TW202119575A - Packaging structure and manufacturing method thereof - Google Patents

Packaging structure and manufacturing method thereof Download PDF

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TW202119575A
TW202119575A TW108144365A TW108144365A TW202119575A TW 202119575 A TW202119575 A TW 202119575A TW 108144365 A TW108144365 A TW 108144365A TW 108144365 A TW108144365 A TW 108144365A TW 202119575 A TW202119575 A TW 202119575A
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control chip
optical device
annular protrusion
bending
metal substrate
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TW108144365A
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TWI714380B (en
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何俊杰
黃建中
龍成海
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大陸商弘凱光電（深圳）有限公司
弘凱光電股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

The invention belongs to the technical field of packaging, and particularly relates to a packaging structure and a manufacturing method thereof. The packaging structure comprises a metal substrate, a control chip and an optical device, and the metal substrate is provided with a first surface and a second surface which are oppositely arranged; the control chip is mounted on the first surface; the optical device is mounted on the second surface; the metal substrate is provided with a plurality of shielding parts, and each shielding part protrudes out of the first surface and surrounds the periphery of the control chip so as to electrically shield the control chip; the control chip and the optical device are both electrically connected with the shielding parts so that the shielding parts can serve as electrical pins used for being electrically connected with an external component. The packaging structure control chip and the optical device are respectively located on the first surface and the second surface which are oppositely arranged of the metal substrate. The shielding parts are arranged on the periphery of the control chip in a surrounding mode, and the use of the optical device is not affected, so the shielding parts can have a good shielding and anti-interference effect on the control chip; meanwhile, the structure is simple, small in boundary dimension and beneficial to miniaturization or thinning design.

Description

封裝結構及其製作方法Packaging structure and manufacturing method thereof

本發明屬於封裝技術領域，尤其涉及一種封裝結構及其製作方法。The invention belongs to the field of packaging technology, and in particular relates to a packaging structure and a manufacturing method thereof.

現代電子技術中，各類光電感測器大量的應用，尤其在車用電子系統中，因系統的複雜性，各類控制開關、各類不同數位和模擬訊號透過不同的線束或載體傳輸，各器件間的傳導干擾訊號會相互影響，導致相關感測器工作出現異常，同時也會對系統內其他電子產品產生干擾，影響電子產品的正常使用。為了使各器件能正常工作，又不干擾其他器件的工作，在電子系統中需要加入大量防止干擾電路系統（比如濾波除紋等），但同時也提高了系統的複雜度和成本。In modern electronic technology, various photoelectric sensors are widely used, especially in automotive electronic systems. Due to the complexity of the system, various control switches, various digital and analog signals are transmitted through different wiring harnesses or carriers. The conducted interference signals between the devices will affect each other, causing the related sensors to work abnormally. At the same time, they will also interfere with other electronic products in the system and affect the normal use of the electronic products. In order to make each device work normally without interfering with the work of other devices, it is necessary to add a large number of interference prevention circuit systems (such as filtering and removing lines) in the electronic system, but at the same time it also increases the complexity and cost of the system.

現有遮罩技術有多種，最為主流的技術方式是採用內遮罩和外遮罩的方式進行，現有內遮罩的方式採用控制晶片與光電受光器件或光器件在同一平面，控制晶片正面或側面使用金屬塊進行一定遮擋，但因同時要留給受光器件視窗進行接受訊號，金屬塊的金屬面積又不能過大，影響遮罩抗干擾的效果。另外，現有外遮罩的部分是基於感測器或控制晶片周身訂製鐵製外殼，在感測器或控制晶片完成封裝後，需要用人工去裝外殼而後再焊接外殼與感測器或控制晶片的對地端，以利用外殼遮罩的效果的達成，其加工的過程繁瑣，不利於提升生產效率，另外採用外遮罩的方式，產品的外形尺寸必然會增加，不利於系統小型或薄型化產品設計趨勢。There are a variety of existing masking technologies. The most mainstream technology is to use inner masks and outer masks. The existing inner masks use the control chip and the photoelectric light-receiving device or optical device in the same plane to control the front or side of the chip. A metal block is used for a certain shielding, but at the same time, it is left for the light receiving device window to receive the signal, and the metal area of the metal block cannot be too large, which affects the anti-interference effect of the mask. In addition, the existing outer shield part is based on a custom-made iron shell around the sensor or control chip. After the sensor or control chip is packaged, it is necessary to manually install the shell and then weld the shell and the sensor or control. The ground end of the chip is achieved by using the effect of the shell mask. The processing process is cumbersome, which is not conducive to improving production efficiency. In addition, using the outer mask method will inevitably increase the size of the product, which is not conducive to the small or thin system. Trends in chemical product design.

本發明的目的在於提供一種封裝結構及其製作方法，旨在解決現有技術中的封裝結構電遮罩效果不好以及體積大的技術問題。The purpose of the present invention is to provide a packaging structure and a manufacturing method thereof, aiming to solve the technical problems of poor electrical shielding effect and large volume of the packaging structure in the prior art.

為實現上述目的，本發明採用的技術方案是：一種封裝結構，包括金屬基板、控制晶片和光器件，金屬基板具有相對設置的第一表面和第二表面；控制晶片安裝於第一表面；光器件安裝於第二表面；以及金屬基板設有若干個遮罩件，各遮罩件凸伸出第一表面並圍設於控制晶片的四周，以電遮罩控制晶片；控制晶片與遮罩件電性連接，以使得遮罩件作為用於與外部部件電性連接的電性引腳。In order to achieve the above objective, the technical solution adopted by the present invention is: a package structure including a metal substrate, a control chip and an optical device, the metal substrate has a first surface and a second surface that are oppositely arranged; the control chip is mounted on the first surface; the optical device Installed on the second surface; and the metal substrate is provided with a number of shielding parts, each of the shielding parts protrudes from the first surface and surrounds the control chip to electrically shield the control chip; the control chip and the shielding part are electrically connected It is electrically connected, so that the shield member serves as an electrical pin for electrical connection with an external component.

較佳地，控制晶片和光器件正對設置。Preferably, the control wafer and the optical device are arranged directly opposite to each other.

較佳地，金屬基板的四周均設有第一彎折部，各遮罩件分別於各第一彎折部朝向第一表面的側方彎折形成。Preferably, the metal substrate is provided with first bending portions on all four sides, and each mask member is respectively formed by bending the first bending portion toward the side of the first surface.

較佳地，第一表面還注塑有圍設於控制晶片的四周的第一環形凸起，控制晶片封裝於第一環形凸起內；各第一彎折部分別貼合於第一環形凸起對應的外側面上。Preferably, the first surface is also injection molded with first annular protrusions surrounding the control chip, and the control chip is encapsulated in the first annular protrusions; each first bending portion is attached to the first ring respectively The outer surface corresponding to the shaped protrusion.

較佳地，第一彎折部背向金屬基板的側部設有引線條，各引線條均貼合於第一環形凸起的端面上。Preferably, the side of the first bending portion facing away from the metal substrate is provided with lead bars, and each lead bar is attached to the end surface of the first annular protrusion.

較佳地，金屬基板的側部設有第二彎折部和第三彎折部，遮罩件於第二彎折部朝向第一表面的側方彎折後再沿控制晶片的周向彎折形成；第三彎折部朝向第二表面的側方彎折後再沿光器件的周向彎折以使得第三彎折部圍設於光器件的四周。Preferably, the side portion of the metal substrate is provided with a second bending portion and a third bending portion, and the mask member is formed by bending the second bending portion toward the side of the first surface and then bending along the circumferential direction of the control chip. ; The third bending portion is bent toward the side of the second surface and then bent along the circumferential direction of the optical device so that the third bending portion surrounds the optical device.

較佳地，第二表面還注塑有圍設於光器件四周的第二環形凸起，光器件封裝於第二環形凸起內，第三彎折部朝向第二表面的側方彎折後再彎折貼合於第二環形凸起的周向壁面。Preferably, the second surface is also injection molded with a second annular protrusion surrounding the optical device, the optical device is encapsulated in the second annular protrusion, and the third bending portion is bent toward the side of the second surface. It is bent and attached to the circumferential wall surface of the second annular protrusion.

較佳地，金屬基板包括安裝塊和若干個引腳塊，控制晶片和光器件分別安裝於安裝塊的相對兩側面，各引腳塊圍設於安裝塊的四周，各引腳塊的一端凸伸出安裝塊上安裝有控制晶片的側面，遮罩件為引腳塊。Preferably, the metal substrate includes a mounting block and a plurality of pin blocks. The control chip and the optical device are respectively mounted on opposite sides of the mounting block. Each pin block is surrounded by the mounting block, and one end of each pin block protrudes. The side surface where the control chip is installed on the mounting block, and the shielding piece is a pin block.

較佳地，各引腳塊與安裝塊透過黏結膠連接為一個整體，引腳塊的側部設有露出黏結膠外並朝向控制晶片延伸的連接凸起，控制晶片與連接凸起電性連接。Preferably, each pin block and the mounting block are connected as a whole through adhesive, and the side of the pin block is provided with a connection protrusion that exposes the adhesive and extends toward the control chip, and the control chip is electrically connected to the connection protrusion .

