TWM570532U - Illumination module - Google Patents

Abstract

A light emitting module includes an insulative housing, a substrate, at least one light emitting unit, and a driving wafer. a first groove and a second groove are respectively recessed in opposite ends of the insulating body, and the substrate is disposed in the insulating body, and the first mounting surface and the first surface are respectively exposed in the first groove and the second groove The first mounting surface and the second mounting surface are opposite to each other, and the light emitting unit and the driving wafer are respectively disposed on the first mounting surface and the second mounting surface. The light-emitting module of the present invention can reduce the overall size of the light-emitting module by vertically arranging the light-emitting unit and the driving wafer vertically.

Description

Light module

The present invention relates to a lighting module, and more particularly to a lighting module including a driving chip therein.

The existing LED unit including the control wafer inside is not widely used in a small-sized electronic device due to the setting of the control wafer. However, the LED unit including the control chip is internally provided, and the control chip is disposed outside the LED unit in terms of electronic control and the like, and has the advantages of convenient control and the like. Therefore, for the related art of the LED unit, the reduction of the LED unit having the control wafer inside is one of the problems that is extremely desired to be improved.

Therefore, the author is concentrating on research and using the application of theory, and proposes a creation that is reasonable in design and effective in improving the above problems.

The main purpose of the present invention is to provide a light-emitting module for improving the size of a light-emitting module in which a control chip is packaged in the prior art.

In order to achieve the above object, the present invention provides a light emitting module comprising: an insulating body, a substrate, at least one light emitting unit, and a control wafer. A first groove and a second groove are respectively recessed in the opposite ends of the insulating body. The first groove is filled with a transparent colloid, and the second groove is filled with an encapsulant. The substrate is disposed in the insulative housing, and the opposite sides are defined as a first mounting surface and a second mounting surface. The first mounting surface is exposed to the first recess, and the second mounting surface is exposed to the second recess. The substrate includes a plurality of conductive channels. At least one light emitting unit is fixedly disposed on the first mounting surface, and the light emitting unit is correspondingly located in the first groove, and is The light unit is covered by a light-transmitting colloid. The control wafer is fixedly disposed on the second mounting surface, and the control wafer is electrically connected to the light emitting unit through a plurality of conductive channels, and the control wafer is coated in the encapsulant, and the control wafer is not exposed to the insulating body or the encapsulant. A plurality of pins are exposed outside the insulating body, and some of the pins are electrically connected to the light emitting unit, and some of the pins are electrically connected to the control chip. The control chip can receive the electrical signal transmitted by the external control device through the pin to control the brightness or color temperature of the light beam emitted by the light emitting unit.

In order to achieve the above object, the present invention also provides a light emitting module, comprising: an insulating body, a plurality of lead frames, a plurality of light emitting units, and a control wafer. A first groove and a second groove are respectively recessed in the opposite ends of the insulating body. The first groove is filled with a transparent colloid, and the second groove is filled with an encapsulant. The two opposite sides of the lead frames are respectively exposed to the first groove and the second groove, and portions of the lead frames are exposed to the insulating body. The plurality of light emitting units are fixedly disposed on the portion of the plurality of lead frames exposed to the first recess, and the plurality of light emitting units are correspondingly located in the first recess, and each of the light emitting units passes through the plurality of first metal wires and at least a portion The lead frame is electrically connected; the plurality of light emitting units and the plurality of first metal wires are covered by the light transmitting colloid. The control chip is fixedly disposed on a portion of the plurality of lead frames exposed to the second recess, and the control wafer is electrically connected to the at least one portion of the lead frame through the plurality of second metal wires; the plurality of light emitting units and the plurality of second metals The wire is covered by the encapsulant; the control wafer is electrically connected to the plurality of light emitting units through the plurality of second metal wires and the lead frames electrically connected to the second metal wires. The control chip can receive the electrical signals transmitted by the external control device through the plurality of lead frames to correspondingly control the brightness or color temperature of the light beams emitted by the respective light emitting units.

The beneficial effect of the present invention is that the size of the entire light-emitting module can be greatly reduced by designing the control wafer and the light-emitting unit on the substrate or the opposite sides of the plurality of lead frames.

