CN101202264A - Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure - Google Patents
Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure Download PDFInfo
- Publication number
- CN101202264A CN101202264A CN 200610167814 CN200610167814A CN101202264A CN 101202264 A CN101202264 A CN 101202264A CN 200610167814 CN200610167814 CN 200610167814 CN 200610167814 A CN200610167814 A CN 200610167814A CN 101202264 A CN101202264 A CN 101202264A
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- pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a single side welding pad wire wafer packaging conductor frame and a wafer packaging structure thereof and discloses a wafer packaging conductor frame and a wafer packaging structure which uses the conductor frame. The conductor frame comprises a plurality of first side pins and a plurality of second side pins; wherein, the first side pins extend internally with a plurality of first kin internal pins from the first sides; the second side pins extend internally with a plurality of second kin internal pins from the second sides; internal ends of the first kink internal pins and the second kink internal pins face a third side and are connected to the conductor frame. Therefore, the first side pins and the second side pins can have symmetrical lengths without long side suspension ends and can be suitable for sticking and fixing wafers with single side welding pads.
Description
Technical field
The present invention relates to a kind of lead frame of wafer package, particularly relate to a kind of lead frame and wafer packaging construction thereof of single lateral weld mat beat lines wafer encapsulation.
Background technology
Lead frame (leadframe) is the pin with a plurality of metal materials, in order to electrical transmission wafer signal.At a kind of known lead frame framework, pin more can replace wafer holder (die pad) and paste solid purposes so that wafer to be provided.In addition, at the bond pad locations difference of wafer, the pin configuration of lead frame also need be done difform to change.Usually the lead frame that wafer was suitable for that has peripheral weld pad is to have a wafer holder, for sticking brilliant.The lead frame that wafer was suitable for central welding pad is with the stickup as wafer of the interior pin that extends.Yet the weld pad configuration of known a kind of wafer is to be one-sided limit, and its pin of the lead frame that is suitable for is asymmetric length, and the problem of supportive deficiency is arranged easily.
See also shown in Figure 1ly, a kind of existing known wafer packaging construction is to be applicable to that encapsulation has the wafer of one-sided weld pad.Fig. 1 is the schematic cross-section for this wafer packaging construction, and Fig. 2 is for having the wafer schematic diagram of one-sided weld pad, and Fig. 3 is the schematic diagram in an adhesive area of the lead frame with asymmetric pin for existing known wafer packaging construction.Known wafer packaging construction be should have now, a plurality of first side pins 110 of a lead frame and a wafer 210 and the adhesive body 220 that a plurality of second side pins 120, have one-sided weld pad 211 consisted predominantly of.Wherein, those first side pins 110 on length be with those second side pins 120 for asymmetric, its long design is in order to this wafer 210 that is sticked.
See also shown in Figure 2ly, the one-sided weld pad 211 of those of this wafer 210 is the wherein sides that are arranged in an active surface of this wafer 210.Please cooperate and consult shown in Figure 1ly, when this wafer 210 is attached to those first side pins 110, can utilize a plurality of bonding wires 230 that those one-sided weld pads 211 are electrically connected to the interior pin 111 of those first side pins 110 and the interior pin 121 of those second side pins 120.And this adhesive body 220 is the interior pin 111 of this wafer 210 of sealing, those first side pins 110 and the interior pin 121 and those bonding wires 230 of those second side pins 120.
See also shown in Figure 3ly, those first side pins 110 of a lead frame 100 are the interior pins 111 that have in an adhesive area, and those second side pins 120 are the interior pins 121 that have in an adhesive area.Wherein, the interior pin 111 of those first side pins 110 is interior pins 121 of being longer than those second side pins 120, and is hanging shape, and lacks enough supports with fixing.Form in the processing procedure of those bonding wires 230 at routing, those first side pins 110 can have the problem that routing rocks.Form in the processing procedure of this adhesive body 220 in the mould envelope, can have the sealing displacement problem of this wafer 210.
