TWI714380B - Packaging structure and manufacturing method thereof - Google Patents

Abstract

The present invention belongs to the field of packaging technology, and in particular relates to a packaging structure and a manufacturing method thereof. The packaging structure includes a metal substrate, a control chip and an optical device. The metal substrate has a first surface and a second surface oppositely arranged; the control chip is mounted on the first surface; The optical device is installed on the second surface; the metal substrate is provided with a number of shielding parts, and each shielding part protrudes from the first surface and surrounds the control chip to electrically shield the control chip; the control chip and the optical device are both The shield member is electrically connected so that the shield member serves as an electrical pin for electrical connection with an external component. The control chip and the optical device of the package structure are respectively located on the first surface and the second surface of the metal substrate which are arranged oppositely. The shielding member is arranged around the control chip and will not affect the use of the optical device, so that the shielding member can play a role. The shield has a good anti-interference effect on the control chip, and at the same time, its structure is simple and the external size is small, which is conducive to miniaturization or thin design.

Description

Packaging structure and manufacturing method thereof

The invention belongs to the field of packaging technology, and in particular relates to a packaging structure and a manufacturing method thereof.

In modern electronic technology, various types of photoelectric sensors are widely used, especially in automotive electronic systems. Due to the complexity of the system, various control switches, various digital and analog signals are transmitted through different wiring harnesses or carriers. The conducted interference signals between the devices will affect each other, causing the related sensors to work abnormally. At the same time, they will also interfere with other electronic products in the system and affect the normal use of the electronic products. In order to make each device work normally without interfering with the work of other devices, a large number of interference prevention circuit systems (such as filtering and removing lines) need to be added to the electronic system, but it also increases the complexity and cost of the system.

There are many kinds of existing mask technologies. The most mainstream technology is to use inner mask and outer mask. The existing inner mask uses control chip and photoelectric light receiving device or optical device in the same plane, and control the front or side of the chip Metal blocks are used for certain shielding, but at the same time, the window of the light-receiving device is left to receive signals, and the metal area of the metal blocks cannot be too large, which affects the anti-interference effect of the mask. In addition, the existing outer shield part is based on a custom-made iron shell around the sensor or control chip. After the sensor or control chip is packaged, it is necessary to manually install the shell and then weld the shell and the sensor or control. The ground end of the chip is achieved by using the effect of the shell mask, and the processing process is cumbersome. It is helpful to improve production efficiency. In addition, the use of an outer shield will inevitably increase the size of the product, which is not conducive to the design trend of small or thin products.

The purpose of the present invention is to provide a packaging structure and a manufacturing method thereof, aiming to solve the technical problems of poor electrical shielding effect and large volume of the packaging structure in the prior art.

In order to achieve the above objective, the technical solution adopted by the present invention is: a package structure including a metal substrate, a control chip and an optical device, the metal substrate has a first surface and a second surface that are arranged oppositely; the control chip is mounted on the first surface; the optical device Installed on the second surface; and the metal substrate is provided with a number of shielding members, each of the shielding members protrudes from the first surface and surrounds the control chip to electrically shield the control chip; the control chip and the shielding member are electrically connected Are electrically connected, so that the shield member serves as an electrical pin for electrical connection with an external component.

Preferably, the control wafer and the optical device are arranged directly opposite.

Preferably, the metal substrate is provided with first bending portions on all four sides, and each mask member is respectively formed by bending the first bending portion toward the side of the first surface.

Preferably, the first surface is also injection molded with first annular protrusions surrounding the control chip, and the control chip is encapsulated in the first annular protrusion; each first bending part is attached to the first ring respectively The corresponding outer surface of the shaped protrusion.

Preferably, the side portion of the first bending portion facing away from the metal substrate is provided with lead bars, and each lead bar is attached to the end surface of the first annular protrusion.

Preferably, the side portion of the metal substrate is provided with a second bending portion and a third bending portion, and the mask member is formed by bending the second bending portion toward the side of the first surface and then bending along the circumferential direction of the control chip. ; The third bending portion is bent toward the side of the second surface and then bent along the circumferential direction of the optical device so that the third bending portion surrounds the optical device.

Preferably, the second surface is also injection molded with a second annular protrusion surrounding the optical device, the optical device is encapsulated in the second annular protrusion, and the third bending portion is bent toward the side of the second surface. The bend fits on the circumferential wall surface of the second annular protrusion.

Preferably, the metal substrate includes a mounting block and a number of pin blocks. The control chip and the optical device are respectively mounted on opposite sides of the mounting block. Each pin block is surrounded by the mounting block, and one end of each pin block protrudes. The side surface where the control chip is installed on the mounting block, and the shielding piece is a pin block.

Preferably, each pin block is connected to the mounting block as a whole through adhesive, and the side of the pin block is provided with a connection protrusion that exposes the adhesive and extends toward the control chip, and the control chip is electrically connected to the connection protrusion .