In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings regarding this creation, however, the drawings only provide references and explanations. Used, not to limit the creation of this creation.

100‧‧‧Lighting module

10‧‧‧Insulated body

10a‧‧‧first groove

10b‧‧‧second groove

11‧‧‧Translucent colloid

12‧‧‧Package colloid

13‧‧‧Substrate

131‧‧‧First mounting surface

132‧‧‧Second mounting surface

133‧‧‧ conductive path

134‧‧‧ solder pads

14‧‧‧Lighting unit

141‧‧‧Metal wire

142‧‧‧welding body

15‧‧‧Control chip

151‧‧‧Metal wire

16‧‧‧ pins

17‧‧‧ lead frame

18‧‧‧ lead frame

181‧‧‧welding surface

FIG. 1 is a perspective view of a first embodiment of a lighting module of the present invention.

2 is a perspective view of another angle of the first embodiment of the light-emitting module of the present invention.

3 is a cross-sectional view showing a first embodiment of the light-emitting module of the present invention.

4 is a cross-sectional view showing a second embodiment of the light-emitting module of the present invention.

Fig. 5 is a partially enlarged schematic view of Fig. 4;

FIG. 6 is a perspective view of a third embodiment of the light-emitting module of the present invention.

FIG. 7 is a cross-sectional view showing a third embodiment of the light-emitting module of the present invention.

FIG. 8 is a perspective view of a fourth embodiment of the light-emitting module of the present invention.

FIG. 9 is a cross-sectional view showing a fourth embodiment of the light-emitting module of the present invention.

FIG. 10 is a schematic flow chart of a first embodiment of a method for fabricating a light-emitting module according to the present invention.

FIG. 11 is a schematic flow chart of a second embodiment of a method for fabricating a light-emitting module according to the present invention.

FIG. 12 is a schematic flow chart of a third embodiment of a method for fabricating a light-emitting module according to the present invention.

FIG. 13 is a schematic flow chart of a fourth embodiment of a method for fabricating a light-emitting module according to the present invention.

The following describes the implementation of the light-emitting module of the present invention by a specific specific example, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. The present invention may also be implemented or applied by other specific examples. The details of the present specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. The drawing of this creation is only a brief description, and is not depicted in actual size, that is, the actual size of the relevant composition is not reflected, which will be described first. The following embodiments are further detailed in this section. The idea of creation, but does not limit the scope of this creation by any point of view. In the following description, if reference is made to a specific drawing or as shown in the specific drawings, it is only used to emphasize that in the following description, the relevant content of the description is mostly in the specific drawing. However, it is not limited to the specific description in the following description.

Please refer to FIG. 1 to FIG. 3 , FIG. 1 and FIG. 2 are schematic perspective views of a first embodiment of a light-emitting module according to the present invention; FIG. 3 is a cross-sectional view of a first embodiment of the light-emitting module of the present invention. As shown, the light-emitting module 100 includes an insulative housing 10, a substrate 13, three light-emitting units 14, a control wafer 15, and four pins 16.

A first recess 10a and a second recess 10b are respectively recessed in opposite ends of the insulative housing 10. The first recess 10a is filled with a transparent colloid 11 and the second recess is filled with an encapsulant 12. In practical applications, the shapes of the first recess 10a and the second recess 10b may be changed according to requirements, and only one of the exemplary embodiments is shown; the first recess 10a and the second recess 10b Basically, they are not connected to each other, but not limited to this. In practical applications, the sidewall forming the first recess 10a may be provided with a reflective layer (not shown), and the sidewall forming the first recess 10a may also be inclined, so that the guiding light can be assisted. The beam emitted by unit 14.