This shows that above-mentioned existing lead frame and wafer packaging construction thereof obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.For solving the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found lead frame and wafer packaging construction thereof that a kind of novel single lateral weld mat beat lines wafer encapsulates, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing lead frame and wafer packaging construction thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding lead frame and the wafer packaging construction thereof that a kind of novel single lateral weld mat beat lines wafer encapsulates, can improve general existing lead frame and wafer packaging construction thereof, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing lead frame and wafer packaging construction thereof exist, and provide a kind of lead frame of wafer package of new structure, technical problem to be solved is to make it can solve the existing known wafer with one-sided side weld pad to be attached at the caused routing of unsettled long side pin and to rock problem with the sealing displacement, thereby is suitable for practicality more.
Of the present invention time a purpose is that a kind of lead frame of wafer package of new structure is provided, and technical problem to be solved is to make it can attach and support larger sized wafer with one-sided side weld pad, thereby is suitable for practicality more.
Another object of the present invention is to, a kind of wafer packaging construction of novel this lead frame of use is provided, technical problem to be solved is to make it can solve the existing known wafer with one-sided side weld pad to be attached at the caused routing of unsettled long side pin and to rock problem with the sealing displacement, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.The lead frame of a kind of wafer package that proposes according to the present invention, in an encapsulation unit, define one first side, one second side and one the 3rd side, wherein first side is parallel with second side, the 3rd side is to be formed between first side and second side, this lead frame comprises: a plurality of first side pins, and it is to be provided with pin in a plurality of first bendings by first side toward interior extension; And a plurality of second side pins, it is to be provided with pin in a plurality of second bendings by second side toward interior extension; Wherein, the inner of the inner of pin and the interior pin of those second bendings is towards the 3rd side and is connected to this lead frame in those first bendings.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The lead frame of aforesaid wafer package, the inner of the inner of pin and the interior pin of those second bendings is to be connected to the moulding of this lead frame between two siding tracks in wherein said those first bendings.
The lead frame of aforesaid wafer package, the inner of pin is to be formed as one with the inner to being connected of this moulding of the interior pin of those second bendings in wherein said those first bendings.
The lead frame of aforesaid wafer package, but the inner of pin is that one is connected to this lead frame in the inner of the interior pin of wherein said those first bendings and those second bendings.
The lead frame of aforesaid wafer package, it can include a paster in addition, with the inner of the inner of connecting pin in those first bendings and the interior pin of those second bendings to this lead frame.
The lead frame of aforesaid wafer package, pin can respectively have the horizontal inflection point of two about 45 degree in wherein said each first or second bending.
The lead frame of aforesaid wafer package, in wherein said those first bendings in pin and those second bendings pin be to can be copline and do not have and to bend.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of wafer packaging construction according to the present invention's proposition, its comprise a wafer, an adhesive body and as a plurality of first side pins and a plurality of second side pin of the described lead frame of above-mentioned technical scheme, wherein this wafer is to have a plurality of one-sided weld pads, and it is towards the 3rd side.
The object of the invention to solve the technical problems also can be further achieved by the following technical measures.Aforesaid wafer packaging construction, it includes a plurality of bonding wires in addition, and it is to electrically connect those one-sided weld pads to the inner of the interior pin of those first bendings and the inner of the interior pin of those second bendings.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, the invention provides a kind of lead frame of wafer package, be in an encapsulation unit, to define one first side, one second side and one the 3rd side, wherein first side is parallel with second side, the 3rd side is to be formed between first side and second side, and this lead frame is to comprise a plurality of first side pins and a plurality of second side pin.This first side pin is to be extended with pin in a plurality of first bendings toward in by first side.Those second side pins are to be extended with pin in a plurality of second bendings toward in by second side.Wherein, the inner of the inner of pin and the interior pin of those second bendings is towards the 3rd side and is connected to this lead frame in those first bendings.The present invention has also disclosed a kind of wafer packaging construction that uses this lead frame in addition.
