CN208538853U - Light emitting module - Google Patents
Light emitting module Download PDFInfo
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- CN208538853U CN208538853U CN201821369222.0U CN201821369222U CN208538853U CN 208538853 U CN208538853 U CN 208538853U CN 201821369222 U CN201821369222 U CN 201821369222U CN 208538853 U CN208538853 U CN 208538853U
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- emitting diode
- backlight unit
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Abstract
A kind of light emitting module, it includes an insulating bodies, a substrate, at least a luminescence unit and a driving chip.The reciprocal both ends of insulating body have been recessed the first groove and the second groove respectively, substrate is set in insulating body, substrate exposes respectively in the first groove and the second groove the first mounting surface and the second mounting surface, first mounting surface and the second mounting surface are reciprocally arranged, and luminescence unit and driving chip are respectively arranged at the first mounting surface and the second mounting surface.The light emitting module of the utility model through luminescence unit and driving chip is arranged vertically up and down, and can reduce the size of light emitting module entirety.
Description
Technical field
The utility model relates to a kind of light emitting module, especially a kind of inside includes the light emitting module of driving chip.
Background technique
Existing inside includes the LED unit for controlling chip, due to controlling the setting of chip, therefore, it is impossible to by widely
Applied in the electronic device of small size.But inside include control chip LED unit, in terms of compared to
Tradition is set to chip is controlled outside LED unit, and is had and is facilitated the advantages such as control.Therefore, for the related dealer of LED unit and
Speech becomes one of the problem of pole need to be enhanced in this way, reducing the internal LED unit with control chip.
Utility model content
The main purpose of the utility model is to provide a kind of light emitting modules, to improve in the prior art, enclosed inside
The problem of having the light emitting module size of control chip can not reduce again.
To achieve the goals above, the utility model provides a kind of light emitting module, it includes: an insulating body, each other
Opposite both ends have been recessed one first groove and one second groove respectively, are filled with a light transmission glue in first groove
Body, second groove are filled with a packing colloid；One substrate is set in the insulating body, reciprocal width side
Face is respectively defined as one first mounting surface and one second mounting surface, and the first mounting surface correspondence exposes to first groove,
The second mounting surface correspondence exposes to second groove, includes multiple conductive channels in the substrate；At least one shines
Unit is fixedly installed on first mounting surface, and the luminescence unit is corresponding in first groove, and the hair
Light unit is coated by the light transmission colloid；One control chip, is fixedly installed on second mounting surface, the control chip
It being electrically connected by multiple conductive channels with the luminescence unit, the control chip is coated in the packing colloid,
And the control chip does not expose to the insulating body or the packing colloid；Multiple pins expose to the insulation originally
In vitro, the part pin is electrically connected with the luminescence unit, and the part pin is electrically connected with the control chip；Wherein,
The control chip can receive external control device and pass through the electric signal that the pin is transmitted, to control the luminescence unit institute
The brightness or colour temperature of the light beam of sending.
Preferably, the luminescence unit is through multiple plain conductors and the conductive fabric knot for being formed in first mounting surface
Structure electrical connection；Alternatively, the luminescence unit is mutually interconnected through welding body with the multiple weld pads being set on first mounting surface
It connects.
Preferably, the control chip is through multiple plain conductors and the conductive fabric knot for being set to second mounting surface
Structure electrical connection；Alternatively, the control chip is mutually interconnected through welding body with the multiple weld pads being set on second mounting surface
It connects.
Preferably, the packing colloid is translucent construction.
Preferably, the packing colloid is impermeable photo structure.
Preferably, light emitting module tool is there are three the luminescence unit, be respectively one first light-emitting diode chip for backlight unit,
One second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, first light-emitting diode chip for backlight unit can issue wavelength
610 nanometers to 780 nanometers of light beam；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength of light
Beam；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength of light beam；First light emitting diode
The range of exposures energy of any of chip, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit and its
The range of exposures of at least one of remaining light-emitting diode chip for backlight unit partly overlaps；First light-emitting diode chip for backlight unit, described
The light beam that two light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued, can be mutually mixed as a light mixing light
Beam；The control chip can receive external control device and pass through the electric signal that the pin is transmitted, described mixed with corresponding control
The brightness or colour temperature of light light beam.