The substrate 13 is disposed in the insulative housing 10, and the two wide sides opposite to each other are defined as a first mounting surface 131 and a second mounting surface 132. The first mounting surface 131 is correspondingly exposed to the bottom of the first recess 10a. The second mounting surface 132 is correspondingly exposed to the bottom of the second recess 10b. As shown in FIG. 3, the substrate 13 includes a plurality of conductive vias 133. Specifically, the substrate 13 may be any type of circuit board, and the first mounting surface 131 and the second mounting surface 132 may be formed by etching or the like according to requirements, such as a conductive wiring structure (Layout) and a plurality of pads. The conductive path 133 may be formed by a through hole formed in the substrate 13 and a conductive material filled in the through hole. The conductive wiring structure and the pad formed on the first mounting surface 131 and the second mounting surface 132 may be configured according to the type of the light emitting unit 14 , the number of the light emitting units 14 , the type of the control wafer 15 , and the light emitting module 100 . The number of pins 16 and the like are designed and are not limited herein. Regarding the number of conductive channels 133 and their setting positions, It may be determined according to the position at which the control wafer 15 and the light-emitting unit 14 are disposed on the substrate 13. The control wafer 15 may be, for example, a driving chip for driving the light-emitting unit 14 to light up, or may be various types of microprocessors.

As shown in FIG. 3 and FIG. 4 , the three light-emitting units 14 are fixedly disposed on the first mounting surface 131 , and each of the light-emitting units 14 is electrically connected to the conductive wiring structure on the first mounting surface 131 through the plurality of metal wires 141 . And electrically connected to the conductive channel 133 in the substrate 13. The three light emitting units 14 fixed to the first mounting surface 131 are correspondingly located in the first recess 10a, and the three light emitting units 14 are covered by the transparent colloid 11 , and the light beams emitted by the three light emitting units 14 can pass through. The light-transmitting colloid 11 is emitted outward.

In practical applications, the three light emitting units 14 can be a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, and the first light emitting diode chip can emit wavelengths. a light beam of 610 nm to 780 nm; a second light emitting diode chip capable of emitting a light beam having a wavelength of 500 nm to 570 nm; and a third light emitting diode chip capable of emitting a light beam having a wavelength of 450 nm to 495 nm; That is, the three light emitting units 14 may be light beams capable of emitting red light, green light, and blue light, respectively. The illumination range of any one of the first LED chip, the second LED chip, and the third LED chip can partially overlap the illumination range of at least one of the remaining LED chips, and The light beams emitted by the light-emitting diode chip, the second light-emitting diode chip, and the third light-emitting diode chip can be mixed with each other to form a mixed light beam. In particular, the light-emitting unit 14 may be any light-emitting chip, such as a light-emitting chip capable of emitting infrared light or UV light. The wavelengths that can be emitted by the above-mentioned light-emitting diode chips are only one of the exemplary aspects.

In this embodiment, three light-emitting units 14 that can emit different light are taken as an example, but not limited thereto. In a specific embodiment, the light-emitting module 100 may have four or more or less. The wavelength of the light beam that can be emitted by the light-emitting unit 14 and the light-emitting unit 14 is not limited to the above, and can be selected according to requirements.

The control wafer 15 is fixedly disposed on the second mounting surface 132, and the control wafer 15 is electrically connected to the conductive wiring structure on the second mounting surface 132 through the plurality of metal wires 151. The control wafer 15 can be electrically connected to the three light emitting units 14 through the conductive vias 133 in the substrate 13. The control wafer 15 is correspondingly located in the second recess 10b, and the control wafer 15 is covered in the encapsulant 12, and the control wafer 15 is not exposed to the insulative housing 10 or the encapsulant 12. The encapsulant 12 can be an opaque structure or a light transmissive structure, which is not limited herein.

The second recess 10b is only for exposing the second mounting surface 132 of the substrate 13, so that the control wafer 15 can be correspondingly disposed on the second mounting surface 132. Therefore, the size and shape of the second recess 10b are substantially It is designed according to the size of the control wafer 15, and the size and shape of the second groove 10b are not in absolute relative relationship with the size and shape of the first groove 10a. However, if the second recess 10b is located directly below the first recess 10a, the overall size of the light emitting module 100 can be effectively reduced.

