CN103390717B - Lamination LED illuminating module and manufacture method - Google Patents
Lamination LED illuminating module and manufacture method Download PDFInfo
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- CN103390717B CN103390717B CN201310327066.7A CN201310327066A CN103390717B CN 103390717 B CN103390717 B CN 103390717B CN 201310327066 A CN201310327066 A CN 201310327066A CN 103390717 B CN103390717 B CN 103390717B
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Abstract
A kind of lamination LED illuminating module, comprise upper strata encapsulation and lower floor's encapsulation, upper strata encapsulation comprises LED and upper substrate, upper substrate offers through hole, upper substrate surface is provided with metal level, lower floor's encapsulation comprises infrabasal plate and circuit element, circuit element is fixed on infrabasal plate, infrabasal plate upper surface is provided with metal level, infrabasal plate offers blind slot, soldering-tin layer is provided with between through hole and blind slot, this patent further provides a kind of method manufacturing above-mentioned LED illuminating module, by soldered ball positioning action, achieve the mechanical Alignment Method of upper substrate and infrabasal plate, reduce cost, decrease size, simplify the alignment methods of horizontal direction in addition, by temperature and light measuring ability is integrated in module packaging, and make its miniaturization become possibility, maximum temperature scope on LED chip be passed to temperature sensor, outside light irradiates on the optical sensor through optical through-hole.
Description
Technical field
The present invention relates to the fields such as illumination/communication/consumer electronics/automobile/signal lamp, specifically a kind of lamination LED illuminating module and manufacture method.
Background technology
LED illuminating module comprises LED light source and driver module two parts are formed, and LED light source is made up of the some separation LED be welded on heat-conducting substrate usually.This encapsulation is often based on direct organization, that is: chip is fixed on support, is electrically connected between chip and support with gold thread, places phosphor material powder as required, then seals with silica gel.
Driver module, comprises integrated circuit and passive component.Integrated circuit (IC) chip encapsulates separately, is then arranged on another block circuit board together with passive component, and drive circuit board and light source module, after completing, are connected with electric wire.
In some cases, drive circuit is fairly simple, now drive integrated circult can be encapsulated, LED and other passive components be arranged on same heat-conducting substrate.
The major defect of the LED illuminating module of prior art comprises:
1) each assembly independent design makes, and cost is high, and needs extra assembling separately.
2) product size is large, and be difficult to reduce, consumable material is many.
3) every LEDs chip, drive integrated circult chip encapsulate all separately, and packaging cost is higher.
4) do not comprise the temperature and light test section to LED chip in existing illuminating module, for the module that brightness detects, outside usually external outside illuminating module, or whole light fixture, testing result is inaccurate, and effect is bad.
Summary of the invention
The object of the present invention is to provide a kind of rational in infrastructure, aim at accurately, to reduce costs, lamination LED illuminating module that size reduces and manufacture method.
For solving the problems of the technologies described above, the invention provides a kind of lamination LED illuminating module, comprise upper strata encapsulation and lower floor's encapsulation, the encapsulation of described upper strata comprises LED and upper substrate, and LED comprises chip, fluorescent material and silica gel, and upper substrate offers reflector, chip is arranged on reflector bottom side, and by silica gel, reflector is sealed, be provided with fluorescent material in silica gel
Upper substrate offers through hole, through hole is the cone barrel hole that two small ends communicate, described upper substrate surface is provided with for being conducted electricity and reflective metal level, the encapsulation of described lower floor comprises infrabasal plate and circuit element, described circuit element is fixed on infrabasal plate, and described infrabasal plate upper surface is provided with the metal level connected for circuit, and the corresponding lead to the hole site of described infrabasal plate offers the blind slot of cone barrel, the large end of blind slot, towards the through hole of upper substrate, is provided with soldering-tin layer between described through hole and blind slot.
For strengthening the control of whole lamination LED illuminating module, the present invention improves to be had, and described lamination LED illuminating module also comprises temperature sensor, and temperature sensor is arranged on infrabasal plate also just to chip position.
The present invention improves to be had, and also comprise optical pickocff, described optical pickocff is arranged on infrabasal plate, and the corresponding optical pickocff position of described upper substrate is provided with optical through-hole.