The above-mentioned one or more technical solutions in the package structure provided by the present invention have at least one of the following technical effects: the control chip and the optical device of the package structure are respectively located on the first surface and the second surface of the metal substrate, and the mask Surrounded by the control chip, it does not affect the use of the optical device. The shielding member can also have a good electrical shielding anti-interference effect on the control chip. At the same time, the control chip and the optical device are located opposite to the metal substrate. The first surface and the second surface are not on the same surface of the metal substrate, which can greatly reduce the external size of the package structure, and since the control chip is electrically connected to the shield member, the shield member is also electrically connected Therefore, the shielding member can be directly used as electrical pins for electrically connecting the packaging structure and external components (such as circuit boards), making the installation and operation of the packaging structure and external components simple, convenient and quick.

Another technical solution adopted by the present invention is: the packaging structure manufacturing method for manufacturing the aforementioned packaging structure specifically includes the following steps: providing a metal substrate, a control chip, and an optical device; mounting the control chip on the first surface, and combining the control chip with The shielding parts are electrically connected, so that the shielding parts serve as electrical pins for electrical connection with external components, and each shielding part is arranged around the control chip to electrically shield the control chip; Mount the optical device on the second surface.

The packaging structure manufacturing method of the present invention is convenient and quick to operate, time-saving and labor-saving, and the packaging structure manufactured by the packaging structure manufacturing method has good electric shielding effect, simple structure, convenient and quick processing and production, high production efficiency and external dimensions Small and exquisite, it is conducive to its miniaturization or thin design.

10: Metal substrate

11: First surface

12: second surface

13: Installation Department

14: Connection part

15: The first bending part

16: second bending part

17: The third bending part

18: connecting bar

19: Lead bar

20: control chip

21: wire bonding

30: Optical devices

41: The first ring bump

42: The third ring bump

43: The second ring bump

44: The fourth ring bump

45: Fifth ring bump

50: Encapsulation glue

60: adhesive

101: installation block

102: pin block

111: first installation cavity

112: second mounting cavity

113: Third mounting cavity

114: Fourth mounting cavity

161: The first bending section

162: Second bending section

163: third bending section

164: The fourth bending section

165: Fifth bending section

171: The sixth bending section

172: seventh bending section

173: Eighth bending section

174: Ninth bending section

1021: connecting bump

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely the present invention. For some of the embodiments of, for those of ordinary skill in the art, other schemas can be obtained based on these schemas without creative labor.

FIG. 1 is a cross-sectional view of a package structure provided by an embodiment of the present invention.

2 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention.

FIG. 3 is a flowchart of a manufacturing method of the package structure shown in FIG. 1.

4 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention.

FIG. 5 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention.

FIG. 6 is a flowchart of a manufacturing method of the package structure shown in FIG. 5.

FIG. 7 is a schematic structural diagram from a perspective of a package structure provided by another embodiment of the present invention.

FIG. 8 is a schematic structural diagram of the package structure shown in FIG. 7 from another perspective.

Fig. 9 is a cross-sectional view taken along the line A-A in Fig. 8.

FIG. 10 is an exploded view of the packaging structure shown in FIG. 8 from a perspective.

FIG. 11 is an exploded view of the packaging structure shown in FIG. 8 from a perspective.

FIG. 12 is a cross-sectional view of a package structure provided by another embodiment of the present invention.

FIG. 13 is a flowchart of a manufacturing method of the package structure shown in FIG. 12.

FIG. 14 is a flowchart of a manufacturing method of the package structure shown in FIG. 9.

The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar element symbols from the beginning to the end represent the same or similar elements or elements with the same or similar functions. The following embodiments described with reference to Figures 1 to 14 are exemplary, and are intended to explain the present invention, but should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the diagram, which is only for the convenience of describing the present invention and simplifying the description. It does not indicate or imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connected", "connected", "fixed" and other terms should be interpreted broadly, for example, it may be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present invention can be understood according to specific circumstances.

As shown in FIGS. 1 to 14, in an embodiment of the present invention, a package structure is provided, which includes a metal substrate 10, a control chip 20, and an optical device 30. The metal substrate 10 has a first surface 11 and a second surface 12 opposite to each other. The control chip 20 is installed on the first surface 11; the optical device 30 is installed on the second surface 12; the metal substrate 10 is provided with a number of shielding pieces, each of which protrudes from the first surface 11 and surrounds the control chip 20 An electrical shield is used to control the chip 20 around the periphery; the control chip 20 is electrically connected to the shielding member, so that the shielding member serves as an electrical pin for electrical connection with external components.

