CN208637100U - Show equipment - Google Patents
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- CN208637100U CN208637100U CN201821368050.5U CN201821368050U CN208637100U CN 208637100 U CN208637100 U CN 208637100U CN 201821368050 U CN201821368050 U CN 201821368050U CN 208637100 U CN208637100 U CN 208637100U
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Abstract
This disclosure relates to show equipment.A kind of display equipment includes multiple luminescence units, circuit main board and processing unit.Each luminescence unit includes insulating body, substrate, luminescence chip, driving chip and pin.The reciprocal both ends of insulating body are recessed respectively to be formed with the first groove and the second groove.Substrate is set in insulating body.Luminescence chip is fixedly installed on substrate, and luminescence chip is exposed to the first groove.Driving chip is fixedly installed on substrate, and driving chip is exposed to the second groove.First groove is filled with light transmission colloid.Second groove is filled with packing colloid.Each luminescence unit is fixedly installed on circuit main board.Processing unit is fixedly installed on circuit main board, and processing unit is electrically connected each luminescence unit, and processing unit can be individually controlled the brightness or colour temperature for the light beam that each luminescence unit is issued.The utility model can to improve existing high density show equipment circuit main board production cost it is high, and circuit main board interlock circuit it is complicated the problems such as.
Description
Technical field
The utility model relates to a kind of display equipment, especially a kind of display equipment with highdensity LED.
Background technique
Existing high density shows equipment, is that multiple LED units and relevant driving chip are set to a circuit main board
On, due to the substantial amounts of LED unit, the quantity of corresponding driving chip is also very huge, to have circuit master
The complex circuit designs of plate, the high problem of production cost.
In addition, part manufacturer can make single driving to reduce the circuit complexity and its production cost of circuit main board
Chip drives multiple LED units simultaneously, is designed in this way, although the circuit complexity of circuit main board slightly can be reduced, however, working as
When being damaged by any one LED unit that the same driving chip drives jointly, it would be possible to so that multiple LED units can not transport together
Make；Alternatively, will lead to multiple LED units when any one driving chip damages while can not operate.
Utility model content
The main purpose of the utility model is to provide a kind of display equipment, show equipment to improve existing high density
Circuit main board production cost it is high, and circuit main board interlock circuit it is complicated the problems such as.
To achieve the goals above, the utility model provides a kind of display equipment, which is characterized in that display equipment includes:
Multiple luminescence units, each luminescence unit includes: an insulating body, reciprocal both ends have been recessed one respectively
First groove and one second groove are filled with a light transmission colloid in first groove, and second groove is filled with an encapsulation
Colloid；One substrate is set in the insulating body, and the reciprocal broad side surface of substrate is respectively defined as one first peace
Dress face and one second mounting surface, first mounting surface is corresponding to expose to first groove, and second mounting surface is corresponding outer
It is exposed to second groove, includes multiple conductive channels in the substrate；An at least luminescence chip is fixedly installed on described
First mounting surface, and the luminescence chip is corresponding in first groove, and the luminescence chip is by the light transmission colloid
Cladding；One driving chip, is fixedly installed on second mounting surface, the driving chip by multiple conductive channels with
The luminescence chip is electrically connected, and the driving chip is coated in the packing colloid, and the driving chip is not exposed
In the insulating body or the packing colloid；Multiple pins, part expose to outside the insulating body, the part pin
It is electrically connected with the luminescence chip, the part pin and the driving chip are electrically connected；One circuit main board, it is multiple described
Luminescence unit is fixedly installed on the circuit main board, and multiple luminescence units are arranged at each interval；And at one
Unit is managed, the circuit main board is fixedly installed on, the processing unit passes through the circuit main board and each luminous list
Member is electrically connected, and the processing unit can independently control the brightness or colour temperature of the light beam that each luminescence unit is issued.
Preferably, the luminescence chip passes through multiple plain conductors and the conductive fabric knot for being formed in first mounting surface
Structure is electrically connected；Alternatively, the luminescence chip is mutual by welding body and multiple weld pads for being set on first mounting surface
Connection.
Preferably, the driving chip passes through multiple plain conductors and the conductive fabric knot for being set to second mounting surface
Structure is electrically connected；Alternatively, the driving chip is mutual by welding body and multiple weld pads for being set on second mounting surface
Connection.
Preferably, the packing colloid is translucent construction or impermeable photo structure.
Preferably, there are three the luminescence chips for each luminescence unit tool, are respectively one first light emitting diode
Chip, one second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, first light-emitting diode chip for backlight unit can issue
The light beam that 610 nanometers to 780 nanometers of wavelength；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength
Light beam；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength of light beam；First light-emitting diodes
The range of exposures of any of tube chip, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit can be with
The range of exposures of at least one of remaining light-emitting diode chip for backlight unit partly overlaps；It is first light-emitting diode chip for backlight unit, described
The light beam that second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued, can be mutually mixed as a light mixing light
Beam；The processing unit can control first light-emitting diode chip for backlight unit of each luminescence unit, described second luminous two
Any of pole pipe chip and the third light-emitting diode chip for backlight unit, to control the brightness or colour temperature of the light mixing light beam.
