CN204144251U - A kind of LED lamp bead of multifaceted light-emitting - Google Patents
A kind of LED lamp bead of multifaceted light-emitting Download PDFInfo
- Publication number
- CN204144251U CN204144251U CN201420410668.9U CN201420410668U CN204144251U CN 204144251 U CN204144251 U CN 204144251U CN 201420410668 U CN201420410668 U CN 201420410668U CN 204144251 U CN204144251 U CN 204144251U
- Authority
- CN
- China
- Prior art keywords
- led chip
- chip
- electrode
- hole
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011324 bead Substances 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
A kind of LED lamp bead of multifaceted light-emitting, comprising can two electrode pins of straight cutting and LED chip, one or two in electrode pins is the support of fixed L ED chip, through hole or breach is had at the electrode pins epimere of fixed chip, LED chip sets up and is fixed on through hole or breach, LED chip electrode is connected and stent electrode conducting with the solder joint on support by bonding wire, or realize the connection between each LED chip by bonding wire between chip, and then weld conducting with the solder joint of stent electrode, or with conducting resinl directly by bonding with support for chip electrode conducting.Further, also can be fixed L ED chip on patch type bracket, support arranges through-hole structure.The LED lamp bead of the utility model design is can the encapsulating structure of multifaceted light-emitting, can directly grafting or be welded on wiring board, and application facilitates.
Description
Technical field
The utility model relates to LED field, belongs to multifaceted light-emitting LED lamp bead particularly.
Background technology
Penetrate luminescence bottom lamp pearl straight cutting in industry or all very difficult realization of paster, the utility model achieves.
Summary of the invention
In order to solve the problem, the technical scheme of employing of the present utility model is as follows:
One: a kind of LED lamp bead of multifaceted light-emitting, comprising can two electrode pins of straight cutting and LED chip, one or two in electrode pins is the support of fixed L ED chip, through hole or breach is had at the electrode pins epimere of fixed chip, LED chip sets up and is fixed on through hole or breach, LED chip electrode is connected and stent electrode conducting with the solder joint on support by bonding wire, or realize the connection between each LED chip by bonding wire between chip, and then weld conducting with the solder joint of stent electrode, or with conducting resinl directly by bonding with support for chip electrode conducting.
Wherein, LED chip length is greater than the width of through hole or breach, LED chip two ends by crystal-bonding adhesive hydropexis in through hole or breach edge, die bond glue be conduction or nonconducting.
Its two: a kind of LED lamp bead of multifaceted light-emitting, comprise LED chip and there is the patch type bracket of pad, through hole is had bottom carrier cup, LED chip sets up and is fixed on through hole, LED chip electrode is connected with the pad on support by bonding wire, or the upside-down mounting of LED chip electrode is bonded in conducting on two solder joints, after packaging plastic encapsulation, namely form the LED lamp bead of SMD multifaceted light-emitting.
Wherein, LED chip length is greater than entire widths, LED chip two ends by crystal-bonding adhesive hydropexis in through hole edge, die bond glue be conduction or nonconducting.
The LED lamp bead of the utility model design is can the encapsulating structure of multifaceted light-emitting, can directly grafting or be welded on wiring board, and application facilitates.
Accompanying drawing explanation
Fig. 1 is that the utility model can directly be plugged in structural representation on wiring board.
Fig. 2 is that the utility model can be directly welded in structural representation on wiring board.
Embodiment
In order to allow those skilled in the art understand the technical solution of the utility model better, below in conjunction with accompanying drawing, the utility model is further elaborated.
Be the LED lamp bead of direct insertion multifaceted light-emitting as shown in Figure 1, this LED lamp bead comprises can two electrode pins 1 of straight cutting and LED chip 2, and one simultaneously in electrode pins 1 is the support of fixed L ED chip 2.Have through hole 11 at the electrode pins epimere of fixed chip, LED chip sets up and is fixed on through hole, and certainly, LED chip length need be greater than the width of through hole, and crystal-bonding adhesive hydropexis is passed through in through hole edge in LED chip two ends.LED chip electrode is connected and stent electrode conducting with the solder joint on support by bonding wire, the connection in series-parallel simultaneously realized between each LED chip by bonding wire connects, and then weld conducting with the solder joint of stent electrode, at electrode pins epimere encapsulation glue, LED chip and two electrode pins are packaged as a whole.Except adopting bonding wire welding conducting, also can with conducting resinl directly by bonding with support for chip electrode conducting.
During making, first electrode pins is made, and through hole is gone out with mould in electrode pins, then by LED core horse die bond bonding wire on through hole, finally die bond and the good electrode pins of bonding wire and an other pole electrode pins being poured into fills in the die hole of glue, is heating and curing, finally demould, continue again to be heating and curing, form the LED lamp bead of multifaceted light-emitting.Such LED lamp bead can multiplely make when making simultaneously, and then cross cutting separately.