To achieve the goals above, the utility model also provides a kind of light emitting module, it includes: an insulating body, that
This opposite both ends has been recessed one first groove and one second groove respectively, is filled with a light transmission glue in first groove
Body, second groove are filled with a packing colloid；Multiple lead frames, each reciprocal two sides of lead frame, point
It is not exposed to first groove and second groove, and the part of each lead frame exposes to the insulating body；
Multiple luminescence units, are fixedly installed on the part that multiple lead frames are exposed to first groove, and multiple hairs
Light unit is corresponding to be located in first groove, and each luminescence unit passes through multiple first plain conductors and at least part
The lead frame electrical connection；Multiple luminescence units and multiple first plain conductors are coated by the light transmission colloid；
One control chip, is fixedly installed on the part that multiple lead frames are exposed to second groove, and the control chip is logical
Multiple second plain conductors are crossed to be electrically connected at least part of lead frame；Multiple luminescence units and multiple described
Two plain conductors are coated by the packing colloid；The control chip passes through multiple second plain conductors and each described the
The lead frame that two plain conductors are electrically connected, and be electrically connected with multiple luminescence units；Wherein, the control chip energy
It receives external control device and passes through the electric signal that multiple lead frames are transmitted, control each luminescence unit institute with corresponding
The brightness or colour temperature of the light beam of sending.
Preferably, the packing colloid is translucent construction.
Preferably, the packing colloid is impermeable photo structure.
Preferably, light emitting module tool is there are three the luminescence unit, be respectively one first light-emitting diode chip for backlight unit,
One second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, first light-emitting diode chip for backlight unit can issue wavelength
610 nanometers to 780 nanometers of light beam；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength of light
Beam；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength of light beam；First light emitting diode
The range of exposures energy of any of chip, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit and its
The range of exposures of at least one of remaining light-emitting diode chip for backlight unit partly overlaps；First light-emitting diode chip for backlight unit, described
The light beam that two light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued, can be mutually mixed as a light mixing light
Beam；The control chip can receive external control device and pass through the electric signal that the lead frame is transmitted, described in corresponding control
The brightness or colour temperature of light mixing light beam.
The beneficial effects of the utility model can be: be set to substrate or more through making to control chip and luminescence unit
The design of a reciprocal two sides of lead frame can will substantially reduce the size of light emitting module entirety.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the first embodiment of the light emitting module of the utility model.
Fig. 2 is the stereoscopic schematic diagram of another angle of the first embodiment of the light emitting module of the utility model.
Fig. 3 is the diagrammatic cross-section of the first embodiment of the light emitting module of the utility model.
Fig. 4 is the diagrammatic cross-section of the second embodiment of the light emitting module of the utility model.
Fig. 5 is the partial enlargement diagram of Fig. 4.
Fig. 6 is the stereoscopic schematic diagram of the 3rd embodiment of the light emitting module of the utility model.
Fig. 7 is the diagrammatic cross-section of the 3rd embodiment of the light emitting module of the utility model.
Fig. 8 is the stereoscopic schematic diagram of the fourth embodiment of the light emitting module of the utility model.
Fig. 9 is the diagrammatic cross-section of the fourth embodiment of the light emitting module of the utility model.
Figure 10 is the flow diagram of the first embodiment of the production method of the light emitting module of the utility model.
Figure 11 is the flow diagram of the second embodiment of the production method of the light emitting module of the utility model.
Figure 12 is the flow diagram of the 3rd embodiment of the production method of the light emitting module of the utility model.
Figure 13 is the flow diagram of the fourth embodiment of the production method of the light emitting module of the utility model.
Specific embodiment
Also referring to Fig. 1 to Fig. 3, Fig. 1 and Fig. 2 illustrate for the three-dimensional of light emitting module first embodiment of the utility model
Figure；Fig. 3 is the diagrammatic cross-section of the first embodiment of the light emitting module of the utility model.As shown, light emitting module 100 includes
13, three one insulating body 10, substrate luminescence units 14, one control chip 15 and four pins 16.
The reciprocal both ends of insulating body 10 have been recessed one first groove 10a and one second groove 10b respectively, the
A light transmission colloid 11 is filled in one groove 10a, the second groove is filled with a packing colloid 12.In practical applications, first is recessed
The external form of slot 10a and the second groove 10b can be according to changes in demand, and as shown in the figure is only a wherein embodiment；Described first
Groove 10a and the second groove 10b are not interconnected substantially, and but not limited to this.In practical applications, the first groove is formed
The side wall of 10a, which can be, is provided with reflecting layer (not shown), and the side wall for forming the first groove 10a is also possible to be rendered as tilting
Shape, in this way, the light beam that guiding luminescence unit 14 will can be assisted to be issued.