Specifically, in the package structure of the embodiment of the present invention, the control chip 20 and the optical device 30 are respectively located on the first surface 11 and the second surface 12 opposite to the metal substrate 10, and the mask is arranged around the control chip 20. Will affect the use of the optical device 30, the shielding member can also play a good anti-interference effect on the electrical shielding of the control chip 20. At the same time, the control chip 20 and the optical device 30 are respectively located on the first surface 11 and the opposing surface of the metal substrate 10. The second surface 12 is not on the same surface of the metal substrate 10, which can greatly reduce the external size of the package structure, and since the control chip 20 is electrically connected to the shielding member, the shielding member is also electrically connected Function, then the shielding member can be directly used as electrical pins for electrically connecting the package structure and external components (such as circuit boards), which not only makes the installation and operation of the package structure and external components simple, convenient and fast, but also controls the chip There is no need for other complicated connecting parts between 20 and external components and between the optical device 30 and external components, so that the structure is simpler, the processing process is simpler, and the production efficiency is high; the packaging structure has good shielding The cover effect, simple structure, convenient and quick processing and production, high production efficiency and small size are conducive to its miniaturization or thin design.

Further, the optical device 30 can also be electrically connected to the shielding member to realize electrical communication between the control chip 20 and the optical device 30, and the connection operation is simple, convenient and quick.

In another embodiment of the present invention, referring to FIG. 1 and FIG. 2, the control chip 20 and the optical device 30 of the provided package structure are arranged directly opposite to each other. On the one hand, the distance between the two is relatively close to facilitate The electrical connection between the two, on the other hand, can also greatly reduce the overall appearance size of the package structure, and realize the miniaturization design of the package structure.

In another embodiment of the present invention, referring to FIG. 2 and FIG. 3, the metal substrate 10 of the package structure is provided with a first bending portion 15 around the periphery, and each shielding member is located at each first bending portion. The folding portion 15 is formed by being bent toward the side of the first surface 11. Specifically, the first bending portions 15 provided around the metal substrate 10 are all bent toward the side of the first surface 11 where the control chip 20 is mounted, so that the first bending portion 15 protrudes from the first surface 11 to surround the first surface 11 It is arranged around the control chip 20 and functions as an electric shield for the control chip 20. The mask is directly formed by bending the first bending portion 15 around the metal substrate 10. The manufacturing method is beneficial to improve production efficiency.

In another embodiment of the present invention, referring to FIG. 1, each of the first bending portions 15 of the package structure and the first surface 11 are provided to form a first mounting cavity 111, and the control chip 20 is packaged in the first mounting cavity 111. Specifically, after the packaging glue 50 is injected or poured into the first mounting cavity 111, it is baked at a high temperature to cure the packaging glue 50, and the cured packaging glue 50 will control the chip 20 with the outside world. Insulation, which can play the role of waterproof, moisture-proof, shock-proof and dust-proof, can also protect the control chip 20, avoid damage to the control chip 20 and cause the packaging structure to be scrapped, and can greatly extend the service life of the packaging structure.

In another embodiment of the present invention, referring to FIG. 1, the provided optical device 30 of the package structure is packaged on the second surface 12, the package glue 50 is coated on the second surface 12, and the package glue 50 is packaged Cover the optical device 30, and then bake it at a high temperature to cure the encapsulant 50, so as to realize the encapsulation of the optical device 30. The cured encapsulant 50 isolates the optical device 30 from the outside world to protect the optical device 30 from The optical device 30 is damaged and the packaging structure is scrapped.

In another embodiment of the present invention, referring to FIGS. 2 and 3, the first surface 11 of the provided package structure is also injection molded with first annular protrusions 41 surrounding the control chip 20 to control The chip 20 is encapsulated in the first annular protrusion 41, and each first bending portion 15 is attached to the first annular protrusion 41, respectively The corresponding outer side. Specifically, the first annular protrusion 41 has a cup-shaped structure, and the hollow space of the first annular protrusion 41 provides installation space for the control chip 20 and the packaging glue 50; during production, the packaging glue 50 is injected or poured into After being poured into the hollow space of the first annular protrusion 41, it is baked at a high temperature to solidify the encapsulant 50, thereby realizing the encapsulation of the control chip 20; the first bending part 15 is bent and attached to the first The outer surface of an annular protrusion 41 makes the accuracy of the bending position of the first bending portion 15 good, and can also ensure the consistency of the external dimensions of the packaging structure. At the same time, the first annular protrusion 41 functions The function of supporting the first bending portion 15 prevents the deformation and collapse of the first bending portion 15 due to the force. Each first bending portion 15 is attached to the outer surface around the first annular protrusion 41 stably , So that the first bending portion 15 is stably arranged around the control chip 20 to ensure that the packaging structure has a good electrical shielding effect.