Preferably, the circuit main board only includes four layers of electrical layer structure, is respectively one first signals layer structure, one
Bus plane structure, a second signal layer structure and a ground plane structure.
To achieve the goals above, the utility model also provides a kind of display equipment, which is characterized in that the display equipment
Include: multiple luminescence units, each luminescence unit includes: an insulating body, and concave shaped is distinguished at reciprocal both ends
The first groove of Cheng Youyi and one second groove, a light transmission colloid is filled in first groove, and second groove is filled with
One packing colloid；Multiple lead frames, each reciprocal two sides of lead frame, be exposed to respectively first groove and
Second groove, and the part of each lead frame exposes to the insulating body；Multiple luminescence chips, fixed setting
It is exposed to the part of first groove in multiple lead frames, and multiple luminescence chips are corresponding recessed positioned at described first
In slot, each luminescence chip is electrically connected by multiple first plain conductors and at least a part of lead frame；It is more
A luminescence chip and multiple first plain conductors are coated by the light transmission colloid；One driving chip, fixed setting
It is exposed to the part of second groove in multiple lead frames, the driving chip is by multiple second plain conductors and extremely
Few a part of lead frame is electrically connected；Multiple driving chips and multiple second plain conductors are by the packing colloid
Cladding；The driving chip is led by what multiple second plain conductors and each second plain conductor were electrically connected
Coil holder, and be electrically connected with multiple luminescence chips；One circuit main board, multiple luminescence units are fixedly installed on the electricity
Road mainboard, and multiple luminescence units are arranged at each interval；And a processing unit, it is fixedly installed on the electricity
Road mainboard, the processing unit are electrically connected by the circuit main board and each luminescence unit, the processing unit energy
Independently control the brightness or colour temperature of the light beam of each luminescence unit issued.
Preferably, the packing colloid is translucent construction or impermeable photo structure.
Preferably, luminescence unit tool is there are three the luminescence chip, be respectively one first light-emitting diode chip for backlight unit,
One second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, first light-emitting diode chip for backlight unit can issue wavelength
610 nanometers to 780 nanometers of light beam；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength of light
Beam；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 nanometers of wavelength of light beam；First light emitting diode
The range of exposures energy of any of chip, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit and its
The range of exposures of at least one of remaining light-emitting diode chip for backlight unit partly overlaps；First light-emitting diode chip for backlight unit, described
The light beam that two light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued, can be mutually mixed as a light mixing light
Beam；The processing unit can control first light-emitting diode chip for backlight unit of each luminescence unit, described second luminous two
Any of pole pipe chip and the third light-emitting diode chip for backlight unit, to control the brightness or colour temperature of the light mixing light beam.
Preferably, the circuit main board only includes four layers of electrical layer structure, is respectively one first signals layer structure, one
Bus plane structure, a second signal layer structure and a ground plane structure.
The beneficial effects of the utility model can be: by making driving chip and luminescence chip is set to substrate or more
The design of a reciprocal two sides of lead frame can will substantially reduce the size of luminescence unit entirety, so as to effectively reduce
It shows the spacing distance of the luminescence unit of equipment to each other, and setting for luminescence unit can be increased in the unit area of display equipment
Set density.In addition, being internally provided with the design of driving chip by each luminescence unit, the electricity of circuit main board will can be greatly reduced
Road complexity, and the production cost of circuit main board can be reduced.
Detailed description of the invention
Fig. 1 is the partial schematic diagram of the display equipment of the utility model.
Fig. 2 is the partial cutaway schematic of the display equipment of the utility model.
Fig. 3 is the schematic diagram of the first embodiment of the luminescence unit of the display equipment of the utility model.
Fig. 4 is another visual angle schematic diagram of the first embodiment of the luminescence unit of the display equipment of the utility model.
Fig. 5 is the diagrammatic cross-section of the first embodiment of the luminescence unit of the display equipment of the utility model.
Fig. 6 is the diagrammatic cross-section of the second embodiment of the luminescence unit of the display equipment of the utility model.
Fig. 7 is the partial enlargement diagram of Fig. 6.
Fig. 8 is the stereoscopic schematic diagram of the 3rd embodiment of the luminescence unit of the display equipment of the utility model.
Fig. 9 is the diagrammatic cross-section of the 3rd embodiment of the luminescence unit of the display equipment of the utility model.
Figure 10 is the process signal of the first embodiment of the production method of the luminescence unit of the display equipment of the utility model
Figure.
Figure 11 is the process signal of the second embodiment of the production method of the luminescence unit of the display equipment of the utility model
Figure.