The present invention further provides a kind of manufacture method of lamination LED illuminating module, comprise the following steps:
The encapsulation of step 1. upper strata makes and lower floor's encapsulation makes;
The encapsulation of described upper strata makes specific as follows:
1) on upper substrate, offer reflector and through hole, through hole is the cone barrel hole that two small ends communicate;
2) in upper substrate surface deposited metal, and graphically, make metal level as conduction and reflectorized material;
3) LED is fixed on reflector;
The encapsulation of described lower floor makes specific as follows:
1) circuit element is fixed on infrabasal plate;
2) offer blind slot at the corresponding lead to the hole site of infrabasal plate, blind slot is large end cone barrel groove outwardly;
3) deposited metal on infrabasal plate, and graphically;
Soldered ball is placed in blind slot by step 2., and leans against on infrabasal plate by upper substrate, and soldered ball makes upper substrate and infrabasal plate initial alignment;
Step 3. is dissolved by soldered ball high temperature, and liquefied solder material surface tension drives upper substrate to move, and achieve aiming at of upper substrate and infrabasal plate, the LED of substrate is electrically connected with the circuit element of infrabasal plate.
The present invention improves to be had, and also comprise the installation steps of temperature sensor before carry out step 2, comprise temperature sensor, temperature sensor is fixed on corresponding chip position on infrabasal plate, and temperature sensor is electrically connected with circuit element by metal level.
For strengthening the conduction of whole LED to temperature, the present invention improves to be had, and after when step 2, temperature sensor is installed, before upper and lower substrate pressing, between temperature sensor and upper substrate, place layer, layer avoids electric component and metal level.
For increasing the light measuring ability of lamination LED illuminating module, the present invention improves to be had, the installation steps of optical pickocff are also comprised: be fixedly installed on by optical pickocff on infrabasal plate before carry out step 2, on described upper substrate, corresponding optical pickocff position is offered and is provided with optical through-hole, after upper substrate is fixed on infrabasal plate, optical through-hole is just to optical sensor, and described optical sensor is electrically connected with circuit element.
The present invention improves to be had, and described infrabasal plate offers groove, circuit element is placed on bottom portion of groove, and wrapped up by resin material, the overall height of described circuit element and resin material is less than lower substrate surface height.
Beneficial effect of the present invention is, novel lamination LED illuminating module manufacture method and the lamination LED light-emitting structure of die set of adaptive the method, its through hole only needs rough just to soldered ball, dissolved by soldered ball high temperature, liquefied solder material surface tension drives upper substrate to move, achieve the surface tension of liquid Alignment Method of upper substrate and infrabasal plate, other auxiliary exactitude position equipment need not be adopted, reduce cost, decrease size, simplify the alignment methods of horizontal direction, in addition, by temperature and light measuring ability is integrated in module packaging, and make its miniaturization become possibility, maximum temperature scope on LED chip be passed to temperature sensor, outside light irradiates on the optical sensor through optical through-hole.
Accompanying drawing explanation
Accompanying drawing 1 is the upper strata encapsulation flow chart of lamination LED illuminating module of the present invention;
Accompanying drawing 2 is lower floor's encapsulation flow chart of lamination LED illuminating module of the present invention;
Accompanying drawing 3 is lamination LED illuminating module of the present invention upper and lower layer encapsulation assembly flow charts;
Accompanying drawing 4 is the structural representation of the production in enormous quantities of lamination LED illuminating module of the present invention.
Label declaration: 1-LED encapsulates; 2-upper substrate; 21-reflector; 22-through hole; 23-optical through-hole; 3-infrabasal plate; 31-blind slot; 4-circuit element; 5-metal level; 6-soldered ball; 7-temperature sensor; 8-optical pickocff.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.
Refer to Fig. 1-accompanying drawing 3, a kind of lamination LED illuminating module provided by the invention shown in accompanying drawing, comprise upper strata encapsulation and lower floor's encapsulation, the encapsulation of described upper strata comprises LED 1 and upper substrate 2, and LED 1 comprises chip, fluorescent material and silica gel, upper substrate 2 offers reflector 21, chip is arranged on reflector bottom side, and reflector can increase light extraction efficiency, and is sealed by reflector 21 by silica gel, fluorescent material is provided with in silica gel
Upper substrate 2 offers through hole 22, through hole 22 is the cone barrel hole that two small ends communicate, described upper substrate 2 surface is provided with for being conducted electricity and reflective metal level 5, the encapsulation of described lower floor comprises infrabasal plate 3 and circuit element 4, described circuit element 4 is fixed on infrabasal plate 3, described infrabasal plate 3 upper surface is provided with the metal level 5 connected for circuit, described infrabasal plate 3 corresponding through hole 22 position offers the blind slot 31 of cone barrel, the large end of blind slot 31, towards the through hole 22 of upper substrate 2, is provided with soldering-tin layer between described through hole 22 and blind slot 31.