In another embodiment of the present invention, referring to FIG. 2 and FIG. 3, the first bent portion 15 of the package structure provided is provided with a lead bar 19 on the side facing away from the metal substrate 10, and each lead bar 19 is It is attached to the end surface of the first annular protrusion 41. Specifically, the lead bar 19 is bent along the end surface of the first annular protrusion 41 and attached to the end surface of the first annular protrusion 41, so when connecting with the external component, only the first annular protrusion The lead bar 19 on the end surface of 41 is directly welded to the external component, so that the surface welding operation of the lead bar 19 and the external component is convenient and quick, and the electrical conduction between the package structure and the external component can also be realized; the first annular protrusion 41 serves The function of supporting the lead bar 19 ensures that the package structure can be stably welded to the external component, so that the connection between the package structure and the external component is more stable and firm.

In another embodiment of the present invention, referring to FIGS. 2 and 3, the metal substrate 10 of the package structure provided includes a mounting portion 13, two connecting portions 14 and five first bending portions 15. The mounting portion 13 and the two connecting portions 14 are located on the same plane, the control chip 20 and the optical device 30 are respectively mounted on opposite sides of the mounting portion 13, and the two connecting portions 14 are respectively located on the same side of the mounting portion 13 and spaced apart. The mounting portion 13 and the two connecting portions 14 are surrounded by the first annular protrusion 41; and the bonding wires 21 of the control chip 20 are connected to the two connecting portions 14, and the bonding wires 21 of the optical device 30 are also connected to the two connecting portions 14. Above, through the electrical conduction of the two connecting parts 14, the electrical conduction between the control chip 20 and the optical device 30 is realized; Among them, the three first bending portions 15 are respectively located on the other three sides of the mounting portion 13 and are respectively connected to the side portions of the corresponding mounting portion 13, and the other two first bending portions 15 are respectively located on the two connecting portions 14 It faces away from the side of the mounting portion 13 and is connected to the two connecting portions 14 respectively; the five first bending portions 15 are all bent toward the side of the mounting portion 13 where the control chip 20 is mounted, so that the control chip 20 is surrounded by Within the five first bending parts 15, the electrical shielding of the control chip 20 is realized.

Further, the side of the first bending portion 15 is directly connected to the side of the mounting portion 13 and the side of the connecting portion 14, or the first bending portion 15 is connected to the mounting portion 13 and the connecting portion 14 through the connecting strip 18. The connection has a simpler structure and the bending of the first bending portion 15 saves time and effort.

Furthermore, a metal substrate 10 can be stamped or etched to obtain the above-mentioned mounting portion 13, connecting portion 14, first bending portion 15, and connecting bar 18 for connection, and the metal substrate 10 can be stamped or etched. The above structure is obtained by etching, and its manufacturing operation is simple and the manufacturing efficiency is high.

Furthermore, whether the two ends of the first bending portion 15 are flush with the side portion of the corresponding mounting portion 13 can be set according to actual needs.

In another embodiment of the present invention, referring to FIGS. 2 and 3, the second surface 12 of the provided package structure is also injection molded with a third annular protrusion 42 surrounding the optical device 30. The optical device 30 Encapsulated in the third annular protrusion 42. Specifically, the third annular protrusion 42 has a cup-shaped structure, and the hollow space of the third annular protrusion 42 provides installation space for the optical device 30 and the encapsulating glue 50; during production, the encapsulating glue 50 is injected or poured into After entering the hollow space of the third annular protrusion 42, high-temperature baking is performed to cure the encapsulant 50, thereby realizing the encapsulation of the optical device 30. The cured encapsulant 50 isolates the optical device 30 from the outside and protects it. The optical device 30 prevents the optical device 30 from being damaged and the packaging structure is scrapped.

In another embodiment of the present invention, referring to FIG. 4, FIG. 5 and FIG. 6, there is provided a second bending portion 16 and a third bending portion 17 on the side of the metal substrate 10 of the package structure provided. Mask After the second bending portion 16 is bent toward the side of the first surface 11, the second bending portion 16 is formed by bending along the circumferential direction of the control chip 20 to realize the surrounding of the control chip 20 and ensure The control chip 20 receives a good electrical shielding effect, and the control chip 20 is surrounded by the bending of the second bending portion 16. Its operation is simple, convenient and fast, which is beneficial to the rapid production of the package structure; in the control chip 20 After the enclosure is completed, the third bending portion 17 is bent toward the side of the second surface 12, and then the third bending portion 17 is bent along the circumferential direction of the optical device 30 to realize the enclosure of the optical device 30 The configuration ensures that the optical device 30 receives a good electrical shielding effect; the bending of the third bending portion 17 realizes the surrounding of the optical device 30, which is convenient and quick to operate, which is beneficial to the rapid production of the packaging structure.

In another embodiment of the present invention, referring to FIG. 4, the second bending portion 16 of the package structure and the first surface 11 are provided to form a second mounting cavity 112, and the control chip 20 is sealed by the package glue 50 It is packaged in the second mounting cavity 112, and its manufacturing method is similar to the foregoing, and will not be repeated.