Figure 12 is the process signal of the 3rd embodiment of the production method of the luminescence unit of the display equipment of the utility model
Figure.
Figure 13 is the process signal of the fourth embodiment of the production method of the luminescence unit of the display equipment of the utility model
Figure.
Specific embodiment
Referring to Fig. 1, its partial schematic diagram for the display equipment of the utility model.As shown, display equipment 1000
Include: multiple luminescence units 100, a circuit main board 200 and a processing unit 300.Multiple luminescence units 100 are arranged at each interval
Column are set to circuit main board 200, and processing unit 300 is fixedly installed on circuit main board 200, and processing unit 300 can pass through circuit
Mainboard 200 is electrically connected each luminescence unit 100, and processing unit 300 can independently control each luminescence unit 100 and be issued
Light beam brightness or colour temperature.
As shown in Fig. 2, its diagrammatic cross-section for being shown as circuit main board 200 and single a luminescence unit 100.Circuit main board
200 to can be only include four layers of electrical layer structure, be respectively one first signals layer structure 201, a bus plane structure 202,
One second signal layer structure 203 and a ground plane structure 204.Each luminescence unit 100 can by the first signals layer structure 201,
Bus plane structure 202, second signal layer structure 203 and ground plane structure 204 and processing unit 300 and relevant power supply unit
It is electrically connected, to receive the signal transmitted from processing unit 300 and the electric power transmitted from power supply unit.
The quantity of luminescence unit 100 shown in FIG. 1, size and its spacing distance, arrangement mode to each other, all can foundation
Changes in demand, not to be limited as shown in the figure.In addition, the size of processing unit 300 and its setting relative to multiple luminescence units 100
Seated position, also can be according to changes in demand, merely illustrative form as shown in the figure.In addition, in special application, processing unit 300
It is also possible to not be set to the same side of circuit main board 200 with luminescence unit 100, and processing unit 300 and multiple luminous lists
Member 100, which can be, is respectively arranged at the reciprocal two sides of circuit main board 200.In addition, processing unit 300 is, for example, micro process
Device or the various processor that can control light emitting diode.In different applications, show that equipment 1000 is also possible to include
Multiple processing units 300, and different processing units 300 can be multiple luminescence units 100 of corresponding control different zones.
Also referring to Fig. 3 to Fig. 5, Fig. 3 and Fig. 4 illustrate for the three-dimensional of luminescence unit first embodiment of the utility model
Figure；Fig. 5 is the diagrammatic cross-section of the first embodiment of the luminescence unit of the utility model.As shown, luminescence unit 100 includes
One insulating body 10, light transmission colloid 11, a packing colloid 12,13, three luminescence chips 14 of a substrate, a driving chip 15 and four
A pin 16.
The reciprocal both ends of insulating body 10 have been recessed one first groove 10a and one second groove 10b respectively, the
A light transmission colloid 11 is filled in one groove 10a, the second groove 10b is filled with a packing colloid 12.In practical applications, first
The external form of groove 10a and the second groove 10b can be according to changes in demand, and as shown in the figure is only wherein exemplary forms；It is described
First groove 10a and the second groove 10b are not interconnected substantially, and but not limited to this.In practical applications, first is formed
The side wall of groove 10a, which can be, is provided with reflecting layer (not shown), and the side wall for forming the first groove 10a is also possible to be rendered as
It is skewed, in this way, the light beam that guiding luminescence chip 14 will can be assisted to be issued.
Substrate 13 is set in insulating body 10, and 13 reciprocal two broad side surfaces of substrate are respectively defined as one first peace
Dress face 131 and one second mounting surface 132, the corresponding bottom for exposing to the first groove 10a of the first mounting surface 131, the second mounting surface
The 132 corresponding bottoms for exposing to the second groove 10b.As shown in figure 5, including multiple conductive channels 133 in substrate 13.It is specific next
It says, substrate 13 may be any type of circuit board, and the first mounting surface 131 and the second mounting surface 132 can be according to demand
In a manner of etching etc., it is formed with the structures such as conducting wiring structure (Layout) and multiple weld pads, and the conductive channel 133 can be with
It is the perforation by being formed in substrate 13, and the conductive material being filled in perforation is constituted.About the first mounting surface 131 and second
It is formed by the structures such as conducting wiring structure and weld pad on mounting surface 132, can be the type according to luminescence chip 14, shine core
The design such as 16 quantity of pin of the quantity of piece 14, the type of driving chip 15 and luminescence unit 100, it is without restriction in this.It closes
Quantity and its setting position in conductive channel 133, can be and be set to substrate 13 according to driving chip 15 and luminescence chip 14
On position and determine.