In aforesaid way, two electrode pins also all can arrange through hole and fixed L ED chip.Above-mentioned through hole also can be the breach being arranged at electrode pins side, and LED chip is set up on breach, can form the LED lamp bead of multifaceted light-emitting equally.The die bond glue that the utility model adopts can be conduction, also can be nonconducting.
For another example the attached LED lamp bead of SMD multifaceted light-emitting that Figure 2 shows that under the utility model design, this LED lamp bead comprises the patch type bracket 1 and LED chip 2 with two pads 11, support 1 has through hole between two pads, LED chip sets up and is fixed on through hole 12, certainly, LED chip length is greater than entire widths, and crystal-bonding adhesive hydropexis is passed through in through hole edge in LED chip electrode two ends.LED chip electrode is connected with the pad on support by bonding wire, after packaging plastic encapsulation, namely forms the LED lamp bead of SMD multifaceted light-emitting.In addition, this LED chip also can be flip-chip fashion and is installed on support 1, and namely the light-emitting area of LED chip and solder joint are towards bracket side, then after packaging plastic encapsulation, namely forms the LED lamp bead of SMD multifaceted light-emitting.
The die bond glue that the utility model adopts can be conduction, also can be nonconducting
The LED lamp bead of above-mentioned SMD multifaceted light-emitting can make in the following way: first make patch type bracket, aim at laser-beam drilling machine and between two pads, LED chip position is installed and gets through hole, then conventional LED chip encapsulation flow process is adopted to carry out die bond bonding wire, or by LED core horse on through hole after die bond, namely bonding wire encapsulation becomes the LED lamp bead of multifaceted light-emitting.
The above is better embodiment of the present utility model, not does any pro forma restriction to the utility model.It should be noted that; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change and are out of shape the protection range that all should belong to the claim appended by the utility model.
Claims (4)
1. the LED lamp bead of a multifaceted light-emitting, comprising can two electrode pins (1) of straight cutting and LED chip (2), it is characterized in that, one or two in electrode pins is the support of fixed L ED chip, through hole or breach is had at the electrode pins epimere of fixed chip, LED chip sets up and is fixed on through hole or breach, LED chip electrode is connected and stent electrode conducting with the solder joint on support by bonding wire, or realize the connection between each LED chip by bonding wire between chip, and then weld conducting with the solder joint of stent electrode, or with conducting resinl directly by bonding with support for chip electrode conducting.
2. the LED lamp bead of multifaceted light-emitting according to claim 1, is characterized in that, LED chip length is greater than the width of through hole or breach, LED chip two ends by crystal-bonding adhesive hydropexis in through hole or breach edge, die bond glue be conduction or nonconducting.
3. the LED lamp bead of a multifaceted light-emitting, comprise LED chip (2) and there is the patch type bracket (1) of pad (11), it is characterized in that, through hole is had bottom carrier cup, LED chip sets up and is fixed on through hole, and LED chip electrode is connected with the pad on support by bonding wire, or the upside-down mounting of LED chip electrode is bonded in conducting on two solder joints, after packaging plastic encapsulation, namely form the LED lamp bead of SMD multifaceted light-emitting.
4. the LED lamp bead of multifaceted light-emitting according to claim 3, is characterized in that, LED chip length is greater than entire widths, LED chip two ends by crystal-bonding adhesive hydropexis in through hole edge, die bond glue be conduction or nonconducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420410668.9U CN204144251U (en) | 2014-07-24 | 2014-07-24 | A kind of LED lamp bead of multifaceted light-emitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420410668.9U CN204144251U (en) | 2014-07-24 | 2014-07-24 | A kind of LED lamp bead of multifaceted light-emitting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204144251U true CN204144251U (en) | 2015-02-04 |
Family
ID=52420918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420410668.9U Expired - Fee Related CN204144251U (en) | 2014-07-24 | 2014-07-24 | A kind of LED lamp bead of multifaceted light-emitting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204144251U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725202A (en) * | 2021-08-18 | 2021-11-30 | 东莞中之科技股份有限公司 | Flip-chip exempts from bonding wire to dazzle various luminous LED lamp pearl packaging structure able to programme |
-
2014
- 2014-07-24 CN CN201420410668.9U patent/CN204144251U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725202A (en) * | 2021-08-18 | 2021-11-30 | 东莞中之科技股份有限公司 | Flip-chip exempts from bonding wire to dazzle various luminous LED lamp pearl packaging structure able to programme |
| CN113725202B (en) * | 2021-08-18 | 2023-11-14 | 东莞中之科技股份有限公司 | Flip bonding wire-free programmable colorful luminous LED lamp bead packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 |