本發明提供的封裝結構中的上述一個或多個技術方案至少具有如下技術效果之一：該封裝結構的控制晶片和光器件分別位於金屬基板的相對設置的第一表面和第二表面，遮罩件圍設在控制晶片的四周，並不會影響光器件的使用，遮罩件還可以起到對控制晶片良好的電遮罩抗干擾效果，同時，控制晶片和光器件分別位於金屬基板的相對設置的第一表面和第二表面，不在金屬基板的同一表面，這樣可以大大降低該封裝結構的外形尺寸，並且，由於控制晶片與遮罩件電性連接，使得該遮罩件還起到電性連接的作用，那麼遮罩件可以直接作為封裝結構與外部部件（例如：電路板）電性連接的電性引腳使用，使得封裝結構與外部部件的安裝操作簡單方便快捷。The above-mentioned one or more technical solutions in the package structure provided by the present invention have at least one of the following technical effects: the control chip and the optical device of the package structure are respectively located on the first surface and the second surface of the metal substrate, and the shielding member Surrounded by the control chip, it will not affect the use of the optical device. The shielding member can also have a good electrical shielding anti-interference effect on the control chip. At the same time, the control chip and the optical device are located on the opposite side of the metal substrate. The first surface and the second surface are not on the same surface of the metal substrate, which can greatly reduce the size of the package structure, and since the control chip is electrically connected to the shield member, the shield member is also electrically connected Therefore, the shielding member can be directly used as electrical pins for electrically connecting the packaging structure and external components (such as circuit boards), making the installation and operation of the packaging structure and external components simple, convenient and quick.

本發明採用的另一技術方案是：用於製作上述封裝結構的封裝結構製作方法，具體包括以下步驟：Another technical solution adopted by the present invention is: the packaging structure manufacturing method for manufacturing the above-mentioned packaging structure specifically includes the following steps:

提供金屬基板、控制晶片和光器件；Provide metal substrates, control chips and optical devices;

將控制晶片安裝於第一表面，並將控制晶片與遮罩件電性連接，以使得遮罩件作為用於與外部部件電性連接的電性引腳，各遮罩件圍設於控制晶片的四周以電遮罩控制晶片；The control chip is mounted on the first surface, and the control chip is electrically connected to the shielding member, so that the shielding member serves as an electrical pin for electrical connection with external components, and each shielding member is surrounded by the control chip Control the chip with an electric shield around the periphery;

將光器件安裝於第二表面。Mount the optical device on the second surface.

本發明的封裝結構製作方法，操作方便快捷，省時省力，並且採用該封裝結構製作方法製作出的封裝結構具有良好的電遮罩效果、結構簡單、加工製作方便快捷、生產效率高且外形尺寸小巧，有利於其小型化或者薄型化設計。The packaging structure manufacturing method of the present invention is convenient and quick to operate, time-saving and labor-saving, and the packaging structure manufactured by the packaging structure manufacturing method has good electric shielding effect, simple structure, convenient and quick processing and production, high production efficiency and external dimensions Small and exquisite, it is conducive to its miniaturization or thin design.

下面詳細描述本發明的實施例，所述實施例的示例在所附圖式中示出，其中自始至終相同或類似的元件符號表示相同或類似的元件或具有相同或類似功能的元件。下面透過參考圖式1~14描述的實施例是示例性的，旨在用於解釋本發明，而不能理解為對本發明的限制。The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar element symbols from the beginning to the end indicate the same or similar elements or elements with the same or similar functions. The following embodiments described with reference to FIGS. 1 to 14 are exemplary, and are intended to explain the present invention, but should not be construed as limiting the present invention.

在本發明的描述中，需要理解的是，術語｢長度｣、｢寬度｣、｢上｣、｢下｣、｢前｣、｢後｣、｢左｣、｢右｣、｢豎直｣、｢水平｣、｢頂｣、｢底｣、｢內｣、｢外｣等指示的方位或位置關係為基於圖式所示的方位或位置關係，僅是為了便於描述本發明和簡化描述，而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作，因此不能理解為對本發明的限制。In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "rear", "left", "right", "vertical", The azimuth or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the position or position relationship shown in the diagram, and are only for the convenience of describing the invention and simplifying the description It does not indicate or imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

此外，術語｢第一｣、｢第二｣僅用於描述目的，而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此，限定有｢第一｣、｢第二｣的特徵可以明示或者隱含地包括一個或者更多個該特徵。在本發明的描述中，｢多個｣的含義是兩個或兩個以上，除非另有明確具體的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "multiple" means two or more, unless otherwise specifically defined.

在本發明中，除非另有明確的規定和限定，術語｢安裝｣、｢相連｣、｢連接｣、｢固定｣等術語應做廣義理解，例如，可以是固定連接，也可以是可拆卸連接，或成一體；可以是機械連接，也可以是電連接；可以是直接相連，也可以透過中間媒介間接相連，可以是兩個元件內部的連通或兩個元件的相互作用關係。對於本領域的普通技術人員而言，可以根據具體情況理解上述術語在本發明中的具體含義。In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations.

如圖1~14所示，在本發明的一個實施例中，提供一種封裝結構，包括金屬基板10、控制晶片20和光器件30，金屬基板10具有相對設置的第一表面11和第二表面12；控制晶片20安裝於第一表面11；光器件30安裝於第二表面12；金屬基板10設有若干個遮罩件，各遮罩件凸伸出第一表面11並圍設於控制晶片20的四周，以電遮罩控制晶片20；控制晶片20與遮罩件電性連接，以使得遮罩件作為用於與外部部件電性連接的電性引腳。As shown in FIGS. 1-14, in an embodiment of the present invention, a package structure is provided, which includes a metal substrate 10, a control chip 20, and an optical device 30. The metal substrate 10 has a first surface 11 and a second surface 12 opposed to each other. The control chip 20 is installed on the first surface 11; the optical device 30 is installed on the second surface 12; the metal substrate 10 is provided with a number of shielding parts, and each shielding part protrudes from the first surface 11 and surrounds the control chip 20 An electrical shield is used to control the chip 20 around the periphery; the control chip 20 is electrically connected to the shielding member, so that the shielding member serves as an electrical pin for electrical connection with external components.

具體地，本發明實施例的封裝結構，控制晶片20和光器件30分別位於金屬基板10的相對設置的第一表面11和第二表面12，遮罩件圍設在控制晶片20的四周，並不會影響光器件30的使用，遮罩件還可以起到對控制晶片20良好的電遮罩抗干擾效果，同時，控制晶片20和光器件30分別位於金屬基板10的相對設置的第一表面11和第二表面12，不在金屬基板10的同一表面，這樣可以大大降低該封裝結構的外形尺寸，並且，由於控制晶片20與遮罩件電性連接，使得該遮罩件還起到電性連接的作用，那麼該遮罩件可以直接作為該封裝結構與外部部件（例如：電路板）電性連接的電性引腳使用，不僅使得該封裝結構與外部部件的安裝操作簡單方便快捷，並且控制晶片20與外部部件之間以及光器件30與外部部件之間也無需其他複雜連接部件，使其結構更為簡單，其加工的過程也更為簡單，生產效率高；該封裝結構，具有良好的遮罩效果、結構簡單、加工製作方便快捷、生產效率高且外形尺寸小巧，有利於其小型化或者薄型化設計。Specifically, in the package structure of the embodiment of the present invention, the control chip 20 and the optical device 30 are respectively located on the first surface 11 and the second surface 12 opposite to the metal substrate 10, and the mask is arranged around the control chip 20. It will affect the use of the optical device 30. The shielding member can also have a good electrical shielding anti-interference effect on the control chip 20. At the same time, the control chip 20 and the optical device 30 are respectively located on the opposed first surfaces 11 and 11 of the metal substrate 10. The second surface 12 is not on the same surface of the metal substrate 10, which can greatly reduce the external size of the package structure. Moreover, since the control chip 20 is electrically connected to the shielding member, the shielding member is also electrically connected Function, then the shielding member can be directly used as electrical pins for electrically connecting the package structure and external components (such as circuit boards), which not only makes the installation and operation of the package structure and external components simple, convenient and fast, but also controls the chip There is no need for other complicated connecting parts between 20 and external components and between the optical device 30 and external components, so that the structure is simpler, the processing process is simpler, and the production efficiency is high; the packaging structure has good shielding. The cover effect, simple structure, convenient and quick processing and production, high production efficiency and small size are conducive to its miniaturization or thin design.

進一步地，光器件30也可以與遮罩件電性連接，以實現控制晶片20和光器件30的電性連通，其連接操作簡單，方便快捷。Further, the optical device 30 may also be electrically connected to the shielding member to realize the electrical communication between the control chip 20 and the optical device 30, and the connection operation is simple, convenient and quick.

在本發明的另一個實施例中，參閱圖1和圖2所示，提供的該封裝結構的控制晶片20和光器件30正對設置。一方面，兩者之間的距離較近，便於兩者之間的電性連接，另一方面，也可以大大降低該封裝結構的整體外觀尺寸，實現封裝結構的小型化設計。In another embodiment of the present invention, referring to FIG. 1 and FIG. 2, the control chip 20 and the optical device 30 of the provided package structure are arranged directly opposite to each other. On the one hand, the distance between the two is relatively close, which facilitates the electrical connection between the two. On the other hand, the overall appearance size of the packaging structure can be greatly reduced, and the miniaturization design of the packaging structure can be realized.