Substrate 13 is set in insulating body 10, and 13 reciprocal two broad side surfaces of substrate are respectively defined as one first peace
Dress face 131 and one second mounting surface 132, the corresponding bottom for exposing to the first groove 10a of the first mounting surface 131, the second mounting surface
The 132 corresponding bottoms for exposing to the second groove 10b.As shown in figure 3, including multiple conductive channels 133 in substrate 13.It is specific next
It says, substrate 13 may be any type of circuit board, and the first mounting surface 131 and the second mounting surface 132 can be according to demand
In a manner of etching etc., it is formed with the structures such as conducting wiring structure (Layout) and multiple weld pads, and the conductive channel 133 can be with
It is the perforation by being formed in substrate 13, and the conductive material being filled in perforation is constituted.About the first mounting surface 131 and second
It is formed by the structures such as conducting wiring structure and weld pad on mounting surface 132, can be the type according to luminescence unit 14, shine list
The design such as 16 quantity of pin of the quantity of member 14, the type for controlling chip 15 and light emitting module 100, it is without restriction in this.It closes
Quantity and its setting position in conductive channel 133, can be and be set to substrate 13 according to control chip 15 and luminescence unit 14
On position and determine.Wherein, control chip 15 for example can be the driving chip for driving luminescence unit 14 to light, or
It can be various microprocessor.
As shown in Figures 3 and 4, three luminescence units 14 are fixedly installed on the first mounting surface 131, and each luminescence unit 14
By multiple plain conductors 141, and be electrically connected with the conducting wiring structure on the first mounting surface 131, and with leading in substrate 13
Electric channel 133 is electrically connected.Three luminescence units 14 for being fixed on the first mounting surface 131 are corresponding in the first groove 10a, and three
A luminescence unit 14 is coated by light transmission colloid 11, and the light beam that three luminescence units 14 are issued, and can pass through light transmission colloid 11
To project outward.
In practical applications, three luminescence units 14 can be respectively one first light-emitting diode chip for backlight unit, one second shine
Diode chip for backlight unit and a third light-emitting diode chip for backlight unit, the first light-emitting diode chip for backlight unit can issue 610 nanometers to 780 nanometers of wavelength
Light beam；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength of light beam；Third light-emitting diode chip for backlight unit
450 nanometers to 495 nanometers of wavelength of light beam can be issued；That is, three luminescence units 14 can be can issue respectively feux rouges, green light and
The light beam of blue light.Any in first light-emitting diode chip for backlight unit, the second light-emitting diode chip for backlight unit and third light-emitting diode chip for backlight unit
A range of exposures can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit, and first luminous two
The light beam that pole pipe chip, the second light-emitting diode chip for backlight unit and third light-emitting diode chip for backlight unit are issued, can be mutually mixed as one
Light mixing light beam.Illustrate, it includes any luminescence chip that luminescence unit 14, which can be, can e.g. issue infrared ray,
The luminescence chip of UV light, the wavelength that above-mentioned lifted each light-emitting diode chip for backlight unit can issue are only a wherein embodiment.
It in this present embodiment, is for capable of issuing different luminescence units 14 by three, but not limited to this, specific
In embodiment, light emitting module 100 can be above or two luminescence units 14 below there are four tools, and 14 institute of luminescence unit
The light beam wavelength that can be issued, and be not limited with above-mentioned, it can be selected according to demand.
Control chip 15 is fixedly installed on the second mounting surface 132, and controls chip 15 and pass through multiple plain conductors 151 and the
Conducting wiring structure electrical connection on two mounting surfaces 132, and controlling chip 15 can be by the conductive channel 133 and three in substrate 13
A luminescence unit 14 is electrically connected.It is corresponding in the second groove 10b to control chip 15, and controls chip 15 and is coated on packaging plastic
In body 12, and controlling chip 15 is not expose to insulating body 10 or packing colloid 12.Wherein, packing colloid 12 can be impermeable
Photo structure or translucent construction, it is without restriction in this.