By technique scheme, the lead frame and the wafer packaging construction thereof of single lateral weld mat beat lines wafer encapsulation of the present invention have following advantage at least:
1, the lead frame of wafer package of the present invention can solve the existing known wafer with one-sided side weld pad and be attached at the caused routing of unsettled long side pin and rock problem with the sealing displacement, is very suitable for practicality.
2, the lead frame of wafer package of the present invention, it can attach and support larger sized wafer with one-sided side weld pad, thereby is suitable for practicality more.
3, wafer packaging construction of the present invention can solve the existing known wafer with one-sided side weld pad and be attached at the caused routing of unsettled long side pin and rock problem with the sealing displacement, is very suitable for practicality.
In sum, the invention relates to a kind of lead frame and wafer packaging construction thereof of single lateral weld mat beat lines wafer encapsulation, the wafer packaging construction that has disclosed a kind of lead frame of wafer package and used this lead frame.This lead frame comprises a plurality of first side pins and a plurality of second side pin.This first side pin is to be extended with pin in a plurality of first bendings toward in by one first side.Those second side pins are to be extended with pin in a plurality of second bendings toward in by one second side.Wherein, the inner of the inner of pin and the interior pin of those second bendings is towards the 3rd side and is connected to this lead frame in those first bendings.Therefore, those first side pins can reach the length symmetry and not have long side free end with those second side pins, and go for pasting the wafer that has one-sided weld pad admittedly.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing lead frame and wafer packaging construction thereof have the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is a kind of schematic cross-section that has known wafer packaging construction now.
Fig. 2 is the wafer schematic diagram with one-sided weld pad that has known wafer packaging construction now.
Fig. 3 is the schematic diagram of the lead frame with asymmetric pin in an adhesive area of existing known wafer packaging construction.
Fig. 4 is according to first specific embodiment of the present invention, a kind of lead frame schematic diagram of single lateral weld mat beat lines wafer encapsulation.
Fig. 5 is according to first specific embodiment of the present invention, the local enlarged diagram of this lead frame behind sticking brilliant also routing.
Fig. 6 is according to first specific embodiment of the present invention, uses the schematic cross-section of a wafer packaging construction of this lead frame.
Fig. 7 is according to second specific embodiment of the present invention, the lead frame schematic diagram of another kind of single lateral weld mat beat lines wafer encapsulation.
100: 110: the first side pins of lead frame
111: 120: the second side pins of interior pin
121: interior pin 210: wafer
211: one-sided weld pad 220: adhesive body
230: bonding wire 300: lead frame
302: the second sides of 301: the first sides
305: 310: the first side pins of moulding
313: 320: the second side pins in horizontal inflection point
323: horizontal inflection point 410: wafer
411: one-sided weld pad 420: adhesive body
430: bonding wire 500: lead frame
502: the second sides of 501: the first sides
Side 504 in 503: the three: siding track
Pin in the bending in 511: the first of 510: the first side pins
512: inner 513: horizontal inflection point
Pin in the bending in 521: the second of 520: the second side pins
522: inner 523: horizontal inflection point
530: paster
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, lead frame and its embodiment of wafer packaging construction, structure, feature and the effect thereof of the single lateral weld mat beat lines wafer encapsulation that foundation the present invention is proposed, describe in detail as after.
According to first specific embodiment of the present invention, disclose a kind of lead frame of wafer package.Fig. 4 is the structural representation for this lead frame, and Fig. 5 is the local enlarged diagram of this lead frame behind sticking brilliant also routing, and Fig. 6 is the schematic cross-section for a wafer packaging construction that uses this lead frame.
See also shown in Figure 4, this lead frame 300 is to define one first side 301, one second side 302 and one the 3rd side 303 in an encapsulation unit, wherein, first side 301 is parallel with second side 302, and the 3rd side 303 is to be formed between first side 301 and second side 302.