In another embodiment of the present invention, referring to FIG. 4, the third mounting cavity 113 formed by the third bending portion 17 and the second surface 12 of the package structure is provided. 30 is packaged in the third mounting cavity 113, and its manufacturing method is similar to the foregoing, and will not be repeated.

In another embodiment of the present invention, referring to FIG. 5 and FIG. 6, the first surface 11 of the package structure provided is also injection molded with a fourth annular protrusion 44 surrounding the control chip 20. The control chip 20 is encapsulated in the fourth annular protrusion 44; the second bending portion 16 is bent toward the side of the first surface 11 and then bent and attached to the circumferential wall surface of the fourth annular protrusion 44. Specifically, the fourth annular protrusion 44 has a cup-shaped structure, and the hollow space of the fourth annular protrusion 44 provides installation space for the control chip 20 and the packaging glue 50; during production, the packaging glue 50 is arranged on the fourth annular protrusion In the hollow space of 44, the packaging of the control chip 20 can be realized; the fourth annular protrusion 44 can support the second bending portion 16 and prevent the deformation and collapse of the second bending portion 16 under stress. The two bending portions 16 are stably attached to the wall surface around the fourth annular protrusion 44, so that the second bending portion 16 is stably arranged around the control chip 20, ensuring that the packaging structure has a good electrical shielding effect.

Further, the second bending portion 16 includes a first bending section 161, a second bending section 162, a third bending section 163, a fourth bending section 164 connected to an end of the second bending section 162, and The fifth bending section 165 connected to the end of the third bending section 163, the side of the second bending section 162 is connected to the side of the mounting portion 13 facing away from the connecting portion 14, when the second bending section 162 faces After the side surface of the mounting portion 13 where the control chip 20 is mounted is bent, the fourth bending section 164 is then bent along the circumferential direction of the control chip 20, so that the second bending section 162 and the fourth bending section 164 are attached to each other. Fits on two adjacent sides of the fourth annular protrusion 44 to seal the two adjacent sides of the control chip 20; the first bending section 161 is connected to a connecting portion 14 close to the fourth bending section 164 , The third bending section 163 is connected to the other connecting portion 14, and the fifth bending section 165 extends away from the first bending section 161, and the first bending section 161 and the third bending section 163 face the control chip After the side surface of the mounting portion 13 of 20 is bent, so that the first bending section 161 and the third bending section 163 are simultaneously attached to the outer wall surface of the fourth annular protrusion 44, and then the fifth bending section 165 is The control wafer 20 is bent in the circumferential direction, so that the fifth bending section 165 is attached to the wall surface of the last vacancy of the fourth annular protrusion 44, and thus, the enclosure of the control wafer 20 is completed.

In another embodiment of the present invention, referring to FIGS. 5 and 6, the second surface 12 of the provided package structure is also injection molded with a second annular protrusion 43 surrounding the optical device 30. The optical device 30 Encapsulated in the second annular protrusion 43, the third bending portion 17 is bent toward the side of the second surface 12 and then bent and attached to the circumferential wall surface of the second annular protrusion 43, and the packaging glue 50 is set In the hollow space of the second annular protrusion 43, so as to realize the packaging of the optical device 30; its manufacturing method and function are similar to the foregoing, and will not be repeated; the second annular protrusion 43 is a cup-shaped structure, and the second annular protrusion 43 is The hollow space provides installation space for the optical device 30 and the packaging glue 50. Since the third bending portion 17 is attached to the circumferential wall surface of the second annular protrusion 43, the second annular protrusion 43 can also support the third bending portion 17 and prevent the third bending portion 17 from being stressed. Problems of deformation and collapse occur, and the third bending portion 17 is stably attached to the wall surface around the second annular protrusion 43, so that the third bending portion 17 is stably arranged around the optical device 30 to ensure the optical device 30 receives a good electric shielding effect.

Further, the third bending portion 17 includes a sixth bending section 171, a seventh bending section 172, an eighth bending section 173 connected to an end of the sixth bending section 171, and a seventh bending section 172. The ends of the ninth bending section 174, the sixth bending section 171 and the seventh bending section 172 are respectively located on opposite sides of the mounting portion 13 and on the sides of the two connecting portions 14, and the sixth bending section After the bending section 171 is bent toward the side surface of the mounting portion 13 where the optical device 30 is installed, the eighth bending section 173 is then bent along the circumferential direction of the optical device 30, so that the sixth bending section 171 and the eighth bending section 171 are bent. The section 173 is attached to the two adjacent side surfaces of the second annular protrusion 43 to seal the two adjacent sides of the optical device 30; the seventh bending section 172 faces the mounting portion 13 where the optical device 30 is installed. After the sides are bent, the ninth bending section 174 is bent along the circumferential direction of the optical device 30, so that the seventh bending section 172 and the ninth bending section 174 are respectively attached to the other two on the second annular protrusion 43. Two adjacent sides are used to seal the other two adjacent sides of the optical device 30, thereby completing the surrounding of the optical device 30 and ensuring that the optical device 30 receives a good electrical shielding effect.