Second groove 10b is only and control chip 15 can be corresponded to and be set to keep the second mounting surface 132 of substrate 13 exposed
It is placed on the second mounting surface 132, therefore, the size and external form of the second groove 10b, the generally size according to control chip 15 are set
Meter, and the relativeness that the size of the second groove 10b, external form be not absolute with size, the external form of the first groove 10a.In this way,
It is located at the lower section of the first groove 10a with making the second groove 10b face, can will effectively reduces the overall dimensions of light emitting module 100.
As shown in Fig. 2, multiple pins 16 expose to outside insulating body 10, part pin 16 is electrically connected with luminescence unit 14,
Part pin 16 is electrically connected with control chip 15；Wherein, pin 16 can be leading on the first mounting surface 131 by substrate 13
Electrical wiring structure, conducting wiring structure and multiple conductive channels 133 on the second mounting surface 132, with multiple luminescence units 14 and
Chip 15 is controlled to be electrically connected.Illustrate, in this signified pin 16 be for making light emitting module 100 be welded in correlation
The structure of electronic component；In specifically practicing, pin 16 can be the structure extended by substrate 13 or pin 16
Can be independently of the metal component of substrate 13, and one end of pin 16 is affixed on substrate 13, the other end of pin 16 is then
Correspondence exposes to outside insulating body 10.Wherein, control chip 15 can receive the electricity that external control device is transmitted by pin 16
Signal, to control the brightness or colour temperature of the light beam that luminescence unit 14 is issued.About the quantity and its external form of pin 16, can be
According to changes in demand, not to be limited as shown in the figure.
Referring to Figure 4 together and Fig. 5, Fig. 4 be the utility model light emitting module second embodiment diagrammatic cross-section,
Fig. 5 is the partial enlargement diagram of Fig. 4.As shown, the present embodiment is with previous embodiment maximum difference: each luminous list
Member 14, which can be, to be connected with each other through welding body 142 with the multiple weld pads 134 being set on the first mounting surface 131, and controls core
Piece 15 is also possible to be connected with each other through welding body 142 with the multiple weld pads 134 being set on the second mounting surface 132.Wherein, if
Multiple weld pads 134 of the first mounting surface 131 and the second mounting surface 132 are placed in, are and the conductive channel 133 that is set in substrate 13
Electrical connection.
Specifically, it during actual installation luminescence unit 14 and control chip 15, can be in luminescence unit 14
And solder sphere (such as tin ball) is set on the control position to be electrically connected of chip 15, then will directly be provided with the hair of solder sphere
Light unit 14 and control chip 15, the multiple weld pads 134 being correspondingly arranged on the first mounting surface 131 and the second mounting surface 132, and
Afterwards again to solder sphere carry out curing operation, between luminescence unit 14 and weld pad 134 control chip 15 and weld pad 134 between
Form the welding body 142；In this way, manufacture is by without using plain conductor described in previous embodiment, so as to substantially
It promotes luminescence unit 14 or controls the yield that chip 15 is correctly installed on substrate 13.
It illustrates, in practical applications, luminescence unit 14 and control chip 15 can be according to actual production system
Demand when making, and be installed on substrate 13 in a manner of the present embodiment or in a manner of previous embodiment respectively；Citing comes
It says, in the same light emitting module 100, can be is electrically connected luminescence unit 14 with substrate 13 by multiple plain conductors 141, and
It is electrically connected control chip 15 with substrate 13 by multiple welding bodies 142；Alternatively, the same light emitting module 100 is also possible to make
Luminescence unit 14 is electrically connected by multiple welding bodies 142 with substrate 13, and make to control chip 15 by multiple plain conductors 151 with
Substrate 13 is electrically connected.
Showing for the 3rd embodiment of the light emitting module of the utility model is shown as to Fig. 9, Fig. 6 and Fig. 7 referring to Figure 6 together
It is intended to；Fig. 8 and Fig. 9 is shown as the schematic diagram of the fourth embodiment of the light emitting module of the utility model.As shown in fig. 6, this implementation
Example is with previous embodiment maximum difference: light emitting module 100, which can not include, above-mentioned substrate 13, and light emitting module 100
Being includes multiple lead frames 17 (lead frame).Illustrate to be illustrated only for lead frame 17 below, remaining component please join
Previous embodiment explanation is read, is repeated no more in this.
The reciprocal two sides of each lead frame 17 are exposed to the first groove 10a and the second groove 10b respectively, and each
The part of a lead frame 17 exposes to insulating body 10, using the pin 16 contained as previous embodiment；About the detailed of pin 16
It describes in detail bright, please refers to previous embodiment, repeated no more in this.