This lead frame 300 is to comprise a plurality of first side pins 310 and a plurality of second side pin 320.This first side pin 310 is to be extended with a plurality of first by first side 301 toward in to bend interior pin 311.Those second side pins 320 are to be extended with a plurality of second by second side 302 toward in to bend interior pin 321.Wherein, in those first bendings in the inners 312 of pin 311 and those second bendings the inners 322 of pin 321 be towards the 3rd side 303 and be connected to this lead frame 300, do not rock and problem such as sealing displacement so in the processing procedure of wafer package, can not have the routing of the unsettled inner generation of existing known long side pin.In the present embodiment, this lead frame 300 is to be siding track 304 (side rail) in the outside of first side 301 and second side 302, and the outermost that promptly is lead frame 300 is than long side, for transmission.Be to form to be provided with a plurality of mouldings 305 between both sides siding track 304, to separate encapsulation unit.In different embodiment, this lead frame 300 is the outside of first side 301 and second side 302 or can be the moulding of lead frame.
More specifically, the inner 322 of pin 321 in the inner 312 of pin 311 and those second bendings is to be connected to the moulding 305 of this lead frame 300 between two siding tracks 304 in those first bendings.Preferably, be to be formed as one by the inner 312 of the interior pin 311 of those first bendings and the inner 322 to being connected of this moulding 305 of the interior pin 321 of those second bendings, to reach integrally formed and to save cost.So the inner 322 of pin 321 is but that one is connected to this lead frame in the inner 312 of the interior pin 311 of those first bendings and those second bendings.
Please consult shown in Figure 4 again, pin 311,321 in this each first or second bending, the horizontal inflection point 313,323 that can respectively have two about 45 degree, so that the inner 312 of pin 311 is arranged in same the 3rd side 303 with those second the inners 322 that bend interior pin 321 in those first bendings, and can reduce the effect of parasitic capacitance.In addition, please cooperate consult shown in Figure 6, in those first bendings in pin 311 and those second bendings pin 321 be to can be copline and need not bending.
Therefore, lead frame 300 of the present invention has the wafer of one-sided side weld pad applicable to encapsulation, has solved routing that wafer that existing known encapsulation has one-sided weld pad produces and has rocked problem (being detailed later) with the sealing displacement.See also shown in Figure 6, a kind of wafer 410 packaging structures that use this lead frame, mainly comprise a wafer 410, an adhesive body 420 and a plurality of first side pins 310 and the second side pin 320 of this lead frame as previously mentioned, wherein, this wafer 410 is to have a plurality of one-sided weld pads 411, and it is towards the 3rd side 303 (as shown in Figure 5).These wafer 410 packaging structures include a plurality of bonding wires 430 in addition, and it is that those one-sided weld pads 411 of electric connection are to the inner 312 of the interior pin 311 of those first bendings and the inner 322 of the interior pin 321 of those second bendings.As shown in Figure 5, in the routing process, the inners 322 of the inner 312 of pin 311 and the interior pin 321 of those second bendings still are connected to the moulding 305 of this lead frame 300 in those first bendings, those bonding wires 430 do not have unsettled problem of rocking, so can firmly be bonded on the inner 312 of pin 311 in those first bendings and the inner 322 of the interior pin 321 of those second bendings.In addition, form in the process of this adhesive body 420 in the mould envelope, the inner 322 of pin 321 is still the moulding 305 that is connected to this lead frame 300 in the inner 312 of the interior pin 311 of those first bendings and those second bendings, and does not have the problem of wafer 410 displacements.
Seeing also shown in Figure 7ly, is according to second specific embodiment of the present invention, the lead frame schematic diagram of another kind of single lateral weld mat beat lines wafer encapsulation.According to second specific embodiment of the present invention, Fig. 7 has disclosed the lead frame schematic diagram of another kind of wafer package.This lead frame 500 is to define one first side 501, one second side 502 and one the 3rd side 503 in an encapsulation unit, and wherein first side 501 is parallel with second side 502, and the 3rd side 503 is to be formed between first side 501 and second side 502.