Furthermore, the side of the first bending section 161, the side of the second bending section 162, the side of the third bending section 163, the side of the fourth bending section 164, and the side of the fifth bending section 165 are all set There is a lead bar 19, which is attached to the end surface of the fourth annular protrusion 44 after bending. The lead bar 19 can be directly used as an electrical pin to facilitate the connection of the package structure with external components.

Furthermore, the side of the sixth bending section 171, the side of the seventh bending section 172, the side of the eighth bending section 173, and the side of the ninth bending section 174 are all provided with lead bars 19, which are bent. After being folded and attached to the end surface of the second annular protrusion 43, the lead bar 19 can be directly used as an electrical pin to facilitate the connection of the package structure with external components.

Furthermore, a metal substrate 10 can be formed by stamping or etching to obtain the mounting portion 13, the connecting portion 14, the second bending portion 16, and the third bending portion 17, and the manufacturing method is simple and efficient.

In another embodiment of the present invention, referring to Figures 7 to 14, the provided metal substrate 10 of the package structure includes a mounting block 101 and a plurality of pin blocks 102, a control chip 20 and an optical device 30 Do not install on opposite sides of the mounting block 101, namely the first surface 11 and the second surface 12. Each pin block 102 is surrounded by the mounting block 101, and one end of each pin block 102 protrudes from the mounting block 101 The side surface where the control chip 20 is mounted, and the shielding member is a pin block 102. Specifically, since the end of the pin block 102 surrounding the mounting block 101 protrudes from the side of the mounting block 101 where the control chip 20 is mounted, that is, each pin block 102 is surrounding the control chip 20, then The pin block 102 can function as an electrical shield to control the chip 20, and the pin block 102 can be used as a mask; at the same time, during specific installation, the bonding wires 21 of the control chip 20 and the bonding wires 21 of the optical device 30 are respectively It is electrically connected with the pin block 102 to realize the electrical connection between the control chip 20 and the optical device 30. At the same time, the pin block 102 can be directly welded with external components, thereby functioning as an electrical pin.

Further, the metal substrate 10 can be etched to obtain the mounting block 101 and a plurality of pin blocks 102 surrounding the mounting block 101. The etching method is simple, and the packaging structure can be efficiently manufactured. Production efficiency has been effectively improved.

In another embodiment of the present invention, referring to FIG. 7, FIG. 8, FIG. 9 and FIG. 12, the side surface of each pin block 102 of the package structure and the surface of the mounting block 101 are provided to form a fourth In the mounting cavity 114, the control chip 20 is packaged in the fourth mounting cavity 114 by the encapsulating glue 50. The manufacturing method and the effect are similar to those described above, and will not be repeated.

In another embodiment of the present invention, as shown in FIG. 12, the provided optical device 30 of the packaging structure is packaged on the second surface 12 of the metal substrate 10 with a packaging glue 50, and the packaging glue 50 seals the optical device 30. Damage to the optical device 30 can be avoided, and the service life of the optical device 30 can be greatly extended.

In another embodiment of the present invention, referring to FIG. 7, FIG. 8 and FIG. 9, the packaging structure provided is also injection molded with a fifth annular protrusion 45 surrounding the optical device 30, and the optical device 30 is encapsulated in In the fifth annular protrusion 45, its manufacturing method and effect are similar to the foregoing, and will not be repeated; the fifth annular protrusion 45 is a cup-shaped structure, and the hollow space of the fifth annular protrusion 45 is provided for the optical device 30 and the encapsulant 50 Installation space.

In another embodiment of the present invention, referring to FIGS. 10 and 11, each pin block 102 of the provided package structure and the mounting block 101 are connected as a whole through the adhesive 60, and the side portion of the pin block 102 A connecting bump 1021 that exposes the adhesive 60 and extends toward the control chip 20 is provided, and the control chip 20 is electrically connected to the connecting bump 1021. Specifically, during installation, the bonding wires 21 of the control chip 20 can be directly connected to the exposed connection bumps 1021 to prevent the adhesive 60 from affecting the electrical conduction between the bonding wires 21 of the control chip 20 and the pin block 102.

Further, the connecting protrusion 1021 that needs to be connected to the optical device 30 also protrudes from the side surface of the mounting block 101 where the optical device 30 is installed and is exposed outside the adhesive 60, so as to avoid the adhesive 60 from obstructing the bonding wire of the optical device 30 The electrical connection between 21 and the pin block 102 makes the connection easier to operate.

As shown in FIGS. 1-14, in another embodiment of the present invention, a packaging structure manufacturing method for manufacturing the above-mentioned packaging structure is provided, which specifically includes the following steps: providing a metal substrate 10, a control chip 20 and an optical device 30; The control chip 20 is mounted on the first surface 11, and the control chip 20 is electrically connected to the shield member, so that the shield member serves as an electrical pin for electrical connection with external components, and each shield member is surrounded by The periphery of the control chip 20 is controlled by an electric shield; the optical device 30 is mounted on the second surface 12.