Multiple luminescence units 14 are fixedly installed on the part that multiple lead frames 17 are exposed to the first groove 10a, and multiple hairs
Light unit 14 is corresponding to be located in the first groove 10a, and each luminescence unit 14 passes through multiple first plain conductors 141 and at least one
The lead frame 17 divided is electrically connected.Wherein, multiple luminescence units 14 and multiple first plain conductors 141 are wrapped by light transmission colloid 11 together
It covers.About the quantity of lead frame 17, it can be the quantity according to luminescence unit 14 and control the type decision of chip 15, not in this
It limits, such as can be 4,6,8 etc..
Control chip 15 is fixedly installed on the part that multiple lead frames 17 are exposed to the second groove 10b, and control chip 15 is logical
Multiple second plain conductors 151 are crossed to be electrically connected at least part of lead frame 17.Control chip 15 and multiple second metals are led
Line 151 is packaged the cladding of colloid 12.It controls chip 15 and passes through multiple second plain conductors 151 and each second plain conductor 151
The lead frame 17 being electrically connected, and be electrically connected with multiple luminescence units 14.Whereby, control chip 15 can receive external control device
The electric signal transmitted by multiple lead frames 17, with the corresponding brightness for controlling the light beam that each luminescence unit 14 is issued or color
Temperature.
As can be seen from figures 8 and 9, the external form for exposing to the lead frame 18 outside insulating body 10 can be according to changes in demand,
It is not limited to shown in Fig. 6 and Fig. 7.Specifically, the welding surface 181 of lead frame 18, can be substantially with light emitting module 100 go out
Smooth surface flushes.
Referring to Fig. 10, its process signal for the first embodiment of the production method of the light emitting module of the utility model
Figure.The production method of the light emitting module of the utility model comprises the steps of:
One substrate manufacture step S11: in reciprocal two broad side surfaces of a substrate be respectively formed multiple first weld pads and
Multiple second weld pads, and multiple conductive channels are formed in substrate, and at least part of first weld pad is enable to lead by multiple
Electric channel is electrically connected at least part of second weld pad；
One insulating body forming step S12: make the part of insulating materials cladding substrate, to form an insulating body, absolutely
The reciprocal both ends of edge ontology have been recessed one first groove and one second groove respectively；
One die bond step S13: at least luminescence unit for being fixed with multiple solder spheres is fixedly welded on multiple first welderings
Pad；
One light transmission colloid forming step S14: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove；
One control chip fixing step S15: the control chip that will be fixed with multiple solder spheres is fixedly welded on multiple the
Two weld pads；
One packing colloid forming step S16: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove.
Figure 11 is please referred to, is the process signal of the second embodiment of the production method of the light emitting module of the utility model
Figure.
One substrate manufacture step S21: in reciprocal two broad side surfaces of a substrate be respectively formed multiple first weld pads and
Multiple second weld pads, and multiple conductive channels are formed in substrate, and at least part of first weld pad is enable to lead by multiple
Electric channel is electrically connected at least part of second weld pad；
One insulating body forming step S22: make the part of insulating materials cladding substrate, to form an insulating body, absolutely
The reciprocal both ends of edge ontology have been recessed one first groove and one second groove respectively；
One control chip fixing step S23: the control chip that will be fixed with multiple solder spheres is fixedly welded on multiple the
Two weld pads；
One packing colloid forming step S24: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove；
One die bond step S25: at least luminescence unit for being fixed with multiple solder spheres is fixedly welded on multiple first welderings
Pad；
One light transmission colloid forming step S26: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove.
About the reciprocal two wide sides of substrate alleged in aforesaid substrate making step S11 and substrate manufacture step S21
Face, alleged first mounting surface and the second mounting surface as in previous embodiment；Aforesaid substrate making step S11 and substrate manufacture step
Alleged multiple first weld pads and multiple second weld pads in rapid S21, as meaning is respectively arranged at the first installation in previous embodiment
The weld pad of face and the second mounting surface.About the first mounting surface, the second mounting surface and the weldering being arranged in previous embodiment
Pad etc. is related to implement explanation, is also similarly applied in the present embodiment.Pass through the production of the light emitting module of above-mentioned the utility model
Light emitting module produced by the first embodiment and second embodiment of method, i.e., as shown in Figure 4.