Blind slot is arranged with the corresponding of through hole, when making soldered ball add thermosetting soldering-tin layer, and upper and lower substrate energy automatic aligning.
On upper substrate, be positioned at cone barrel hole its reflective effect main of top, in other embodiments, cone barrel also can not be adopted to arrange, adopt common through hole.
The manufacture method of above-mentioned lamination LED illuminating module, specifically comprises the following steps:
The encapsulation of step 1. upper strata makes and lower floor's encapsulation makes;
With reference to accompanying drawing 2, the encapsulation of described upper strata makes specific as follows:
1) on upper substrate 2, offer reflector 21 and through hole 22, through hole 22 is the cone barrel hole that two small ends communicate, and offering of hole can be formed by etching, can certainly by other perforate mode, and the present invention does not do concrete restriction;
2) at upper substrate 2 surface deposition metal level 5, and graphically, make metal level 5 as conduction and reflectorized material;
3) LED 1 is fixed on reflector 21;
Elder generation's plated metal in reflector 21 before carrying out LED 1, form the electrode be electrically connected with LED chip, in the present embodiment, depositing metal layers 5 can pass through the plating mode such as physical vapor deposition (PVD), chemical vapor deposition (CVD);
The shape of reflector 21 is cone barrel, and after LED 1 is fixed on upper substrate 2, the light of chip injection can be reflected by the two side of reflector 21, can be strengthened the reflecting effect of whole upper substrate 2 by the metal level 5 be arranged on reflector 21.
In addition, through hole 22 be positioned at above upper substrate 2 cone barrel hole outside metal level 5 also can strengthen the reflecting effect of upper substrate 2.
With reference to accompanying drawing 1, the encapsulation of described lower floor makes specific as follows:
1) circuit element 4 is fixed on infrabasal plate 3, concrete, first on infrabasal plate 3, offer the perforate of placing circuit element, prepare the silicon chip of circuit element again, silicon chip is fixedly secured on infrabasal plate 3, the mounting means of circuit element 4 can be the welding of upside-down mounting eutectic, the welding of upside-down mounting eutectic is electrically connected without the need to routing, in other embodiments, mounting means can adopt the modes such as formal dress die bond routing, such as, in one embodiment of the invention, first on infrabasal plate 3, groove is made, circuit element 4 is arranged on wherein, with the protection of resin material parcel, circuit element 4 should be less than infrabasal plate 3 apparent height with the overall height of resin material, can fix by realizing circuit element equally.
2) offer blind slot 31 in infrabasal plate 3 corresponding through hole 22 position, blind slot 31 is large end cone barrel groove outwardly, and offering of blind slot 31 can be formed by etching, and certainly, can adopt other perforate modes, the present invention does not do concrete restriction yet;
3) deposited metal 5 on infrabasal plate 3, and graphically, the setting of metal level 5 is to be connected with the circuit on upper substrate 2;
Above-mentioned upper substrate 2 is made up of Heat Conduction Material with infrabasal plate 3, is preferably silicon, magnesium alloy, aluminium alloy etc.
Soldered ball 6, with reference to accompanying drawing 3, is placed in blind slot 31 by step 2., and leans against on infrabasal plate 3 by upper substrate 2, coordinates by the through hole 22 of blind slot 31 and cone barrel and blind slot 31 initial alignment realizing upper substrate 2 and infrabasal plate 3;
Soldered ball 6 is for spherical before becoming soldering-tin layer, and soldered ball 6 is first placed in blind slot 31, by rough for upper substrate 2 just to covering on infrabasal plate 3.
Step 3. is with reference to accompanying drawing 3, dissolved by soldered ball high temperature, liquefied solder material surface tension drives upper substrate to move, achieve the surface tension of liquid Alignment Method of upper substrate and infrabasal plate, reduce cost, decrease size, simplify the alignment methods of horizontal direction, other auxiliary alignment apparatus need not be adopted.Realize welding of upper substrate 2 and infrabasal plate 3.