As depicted in figs. 3 and 5, three luminescence chips 14 are fixedly installed on the first mounting surface 131, and each luminescence chip 14
By multiple plain conductors 141, and on the first mounting surface 131 conducting wiring structure be electrically connected, and in substrate 13
Conductive channel 133 is electrically connected.Three luminescence chips 14 for being fixed on the first mounting surface 131 are corresponding in the first groove 10a,
And three luminescence chips 14 are coated by light transmission colloid 11, and the light beam that three luminescence chips 14 are issued, light transmission colloid can be passed through
11 to project outward.
In practical applications, three luminescence chips 14 can be respectively one first light-emitting diode chip for backlight unit, one second shine
Diode chip for backlight unit and a third light-emitting diode chip for backlight unit, the first light-emitting diode chip for backlight unit can issue 610 nanometers to 780 nanometers of wavelength
Light beam；Second light-emitting diode chip for backlight unit can issue 500 nanometers to 570 nanometers of wavelength of light beam；Third light-emitting diode chip for backlight unit
450 nanometers to 495 nanometers of wavelength of light beam can be issued；Also that is, three luminescence chips 14 can be can issue feux rouges, green light respectively
And the light beam of blue light.Appointing in the first light-emitting diode chip for backlight unit, the second light-emitting diode chip for backlight unit and third light-emitting diode chip for backlight unit
One range of exposures can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit, and first shines
The light beam that diode chip for backlight unit, the second light-emitting diode chip for backlight unit and third light-emitting diode chip for backlight unit are issued, can be mutually mixed becomes
One light mixing light beam.
It in this present embodiment, is for capable of issuing different luminescence chips 14 by three, but not limited to this, specific
In embodiment, luminescence unit 100 can be above or two luminescence chips 14 below there are four tools, and 14 institute of luminescence chip
The light beam wavelength that can be issued, is not also limited with above-mentioned, can be selected according to demand.
Driving chip 15 is fixedly installed on the second mounting surface 132, and driving chip 15 passes through multiple plain conductors 151 and the
Conducting wiring structure on two mounting surfaces 132 is electrically connected, and driving chip 15 can by conductive channel 133 in substrate 13 and
Three luminescence chips 14 are electrically connected.Driving chip 15 is corresponding to be located in the second groove 10b, and driving chip 15 is coated on envelope
It fills in colloid 12, and driving chip 15 is not expose to insulating body 10 or packing colloid 12.Wherein, packing colloid 12 can be
Impermeable photo structure or translucent construction, it is without restriction in this.
Second groove 10b is only to keep the second mounting surface 132 of substrate 13 exposed and driving chip 15 can be corresponded to and sets
It is placed on the second mounting surface 132, therefore, the size and external form of the second groove 10b are generally set according to the size of driving chip 15
Meter, and the relativeness that the size of the second groove 10b, external form be not absolute with size, the external form of the first groove 10a.In this way, making
Second groove 10b face it is located at the lower section of the first groove 10a, can will effectively reduces the overall dimensions of luminescence unit 100.
As shown in figure 4, multiple pins 16 expose to outside insulating body 10, part pin 16 electrically connects with luminescence chip 14
It connects, part pin 16 and driving chip 15 are electrically connected；Wherein, pin 16 can be the first mounting surface 131 by substrate 13
On conducting wiring structure, conducting wiring structure and multiple conductive channels 133 on the second mounting surface 132, with multiple luminous cores
Piece 14 and driving chip 15 are electrically connected.
Luminescence unit 100 is fixed by multiple pins 16 and is electrically connected at circuit main board 200 (as shown in Figure 1), and locates
The driving chip of signal to each luminescence unit 100 can be controlled by circuit main board 200 and the transmitting of multiple pins 16 by managing unit 300
15, change the brightness or colour temperature of the light beam that each luminescence unit 100 is issued accordingly；Relatively, when single a luminescence unit 100
With multiple luminescence chips that can issue different-colour respectively, then processing unit 300 can correspond to control luminescence unit 100 and be issued
Light mixing light beam brightness and colour temperature.It illustrates, since processing unit 300 can independently control single a luminescence unit
100, therefore, the display equipment 1000 of the utility model can adjust the light beam that each luminescence unit 100 is issued according to demand
Colour temperature so that multiple luminescence units 100 of display equipment 1000 can have height when issuing the light beam of identical colour temperature respectively
Consistency.
In addition, since each luminescence unit 100 has independent driving chip 15, and circuit main board 200 is to pass through control
The driving chip 15 of each luminescence unit 100, to achieve the purpose that control luminescence unit 100, therefore, multiple luminescence units 100
It can be not absolute connection relationship to each other, also that is, related personnel or machinery can be to single a luminescence unit 100
It is replaced.
In specifically practicing, pin 16 can be the structure extended by substrate 13 or pin 16 can be only
The metal component of substrate 13 is stood on, and one end of pin 16 is affixed on substrate 13, the other end of pin 16 is then corresponding outer
It is exposed to outside insulating body 10.