在本發明的另一個實施例中，參閱圖2和圖3所示，提供的該封裝結構的金屬基板10的四周均設有第一彎折部15，各遮罩件分別於各第一彎折部15朝向第一表面11的側方彎折形成。具體地，將設置在金屬基板10四周的第一彎折部15均朝向安裝有控制晶片20的第一表面11的側方彎折，使得第一彎折部15凸出第一表面11以圍設在控制晶片20的四周，起到電遮罩控制晶片20的作用，遮罩件直接為金屬基板10的四周的第一彎折部15折彎形成，其製作方法，有利於提高生產效率。In another embodiment of the present invention, referring to FIGS. 2 and 3, the provided metal substrate 10 of the package structure is provided with a first bending portion 15 around the periphery, and each shielding member is located at each first bending portion. The folding portion 15 is formed by being bent toward the side of the first surface 11. Specifically, the first bending portions 15 provided around the metal substrate 10 are all bent toward the side of the first surface 11 on which the control chip 20 is mounted, so that the first bending portion 15 protrudes from the first surface 11 to surround the first surface 11 It is arranged around the control chip 20 and functions as an electric shield for the control chip 20. The mask is directly formed by bending the first bending portion 15 around the metal substrate 10. The manufacturing method is beneficial to improve production efficiency.

在本發明的另一個實施例中，參閱圖1所示，提供的該封裝結構的各第一彎折部15與第一表面11圍設形成第一安裝腔111，利用封裝膠50將控制晶片20封裝於第一安裝腔111內。具體地，將封裝膠50注塑或者灌膠的方式灌入第一安裝腔111內後，再對其進行高溫烘烤，使得封裝膠50固化，固化後的封裝膠50將控制晶片20與外界進行隔絕，這樣可以起到防水、防潮、防震和防塵的作用，也可以保護控制晶片20，避免控制晶片20受損而導致該封裝結構報廢，可以大大延長該封裝結構的使用壽命。In another embodiment of the present invention, referring to FIG. 1, each first bending portion 15 of the package structure and the first surface 11 are provided to form a first mounting cavity 111, and the control chip 20 is packaged in the first mounting cavity 111. Specifically, after the packaging glue 50 is injected or poured into the first mounting cavity 111, it is then baked at a high temperature to cure the packaging glue 50, and the cured packaging glue 50 will control the chip 20 and the outside world. Insulation, which can play the role of waterproof, moisture-proof, shock-proof and dust-proof, can also protect the control chip 20, avoid damage to the control chip 20 and cause the packaging structure to be scrapped, and can greatly extend the service life of the packaging structure.

在本發明的另一個實施例中，參閱圖1所示，提供的該封裝結構的光器件30封裝於第二表面12，將封裝膠50塗覆於第二表面12上，並且封裝膠50包覆光器件30，然後，再對其進行高溫烘烤，使得封裝膠50固化，從而實現光器件30的封裝，固化後的封裝膠50將光器件30與外界進行隔絕，保護光器件30，避免光器件30受損而導致該封裝結構報廢。In another embodiment of the present invention, referring to FIG. 1, the provided optical device 30 of the packaging structure is packaged on the second surface 12, the packaging glue 50 is coated on the second surface 12, and the packaging glue 50 is packaged. Cover the optical device 30, and then bake it at a high temperature to cure the encapsulant 50, thereby realizing the encapsulation of the optical device 30. The cured encapsulant 50 isolates the optical device 30 from the outside, and protects the optical device 30. The optical device 30 is damaged, causing the packaging structure to be scrapped.

在本發明的另一個實施例中，參閱圖2和圖3所示，提供的該封裝結構的第一表面11還注塑有圍設於控制晶片20的四周的第一環形凸起41，控制晶片20封裝於第一環形凸起41內，各第一彎折部15分別貼合於第一環形凸起41對應的外側面。具體地，第一環形凸起41呈杯狀結構，第一環形凸起41的中空空間為控制晶片20和封裝膠50提供安裝空間；在製作時，將封裝膠50注塑或者灌膠的方式灌入第一環形凸起41的中空空間後，再對其進行高溫烘烤，使得封裝膠50固化，從而實現控制晶片20的封裝；第一彎折部15彎折後貼合在第一環形凸起41的外側面上，使得第一彎折部15的彎折位置的準確性好，也可以保證該封裝結構外形尺寸的一致性，同時，第一環形凸起41起到支撐第一彎折部15的作用，防止第一彎折部15受力出現變形和塌陷的問題，各第一彎折部15分別穩定貼合在第一環形凸起41四周的外側面上，使得第一彎折部15穩定地圍設在控制晶片20的四周，保證該封裝結構具有良好的電遮罩效果。In another embodiment of the present invention, referring to Figs. 2 and 3, the first surface 11 of the provided package structure is also injection molded with first annular protrusions 41 surrounding the control chip 20 to control The chip 20 is packaged in the first annular protrusion 41, and each first bending portion 15 is attached to the corresponding outer side surface of the first annular protrusion 41. Specifically, the first annular protrusion 41 has a cup-shaped structure, and the hollow space of the first annular protrusion 41 provides installation space for the control chip 20 and the packaging glue 50; during production, the packaging glue 50 is injection-molded or filled with glue. After being poured into the hollow space of the first annular protrusion 41, it is baked at a high temperature to solidify the encapsulant 50, thereby realizing the encapsulation of the control chip 20; the first bending portion 15 is bent and attached to the first The outer surface of an annular protrusion 41 makes the accuracy of the bending position of the first bending portion 15 good, and can also ensure the consistency of the external dimensions of the packaging structure. At the same time, the first annular protrusion 41 functions as The function of supporting the first bending portion 15 prevents the deformation and collapse of the first bending portion 15 due to the force. Each first bending portion 15 is respectively and stably attached to the outer surface around the first annular protrusion 41 , So that the first bending portion 15 is stably arranged around the control chip 20 to ensure that the packaging structure has a good electrical shielding effect.

在本發明的另一個實施例中，參閱圖2和圖3所示，提供的該封裝結構的第一彎折部15背向金屬基板10的側部設有引線條19，各引線條19均貼合於第一環形凸起41的端面上。具體地，引線條19沿第一環形凸起41的端面彎折並貼合於第一環形凸起41的端面上，那麼在與外部部件連接時，僅需將第一環形凸起41端面上引線條19直接焊接在外部部件上，使得引線條19與外部部件的表面焊接操作方便快捷，也可以實現該封裝結構與外部部件的電性導通；第一環形凸起41起到支撐引線條19的作用，保證該封裝結構可以穩定焊接在外部部件上，使得封裝結構與外部部件之間連接更為穩定牢固。In another embodiment of the present invention, referring to FIGS. 2 and 3, the first bending portion 15 of the package structure provided is provided with a lead bar 19 on the side facing away from the metal substrate 10, and each lead bar 19 is It is attached to the end surface of the first annular protrusion 41. Specifically, the lead bar 19 is bent along the end surface of the first ring-shaped protrusion 41 and attached to the end surface of the first ring-shaped protrusion 41, so when connecting with an external component, only the first ring-shaped protrusion The lead bar 19 on the end surface of 41 is directly welded to the external component, so that the surface welding operation of the lead bar 19 and the external component is convenient and quick, and the electrical conduction between the package structure and the external component can also be realized; The function of supporting the lead bar 19 ensures that the package structure can be stably welded to the external component, so that the connection between the package structure and the external component is more stable and firm.

在本發明的另一個實施例中，參閱圖2和圖3所示，提供的該封裝結構的金屬基板10包括安裝部13、兩個連接部14和五個第一彎折部15，安裝部13和兩個連接部14位於同一平面，控制晶片20和光器件30分別安裝於安裝部13的相對兩側面，兩個連接部14分別位於安裝部13的同一側方並間隔設置，其中，安裝部13和兩個連接部14被第一環形凸起41圍繞；並且，控制晶片20的焊線21連接在兩個連接部14上，光器件30的焊線21也連接在兩個連接部14上，透過兩個連接部14的電性導通作用，從而實現控制晶片20和光器件30的電性導通；其中，三個第一彎折部15分別位於安裝部13的另外三個側方並分別與對應的安裝部13的側部連接，另外兩個第一彎折部15分別位於兩個連接部14背向安裝部13的側方並分別與兩個連接部14連接；五個第一彎折部15均朝向安裝有控制晶片20的安裝部13側部彎折，從而將控制晶片20圍設在五個第一彎折部15之內，實現控制晶片20的電遮罩。In another embodiment of the present invention, referring to FIGS. 2 and 3, the metal substrate 10 of the package structure provided includes a mounting portion 13, two connecting portions 14 and five first bending portions 15. The mounting portion 13 and the two connecting portions 14 are located on the same plane, the control chip 20 and the optical device 30 are respectively mounted on opposite sides of the mounting portion 13, and the two connecting portions 14 are respectively located on the same side of the mounting portion 13 and arranged at intervals, wherein the mounting portion 13 and the two connecting portions 14 are surrounded by the first annular protrusion 41; and the bonding wires 21 of the control chip 20 are connected to the two connecting portions 14, and the bonding wires 21 of the optical device 30 are also connected to the two connecting portions 14. Above, through the electrical conduction of the two connecting portions 14, the electrical conduction between the control chip 20 and the optical device 30 is realized; wherein, the three first bending portions 15 are respectively located on the other three sides of the mounting portion 13 and are respectively Connected to the side of the corresponding mounting portion 13, the other two first bending portions 15 are respectively located on the side of the two connecting portions 14 away from the mounting portion 13 and respectively connected to the two connecting portions 14; five first bends The folding portions 15 are all bent toward the side of the mounting portion 13 where the control chip 20 is mounted, so that the control chip 20 is enclosed within the five first bending portions 15 to realize the electrical shielding of the control chip 20.