As shown in FIG. 2 , the plurality of pins 16 are exposed outside the insulative housing 10 , and some of the pins 16 are electrically connected to the light emitting unit 14 , and some of the pins 16 are electrically connected to the control chip 15 . The conductive wiring structure on the first mounting surface 131 of the substrate 13 , the conductive wiring structure on the second mounting surface 132 , and the plurality of conductive vias 133 are electrically connected to the plurality of light emitting units 14 and the control wafer 15 . Specifically, the pin 16 referred to herein is a structure for soldering the light emitting module 100 to the related electronic component; in a specific implementation application, the pin 16 may be a structure extended by the substrate 13. Alternatively, the pin 16 may be independent of the metal member of the substrate 13, and one end of the pin 16 is fixed to the substrate 13, and the other end of the pin 16 is correspondingly exposed outside the insulating body 10. The control chip 15 can receive the electrical signal transmitted by the external control device through the pin 16 to control the brightness or color temperature of the light beam emitted by the light emitting unit 14. Regarding the number of pins 16 and their appearance, it may be changed according to requirements, and is not limited to the one shown in the figure.

Please refer to FIG. 4 and FIG. 5 together. FIG. 4 is a cross-sectional view showing a second embodiment of the light-emitting module of the present invention, and FIG. 5 is a partially enlarged schematic view of FIG. As shown in the figure, the maximum difference between the embodiment and the foregoing embodiment is that each of the light-emitting units 14 may be interconnected with the plurality of pads 134 disposed on the first mounting surface 131 through the soldering body 142. The control wafer 15 may be connected to the plurality of pads 134 disposed on the second mounting surface 132 via the soldering body 142. The plurality of pads 134 disposed on the first mounting surface 131 and the second mounting surface 132 are electrically connected to the conductive vias 133 disposed in the substrate 13 .

Specifically, in the process of actually mounting the light-emitting unit 14 and the control wafer 15, a solder ball (for example, a solder ball) may be disposed at a position where the light-emitting unit 14 and the control wafer 15 are to be electrically connected, and then directly disposed The light-emitting unit 14 and the control wafer 15 of the solder ball are corresponding to the plurality of pads 134 disposed on the first mounting surface 131 and the second mounting surface 132, and then the solder ball is cured to the light-emitting unit 14 and the bonding pad. The solder body 142 is formed between the 134 and between the control wafer 15 and the pad 134; thus, the manufacturing method will eliminate the need to use the metal wires described in the foregoing embodiments, so that the light-emitting unit 14 or the control wafer 15 can be greatly improved. The yield on the substrate 13.

In particular, in practical applications, the light-emitting unit 14 and the control wafer 15 may be mounted on the substrate 13 in the manner of the present embodiment or in the manner of the foregoing embodiments, respectively, according to actual manufacturing requirements; In the same light-emitting module 100, the light-emitting unit 14 can be electrically connected to the substrate 13 through the plurality of metal wires 141, and the control wafer 15 can be electrically connected to the substrate 13 through the plurality of soldering bodies 142; or The same light-emitting module 100 may be such that the light-emitting unit 14 is electrically connected to the substrate 13 through the plurality of soldering bodies 142, and the control wafer 15 is electrically connected to the substrate 13 through the plurality of metal wires 151.

Please refer to FIG. 6 to FIG. 9 . FIG. 6 and FIG. 7 are schematic diagrams showing a third embodiment of the lighting module of the present invention. FIG. 8 and FIG. 9 show a fourth embodiment of the lighting module of the present invention. schematic diagram. As shown in FIG. 6 , the biggest difference between the embodiment and the foregoing embodiment is that the light emitting module 100 does not include the substrate 13 , and the light emitting module 100 includes a plurality of lead frames 17 . The following description is only for the lead frame 17, and the rest of the components are described in the foregoing embodiments, and details are not described herein again.

Two side faces of the respective lead frames 17 opposite to each other are respectively exposed to the first groove 10a And the second recess 10b, and a portion of each lead frame 17 is exposed to the insulative housing 10 to serve as the pin 16 of the foregoing embodiment; for a detailed description of the pin 16, please refer to the foregoing embodiment, Let me repeat.

The plurality of light emitting units 14 are fixedly disposed on a portion of the plurality of lead frames 17 exposed to the first recess 10a, and the plurality of light emitting units 14 are correspondingly located in the first recess 10a, and each of the light emitting units 14 passes through the plurality of first metal wires. The 141 is electrically connected to at least a portion of the lead frame 17 . The plurality of light emitting units 14 and the plurality of first metal wires 141 are coated together by the light transmitting colloid 11 . The number of the lead frames 17 may be determined according to the number of the light-emitting units 14 and the type of the control wafer 15, and may be, for example, four, six, eight, or the like.

