively reduced, and the double-sided display effect is further improved.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. Two-sided display packaging structure, its characterized in that includes:
the front surface of the substrate is a first mounting surface, a first positive conductive area and a first negative conductive area are arranged on the first mounting surface, the back surface of the substrate is a second mounting surface, a second positive conductive area and a second negative conductive area are arranged on the second mounting surface, the first positive conductive area is electrically connected with the second positive conductive area, and the first negative conductive area is electrically connected with the second negative conductive area;
a plurality of first light emitters mounted on the first mounting surface, each of the first light emitters electrically connecting the first positive conductive region and the first negative conductive region, respectively;
the plurality of second luminous bodies are arranged on the second installation surface, and each second luminous body is electrically connected with the second positive electrode conductive area and the second negative electrode conductive area respectively;
and the control chip is arranged on the substrate, is electrically connected with each first luminous body and each second luminous body and is used for controlling each first luminous body and each second luminous body to emit light.
2. The dual sided display package of claim 1, wherein: the first positive conductive region is located directly above the second positive conductive region.
3. The dual sided display package of claim 2, wherein: the first light emitters are arranged in the first positive electrode conductive area, and the second light emitters are arranged in the second positive electrode conductive area.
4. The dual sided display package of claim 1, wherein: the first negative conductive region is located directly above the second negative conductive region.
5. The dual sided display package of claim 4, wherein: the first light emitters comprise a first red light emitting unit, a first green light emitting unit and a first blue light emitting unit, and the first negative conductive region comprises a first red negative conductive region, a first green negative conductive region and a first blue negative conductive region; the first red light emitting unit is electrically connected with the first red light cathode conductive region, the first green light emitting unit is electrically connected with the first green light cathode conductive region, the first blue light emitting unit is electrically connected with the first blue light cathode conductive region, and the first red light cathode conductive region, the first green light cathode conductive region and the first blue light cathode conductive region are respectively electrically connected with the control chip.
6. The dual sided display package of claim 5, wherein: the plurality of second light-emitting bodies comprise a second red light emitting unit, a second green light emitting unit and a second blue light emitting unit, the second negative conductive region comprises a second red light negative conductive region which is positioned under the first red light negative conductive region and electrically connected with the first red light negative conductive region, a second green light negative conductive region which is positioned under the first green light negative conductive region and electrically connected with the first green light negative conductive region, and a second blue light negative conductive region which is positioned under the first blue light negative conductive region and electrically connected with the first blue light negative conductive region; the second red light emitting unit is electrically connected with the second red light cathode conductive region, the second green light emitting unit is electrically connected with the second green light cathode conductive region, the second blue light emitting unit is electrically connected with the second blue light cathode conductive region, and the second red light cathode conductive region, the second green light cathode conductive region and the second blue light cathode conductive region are respectively electrically connected with the control chip.
7. The dual sided display package of claim 1, wherein: the double-sided display packaging structure further comprises a first pin assembly and a second pin assembly, the first pin assembly is mounted on the first mounting surface, the second pin assembly is mounted on the second mounting surface, the number of a plurality of pins contained in the first pin assembly is equal to the number of a plurality of pins contained in the second pin assembly, the plurality of pins of the first pin assembly are electrically connected with the plurality of pins of the second pin assembly respectively, the pins of the second pin assembly are electrically connected with the control chip respectively, and the pins of the second pin assembly are electrically connected with the control chip respectively.
8. The dual sided display package of claim 7, wherein: the first mounting surface is provided with a first groove, the first pin assembly is exposed out of the outer periphery of the first groove, and the first light emitters are arranged in the first groove; the second mounting surface is provided with a second groove, the second pin assembly is exposed out of the outer periphery of the second groove, and the plurality of second luminous bodies and the control chip are arranged in the second groove.
9. The dual sided display package of claim 7, wherein: one of the pins of the second pin component is electrically connected with the second anode conductive area and is used for being electrically connected with an external power supply.
10. The dual sided display package of claim 9, wherein: the control chip is electrically connected to the second positive conductive region and the rest of the pins of the second pin assembly.
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| CN202010010332.3A CN111180431B (en) | 2020-01-06 | 2020-01-06 | Double-sided display packaging structure |
| TW109105469A TWI764096B (en) | 2020-01-06 | 2020-02-20 | Double-sided display package structure |
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| CN202010010332.3A CN111180431B (en) | 2020-01-06 | 2020-01-06 | Double-sided display packaging structure |
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| CN111180431B CN111180431B (en) | 2022-03-15 |
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Also Published As
| Publication number | Publication date |
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| TW202127703A (en) | 2021-07-16 |
| CN111180431B (en) | 2022-03-15 |
| TWI764096B (en) | 2022-05-11 |
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