Figure 12 is please referred to, is the process signal of the 3rd embodiment of the production method of the light emitting module of the utility model
Figure.
One pedestal forming step S31: so that an insulating materials is coated multiple lead frames, and make insulating body reciprocal two
Indent has one first groove and one second groove respectively at end, and it is recessed that each reciprocal two sides of lead frame are exposed to first respectively
Slot and the second groove, and the part of each lead frame exposes to insulating body；
One die bond step S32: multiple light-emitting diode chip for backlight unit are fixed on multiple lead frames and are exposed in the first groove
Part, and it is located at multiple light-emitting diode chip for backlight unit in the first groove；
One routing step S33: make multiple light-emitting diode chip for backlight unit by multiple plain conductors, be electrically connected with multiple lead frames
It connects, so that multiple light-emitting diode chip for backlight unit are electrically connected with multiple lead frames；
One light transmission colloid forming step S34: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove；
One control chip fixing step S35: a control chip is fixed on multiple lead frames and is exposed in the first groove
Part, and it is located at control chip in the second groove；
One routing step S36: make to control chip by multiple plain conductors, be electrically connected with multiple lead frames, and make to control
Chip can be electrically connected by lead frame with multiple institute's light-emitting diode chip for backlight unit；
One packing colloid forming step S37: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove.
Figure 13 is please referred to, is the process signal of the fourth embodiment of the production method of the light emitting module of the utility model
Figure.
One pedestal forming step S41: making an insulating materials coat multiple lead frames, to form an insulation in the lead frame
Ontology, indent has one first groove and one second groove respectively at insulating body reciprocal both ends, each lead frame phase each other
Anti- two sides are exposed to the first groove and the second groove respectively, and the part of each lead frame exposes to insulating body；
One control chip fixing step S42: a control chip is fixed on multiple lead frames and is exposed in the first groove
Part, and it is located at control chip in the second groove；
One routing step S43: make to control chip by multiple plain conductors, be electrically connected with multiple lead frames, and make to control
Chip can be electrically connected by lead frame with multiple institute's light-emitting diode chip for backlight unit；
One packing colloid forming step S44: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove；
One die bond step S45: multiple light-emitting diode chip for backlight unit are fixed on multiple lead frames and are exposed in the first groove
Part, and it is located at multiple light-emitting diode chip for backlight unit in the first groove；
One routing step S46: make multiple light-emitting diode chip for backlight unit by multiple plain conductors, be electrically connected with multiple lead frames
It connects, so that multiple light-emitting diode chip for backlight unit are electrically connected with multiple lead frames；
One light transmission colloid forming step S47: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove.
Made by 3rd embodiment and fourth embodiment by the production method of the light emitting module of above-mentioned the utility model
Light emitting module out, i.e., as shown in Fig. 6 to Fig. 9；Relatively, recorded in the previous embodiment corresponding to Fig. 6 to Fig. 9
Related embodiment, can also be applied in the present embodiment.
Claims (10)
1. a kind of light emitting module, which is characterized in that the light emitting module includes:
One insulating body, reciprocal both ends have been recessed one first groove and one second groove respectively, and described first is recessed
A light transmission colloid is filled in slot, second groove is filled with a packing colloid；
One substrate is set in the insulating body, and the reciprocal broad side surface of the substrate is respectively defined as one first peace
Dress face and one second mounting surface, first mounting surface is corresponding to expose to first groove, and second mounting surface is corresponding outer
It is exposed to second groove, includes multiple conductive channels in the substrate；
An at least luminescence unit is fixedly installed on first mounting surface, and the luminescence unit is corresponding recessed positioned at described first
In slot, and the luminescence unit is coated by the light transmission colloid；
One control chip, is fixedly installed on second mounting surface, and the control chip passes through multiple conductive channels and institute
Luminescence unit electrical connection is stated, the control chip is coated in the packing colloid, and the control chip does not expose to institute
State insulating body or the packing colloid；
Multiple pins expose to outside the insulating body, and the part pin is electrically connected with the luminescence unit, connect described in part
Foot is electrically connected with the control chip；
Wherein, the control chip can receive the electric signal that external control device is transmitted by the pin, described in control
The brightness or colour temperature for the light beam that luminescence unit is issued.
2. light emitting module according to claim 1, which is characterized in that the luminescence unit penetrates multiple plain conductors and shape
The conducting wiring structure of first mounting surface described in Cheng Yu is electrically connected；Alternatively, the luminescence unit is through welding body and is set to institute
The multiple weld pads stated on the first mounting surface are connected with each other.