進一步地，第一彎折部15的側邊與安裝部13的側邊及連接部14的側邊直接相接，或者，第一彎折部15與安裝部13及連接部14透過連接條18連接，其結構更為簡單且第一彎折部15的彎折省時省力。Further, the side of the first bending portion 15 is directly connected to the side of the mounting portion 13 and the side of the connecting portion 14, or the first bending portion 15 is connected to the mounting portion 13 and the connecting portion 14 through the connecting strip 18. The connection has a simpler structure and the bending of the first bending portion 15 saves time and effort.

更進一步地，一塊金屬基板10可以經過衝壓或者刻蝕的方式得到上述的安裝部13、連接部14、第一彎折部15以及用於連接的連接條18等結構，金屬基板10採用衝壓或者刻蝕的方式得到上述結構，其製作操作簡單，製作效率高。Furthermore, a metal substrate 10 can be stamped or etched to obtain the above-mentioned mounting portion 13, connecting portion 14, first bending portion 15, and connecting strip 18 for connection, and the metal substrate 10 can be stamped or etched. The above structure is obtained by etching, and its manufacturing operation is simple and the manufacturing efficiency is high.

更進一步地，第一彎折部15的兩端與對應的安裝部13的側部是否平齊，可以根據實際需要進行設置。Furthermore, whether the two ends of the first bending portion 15 are flush with the side portions of the corresponding mounting portion 13 can be set according to actual needs.

在本發明的另一個實施例中，參閱圖2和圖3所示，提供的該封裝結構的第二表面12還注塑有圍設於光器件30四周的第三環形凸起42，光器件30封裝於第三環形凸起42內。具體地，第三環形凸起42呈杯狀結構，第三環形凸起42的中空空間為光器件30和封裝膠50提供安裝空間；在製作時，將封裝膠50注塑或者灌膠的方式灌入第三環形凸起42的中空空間後，再對其進行高溫烘烤，使得封裝膠50固化，從而實現光器件30的封裝，固化後的封裝膠50將光器件30與外界進行隔絕，保護光器件30，避免光器件30受損而導致該封裝結構報廢。In another embodiment of the present invention, referring to FIGS. 2 and 3, the second surface 12 of the provided package structure is also injection molded with a third annular protrusion 42 surrounding the optical device 30. The optical device 30 Encapsulated in the third annular protrusion 42. Specifically, the third annular protrusion 42 has a cup-shaped structure, and the hollow space of the third annular protrusion 42 provides installation space for the optical device 30 and the encapsulating glue 50; during production, the encapsulating glue 50 is injected by injection molding or potting. After entering the hollow space of the third annular protrusion 42, high-temperature baking is performed to cure the encapsulant 50, thereby realizing the encapsulation of the optical device 30. The cured encapsulant 50 isolates the optical device 30 from the outside and protects it. The optical device 30 prevents the optical device 30 from being damaged and the packaging structure is scrapped.

在本發明的另一個實施例中，參閱圖4、圖5和圖6所示，提供的該封裝結構的金屬基板10的側部設有第二彎折部16和第三彎折部17，遮罩件於第二彎折部16朝向第一表面11的側方彎折後，再將第二彎折部16沿著控制晶片20的圓周方向進行彎折而形成，以實現控制晶片20的圍設，保證控制晶片20受到良好的電遮罩效果，透過第二彎折部16的彎折從而實現控制晶片20的圍設，其操作簡單方便快捷，有利於實現該封裝結構的快速製作；在控制晶片20圍設完成後，將第三彎折部17朝向第二表面12的側方彎折後，再將第三彎折部17沿光器件30的圓周方向進行彎折，以實現光器件30的圍設，保證光器件30受到良好的電遮罩效果；通過第三彎折部17的彎折從而實現光器件30的圍設，其操作方便快捷，有利於該封裝結構的快速製作。In another embodiment of the present invention, referring to FIG. 4, FIG. 5 and FIG. 6, the side portion of the metal substrate 10 of the package structure is provided with a second bending portion 16 and a third bending portion 17. After the second bending portion 16 is bent toward the side of the first surface 11, the mask member is formed by bending the second bending portion 16 along the circumferential direction of the control chip 20 to realize the control chip 20 The enclosure ensures that the control chip 20 receives a good electrical shielding effect, and the enclosure of the control chip 20 is realized through the bending of the second bending portion 16, and its operation is simple, convenient and quick, which is beneficial to realize the rapid production of the packaging structure; After the control chip 20 is enclosed, the third bending portion 17 is bent toward the side of the second surface 12, and then the third bending portion 17 is bent along the circumferential direction of the optical device 30 to achieve light The enclosing of the device 30 ensures that the optical device 30 receives a good electrical shielding effect; the bending of the third bending portion 17 realizes the enclosing of the optical device 30, which is convenient and quick to operate, which is beneficial to the rapid production of the packaging structure .

在本發明的另一個實施例中，參閱圖4所示，提供的該封裝結構的第二彎折部16與第一表面11圍設形成第二安裝腔112，利用封裝膠50將控制晶片20封裝於第二安裝腔112內，其製作方式與前述相似，不再贅述。In another embodiment of the present invention, referring to FIG. 4, the second bending portion 16 of the package structure and the first surface 11 are provided to form a second mounting cavity 112, and the control chip 20 is sealed by the package glue 50 It is packaged in the second mounting cavity 112, and the manufacturing method is similar to that described above, and will not be repeated.

在本發明的另一個實施例中，參閱圖4所示，提供的該封裝結構的第三彎折部17與第二表面12圍設形成的第三安裝腔113，利用封裝膠50將光器件30封裝於第三安裝腔113內，其製作方式與前述相似，不再贅述。In another embodiment of the present invention, referring to FIG. 4, the third mounting cavity 113 formed by the third bending portion 17 and the second surface 12 of the package structure is provided, and the optical device is formed by using the encapsulant 50 30 is packaged in the third mounting cavity 113, and its manufacturing method is similar to the foregoing, and will not be repeated.

在本發明的另一個實施例中，參閱圖5和圖6所示，提供的該封裝結構的第一表面11還注塑有圍設於控制晶片20的四周的第四環形凸起44，控制晶片20封裝於第四環形凸起44內；第二彎折部16朝向第一表面11的側方彎折後再彎折貼合於第四環形凸起44的周向壁面。具體地，第四環形凸起44呈杯狀結構，第四環形凸起44的中空空間為控制晶片20和封裝膠50提供安裝空間；在製作時，將封裝膠50設置於第四環形凸起44的中空空間內，從而實現控制晶片20的封裝；第四環形凸起44可以起到支撐第二彎折部16的作用，防止第二彎折部16受力出現變形和塌陷的問題，第二彎折部16穩定貼覆在第四環形凸起44四周的壁面上，從而使得第二彎折部16穩定圍設在控制晶片20的四周，保證該封裝結構具有良好的電遮罩效果。In another embodiment of the present invention, referring to FIG. 5 and FIG. 6, the first surface 11 of the package structure provided is also injection molded with a fourth annular protrusion 44 surrounding the control chip 20. The control chip 20 is encapsulated in the fourth annular protrusion 44; the second bending portion 16 is bent toward the side of the first surface 11 and then bent and attached to the circumferential wall surface of the fourth annular protrusion 44. Specifically, the fourth annular protrusion 44 has a cup-shaped structure, and the hollow space of the fourth annular protrusion 44 provides installation space for the control chip 20 and the packaging glue 50; during production, the packaging glue 50 is set on the fourth annular protrusion In the hollow space of 44, the packaging of the control chip 20 is realized; the fourth annular protrusion 44 can support the second bending portion 16 and prevent the deformation and collapse of the second bending portion 16 from being stressed. The two bending portions 16 are stably attached to the wall surface around the fourth annular protrusion 44, so that the second bending portion 16 is stably arranged around the control chip 20, ensuring that the packaging structure has a good electrical shielding effect.

進一步地，第二彎折部16包括第一彎折段161、第二彎折段162、第三彎折段163、與第二彎折段162的端部連接的第四彎折段164以及與第三彎折段163的端部連接的第五彎折段165，第二彎折段162的側部連接於安裝部13背向連接部14的側部，當第二彎折段162朝向安裝有控制晶片20的安裝部13的側面彎折後，再將第四彎折段164沿控制晶片20的圓周方向彎折，以使得第二彎折段162和第四彎折段164分別貼合於第四環形凸起44上兩個相鄰的側面，以封住控制晶片20相鄰的兩個側部；第一彎折段161與靠近第四彎折段164的一個連接部14連接，第三彎折段163與另一個連接部14連接，第五彎折段165背向第一彎折段161延伸，將第一彎折段161和第三彎折段163朝向安裝有控制晶片20的安裝部13的側面彎折後，以使得第一彎折段161和第三彎折段163同時貼合在第四環形凸起44的外壁面上，再將第五彎折段165沿控制晶片20圓周方向彎折，以使得第五彎折段165貼合第四環形凸起44的最後一個空位壁面上，如此，完成了控制晶片20的圍設。Further, the second bending portion 16 includes a first bending section 161, a second bending section 162, a third bending section 163, a fourth bending section 164 connected to an end of the second bending section 162, and The fifth bending section 165 connected to the end of the third bending section 163, the side of the second bending section 162 is connected to the side of the mounting portion 13 facing away from the connecting portion 14, when the second bending section 162 faces After the side surface of the mounting portion 13 where the control chip 20 is mounted is bent, the fourth bending section 164 is then bent along the circumferential direction of the control chip 20, so that the second bending section 162 and the fourth bending section 164 are attached respectively Fits on two adjacent sides of the fourth annular protrusion 44 to seal the two adjacent sides of the control chip 20; the first bending section 161 is connected to a connecting portion 14 close to the fourth bending section 164 , The third bending section 163 is connected to the other connecting portion 14, and the fifth bending section 165 extends away from the first bending section 161, and the first bending section 161 and the third bending section 163 face the control chip After the side surface of the mounting portion 13 of 20 is bent, so that the first bending section 161 and the third bending section 163 are attached to the outer wall of the fourth annular protrusion 44 at the same time, and then the fifth bending section 165 is The control wafer 20 is bent in the circumferential direction, so that the fifth bending section 165 is attached to the wall surface of the last vacancy of the fourth annular protrusion 44, and thus, the enclosure of the control wafer 20 is completed.