Soldered ball 6 forms soldering-tin layer after welding, and soldering-tin layer, while fixedly securing upper substrate 2 and infrabasal plate 3, also makes the metal level 5 on upper substrate 2 communicate with the metal level 5 of infrabasal plate 3, achieves the luminescence of LED module.
In the present embodiment, also comprise temperature sensor 7 with reference to accompanying drawing 1-accompanying drawing 3, lamination LED illuminating module, temperature sensor 7 is fixed on corresponding chip position on infrabasal plate 3, after temperature sensor 7 is fixed on infrabasal plate 3, it is made to be connected with circuit element 4 by metal level 5, and unified control.
For realizing the Efficient Operation of temperature sensor 7 further, in the present embodiment, be provided with soldering-tin layer between described upper substrate 2 and infrabasal plate 3, soldering-tin layer makes heat be delivered on temperature sensor 7 rapidly, in the course of processing, this soldering-tin layer is finally welded by solder and is formed, the placement of solder can place together while putting soldered ball 6, and this solder is mainly used for heat conduction, does not play electric action, avoiding other electric components and circuit when placing, to avoid short circuit.
The working temperature of LED chip is very large to its aging effects.When its temperature is too high, can be reduced or close the electric current by LED chip, reaching the object to product protection by the temperature detecting LED.
In the present embodiment, with reference to accompanying drawing 1-accompanying drawing 3, lamination LED illuminating module also comprises optical pickocff 8, described optical pickocff 8 is arranged on infrabasal plate 3, and on described upper substrate 2, corresponding optical pickocff 8 position is provided with optical through-hole 23, after upper substrate 2 is fixed on infrabasal plate 3, optical through-hole 23 is just to optical sensor, optical through-hole does not do concrete restriction in shape of the present invention, can adopt and through hole one spline structure, or adopt other any through holes.
After optical pickocff 8 is fixed on infrabasal plate 3, it is made to be connected with circuit element 4 by metal level 5, and unified control.
In intelligent lighting, the luminescence of LED module, needs the light status according to actual environment, adjusts.Therefore need integrated optics measuring ability in module, arrange optical detection apparatus relative to tradition around LED module, reduce the size of whole system of knowing clearly, and optical pickocff distance LED is comparatively near, accuracy of detection is higher, and the corresponding speed of equipment is faster.
By temperature and light measuring ability is integrated in module packaging, and make its miniaturization become possibility, and the accurate detection of optics and temperature is based upon that upper substrate 2 and infrabasal plate are upper and lower two-layerly accurately to be aimed on basis, what make the maximum temperature scope on LED chip is passed to temperature sensor 7, and outside light is radiated on optical pickocff 8 through optical through-hole.
With reference to accompanying drawing 4, multiple lamination LED illuminating module large-scale parallel can first make by the present invention as required, the larger upper substrate 2 of area and the larger infrabasal plate 3 of area are such as set, upper and lower double-layer structure all can make in array on substrate, and weld the multiple LED illuminating module of formation by above-mentioned manufacture method by soldered ball 6, disposable bonding, carries out segmentation by cut-off rule afterwards and obtains multiple lamination LED illuminating module, produce in enormous quantities.
The lamination LED illuminating module that new producing method is produced, be conducive to reducing costs, miniaturized LED product, it has the following advantages:
1, the unified encapsulation of LED chip, instead of encapsulate respectively.
2, mass makes, then cuts.Cost reduces.
3, product size is little, and consumable material is few.
4, each assembly has been produced once, and assembles without the need to the later stage.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. a lamination LED illuminating module, comprise upper strata encapsulation and lower floor's encapsulation, the encapsulation of described upper strata comprises LED and upper substrate, LED comprises chip, fluorescent material and silica gel, and upper substrate offers reflector, and chip is arranged on reflector bottom side, and by silica gel, reflector is sealed, be provided with fluorescent material in silica gel, it is characterized in that
Upper substrate offers through hole, through hole is the cone barrel hole that two small ends communicate, described upper substrate surface is provided with for be conducted electricity and reflective through patterned metal level, the encapsulation of described lower floor comprises infrabasal plate and circuit element, described circuit element is fixed in the perforate of the placement circuit element that infrabasal plate is offered, described infrabasal plate upper surface be provided with for circuit connect through patterned metal level, the corresponding lead to the hole site of described infrabasal plate offers the blind slot of cone barrel, the large end of blind slot is towards the through hole of upper substrate, soldering-tin layer is provided with between described through hole and blind slot.