This lead frame 500 is to comprise a plurality of first side pins 510 and a plurality of second side pin 520.This first side pin 510 is to be extended with a plurality of first by first side 501 toward in to bend interior pin 511.Those second side pins 520 are to be extended with a plurality of second by second side 502 toward in to bend interior pin 521.Wherein, in those first bendings in the inners 512 of pin 511 and those second bendings the inners 522 of pin 521 be towards the 3rd side 503 and be connected to this lead frame 500, do not rock and problem such as sealing displacement so in wafer encapsulation procedure, do not have the routing of the unsettled inner generation of existing known long side pin.This lead frame 500 can include a paster 530 in addition, as pi adhesion film, with the inner 522 of pin 521 in the inner 512 of connecting pin 511 in those first bendings and those second bendings to this lead frame 500.Therefore, can solve existing known wafer with one-sided side weld pad is attached at the caused routing of unsettled long side pin and rocks problem with the sealing displacement.In addition, in the present embodiment, this lead frame 500 is to be siding track 504 (siderail) in the outside of first side 501 and second side 502, and the outermost that promptly is lead frame 500 is than long side, for transmission.
Please consult shown in Figure 7 again, pin 511,521 in this each first or second bending, the horizontal inflection point 513,523 that can respectively have two about 45 degree, so that the inner of pin 512 is arranged in same the 3rd side 503 in the inner of the interior pin 511 of those first bendings and those second bendings, and can reduce the effect of parasitic capacitance.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (9)
1. the lead frame of a wafer package defines one first side, one second side and one the 3rd side in an encapsulation unit, and wherein first side is parallel with second side, and the 3rd side is to be formed between first side and second side, it is characterized in that this lead frame comprises:
A plurality of first side pins, it is to be provided with pin in a plurality of first bendings by first side toward interior extension; And
A plurality of second side pins, it is to be provided with pin in a plurality of second bendings by second side toward interior extension;
Wherein, the inner of the inner of pin and the interior pin of those second bendings is towards the 3rd side and is connected to this lead frame in those first bendings.
2. the lead frame of wafer package according to claim 1 is characterized in that the inner of pin in wherein said those first bendings and the inner of the interior pin of those second bendings are to be connected to the moulding of this lead frame between two siding tracks.
3. the lead frame of wafer package according to claim 2 is characterized in that the inner of pin in wherein said those first bendings and those second the inner to being connected of this moulding that bend interior pin are to be formed as one.
4. the lead frame of wafer package according to claim 1 is characterized in that the inner of pin in wherein said those first bendings and the inner of the interior pin of those second bendings are that one is connected to this lead frame.
5. the lead frame of wafer package according to claim 1 is characterized in that it includes a paster in addition, with the inner of the inner of connecting pin in those first bendings and the interior pin of those second bendings to this lead frame.
6. the lead frame of wafer package according to claim 1 is characterized in that pin respectively has two the about 45 horizontal inflection points of spending in wherein said each first or second bending.
7. the lead frame of wafer package according to claim 1 is characterized in that pin is not have the bending of sinking for copline in the wherein said interior pin of those first bendings and those second bendings.
8. wafer packaging construction, it is characterized in that a plurality of first side pins and a plurality of second side pin that it comprises a wafer, an adhesive body and lead frame as claimed in claim 1, wherein this wafer is to have a plurality of one-sided weld pads, and it is towards the 3rd side.
9. wafer packaging construction according to claim 8 is characterized in that it includes a plurality of bonding wires in addition, and it is to electrically connect those one-sided weld pads to the inner of the interior pin of those first bendings and the inner of the interior pin of those second bendings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610167814 CN101202264A (en) | 2006-12-14 | 2006-12-14 | Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610167814 CN101202264A (en) | 2006-12-14 | 2006-12-14 | Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN101202264A true CN101202264A (en) | 2008-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200610167814 Pending CN101202264A (en) | 2006-12-14 | 2006-12-14 | Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
| CN114972505A (en) * | 2022-04-29 | 2022-08-30 | 弥费实业(上海)有限公司 | Position recognition system |
-
2006
- 2006-12-14 CN CN 200610167814 patent/CN101202264A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
| CN114972505A (en) * | 2022-04-29 | 2022-08-30 | 弥费实业(上海)有限公司 | Position recognition system |
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