In another embodiment of the present invention, as shown in FIG. 3, a method for manufacturing a package structure is provided, which specifically includes the following steps: a metal substrate 10 is provided, and the metal substrate 10 is stamped or etched to obtain the mounting portions 13, two One connecting portion 14 and five first bending portions 15; the first annular protrusion 41 and the third annular protrusion 42 are obtained by injection molding on the surfaces on opposite sides of the mounting portion 13 and the two connecting portions 14, respectively ; Mount the control chip 20 on a surface of the mounting portion 13 and located in the first annular protrusion 41, and then electrically connect the control chip 20 to the two connecting portions 14; Use the packaging glue 50 to package the control chip 20 in the first annular protrusion 41; install the optical device 30 on the other surface of the mounting portion 13 and in the third annular protrusion 42, and then electrically connect the optical device 30 In the two connecting portions 14; the optical device 30 is encapsulated in the third annular protrusion 42 with the encapsulant 50; the five first bending portions 15 are respectively bent and fitted around the first annular protrusion 41 On the outer surface of, the first bending portion 15 is arranged around the control chip 20, which functions as an electric shield.

In another embodiment of the present invention, as shown in Figure 1, the steps shown in Figure 3 above do not need to make the first annular protrusion 41 and the third annular protrusion 42, and the five first bending parts 15 are all bent toward the side where the control chip 20 is provided, so that the first bending portion 15 is arranged around the control chip 20 and functions as an electric shield; and then the control chip 20 is encapsulated by the packaging glue 50 The five first bending portions 15, the two connecting portions 14, and the mounting portion 13 are surrounded by the first mounting cavity 111 to complete the packaging of the control chip 20. Finally, the optical device 30 is directly encapsulated by the encapsulant 50 On the other surface of the mounting part 13.

In another embodiment of the present invention, the steps shown in FIG. 3 above do not need to fabricate the third annular protrusion 42, install the optical device 30 on the other surface of the mounting portion 13, and electrically connect the optical device 30 to After the two connecting parts 14, the optical device 30 is directly packaged on the other surface of the mounting part 13 with the packaging glue 50.

In another embodiment of the present invention, referring to FIG. 6, a method for manufacturing a package structure is provided, which specifically includes the following steps: a metal substrate 10 is provided, and the metal substrate 10 is stamped or etched to obtain the mounting portions 13, two A connecting portion 14, a second bending portion 16 and a third bending portion 17; on the mounting portion 13 and the two connecting portions 14 on opposite sides of the surface by injection molding to obtain the second annular protrusion 43 and the fourth Annular protrusion 44; The control chip 20 is mounted on a surface of the mounting portion 13 and located in the fourth annular protrusion 44, and then the control chip 20 is electrically connected to the two connecting portions 14; the control chip 20 is encapsulated in the fourth ring with the packaging glue 50 In the protrusion 44; install the optical device 30 on the other surface of the mounting portion 13 and located in the second annular protrusion 43, and then electrically connect the optical device 30 to the two connecting portions 14; use the encapsulant 50 to connect the optical device 30 is encapsulated in the second annular protrusion 43; the second bending portion 16 is bent toward the side where the control chip 20 is provided, and then bent along the circumferential direction of the control chip 20, so that the second bending portion 16 is surrounded by the control chip 20 The periphery of the wafer 20 functions as an electrical shield; the third bending portion 17 is bent toward the side where the optical device 30 is disposed, and then bent along the periphery of the optical device 30, so that the third bending portion 17 surrounds It is arranged around the optical device 30 and functions as an electric shield.

In another embodiment of the present invention, as shown in FIG. 4, the steps shown in FIG. 6 above do not need to make the second annular protrusion 43 and the fourth annular protrusion 44, and directly direct each second bending portion 16 toward The side of the control chip 20 is bent and then bent along the periphery of the control chip 20, so that the second bending part 16 is arranged around the control chip 20; the third bending part 17 is directly arranged facing The side of the optical device 30 is bent and then bent along the periphery of the optical device 30, so that the third bending portion 17 is surrounded by the periphery of the optical device 30; and then the control chip 20 is packaged in the second bend with the encapsulant 50 Inside the second mounting cavity 112 formed by the folding portion 16, the two connecting portions 14, and the mounting portion 13; the optical device 30 is encapsulated in the third bending portion 17, the two connecting portions 14 and the mounting portion 13 with the encapsulant 50 The third installation cavity 113 is enclosed and formed.