The control wafer 15 is fixedly disposed on a portion of the plurality of lead frames 17 exposed to the second recess 10b. The control wafer 15 is electrically connected to at least a portion of the lead frame 17 through the plurality of second metal wires 151. The control wafer 15 and the plurality of second metal wires 151 are covered by the encapsulant 12. The control wafer 15 is electrically connected to the plurality of light emitting units 14 through a plurality of second metal wires 151 and lead frames 17 electrically connected to the respective second metal wires 151. Thereby, the control wafer 15 can receive the electrical signals transmitted by the external control device through the plurality of lead frames 17 to correspondingly control the brightness or color temperature of the light beams emitted by the respective light emitting units 14.

As shown in FIG. 8 and FIG. 9, the outer shape of the lead frame 18 exposed outside the insulative housing 10 may be changed according to requirements, and is not limited to those shown in FIGS. 6 and 7. Specifically, the soldering surface 181 of the lead frame 18 may be substantially flush with the light emitting surface of the light emitting module 100.

Please refer to FIG. 10 , which is a schematic flowchart of a first embodiment of a method for fabricating a light-emitting module. The manufacturing method of the illuminating module of the present invention comprises the following steps: a substrate manufacturing step S11: forming a plurality of first pads and a plurality of second pads on two wide sides opposite to each other on a substrate, and forming the same in the substrate a plurality of conductive channels to enable at least a portion of the first pad Electrically connecting with at least a portion of the second bonding pad through a plurality of conductive channels; an insulating body forming step S12: covering an insulating material with a portion of the substrate to form an insulating body, the opposite ends of the insulating body Forming a first recess and a second recess respectively; a solid crystal step S13: soldering and fixing at least one light emitting unit fixed with a plurality of solder balls to the plurality of first pads; and a transparent colloid molding step S14: filling a light-transmissive glue in the first recess, and curing the transparent adhesive to form a transparent colloid, the transparent colloid sealing the first recess; and controlling the wafer fixing step S15: a plurality of solder balls are fixed a control wafer is soldered and fixed to the plurality of second pads; a package colloid molding step S16: filling a package adhesive in the second recess, and curing the encapsulant to form an encapsulant, the encapsulant sealing the second recess .

Please refer to FIG. 11 , which is a schematic flowchart of a second embodiment of a method for fabricating a light-emitting module.

a substrate manufacturing step S21: forming a plurality of first pads and a plurality of second pads on two wide sides opposite to each other, and forming a plurality of conductive channels in the substrate, and at least one part of the a solder pad can be electrically connected to at least a portion of the second pad through a plurality of conductive vias; an insulative body molding step S22: an insulating material covers a portion of the substrate to form an insulative body, and the insulative bodies are in contact with each other The opposite ends are respectively concavely formed with a first groove and a second groove; a control wafer fixing step S23: soldering and fixing a control wafer with a plurality of solder balls fixed to the plurality of second solder pads; and an encapsulation molding step S24: filling a package adhesive in the second recess and curing the encapsulant To form a package colloid, the encapsulant seals the second recess; a solid crystal step S25: soldering and fixing at least one light-emitting unit with a plurality of solder balls fixed to the plurality of first pads; and a transparent colloid molding step S26 Filling a light-transmissive glue in the first groove and curing the light-transmitting glue to form a light-transmissive colloid, and the light-transmitting gel seals the first groove.

The two wide side surfaces of the substrate in the substrate forming step S11 and the substrate forming step S21 are opposite to each other, that is, the first mounting surface and the second mounting surface in the above embodiments; the substrate manufacturing step S11 and the substrate manufacturing step The plurality of first pads and the plurality of second pads referred to in S21 are the pads provided on the first mounting surface and the second mounting surface, respectively, as referred to in the foregoing embodiments. The related embodiments of the first mounting surface, the second mounting surface, and the pads disposed thereon in the foregoing embodiments are also applicable to the present embodiment. The light-emitting module produced by the first embodiment and the second embodiment of the method for fabricating the light-emitting module of the present invention is as shown in FIG.