在本發明的另一個實施例中，參閱圖5和圖6所示，提供的該封裝結構的第二表面12還注塑有圍設於光器件30四周的第二環形凸起43，光器件30封裝於第二環形凸起43內，第三彎折部17朝向第二表面12的側方彎折後再彎折貼合於第二環形凸起43的周向壁面，並將封裝膠50設置於第二環形凸起43的中空空間，從而實現光器件30的封裝；其製作方式與功效與前述相似，不再贅述；第二環形凸起43呈杯狀結構，第二環形凸起43的中空空間為光器件30和封裝膠50提供安裝空間。由於第三彎折部17貼合於第二環形凸起43的周向壁面，第二環形凸起43還可以起到支撐第三彎折部17的作用，防止第三彎折部17受力出現變形和塌陷的問題，第三彎折部17穩定地貼覆在第二環形凸起43四周的壁面上，從而使得第三彎折部17穩定圍設在光器件30的四周，保證光器件30受到良好的電遮罩效果。In another embodiment of the present invention, referring to FIGS. 5 and 6, the second surface 12 of the provided package structure is also injection molded with a second annular protrusion 43 surrounding the optical device 30. The optical device 30 Encapsulated in the second annular protrusion 43, the third bending portion 17 is bent toward the side of the second surface 12 and then bent and attached to the circumferential wall surface of the second annular protrusion 43, and the packaging glue 50 is set In the hollow space of the second annular protrusion 43, the packaging of the optical device 30 is realized; its manufacturing method and effect are similar to the foregoing, and will not be repeated; the second annular protrusion 43 has a cup-shaped structure, and the second annular protrusion 43 has a cup-shaped structure. The hollow space provides installation space for the optical device 30 and the packaging glue 50. Since the third bending portion 17 is attached to the circumferential wall surface of the second annular protrusion 43, the second annular protrusion 43 can also support the third bending portion 17 and prevent the third bending portion 17 from being stressed. Problems of deformation and collapse occur, and the third bending portion 17 is stably attached to the wall surface around the second annular protrusion 43, so that the third bending portion 17 is stably arranged around the optical device 30 to ensure the optical device 30 receives a good electric shielding effect.

進一步地，第三彎折部17包括第六彎折段171、第七彎折段172、與第六彎折段171的端部連接的第八彎折段173以及與第七彎折段172的端部連接的第九彎折段174，第六彎折段171和第七彎折段172分別位於安裝部13的相對兩側部並分別位於兩個連接部14的側方，第六彎折段171朝向安裝有光器件30的安裝部13的側面彎折後，再將第八彎折段173沿光器件30的圓周方向彎折，以使得第六彎折段171和第八彎折段173分別貼合第二環形凸起43上兩個相鄰的側面，以封住光器件30相鄰的兩個側部；第七彎折段172朝向安裝有光器件30的安裝部13的側面彎折後，再將第九彎折段174沿光器件30的圓周方向彎折，以使得第七彎折段172和第九彎折段174分別貼合第二環形凸起43上另外兩個相鄰的側面上，以封住光器件30另外相鄰的兩個側部，從而完成光器件30的圍設，保證光器件30受到良好的電遮罩效果。Further, the third bending portion 17 includes a sixth bending section 171, a seventh bending section 172, an eighth bending section 173 connected to an end of the sixth bending section 171, and a seventh bending section 172. The ends of the ninth bending section 174, the sixth bending section 171 and the seventh bending section 172 are respectively located on opposite sides of the mounting portion 13 and on the sides of the two connecting portions 14, respectively, and the sixth bending section After the bending section 171 is bent toward the side surface of the mounting portion 13 where the optical device 30 is installed, the eighth bending section 173 is then bent along the circumferential direction of the optical device 30, so that the sixth bending section 171 and the eighth bending section 171 are bent. The section 173 is attached to the two adjacent side surfaces of the second annular protrusion 43 to seal the two adjacent sides of the optical device 30; the seventh bending section 172 faces the mounting portion 13 where the optical device 30 is installed. After the sides are bent, the ninth bending section 174 is then bent along the circumferential direction of the optical device 30, so that the seventh bending section 172 and the ninth bending section 174 are respectively attached to the other two on the second annular protrusion 43. Two adjacent sides are used to seal the other two adjacent sides of the optical device 30, thereby completing the surrounding of the optical device 30, and ensuring that the optical device 30 receives a good electrical shielding effect.

更進一步地，第一彎折段161的側面、第二彎折段162的側面、第三彎折段163的側面、第四彎折段164的側面以及第五彎折段165的側面均設有引線條19，引線條19彎折後貼合於第四環形凸起44的端面上，引線條19可以直接作為電性引腳使用，以方便該封裝結構與外部的部件連接。Furthermore, the side of the first bending section 161, the side of the second bending section 162, the side of the third bending section 163, the side of the fourth bending section 164, and the side of the fifth bending section 165 are all set There is a lead bar 19, which is attached to the end surface of the fourth annular protrusion 44 after being bent. The lead bar 19 can be directly used as an electrical pin to facilitate the connection of the package structure with external components.

更進一步地，第六彎折段171的側面、第七彎折段172的側面、第八彎折段173的側面以及第九彎折段174的側面均設有引線條19，引線條19彎折後貼合於第二環形凸起43的端面上，引線條19可以直接作為電性引腳使用，以方便該封裝結構與外部的部件連接。Furthermore, the side of the sixth bending section 171, the side of the seventh bending section 172, the side of the eighth bending section 173, and the side of the ninth bending section 174 are all provided with lead bars 19, which are bent. After being folded and attached to the end surface of the second annular protrusion 43, the lead bar 19 can be directly used as an electrical pin to facilitate the connection of the package structure with external components.

更進一步地，一塊金屬基板10可以透過衝壓或者刻蝕的方式得到安裝部13、連接部14、第二彎折部16以及第三彎折部17等結構，其製作方法簡單高效。Furthermore, a metal substrate 10 can be formed by stamping or etching to obtain the mounting portion 13, the connecting portion 14, the second bending portion 16, and the third bending portion 17, and the manufacturing method is simple and efficient.

在本發明的另一個實施例中，參閱圖7~14所示，提供的該封裝結構的金屬基板10包括安裝塊101和若干個引腳塊102，控制晶片20和光器件30分別安裝於安裝塊101的相對兩側面，即第一表面11和第二表面12，各引腳塊102圍設於安裝塊101的四周，各引腳塊102的一端凸伸出安裝塊101上安裝有控制晶片20的側面，遮罩件為引腳塊102。具體地，由於圍設在安裝塊101四周的引腳塊102的端部凸伸出安裝塊101上安裝有控制晶片20的側面，即各引腳塊102圍設在控制晶片20的四周，那麼引腳塊102可以起到電遮罩控制晶片20的作用，引腳塊102可以作為遮罩件使用；同時，在具體安裝時，控制晶片20的焊線21以及光器件30的焊線21分別與引腳塊102電性連接，從而實現控制晶片20和光器件30的電性連接，同時，引腳塊102可以直接與外部部件焊接，從而起到電性引腳的作用。In another embodiment of the present invention, referring to FIGS. 7 to 14, the metal substrate 10 of the package structure provided includes a mounting block 101 and a plurality of pin blocks 102. The control chip 20 and the optical device 30 are respectively mounted on the mounting block. On two opposite sides of 101, namely the first surface 11 and the second surface 12, each pin block 102 is surrounded by the mounting block 101, and one end of each pin block 102 protrudes from the mounting block 101, and the control chip 20 is mounted on the mounting block 101. On the side surface, the shielding piece is the pin block 102. Specifically, since the ends of the pin blocks 102 surrounding the mounting block 101 protrude from the side of the mounting block 101 where the control chip 20 is mounted, that is, each pin block 102 is surrounding the control chip 20, then The pin block 102 can function as an electrical shield to control the chip 20, and the pin block 102 can be used as a mask; at the same time, during specific installation, the bonding wires 21 of the control chip 20 and the bonding wires 21 of the optical device 30 are respectively It is electrically connected with the pin block 102 to realize the electrical connection between the control chip 20 and the optical device 30. At the same time, the pin block 102 can be directly welded with external components, thereby functioning as an electrical pin.

進一步地，金屬基板10可以透過刻蝕的方式得到安裝塊101以及若干個圍設在安裝塊101的四周的引腳塊102，刻蝕的製作方法簡單，可以實現該封裝結構的高效製作，其生產效率得到有效地提升。Further, the metal substrate 10 can be etched to obtain the mounting block 101 and a number of pin blocks 102 surrounding the mounting block 101. The etching method is simple, and the packaging structure can be efficiently manufactured. Production efficiency has been effectively improved.