Referring to Figure 6 together and Fig. 7, Fig. 6 be the utility model display equipment each luminescence unit second implementation
The diagrammatic cross-section of example, Fig. 7 are the partial enlargement diagram of Fig. 6.As shown, the present embodiment and previous embodiment maximum difference
Be: each luminescence chip 14 can be through welding body 142 and 134 phase of multiple weld pads that is set on the first mounting surface 131
It connects, and driving chip 15 is also possible to through welding body 142 and the multiple weld pads 134 being set on the second mounting surface 132
It is connected with each other.Wherein, multiple weld pads 134 of the first mounting surface 131 and the second mounting surface 132 are set to, be and are set to substrate
Conductive channel 133 in 13 is electrically connected.
Specifically, it during actual installation luminescence chip 14 and driving chip 15, can be in luminescence chip 14
And driving chip 15 is intended to that solder sphere (such as tin ball) is arranged on the position being electrically connected, then will directly be provided with solder sphere
Luminescence chip 14 and driving chip 15, the multiple weld pads 134 being correspondingly arranged on the first mounting surface 131 and the second mounting surface 132,
Curing operation then is carried out to solder sphere again, between luminescence chip 14 and weld pad 134 and driving chip 15 and weld pad 134 it
Between form the welding body 142；In this way, manufacture is by without using plain conductor described in previous embodiment, so as to big
Width promotes luminescence chip 14 or driving chip 15 is correctly installed on the yield of substrate 13.
It illustrates, in practical applications, luminescence chip 14 and driving chip 15 can be according to actual production system
Demand when making, and be installed on substrate 13 in a manner of the present embodiment or in a manner of previous embodiment respectively；Citing comes
It says, in the same luminescence unit 100, can be is electrically connected luminescence chip 14 with substrate 13 by multiple plain conductors 141,
And it is electrically connected driving chip 15 with substrate 13 by multiple welding bodies 142；Alternatively, the same luminescence unit 100 can also be with
It is to be electrically connected luminescence chip 14 with substrate 13 by multiple welding bodies 142, and lead driving chip 15 by multiple metals
Line 151 and substrate 13 are electrically connected.
Also referring to Fig. 8 and Fig. 9, the third for being shown as each luminescence unit of the display equipment of the utility model is real
Apply the schematic diagram of example.As shown, the present embodiment is with previous embodiment maximum difference: luminescence unit 100 can not include
There is above-mentioned substrate 13, and it includes multiple lead frames 17 (lead frame) that luminescence unit 100, which is,.Illustrate below only for leading
Coil holder 17 is illustrated, remaining component please refers to previous embodiment explanation, is repeated no more in this.
The reciprocal two sides of each lead frame 17 are exposed to the first groove 10a and the second groove 10b respectively, and each
The part of a lead frame 17 exposes to insulating body 10, using the pin 16 contained as previous embodiment；About the detailed of pin 16
It describes in detail bright, please refers to previous embodiment, repeated no more in this.
Multiple luminescence chips 14 are fixedly installed on the part that multiple lead frames 17 are exposed to the first groove 10a, and multiple hairs
Optical chip 14 is corresponding to be located in the first groove 10a, and each luminescence chip 14 passes through multiple first plain conductors 141 and at least one
The lead frame 17 of part is electrically connected.Wherein, multiple luminescence chips 14 and multiple first plain conductors 141 are together by light transmission colloid 11
Cladding.About the quantity of lead frame 17, it can be and determined according to the quantity of luminescence chip 14 and the type of driving chip 15, in this
It is without restriction, such as can be 4,6,8 etc..
Driving chip 15 is fixedly installed on the part that multiple lead frames 17 are exposed to the second groove 10b, and driving chip 15 is logical
Multiple second plain conductors 151 are crossed to be electrically connected at least a part of lead frame 17.Driving chip 15 and multiple second metals
Conducting wire 151 is packaged the cladding of colloid 12.Driving chip 15 passes through multiple second plain conductors 151 and each second plain conductor
151 lead frames 17 being electrically connected, and be electrically connected with multiple luminescence chips 14.Whereby, driving chip 15 can reception processing
Unit 300 passes through the electric signal that multiple lead frames 17 are transmitted, and controls the light beam that each luminescence chip 14 is issued with correspondence
Brightness or colour temperature.
Special emphasis is that existing high density shows the circuit main board that equipment is included, and is provided with driving LED unit
Associated drives chip and its circuit, and the problem that existing circuit main board has complex circuit, production cost high.It is specific next
Say, the electrical layer structure that existing circuit main board must be at least six layers or more can just there are enough spaces to carry out interlock circuit
Design.In addition, existing high density shows equipment to save the complexity of driving chip and its interlock circuit, it will usually make
Single a driving chip drives multiple LED units simultaneously, in this way, when single a LED unit is damaged, it would be possible to can to share
The problem of remaining LED unit of same driving chip can not be lit simultaneously.