In another embodiment of the present invention, as shown in FIG. 13, a method for manufacturing a package structure is provided, which specifically includes the following steps: a metal substrate 10 is provided, and the metal substrate 10 is etched to obtain a mounting block 101 and a number of enclosures. The pin block 102 located around the mounting block 101; the mounting block 101 and a number of pin blocks 102 are connected by the adhesive 60, and the side of each pin block 102 is surrounded by the surface of the mounting block 101 to form a fourth mounting Cavity 114; The control chip 20 is mounted on a surface of the mounting block 101 and is located in the fourth mounting cavity 114, and then the control chip 20 is electrically connected to the pin block 102; the control chip 20 is packaged in the fourth mounting by the packaging glue 50 In the cavity 114; the optical device 30 is mounted on the other surface of the mounting block 101; the optical device 30 is directly packaged on the other surface of the mounting block 101 with the packaging glue 50.

In another embodiment of the present invention, referring to FIG. 14, a method for manufacturing a package structure is provided. The difference between the manufacturing steps shown in FIG. 14 and the manufacturing steps shown in FIG. 13 lies in: The fifth annular protrusion 45 is injected at the peripheral edge of the four mounting cavity 114; the optical device 30 is mounted on the other surface of the mounting block 101 and is located in the fifth annular protrusion 45, and the optical device 30 is electrically connected to the lead On the foot block 102; the optical device 30 is encapsulated in the fifth annular protrusion 45 with the encapsulant 50.

These manufacturing methods are convenient and quick to operate, time-saving and labor-saving, and the package structure manufactured by these package structure manufacturing methods has a good electric shielding effect, simple structure, convenient and quick processing and production, high production efficiency and small size, which are beneficial to Its miniaturization or thin design.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection of the present invention. Within range.

15: The first bending part

19: Lead bar

20: control chip

30: Optical devices

41: The first ring bump

42: The third ring bump

50: Encapsulation glue

111: first installation cavity

Claims (10)

A package structure, comprising: a metal substrate having a first surface and a second surface oppositely arranged; a control chip, the control chip is mounted on the first surface; an optical device, the optical device is mounted On the second surface; and a plurality of masking members are disposed on the metal substrate, each of the plurality of masking members protrudes from the first surface and surrounds the control chip to electrically shield the control chip Wherein the plurality of shielding parts and the first surface surround a mounting cavity, the control chip is located in the mounting cavity, wherein the control chip is electrically connected to the plurality of shielding parts, so that the control chip The electrically connected shield member serves as an electrical pin for electrical connection with external components. According to the package structure described in item 1 of the scope of patent application, the control chip and the optical device are arranged directly opposite. The package structure according to the first item of the scope of patent application, wherein a first bending portion is provided on all sides of the metal substrate, and the plurality of mask members are located on the side of each of the first bending portions facing the first surface Formed by bending. The packaging structure according to item 3 of the scope of patent application, wherein the first surface is also injection molded with a first annular protrusion surrounding the control chip, and the control chip is encapsulated on the first annular protrusion In; each of the first bending portion is respectively attached to the outer surface of the first annular protrusion corresponding. The package structure according to item 4 of the scope of patent application, wherein each of the first bending portions is provided with a lead bar on the side facing away from the metal substrate, and each of the lead bars is attached to the first annular protrusion. End face. The package structure according to the first item of the scope of patent application, wherein the side portion of the metal substrate is provided with a second bending portion and a third bending portion, and the plurality of shielding members face the second bending portion at the The side of the first surface is bent and then formed by bending along the circumferential direction of the control chip; the third bending portion is bent toward the side of the second surface and then bent along the circumferential direction of the optical device, so that the third The bending part is arranged around the optical device. The packaging structure according to item 6 of the scope of patent application, wherein the second surface is further injection molded with a second annular protrusion surrounding the optical device, and the optical device is encapsulated in the second annular protrusion, The third bent portion is bent toward the side of the second surface and then bent and attached to the circumferential wall surface of the second annular protrusion. The package structure according to item 1 of the scope of patent application, wherein the metal substrate includes a mounting block and a plurality of pin blocks, the control chip and the optical device are respectively mounted on opposite sides of the mounting block, and the plurality of lead Foot blocks are arranged around the mounting block, one end of each pin block protrudes from the side surface of the mounting block where the control chip is mounted, and the plurality of shielding parts are the plurality of pin blocks. According to the package structure described in item 8 of the scope of patent application, each of the lead blocks and the mounting block are connected as a whole through an adhesive, and the side of each of the lead blocks is provided with the adhesive exposed and faces the A connection bump extending from the control chip, and the control chip is electrically connected to the connection bump. A manufacturing method of a package structure for manufacturing the package structure as described in any one of items 1 to 9 of the scope of patent application, which specifically includes the following steps: providing the metal substrate, the control chip and the optical device; The chip is mounted on the first surface, and the control chip is electrically connected to the plurality of shielding members, so that the plurality of shielding members serve as electrical pins for electrically connecting with external components. The shielding member is arranged around the control chip to electrically shield The control chip; and the optical device is mounted on the second surface.

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