在本發明的另一個實施例中，參閱圖7、圖8、圖9和圖12所示，提供的該封裝結構的各引腳塊102的側面與安裝塊101的表面圍設形成的第四安裝腔114，利用封裝膠50將控制晶片20封裝於第四安裝腔114內，其製作方式和功效與前述相似，不再贅述。In another embodiment of the present invention, referring to FIG. 7, FIG. 8, FIG. 9 and FIG. 12, the side surface of each pin block 102 of the package structure and the surface of the mounting block 101 are provided to form a fourth In the mounting cavity 114, the control chip 20 is packaged in the fourth mounting cavity 114 by the encapsulating glue 50. The manufacturing method and the effect are similar to those described above, and will not be repeated.

在本發明的另一個實施例中，參閱圖12所示，提供的該封裝結構的光器件30利用封裝膠50封裝於金屬基板10的第二表面12上，封裝膠50將光器件30密封，可以避免光器件30受損，也可以大大延長光器件30的使用壽命。In another embodiment of the present invention, referring to FIG. 12, the provided optical device 30 of the package structure is encapsulated on the second surface 12 of the metal substrate 10 with a encapsulant 50, and the encapsulant 50 seals the optical device 30. The optical device 30 can be prevented from being damaged, and the service life of the optical device 30 can be greatly extended.

在本發明的另一個實施例中，參閱圖7、圖8和圖9所示，提供的該封裝結構還注塑有圍設於光器件30四周的第五環形凸起45，光器件30封裝於第五環形凸起45內，其製作方式和功效與前述相似，不再贅述；第五環形凸起45呈杯狀結構，第五環形凸起45的中空空間為光器件30和封裝膠50提供安裝空間。In another embodiment of the present invention, referring to FIG. 7, FIG. 8 and FIG. 9, the package structure provided is also injection molded with a fifth annular protrusion 45 surrounding the optical device 30, and the optical device 30 is encapsulated in In the fifth annular protrusion 45, its manufacturing method and effect are similar to the foregoing, and will not be repeated; the fifth annular protrusion 45 is a cup-shaped structure, and the hollow space of the fifth annular protrusion 45 is provided for the optical device 30 and the encapsulant 50 Installation space.

在本發明的另一個實施例中，參閱圖10和圖11所示，提供的該封裝結構的各引腳塊102與安裝塊101透過黏結膠60連接為一個整體，引腳塊102的側部設有露出黏結膠60外並朝向控制晶片20延伸的連接凸起1021，控制晶片20與連接凸起1021電性連接。具體地，在安裝時，控制晶片20的焊線21可以直接與外露的連接凸起1021連接，避免黏結膠60影響控制晶片20的焊線21與引腳塊102之間的電性導通。In another embodiment of the present invention, referring to FIG. 10 and FIG. 11, each pin block 102 of the provided package structure and the mounting block 101 are connected as a whole through the adhesive 60, and the side portion of the pin block 102 A connecting protrusion 1021 that exposes the adhesive 60 and extends toward the control chip 20 is provided, and the control chip 20 is electrically connected to the connection protrusion 1021. Specifically, during installation, the bonding wires 21 of the control chip 20 can be directly connected to the exposed connection bumps 1021 to prevent the adhesive 60 from affecting the electrical conduction between the bonding wires 21 of the control chip 20 and the pin block 102.

進一步地，其中需要與光器件30連接的連接凸起1021還凸伸出安裝塊101上安裝光器件30的側面並外露於黏結膠60外，這樣可以避免黏結膠60阻礙光器件30的焊線21與引腳塊102之間的電性連接，使得其連接更為操作簡單。Further, the connecting protrusion 1021 that needs to be connected to the optical device 30 also protrudes from the side surface of the mounting block 101 where the optical device 30 is installed and is exposed outside the adhesive 60, so as to avoid the adhesive 60 from obstructing the bonding wire of the optical device 30 The electrical connection between 21 and the pin block 102 makes the connection easier to operate.

如圖1~14所示，在本發明的另一個實施例中，提供了用於製作上述封裝結構的封裝結構製作方法，具體包括以下步驟：As shown in FIGS. 1-14, in another embodiment of the present invention, a packaging structure manufacturing method for manufacturing the above-mentioned packaging structure is provided, which specifically includes the following steps:

提供金屬基板10、控制晶片20和光器件30；Provide a metal substrate 10, a control chip 20 and an optical device 30;

將控制晶片20安裝於第一表面11，並將控制晶片20與遮罩件電性連接，以使得遮罩件作為用於與外部部件電性連接的電性引腳，各遮罩件圍設於控制晶片20的四周以電遮罩控制晶片20；The control chip 20 is mounted on the first surface 11, and the control chip 20 is electrically connected to the shield member, so that the shield member serves as an electrical pin for electrical connection with external components, and each shield member surrounds The control chip 20 is electrically shielded around the control chip 20;

將光器件30安裝於第二表面12。The optical device 30 is mounted on the second surface 12.

在本發明的另一個實施例中，參閱圖3所示，提供了一種封裝結構製作方法，具體包括以下步驟：In another embodiment of the present invention, referring to FIG. 3, a method for manufacturing a package structure is provided, which specifically includes the following steps:

提供金屬基板10，對金屬基板10採用衝壓或者蝕刻的方式得到安裝部13、兩個連接部14和五個第一彎折部15；A metal substrate 10 is provided, and the metal substrate 10 is stamped or etched to obtain a mounting part 13, two connecting parts 14 and five first bending parts 15;

在安裝部13和兩個連接部14相對兩側的表面分別透過注射成型的方式得到第一環形凸起41和第三環形凸起42；The first annular protrusion 41 and the third annular protrusion 42 are obtained by injection molding on the surfaces on opposite sides of the mounting portion 13 and the two connecting portions 14 respectively;

將控制晶片20安裝於安裝部13的一表面並位於第一環形凸起41內，再將控制晶片20電性連接於兩個連接部14上；Mount the control chip 20 on a surface of the mounting portion 13 and be located in the first annular protrusion 41, and then electrically connect the control chip 20 to the two connecting portions 14;

利用封裝膠50將控制晶片20封裝於第一環形凸起41內；Use the packaging glue 50 to package the control chip 20 in the first annular protrusion 41;

將光器件30安裝於安裝部13的另一表面並位於第三環形凸起42內，再將光器件30電性連接在兩個連接部14；Mount the optical device 30 on the other surface of the mounting portion 13 and located in the third annular protrusion 42, and then electrically connect the optical device 30 to the two connecting portions 14;

利用封裝膠50將光器件30封裝於第三環形凸起42內；Use the packaging glue 50 to package the optical device 30 in the third annular protrusion 42;

將五個第一彎折部15分別對應地彎折貼合在第一環形凸起41四周的外側面上，使得第一彎折部15圍設在控制晶片20的四周，起到電遮罩的作用。The five first bending parts 15 are respectively bent and attached to the outer surface around the first annular protrusion 41, so that the first bending part 15 is arranged around the control chip 20 to provide electrical shielding. The role of the hood.

在本發明的另一個實施例中，如圖1所示結構，以上圖3所示步驟可不需製作第一環形凸起41和第三環形凸起42，直接將五個第一彎折部15均朝向設置有控制晶片20的側方彎折，以使得第一彎折部15圍設在控制晶片20的四周，起到電遮罩的作用；再利用封裝膠50將控制晶片20封裝於五個第一彎折部15、兩個連接部14以及安裝部13圍設形成的第一安裝腔111內，從而完成控制晶片20的封裝，最後，再利用封裝膠50直接將光器件30封裝在安裝部13的另一表面上。In another embodiment of the present invention, as shown in FIG. 1, the steps shown in FIG. 3 above do not need to make the first annular protrusion 41 and the third annular protrusion 42, and the five first bending parts are directly 15 are all bent toward the side where the control chip 20 is provided, so that the first bending portion 15 is arranged around the control chip 20 and functions as an electric shield; and then the control chip 20 is packaged in the encapsulant 50 The five first bending portions 15, the two connecting portions 14, and the mounting portion 13 are surrounded by the first mounting cavity 111 to complete the packaging of the control chip 20. Finally, the optical device 30 is directly packaged with the packaging glue 50 On the other surface of the mounting part 13.

在本發明的另一個實施例中，以上圖3所示步驟可不需製作第三環形凸起42，將光器件30安裝於安裝部13的另一表面上，並將光器件30電性連接在兩個連接部14後直接利用封裝膠50將光器件30封裝在安裝部13的另一表面上。In another embodiment of the present invention, the steps shown in FIG. 3 above do not need to make the third annular protrusion 42, the optical device 30 is mounted on the other surface of the mounting portion 13, and the optical device 30 is electrically connected to After the two connecting parts 14, the optical device 30 is directly packaged on the other surface of the mounting part 13 with the packaging glue 50.