It reviews, the display equipment 1000 that above-mentioned various embodiments of the utility model is lifted drives the drive of each luminescence unit 100
Dynamic chip 15 is set in each luminescence unit 100, in this way, the complexity that circuit main board 200 will can be greatly reduced, and can be big
The production cost of width reduction circuit main board 200.In addition, multiple luminescence units 100 of the display equipment 1000 of the utility model, that
Identical driving chip 15 can not be shared around here, thus it is not easy to which above-mentioned existing high density, which occurs, shows equipment, be easy hair
Raw single a LED unit is damaged, by related the problem of leading to multiple LED units while damaging.
In addition, the display equipment 1000 of the utility model is by making driving chip 15 and luminescence chip 14 be set to substrate 13
Or the design of the reciprocal two sides of multiple lead frames 17, the whole size of luminescence unit 100 can will be substantially reduced, thus
The spacing distance of multiple luminescence units 100 of display equipment 1000 to each other can be effectively reduced, and can be in display equipment 1000
Increase the density of setting of luminescence unit 100 in unit area.
Referring to Fig. 10, its first implementation for the production method of each luminescence unit of the display equipment of the utility model
The flow diagram of example.The production method of the luminescence unit of the display equipment of the utility model comprises the steps of:
One substrate manufacture step S11: in reciprocal two broad side surfaces of a substrate be respectively formed multiple first weld pads and
Multiple second weld pads, and multiple conductive channels are formed in substrate, and the first at least a part of weld pad is enable to lead by multiple
Electric channel is electrically connected with the second at least a part of weld pad；
One insulating body forming step S12: make the part of insulating materials cladding substrate, to form an insulating body, absolutely
The reciprocal both ends of edge ontology have been recessed one first groove and one second groove respectively；
One die bond step S13: at least luminescence chip for being fixed with multiple solder spheres is fixedly welded on multiple first welderings
Pad；
One light transmission colloid forming step S14: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove；
One driving chip fixing step S15: the driving chip for being fixed with multiple solder spheres is fixedly welded on multiple
Two weld pads；
One packing colloid forming step S16: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove.
Figure 11 is please referred to, is that the second of the production method of each luminescence unit of the display equipment of the utility model is implemented
The flow diagram of example.
One substrate manufacture step S21: in reciprocal two broad side surfaces of a substrate be respectively formed multiple first weld pads and
Multiple second weld pads, and multiple conductive channels are formed in substrate, and the first at least a part of weld pad is enable to lead by multiple
Electric channel is electrically connected with the second at least a part of weld pad；
One insulating body forming step S22: make the part of insulating materials cladding substrate, to form an insulating body, absolutely
The reciprocal both ends of edge ontology have been recessed one first groove and one second groove respectively；
One driving chip fixing step S23: the driving chip for being fixed with multiple solder spheres is fixedly welded on multiple
Two weld pads；
One packing colloid forming step S24: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove；
One die bond step S25: at least luminescence chip for being fixed with multiple solder spheres is fixedly welded on multiple first welderings
Pad；
One light transmission colloid forming step S26: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove.
About the reciprocal two wide sides of substrate alleged in aforesaid substrate making step S11 and substrate manufacture step S21
Face, alleged first mounting surface and the second mounting surface as in previous embodiment；Aforesaid substrate making step S11 and substrate manufacture step
Alleged multiple first weld pads and multiple second weld pads in rapid S21, as meaning is respectively arranged at the first installation in previous embodiment
The weld pad of face and the second mounting surface.About the first mounting surface, the second mounting surface and the weldering being arranged in previous embodiment
Pad etc. is related to implement explanation, is also similarly applied in the present embodiment.Pass through each of the display equipment of above-mentioned the utility model
Luminescence unit produced by the first embodiment and second embodiment of the production method of luminescence unit, i.e., as shown in Figure 5.
Figure 12 is please referred to, is that the third of the production method of each luminescence unit of the display equipment of the utility model is implemented
The flow diagram of example.
One pedestal forming step S31: so that an insulating materials is coated multiple lead frames, and make insulating body reciprocal two
Indent has one first groove and one second groove respectively at end, and it is recessed that each reciprocal two sides of lead frame are exposed to first respectively
Slot and the second groove, and the part of each lead frame exposes to insulating body；
One die bond step S32: multiple light-emitting diode chip for backlight unit are fixed on multiple lead frames and are exposed in the first groove
Partly, it is located at multiple light-emitting diode chip for backlight unit in the first groove；
One routing step S33: make multiple light-emitting diode chip for backlight unit by multiple plain conductors, electrically connect with multiple lead frames
It connects, so that multiple light-emitting diode chip for backlight unit and multiple lead frames are electrically connected；
One light transmission colloid forming step S34: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove；
One driving chip fixing step S35: a driving chip is fixed on multiple lead frames and is exposed in the first groove
Partly, it is located at driving chip in the second groove；
One routing step S36: make driving chip by multiple plain conductors, be electrically connected with multiple lead frames, and make to drive
Dynamic chip can be electrically connected by lead frame and multiple institute's light-emitting diode chip for backlight unit；
One packing colloid forming step S37: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove.