Please refer to FIG. 12 , which is a schematic flowchart of a third embodiment of a method for fabricating a light-emitting module.

a pedestal forming step S31: coating an insulating material with a plurality of lead frames, and recessing two opposite ends of the insulating body with a first groove and a second groove respectively, and the opposite sides of the lead frames are opposite to each other Exposed to the first recess and the second recess respectively, and a portion of each lead frame is exposed to the insulative body; a solid crystal step S32: fixing the plurality of LED chips to the plurality of lead frames exposed in the first recess Part of the slot, The plurality of light-emitting diode chips are located in the first recess; the first step S33: the plurality of light-emitting diode chips are electrically connected to the plurality of lead frames through the plurality of metal wires, so that the plurality of light-emitting diodes The polar body chip is electrically connected to the plurality of lead frames; a transparent colloid forming step S34: filling a transparent adhesive in the first recess, and curing the transparent adhesive to form a transparent colloid, the transparent colloid sealing a groove; a control wafer fixing step S35: fixing a control wafer to a portion of the plurality of lead frames exposed in the first groove, and placing the control wafer in the second groove; a wire bonding step S36: enabling control The wafer is electrically connected to the plurality of lead frames through a plurality of metal wires, so that the control chip can be electrically connected to the plurality of light-emitting diode chips through the lead frame; and an encapsulation molding step S37: filling a package adhesive in the second The encapsulant is cured in the recess to form an encapsulant, and the encapsulant seals the second recess.

Please refer to FIG. 13 , which is a schematic flowchart of a fourth embodiment of a method for fabricating a light-emitting module.

a susceptor forming step S41: an insulating material is coated with a plurality of lead frames, so that the lead frame forms an insulating body, and the opposite ends of the insulating body are respectively recessed with a first groove and a second groove The two opposite sides of the lead frames are respectively exposed to the first groove and the second groove, and portions of the lead frames are exposed to the insulating body; a control wafer fixing step S42: fixing a control wafer to a portion of the plurality of lead frames exposed in the first recess, and placing the control wafer in the second recess; and a step S43: passing the control wafer through the plurality of The metal wire is electrically connected to the plurality of lead frames, so that the control chip can be electrically connected to the plurality of light-emitting diode chips through the lead frame; and an encapsulation molding step S44: filling a package adhesive in the second groove, And curing the encapsulant to form a package colloid, the encapsulant sealing the second recess; a solid crystal step S45: fixing the plurality of LED chips to the portion of the plurality of lead frames exposed in the first recess, And the plurality of light-emitting diode chips are located in the first recess; the first step S46: the plurality of light-emitting diode chips are electrically connected to the plurality of lead frames through the plurality of metal wires, so that the plurality of light-emitting diodes The polar body chip is electrically connected to the plurality of lead frames; a transparent colloid forming step S47: filling a transparent adhesive in the first groove, and curing the transparent adhesive to form a transparent colloid, the transparent colloid sealing a groove.

The illuminating module produced by the third embodiment and the fourth embodiment of the illuminating module of the present invention is as shown in FIG. 6 to FIG. 9; correspondingly, corresponding to FIG. 6 to FIG. The related embodiments described in the foregoing embodiments can also be applied to the present embodiment.

The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

Claims (10)