在本發明的另一個實施例中，參閱圖6所示，提供了一種封裝結構製作方法，具體包括以下步驟：In another embodiment of the present invention, referring to FIG. 6, a method for manufacturing a package structure is provided, which specifically includes the following steps:

提供金屬基板10，對金屬基板10採用衝壓或者蝕刻的方式得到安裝部13、兩個連接部14、第二彎折部16和第三彎折部17；A metal substrate 10 is provided, and the metal substrate 10 is stamped or etched to obtain the mounting portion 13, the two connecting portions 14, the second bending portion 16, and the third bending portion 17;

在安裝部13和兩個連接部14相對兩側的表面分別通過注射成型的方式得到第二環形凸起43和第四環形凸起44；The second annular protrusion 43 and the fourth annular protrusion 44 are obtained by injection molding on the surfaces on opposite sides of the mounting portion 13 and the two connecting portions 14, respectively;

將控制晶片20安裝於安裝部13的一表面並位於第四環形凸起44內，再將控制晶片20電性連接在兩個連接部14；Mount the control chip 20 on a surface of the mounting portion 13 and located in the fourth annular protrusion 44, and then electrically connect the control chip 20 to the two connecting portions 14;

利用封裝膠50將控制晶片20封裝於第四環形凸起44內；Use the packaging glue 50 to package the control chip 20 in the fourth annular protrusion 44;

將光器件30安裝於安裝部13的另一表面並位於第二環形凸起43內，再將光器件30電性連接在兩個連接部14；Mount the optical device 30 on the other surface of the mounting portion 13 and located in the second annular protrusion 43, and then electrically connect the optical device 30 to the two connecting portions 14;

利用封裝膠50將光器件30封裝於第二環形凸起43內；Use the packaging glue 50 to package the optical device 30 in the second annular protrusion 43;

將第二彎折部16朝向設置有控制晶片20的側方彎折後再沿控制晶片20的周向彎折，使得第二彎折部16圍設在控制晶片20的四周，起到電遮罩的作用；將第三彎折部17朝向設置有光器件30的側方彎折後再沿光器件30的四周彎折，使得第三彎折部17圍設在光器件30的四周，起到電遮罩的作用。The second bending portion 16 is bent toward the side where the control chip 20 is provided, and then bent along the circumferential direction of the control chip 20, so that the second bending portion 16 is arranged around the control chip 20 and serves as an electrical shield Function; bend the third bending portion 17 toward the side where the optical device 30 is provided, and then bend it along the circumference of the optical device 30, so that the third bending portion 17 is arranged around the optical device 30 to provide electrical The role of the mask.

在本發明的另一個實施例中，如圖4所示結構，以上圖6所示步驟可不需製作第二環形凸起43和第四環形凸起44，直接將各第二彎折部16朝向設置有控制晶片20的側方彎折後再沿控制晶片20的四周彎折，以使得第二彎折部16圍設在控制晶片20的四周；直接將各第三彎折部17朝向設置有光器件30的側方彎折後再沿光器件30的四周彎折，以使得第三彎折部17圍設在光器件30的四周；再利用封裝膠50將控制晶片20封裝於第二彎折部16、兩個連接部14以及安裝部13圍設形成的第二安裝腔112內；利用封裝膠50將光器件30封裝於第三彎折部17、兩個連接部14以及安裝部13圍設形成的第三安裝腔113內。In another embodiment of the present invention, as shown in FIG. 4, the steps shown in FIG. 6 above do not need to make the second annular protrusion 43 and the fourth annular protrusion 44, and directly direct each second bending portion 16 toward The side of the control chip 20 is bent and then bends along the periphery of the control chip 20, so that the second bending portion 16 surrounds the periphery of the control chip 20; the third bending portion 17 is directly arranged toward the After the side of the optical device 30 is bent, it is then bent along the periphery of the optical device 30, so that the third bending portion 17 is surrounded by the periphery of the optical device 30; and then the control chip 20 is packaged in the second bend with the encapsulant 50 Inside the second mounting cavity 112 formed by the folding portion 16, the two connecting portions 14, and the mounting portion 13; the optical device 30 is encapsulated in the third bending portion 17, the two connecting portions 14 and the mounting portion 13 with the encapsulant 50 Surrounded and formed in the third installation cavity 113.

在本發明的另一個實施例中，參閱圖13所示，提供了一種封裝結構製作方法，具體包括以下步驟：In another embodiment of the present invention, referring to FIG. 13, a method for manufacturing a package structure is provided, which specifically includes the following steps:

提供金屬基板10，對金屬基板10採用蝕刻的方式得到安裝塊101和若干個圍設在安裝塊101四周的引腳塊102；利用黏結膠60將安裝塊101和若干個引腳塊102連接起來，且各引腳塊102的側面與安裝塊101的表面圍設形成第四安裝腔114；A metal substrate 10 is provided, and the metal substrate 10 is etched to obtain a mounting block 101 and a number of pin blocks 102 surrounding the mounting block 101; the mounting block 101 and a number of pin blocks 102 are connected by an adhesive 60 , And the side surface of each pin block 102 and the surface of the mounting block 101 are enclosed to form a fourth mounting cavity 114;

將控制晶片20安裝在安裝塊101的一表面上並位於第四安裝腔114內，再將控制晶片20電性連接在引腳塊102上；Mounting the control chip 20 on a surface of the mounting block 101 and located in the fourth mounting cavity 114, and then electrically connecting the control chip 20 to the pin block 102;

利用封裝膠50將控制晶片20封裝於第四安裝腔114內；Encapsulate the control chip 20 in the fourth mounting cavity 114 by using the encapsulant 50;

將光器件30安裝在安裝塊101的另一表面上；Mount the optical device 30 on the other surface of the mounting block 101;

利用封裝膠50直接將光器件30封裝於安裝塊101的另一表面上。The optical device 30 is directly encapsulated on the other surface of the mounting block 101 by using the encapsulant 50.

在本發明的另一個實施例中，參閱圖14所示，提供了一種封裝結構製作方法，圖14所示的製作步驟與圖13所示的製作步驟的差異在於：In another embodiment of the present invention, referring to FIG. 14, a method for manufacturing a package structure is provided. The difference between the manufacturing steps shown in FIG. 14 and the manufacturing steps shown in FIG. 13 lies in:

在安裝塊101背向第四安裝腔114的四周邊緣處注射第五環形凸起45；Inject a fifth annular protrusion 45 at the peripheral edge of the mounting block 101 facing away from the fourth mounting cavity 114;

將光器件30安裝在安裝塊101的另一表面上並位於第五環形凸起45內，並將光器件30電性連接於引腳塊102上；利用封裝膠50將光器件30封裝於第五環形凸起45內。The optical device 30 is mounted on the other surface of the mounting block 101 and is located in the fifth annular protrusion 45, and the optical device 30 is electrically connected to the lead block 102; the optical device 30 is encapsulated on the second surface with the encapsulant 50 Inside the five-ring-shaped protrusion 45.

這些製作方法操作方便快捷，省時省力，並且採用這些封裝結構製作方法製作出的封裝結構，具有良好的電遮罩效果、結構簡單、加工製作方便快捷、生產效率高且外形尺寸小巧，有利於其小型化或者薄型化設計。These manufacturing methods are convenient and quick to operate, save time and effort, and the package structure manufactured by these package structure manufacturing methods has good electrical shielding effect, simple structure, convenient and quick processing and production, high production efficiency and small size, which are beneficial to Its miniaturization or thin design.

以上所述僅為本發明的較佳實施例而已，並不用以限制本發明，凡在本發明的精神和原則之內所作的任何修改、等同替換和改進等，均應包含在本發明的保護範圍之內。The above descriptions are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection of the present invention. Within range.

10:金屬基板 11:第一表面 12:第二表面 13:安裝部 14:連接部 15:第一彎折部 16:第二彎折部 17:第三彎折部 18:連接條 19:引線條 20:控制晶片 21:焊線 30:光器件 41:第一環形凸起 42:第三環形凸起 43:第二環形凸起 44:第四環形凸起 45:第五環形凸起 50:封裝膠 60:黏結膠 101:安裝塊 102:引腳塊 111:第一安裝腔 112:第二安裝腔 113:第三安裝腔 114:第四安裝腔 161:第一彎折段 162:第二彎折段 163:第三彎折段 164:第四彎折段 165:第五彎折段 171:第六彎折段 172:第七彎折段 173:第八彎折段 174:第九彎折段 1021:連接凸起10: Metal substrate 11: The first surface 12: second surface 13: Installation Department 14: Connection part 15: The first bending part 16: The second bending part 17: Third bending part 18: connecting bar 19: Lead bar 20: control chip 21: Welding wire 30: Optical devices 41: The first ring bump 42: The third ring bump 43: The second ring bump 44: The fourth ring bump 45: Fifth ring bump 50: Encapsulation glue 60: adhesive 101: installation block 102: pin block 111: first installation cavity 112: second mounting cavity 113: Third mounting cavity 114: Fourth mounting cavity 161: The first bending section 162: Second bending section 163: Third bending section 164: The fourth bending section 165: Fifth bending section 171: The sixth bending section 172: seventh bending section 173: Eighth bending section 174: Ninth bending section 1021: connecting bump