3. light emitting module according to claim 1, which is characterized in that the control chip penetrates multiple plain conductors and sets
It is placed in the conducting wiring structure electrical connection of second mounting surface；Alternatively, the control chip is through welding body and is set to institute
The multiple weld pads stated on the second mounting surface are connected with each other.
4. light emitting module according to claim 1, which is characterized in that the packing colloid is translucent construction.
5. light emitting module according to claim 1, which is characterized in that the packing colloid is impermeable photo structure.
6. light emitting module according to claim 1, which is characterized in that there are three the luminous lists for the light emitting module tool
Member, respectively one first light-emitting diode chip for backlight unit, one second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, it is described
First light-emitting diode chip for backlight unit can issue 610 nanometers to 780 nanometers of wavelength of light beam；Second light-emitting diode chip for backlight unit can be sent out
500 nanometers to 570 nanometers of wavelength of light beam out；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength
Light beam；First light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit
Any of range of exposures can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit；It is described
The light that first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued
Beam can be mutually mixed as a light mixing light beam；The control chip can receive external control device and be transmitted by the pin
Electric signal, with the corresponding brightness or colour temperature for controlling the light mixing light beam.
7. a kind of light emitting module, which is characterized in that the light emitting module includes:
One insulating body, reciprocal both ends have been recessed one first groove and one second groove respectively, and described first is recessed
A light transmission colloid is filled in slot, second groove is filled with a packing colloid；
Multiple lead frames, each reciprocal two sides of lead frame are exposed to first groove and described respectively
Two grooves, and the part of each lead frame exposes to the insulating body；
Multiple luminescence units are fixedly installed on the part that multiple lead frames are exposed to first groove, and multiple described
Luminescence unit is corresponding to be located in first groove, and each luminescence unit passes through multiple first plain conductors and at least one
The lead frame electrical connection divided；Multiple luminescence units and multiple first plain conductors are by the light transmission colloid packet
It covers；
One control chip, is fixedly installed on the part that multiple lead frames are exposed to second groove, the control chip
It is electrically connected by multiple second plain conductors at least part of lead frame；Multiple luminescence units and multiple described
Second plain conductor is coated by the packing colloid；The control chip passes through multiple second plain conductors and each described
The lead frame that second plain conductor is electrically connected, and be electrically connected with multiple luminescence units；
Wherein, the control chip can receive the electric signal that external control device is transmitted by multiple lead frames, with right
The brightness or colour temperature of the light beam that each luminescence unit is issued should be controlled.
8. light emitting module according to claim 7, which is characterized in that the packing colloid is translucent construction.
9. light emitting module according to claim 7, which is characterized in that the packing colloid is impermeable photo structure.
10. light emitting module according to claim 7, which is characterized in that there are three the luminous lists for the light emitting module tool
Member, respectively one first light-emitting diode chip for backlight unit, one second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, it is described
First light-emitting diode chip for backlight unit can issue 610 nanometers to 780 nanometers of wavelength of light beam；Second light-emitting diode chip for backlight unit can be sent out
500 nanometers to 570 nanometers of wavelength of light beam out；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength
Light beam；First light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit
Any of range of exposures can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit；It is described
The light that first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued
Beam can be mutually mixed as a light mixing light beam；The control chip can receive external control device and be passed by the lead frame
The electric signal passed, with the corresponding brightness or colour temperature for controlling the light mixing light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821369222.0U CN208538853U (en) | 2018-08-23 | 2018-08-23 | Light emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821369222.0U CN208538853U (en) | 2018-08-23 | 2018-08-23 | Light emitting module |
Publications (1)
| Publication Number | Publication Date |
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| CN208538853U true CN208538853U (en) | 2019-02-22 |
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| CN (1) | CN208538853U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180431A (en) * | 2020-01-06 | 2020-05-19 | 弘凯光电(深圳)有限公司 | Double-sided display packaging structure |
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2018
- 2018-08-23 CN CN201821369222.0U patent/CN208538853U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180431A (en) * | 2020-01-06 | 2020-05-19 | 弘凯光电(深圳)有限公司 | Double-sided display packaging structure |
| CN111180431B (en) * | 2020-01-06 | 2022-03-15 | 弘凯光电(深圳)有限公司 | Double-sided display packaging structure |
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