2. lamination LED illuminating module according to claim 1, is characterized in that, also comprise temperature sensor, and temperature sensor is arranged on infrabasal plate also just to chip position.
3. lamination LED illuminating module according to claim 1, it is characterized in that, also comprise optical pickocff, described optical pickocff is arranged on infrabasal plate, and the corresponding optical pickocff position of described upper substrate is provided with optical through-hole.
4. a manufacture method for lamination LED illuminating module, is characterized in that, comprises the following steps:
The encapsulation of step 1. upper strata makes and lower floor's encapsulation makes;
The encapsulation of described upper strata makes specific as follows:
1) on upper substrate, offer reflector and through hole, through hole is the cone barrel hole that two small ends communicate;
2) in upper substrate surface deposited metal, and graphically;
3) LED is fixed on reflector;
The encapsulation of described lower floor makes specific as follows:
1) circuit element is fixed on infrabasal plate;
2) offer blind slot at the corresponding lead to the hole site of infrabasal plate, blind slot is large end cone barrel groove outwardly;
3) deposited metal on infrabasal plate, and graphically;
Soldered ball is placed in blind slot by step 2., and leans against on infrabasal plate by upper substrate, and soldered ball makes upper substrate and infrabasal plate initial alignment;
Step 3. is dissolved by soldered ball high temperature, and liquefied solder material surface tension drives upper substrate to move, and achieve aiming at of upper substrate and infrabasal plate, the LED of substrate is electrically connected with the circuit element of infrabasal plate.
5. the manufacture method of lamination LED illuminating module according to claim 4, it is characterized in that, also comprise the installation steps of temperature sensor before carry out step 2, temperature sensor is fixed on corresponding chip position on infrabasal plate, and temperature sensor is electrically connected with circuit element by metal level.
6. the manufacture method of lamination LED illuminating module according to claim 5, is characterized in that, after temperature sensor is installed, before upper and lower substrate pressing, between temperature sensor and upper substrate, place layer, layer avoids electric component and metal level.
7. the manufacture method of lamination LED illuminating module according to claim 4, its feature exists, the installation steps of optical pickocff are also comprised: be fixed on by optical pickocff on infrabasal plate before carry out step 2, on described upper substrate, optical through-hole is offered in corresponding optical pickocff position, after upper substrate is fixed on infrabasal plate, optical through-hole is just to optical pickocff, and described optical pickocff is electrically connected with circuit element.
8. the manufacture method of lamination LED illuminating module according to claim 4, it is characterized in that, described infrabasal plate offers groove, circuit element is placed on bottom portion of groove, and wrapped up by resin material, the overall height of described circuit element and resin material is less than lower substrate surface height.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310327066.7A CN103390717B (en) | 2013-07-30 | 2013-07-30 | Lamination LED illuminating module and manufacture method |
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| CN201310327066.7A CN103390717B (en) | 2013-07-30 | 2013-07-30 | Lamination LED illuminating module and manufacture method |
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| CN103390717B true CN103390717B (en) | 2016-02-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103646620B (en) * | 2013-12-25 | 2016-01-20 | 深圳市洲明科技股份有限公司 | LED shows module and manufacture method thereof |
| FR3041148A1 (en) * | 2015-09-14 | 2017-03-17 | Valeo Vision | LED LIGHT SOURCE COMPRISING AN ELECTRONIC CIRCUIT |
| CN108767093B (en) * | 2018-08-15 | 2024-03-19 | 张辉 | LED SMD luminous tube with mirror image luminous structure |
| CN115020398A (en) * | 2022-05-31 | 2022-09-06 | 维沃移动通信有限公司 | Optical sensing module, processing method thereof and electronic equipment |
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| JP5042591B2 (en) * | 2006-10-27 | 2012-10-03 | 新光電気工業株式会社 | Semiconductor package and stacked semiconductor package |
| US20080157327A1 (en) * | 2007-01-03 | 2008-07-03 | Advanced Chip Engineering Technology Inc. | Package on package structure for semiconductor devices and method of the same |
| US20080157316A1 (en) * | 2007-01-03 | 2008-07-03 | Advanced Chip Engineering Technology Inc. | Multi-chips package and method of forming the same |
| CN101685783B (en) * | 2008-09-22 | 2012-06-13 | 探微科技股份有限公司 | Light emitting diode chip package structure and making method thereof |
| JP5425584B2 (en) * | 2009-10-15 | 2014-02-26 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
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