Figure 13 is please referred to, is that the 4th of the production method of each luminescence unit of the display equipment of the utility model implements
The flow diagram of example.
One pedestal forming step S41: so that an insulating materials is coated multiple lead frames, and make insulating body reciprocal two
Indent has one first groove and one second groove respectively at end, and it is recessed that each reciprocal two sides of lead frame are exposed to first respectively
Slot and the second groove, and the part of each lead frame exposes to insulating body；
One driving chip fixing step S42: a driving chip is fixed on multiple lead frames and is exposed in the first groove
Partly, it is located at driving chip in the second groove；
One routing step S43: make driving chip by multiple plain conductors, be electrically connected with multiple lead frames, and make to drive
Dynamic chip can be electrically connected by lead frame and multiple institute's light-emitting diode chip for backlight unit；
One packing colloid forming step S44: one packaging plastic of filling is in the second groove, and cure package glue, to form one
Packing colloid, packing colloid seal the second groove；
One die bond step S45: multiple light-emitting diode chip for backlight unit are fixed on multiple lead frames and are exposed in the first groove
Partly, it is located at multiple light-emitting diode chip for backlight unit in the first groove；
One routing step S46: make multiple light-emitting diode chip for backlight unit by multiple plain conductors, electrically connect with multiple lead frames
It connects, so that multiple light-emitting diode chip for backlight unit and multiple lead frames are electrically connected；
One light transmission colloid forming step S47: one light transmission glue of filling solidifies light transmission glue in the first groove, to form one
Light transmission colloid, light transmission colloid seal the first groove.
Luminescence unit produced by 3rd embodiment by the production method of the luminescence unit of above-mentioned the utility model,
I.e. as shown in Fig. 8 and Fig. 9；Relatively, documented correlation embodiment party in the previous embodiment corresponding to Fig. 8 and Fig. 9
Formula is equally applicable in the present embodiment.
According to the display equipment of upper described the utility model, due to having been provided with driving chip inside each luminescence unit, and
Both driving chip and luminescence chip are to be set to insulating body two sides opposite each other, therefore, the minimum ruler of each luminescence unit
It is very little to be contracted to 0.5 millimeter * 0.5 millimeter, and show the spacing (pitch) of the luminescence unit adjacent two-by-two of equipment to each other
It can be contracted to 0.6 millimeter.
Claims (10)
1. a kind of display equipment, which is characterized in that the display equipment includes:
Multiple luminescence units, each luminescence unit includes:
One insulating body, reciprocal both ends have been recessed one first groove and one second groove respectively, and described first
A light transmission colloid is filled in groove, second groove is filled with a packing colloid；
One substrate is set in the insulating body, and the reciprocal broad side surface of substrate is respectively defined as one first peace
Dress face and one second mounting surface, first mounting surface is corresponding to expose to first groove, and second mounting surface is corresponding outer
It is exposed to second groove, includes multiple conductive channels in the substrate；
An at least luminescence chip is fixedly installed on first mounting surface, and the luminescence chip is corresponding positioned at described first
In groove, and the luminescence chip is coated by the light transmission colloid；
One driving chip, is fixedly installed on second mounting surface, the driving chip by multiple conductive channels with
The luminescence chip is electrically connected, and the driving chip is coated in the packing colloid, and the driving chip is not exposed
In the insulating body or the packing colloid；
Multiple pins, part expose to outside the insulating body, and the part pin and the luminescence chip are electrically connected, portion
Part pin and the driving chip are electrically connected；
One circuit main board, multiple luminescence units are fixedly installed on the circuit main board, and multiple luminescence units are each other
Compartment of terrain is arranged；And
One processing unit, is fixedly installed on the circuit main board, and the processing unit passes through the circuit main board and each institute
Luminescence unit electric connection is stated, the processing unit can independently control the brightness for the light beam that each luminescence unit is issued
Or colour temperature.
2. display equipment according to claim 1, which is characterized in that the luminescence chip passes through multiple plain conductors and shape
The conducting wiring structure of first mounting surface described in Cheng Yu is electrically connected；Alternatively, the luminescence chip passes through welding body and is set to
Multiple weld pads on first mounting surface are connected with each other.
3. according to display equipment of any of claims 1 or 2, which is characterized in that the driving chip passes through multiple plain conductors
It is electrically connected with the conducting wiring structure for being set to second mounting surface；Alternatively, the driving chip passes through welding body and sets
The multiple weld pads being placed on second mounting surface are connected with each other.