為了更清楚地說明本發明實施例中的技術方案，下面將對實施例或現有技術描述中所需要使用的所附圖式作簡單地介紹，顯而易見地，下面描述中的圖式僅僅是本發明的一些實施例，對於本領域普通技術人員來講，在不付出創造性勞動性的前提下，還可以根據這些圖式獲得其他的圖式。 圖1為本發明實施例提供的封裝結構的截面圖。 圖2為本發明實施例另一實施例提供的封裝結構的截面圖。 圖3為圖1所示的封裝結構的製作方法的流程圖。 圖4為本發明實施例另一實施例提供的封裝結構的截面圖。 圖5為本發明實施例另一實施例提供的封裝結構的截面圖。 圖6為圖5所示的封裝結構的製作方法的流程圖。 圖7為本發明另一實施例提供的封裝結構的一個視角的結構示意圖。 圖8為圖7所示的封裝結構的另一個視角的結構示意圖。 圖9為沿圖8中A-A線的橫截面圖。 圖10為圖8所示的封裝結構的一個視角的爆炸圖。 圖11為圖8所示的封裝結構的一個視角的爆炸圖。 圖12為本發明另一實施例提供的封裝結構的截面圖。 圖13為圖12所示的封裝結構的製作方法的流程圖。 圖14為圖9所示的封裝結構的製作方法的流程圖。 其中，圖式中的各元件符號： 10…金屬基板        11…第一表面         12…第二表面 13…安裝部          14…連接部           15…第一彎折部 16…第二彎折部      17…第三彎折部       18…連接條 19…引線條          20…控制晶片           21…焊線 30…光器件          41…第一環形凸起     42…第三環形凸起 43…第二環形凸起    44…第四環形凸起     45…第五環形凸起 50…封裝膠          60…黏結膠           101…安裝塊 102…引腳塊         111…第一安裝腔      112…第二安裝腔 113…第三安裝腔     114…第四安裝腔      161…第一彎折段 162…第二彎折段     163…第三彎折段      164…第四彎折段 165…第五彎折段     171…第六彎折段      172…第七彎折段 173…第八彎折段     174…第九彎折段      1021…連接凸起。In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely the present invention. For some of the embodiments of, for those of ordinary skill in the art, other schemas can be obtained based on these schemas without creative labor. FIG. 1 is a cross-sectional view of a package structure provided by an embodiment of the present invention. FIG. 2 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention. FIG. 3 is a flowchart of a manufacturing method of the package structure shown in FIG. 1. 4 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention. FIG. 5 is a cross-sectional view of a package structure provided by another embodiment of the embodiment of the present invention. FIG. 6 is a flowchart of a manufacturing method of the package structure shown in FIG. 5. FIG. 7 is a schematic structural diagram from a perspective of a package structure provided by another embodiment of the present invention. FIG. 8 is a schematic structural diagram of the package structure shown in FIG. 7 from another perspective. Fig. 9 is a cross-sectional view taken along the line A-A in Fig. 8. FIG. 10 is an exploded view of the packaging structure shown in FIG. 8 from a perspective. FIG. 11 is an exploded view of the packaging structure shown in FIG. 8 from a perspective. FIG. 12 is a cross-sectional view of a package structure provided by another embodiment of the present invention. FIG. 13 is a flowchart of a manufacturing method of the package structure shown in FIG. 12. FIG. 14 is a flowchart of a manufacturing method of the package structure shown in FIG. 9. Among them, the symbol of each component in the diagram: 10...Metal substrate 11...First surface 12...Second surface 13...Installation department 14...Connecting part 15...First bending part 16...Second bending part 17... Third bending part 18...Connecting strip 19...lead strip 20...control chip 21...bonding wire 30...Optical device 41...The first ring-shaped protrusion 42...The third ring-shaped protrusion 43...Second annular protrusion 44... Fourth annular protrusion 45... Fifth annular protrusion 50...encapsulating glue 60...bonding glue 101...mounting block 102...Lead block 111...First mounting cavity 112...Second mounting cavity 113...The third mounting cavity 114...The fourth mounting cavity 161...The first bending section 162...Second bending section 163... Third bending section 164... Fourth bending section 165... Fifth bending section 171... Sixth bending section 172... Seventh bending section 173...Eighth bending section 174...Ninth bending section 1021...Connecting protrusion.

15:第一彎折部15: The first bending part

19:引線條19: Lead bar

20:控制晶片20: control chip

30:光器件30: Optical devices

41:第一環形凸起41: The first ring bump

42:第三環形凸起42: The third ring bump

50:封裝膠50: Encapsulation glue

111:第一安裝腔111: first installation cavity

Claims (10)

一種封裝結構，其包括： 一金屬基板，該金屬基板具有相對設置的一第一表面和一第二表面； 一控制晶片，該控制晶片安裝於該述第一表面； 一光器件，該光器件安裝於該第二表面；以及 複數個遮罩件，設置於該金屬基板，各該複數個遮罩件凸伸出該第一表面並圍設於該控制晶片的四周，以電遮罩該控制晶片； 其中該控制晶片與該複數個遮罩件電性連接，以使得該複數個遮罩件作為用於與外部部件電性連接的電性引腳。A packaging structure, which includes: A metal substrate, the metal substrate having a first surface and a second surface disposed opposite to each other; A control chip mounted on the first surface; An optical device mounted on the second surface; and A plurality of shielding members are arranged on the metal substrate, and each of the plurality of shielding members protrudes from the first surface and surrounds the control chip to electrically shield the control chip; The control chip is electrically connected to the plurality of shielding parts, so that the plurality of shielding parts serve as electrical pins for electrically connecting with external components. 根據申請專利範圍第1項所述的封裝結構，其中該控制晶片和該光器件正對設置。According to the package structure described in item 1 of the scope of patent application, the control chip and the optical device are arranged directly opposite. 根據申請專利範圍第1項所述的封裝結構，其中該金屬基板的四周均設有一第一彎折部，各該複數個遮罩件分別於各該第一彎折部朝向該第一表面的側方彎折形成。According to the package structure described in item 1 of the scope of patent application, a first bending portion is provided on all sides of the metal substrate, and each of the plurality of shielding members is located on each of the first bending portions facing the first surface. The side is bent and formed. 根據申請專利範圍第3項所述的封裝結構，其中該第一表面還注塑有圍設於該控制晶片的四周的一第一環形凸起，該控制晶片封裝於該第一環形凸起內；各該第一彎折部分別貼合於該第一環形凸起對應的外側面上。The packaging structure according to item 3 of the scope of patent application, wherein the first surface is also injection molded with a first annular protrusion surrounding the control chip, and the control chip is encapsulated on the first annular protrusion In; each of the first bending portion is respectively attached to the outer surface corresponding to the first annular protrusion. 根據申請專利範圍第4項所述的封裝結構，其中各該第一彎折部背向該金屬基板的側部設有一引線條，各該引線條均貼合於該第一環形凸起的端面上。According to the package structure described in item 4 of the scope of patent application, each of the first bending portions is provided with a lead bar on the side facing away from the metal substrate, and each of the lead bars is attached to the first annular protrusion. End face. 根據申請專利範圍第1項所述的封裝結構，其中該金屬基板的側部設有一第二彎折部和一第三彎折部，各該複數個遮罩件於該第二彎折部朝向該第一表面的側方彎折後再沿該控制晶片的周向彎折形成；該第三彎折部朝向該第二表面的側方彎折後再沿該光器件的周向彎折以使得該第三彎折部圍設於該光器件的四周。The package structure according to the first item of the scope of patent application, wherein the side portion of the metal substrate is provided with a second bending portion and a third bending portion, and each of the plurality of shielding members faces toward the second bending portion The side of the first surface is bent and then formed by bending along the circumferential direction of the control chip; the third bent portion is bent toward the side of the second surface and then bent along the circumferential direction of the optical device to make the third The bending part is arranged around the optical device. 根據申請專利範圍第6項所述的封裝結構，其中該第二表面還注塑有圍設於該光器件四周的一第二環形凸起，該光器件封裝於該第二環形凸起內，該第三彎折部朝向該第二表面的側方彎折後再彎折貼合於該第二環形凸起的周向壁面。According to the packaging structure described in item 6 of the scope of patent application, the second surface is also injection molded with a second annular protrusion surrounding the optical device, and the optical device is encapsulated in the second annular protrusion. The third bent portion is bent toward the side of the second surface and then bent and attached to the circumferential wall surface of the second annular protrusion. 根據申請專利範圍第1項所述的封裝結構，其中該金屬基板包括一安裝塊和複數個引腳塊，該控制晶片和該光器件分別安裝於該安裝塊的相對兩側面，各該引腳塊圍設於該安裝塊的四周，各該引腳塊的一端凸伸出該安裝塊上安裝有該控制晶片的側面，該複數個遮罩件為該複數個引腳塊。The package structure according to item 1 of the scope of patent application, wherein the metal substrate includes a mounting block and a plurality of pin blocks, the control chip and the optical device are respectively mounted on two opposite sides of the mounting block, and each pin Blocks are arranged around the mounting block, one end of each pin block protrudes from the side surface of the mounting block where the control chip is mounted, and the plurality of shielding parts are the plurality of pin blocks. 根據申請專利範圍第8項所述的封裝結構，其中各該引腳塊與該安裝塊透過一黏結膠連接為一個整體，各該引腳塊的側部設有露出該黏結膠外並朝向該控制晶片延伸的一連接凸起，該控制晶片與該連接凸起電性連接。According to the package structure described in item 8 of the scope of patent application, each of the pin blocks and the mounting block are connected as a whole through an adhesive glue, and the side of each of the pin blocks is provided with exposed outside of the adhesive and faces the A connection bump extending from the control chip, and the control chip is electrically connected to the connection bump. 一種用於製作如申請專利範圍第1~9項中任一項所述的封裝結構的封裝結構製作方法，其具體包括以下步驟： 提供該金屬基板、該控制晶片和該光器件； 將該控制晶片安裝於該第一表面，並將該控制晶片與該複數個遮罩件電性連接，以使得該複數個遮罩件作為用於與外部部件電性連接的電性引腳，各該複數個遮罩件圍設於該控制晶片的四周以電遮罩該控制晶片；以及 將該光器件安裝於該第二表面。A manufacturing method of packaging structure for manufacturing the packaging structure as described in any one of items 1 to 9 of the scope of patent application, which specifically includes the following steps: Provide the metal substrate, the control chip and the optical device; Mounting the control chip on the first surface, and electrically connecting the control chip and the plurality of shielding parts, so that the plurality of shielding parts serve as electrical pins for electrically connecting with external components, Each of the plurality of shielding members is arranged around the control chip to electrically shield the control chip; and The optical device is mounted on the second surface.
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