A light-emitting module includes: an insulative body, wherein two opposite ends of the light-emitting module are respectively concavely formed with a first groove and a second groove, wherein the first groove is filled with a transparent colloid, the first The two recesses are filled with a package colloid; a substrate is disposed in the insulative housing, and the opposite wide sides are respectively defined as a first mounting surface and a second mounting surface, and the first mounting surface is correspondingly exposed a first recess, the second mounting surface is correspondingly exposed to the second recess, the substrate includes a plurality of conductive channels; at least one light emitting unit is fixedly disposed on the first mounting surface, and The light emitting unit is correspondingly located in the first recess, and the light emitting unit is covered by the transparent colloid; a control wafer is fixedly disposed on the second mounting surface, and the control wafer passes through The conductive channel is electrically connected to the light emitting unit, the control wafer is encapsulated in the encapsulant, and the control wafer is not exposed to the insulating body or the encapsulant; a plurality of pins Exposed to the above In the external body, a part of the pin is electrically connected to the light emitting unit, and some of the pins are electrically connected to the control chip; wherein the control chip can receive an external control device through the pin a transmitted electrical signal to control the brightness or color temperature of the light beam emitted by the illumination unit. The illuminating module of claim 1, wherein the illuminating unit is electrically connected to the conductive wiring structure formed on the first mounting surface through a plurality of metal wires; or the illuminating unit is permeable to the soldering body and the illuminating unit A plurality of pads on the first mounting surface are connected to each other. The lighting module of claim 1, wherein the control chip is transmitted through a plurality of The metal wire is electrically connected to the conductive wiring structure disposed on the second mounting surface; or the control wafer is interconnected with the plurality of pads disposed on the second mounting surface through the soldering body. The lighting module of claim 1, wherein the encapsulant is a light transmitting structure. The lighting module of claim 1, wherein the encapsulant is an opaque structure. The illuminating module of claim 1, wherein the illuminating module has three illuminating units, which are respectively a first illuminating diode chip, a second illuminating diode chip and a third a light-emitting diode chip capable of emitting a light beam having a wavelength of 610 nm to 780 nm; and the second light-emitting diode chip capable of emitting a light beam having a wavelength of 500 nm to 570 nm; The third light emitting diode chip can emit a light beam having a wavelength of 450 nm to 495 nm; the first light emitting diode chip, the second light emitting diode chip, and the third light emitting diode The illumination range of any of the chips may partially overlap the illumination range of at least one of the remaining LED chips; the first LED chip, the second LED chip, and the third The light beams emitted by the LED chips can be mixed with each other to form a mixed light beam; the control chip can receive the electrical signals transmitted by the external control device through the pins to correspondingly control the brightness of the mixed light beam or Color temperature. A light-emitting module includes: an insulative body, wherein two opposite ends of the light-emitting module are respectively concavely formed with a first groove and a second groove, wherein the first groove is filled with a transparent colloid, the first The two grooves are filled with a package colloid; a plurality of lead frames, two opposite sides of the lead frames are respectively exposed to the first groove and the second groove, and portions of each of the lead frames a plurality of light-emitting units are fixedly disposed on a portion of the plurality of lead frames exposed to the first recess, and a plurality of the light-emitting units are correspondingly located in the first recess Each of the light emitting units is electrically connected to at least a portion of the lead frame through a plurality of first metal wires; and the plurality of the light emitting units and the plurality of the first metal wires are wrapped by the transparent colloid a control wafer fixedly disposed on a portion of the plurality of lead frames exposed to the second recess, the control wafer being electrically connected to the at least one portion of the lead frame through a plurality of second metal wires a plurality of the light emitting units and the plurality of the second metal wires are covered by the encapsulant; the control wafer is electrically connected through the plurality of the second metal wires and each of the second metal wires Connecting the lead frame to be electrically connected to the plurality of the light emitting units; wherein the control chip is capable of receiving an electrical signal transmitted by an external control device through the plurality of lead frames to correspondingly control each of the light emitting Beam emitted by the unit Brightness or color temperature. The lighting module of claim 7, wherein the encapsulant is a light transmitting structure. The lighting module of claim 7, wherein the encapsulant is an opaque structure. The illuminating module of claim 7, wherein the illuminating module has three illuminating units, which are respectively a first illuminating diode chip, a second illuminating diode chip and a third a light-emitting diode chip capable of emitting a light beam having a wavelength of 610 nm to 780 nm; and the second light-emitting diode chip capable of emitting a light beam having a wavelength of 500 nm to 570 nm; The third light emitting diode chip can emit a light beam having a wavelength of 450 nm to 495 nm; the first light emitting diode chip, the second light emitting diode chip, and the third light emitting diode The illumination range of any one of the chips can partially overlap the illumination range of at least one of the remaining LED chips; The light beams emitted by the light emitting diode chip, the second light emitting diode chip and the third light emitting diode chip can be mixed with each other to form a mixed light beam; the control chip can receive an external control device The electrical signal transmitted by the lead frame to correspondingly control the brightness or color temperature of the mixed light beam.