4. display equipment according to claim 1, which is characterized in that the packing colloid is translucent construction or opaque knot
Structure.
5. display equipment according to claim 1, which is characterized in that each luminescence unit tool shines there are three described
Chip, is respectively one first light-emitting diode chip for backlight unit, one second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit,
First light-emitting diode chip for backlight unit can issue 610 nanometers to 780 nanometers of wavelength of light beam；Second light-emitting diode chip for backlight unit
500 nanometers to 570 nanometers of wavelength of light beam can be issued；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 of wavelength
The light beam of nanometer；First light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light emitting diode
The range of exposures of any of chip can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit；
What first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit were issued
Light beam can be mutually mixed as a light mixing light beam；The processing unit can control first hair of each luminescence unit
Any of luminous diode chip, second light-emitting diode chip for backlight unit and described third light-emitting diode chip for backlight unit, with control
The brightness or colour temperature of the light mixing light beam.
6. display equipment according to claim 1, which is characterized in that the circuit main board only includes four layers of electrical layer knot
Structure is respectively one first signals layer structure, a bus plane structure, a second signal layer structure and a ground plane structure.
7. a kind of display equipment, which is characterized in that the display equipment includes:
Multiple luminescence units, each luminescence unit includes:
One insulating body, reciprocal both ends have been recessed one first groove and one second groove respectively, and described first
A light transmission colloid is filled in groove, second groove is filled with a packing colloid；
Multiple lead frames, each reciprocal two sides of lead frame are exposed to first groove and described respectively
Two grooves, and the part of each lead frame exposes to the insulating body；
Multiple luminescence chips, are fixedly installed on the part that multiple lead frames are exposed to first groove, and multiple institutes
It is corresponding in first groove to state luminescence chip, each luminescence chip passes through multiple first plain conductors and at least one
The lead frame of part is electrically connected；Multiple luminescence chips and multiple first plain conductors are by the light transmission colloid
Cladding；And
One driving chip is fixedly installed on the part that multiple lead frames are exposed to second groove, the driving core
Piece is electrically connected by multiple second plain conductors and at least a part of lead frame；Multiple driving chips and multiple described
Second plain conductor is coated by the packing colloid；The driving chip passes through multiple second plain conductors and each described
The lead frame that second plain conductor is electrically connected, and be electrically connected with multiple luminescence chips；
One circuit main board, multiple luminescence units are fixedly installed on the circuit main board, and multiple luminescence units are each other
Compartment of terrain is arranged；And
One processing unit, is fixedly installed on the circuit main board, and the processing unit passes through the circuit main board and each institute
Luminescence unit electric connection is stated, the processing unit can independently control the bright of the light beam of each luminescence unit issued
Degree or colour temperature.
8. display equipment according to claim 7, which is characterized in that the packing colloid is translucent construction or opaque knot
Structure.
9. display equipment according to claim 7, which is characterized in that there are three the luminous cores for the luminescence unit tool
Piece is respectively one first light-emitting diode chip for backlight unit, one second light-emitting diode chip for backlight unit and a third light-emitting diode chip for backlight unit, institute
610 nanometers to 780 nanometers of wavelength of light beam can be issued by stating the first light-emitting diode chip for backlight unit；The second light-emitting diode chip for backlight unit energy
Issue 500 nanometers to 570 nanometers of wavelength of light beam；The third light-emitting diode chip for backlight unit can issue 450 nanometers to 495 of wavelength and receive
The light beam of rice；First light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diodes tube core
The range of exposures of any of piece can partly overlap with the range of exposures of at least one of remaining light-emitting diode chip for backlight unit；Institute
State the light that the first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the third light-emitting diode chip for backlight unit are issued
Beam can be mutually mixed as a light mixing light beam；The processing unit can control each luminescence unit described first shine
Any of diode chip for backlight unit, second light-emitting diode chip for backlight unit and described third light-emitting diode chip for backlight unit, to control
State the brightness or colour temperature of light mixing light beam.
10. display equipment according to claim 7, which is characterized in that the circuit main board only includes four layers of electrical layer
Structure is respectively one first signals layer structure, a bus plane structure, a second signal layer structure and a ground plane structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821368050.5U CN208637100U (en) | 2018-08-23 | 2018-08-23 | Show equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821368050.5U CN208637100U (en) | 2018-08-23 | 2018-08-23 | Show equipment |
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| CN208637100U true CN208637100U (en) | 2019-03-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
| CN113572024A (en) * | 2021-07-13 | 2021-10-29 | Oppo广东移动通信有限公司 | Light emitter, depth module and terminal |
-
2018
- 2018-08-23 CN CN201821368050.5U patent/CN208637100U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
| CN113572024A (en) * | 2021-07-13 | 2021-10-29 | Oppo广东移动通信有限公司 | Light emitter, depth module and terminal |
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