CN204029847U - A kind of LED module COB encapsulating structure - Google Patents
A kind of LED module COB encapsulating structure Download PDFInfo
- Publication number
- CN204029847U CN204029847U CN201420179644.7U CN201420179644U CN204029847U CN 204029847 U CN204029847 U CN 204029847U CN 201420179644 U CN201420179644 U CN 201420179644U CN 204029847 U CN204029847 U CN 204029847U
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- China
- Prior art keywords
- injecting glue
- substrate
- encapsulating structure
- led module
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 238000012536 packaging technology Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 206010073753 Fear of injection Diseases 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The utility model discloses a kind of LED module COB encapsulating structure, comprise the substrate 11 that is provided with hole for injecting glue 12: be arranged at the light source 14 on described substrate 11; Be arranged on described substrate 11 and provide the line layer 13 of line for described light source 14; Inject fluorescent glue by described hole for injecting glue 12, solidify the fluorescent colloid 15 obtaining.This COB encapsulating structure, because chip is directly to encapsulate on substrate, has saved the supporting structure layer in SMD, so corresponding thermal resistance is low, thermal diffusivity is good, and encapsulation and application cost and SMD are also lower.And cost is also lower, and be also more to simplify than traditional COB encapsulation production process, cost also reduces.
Description
Technical field
The utility model relates to LED module encapsulation technology field, relates in particular a kind of LED module COB encapsulating structure.
Background technology
Existing LED main flow is packaged with SMD (surface attaching type, Surface Mounted Devices) encapsulation mode and COB (chip on board encapsulation, Chip on Board) encapsulation mode, SMD packaging thermal resistance is large, and poor radiation, there is glare problem, in the time of application end, device need to be attached on fixing substrate, can only be applied to the less demanding lighting field of properties of product.
COB encapsulation is packaged with certain performance boost and cost advantage with respect to SMD, and cost performance is more outstanding, has rejected support concept, without Reflow Soldering, without paster operation, has also avoided the glare problem in application simultaneously.But need to have box dam technique in the technique of COB encapsulation, this production process is more loaded down with trivial details, and automaticity is very low again, drop into manpower comparing more, and yields control is more difficult, therefore the manufacturing cost of COB is relatively high.
In sum, how providing a kind of encapsulating structure of COB is cheaply the problem that those skilled in the art need solution badly.
Utility model content
In view of this, the utility model provides a kind of LED module COB encapsulating structure, comprising:
Be provided with the substrate of hole for injecting glue:
Be arranged at the light source on described substrate;
Be arranged on described substrate and provide the line layer of line for described light source;
Inject fluorescent glue by described hole for injecting glue, solidify the fluorescent colloid obtaining.
Preferably, in above-mentioned LED module COB encapsulating structure, the number of described hole for injecting glue is 2.
Preferably, in above-mentioned LED module COB encapsulating structure, described fluorescent colloid is the mixture of fluorescent material and glue.
Known via above-mentioned technical scheme, compared with prior art, the utility model openly provides a kind of LED module COB encapsulating structure, this structure is aborning without box dam, first on substrate, carry out die bond bonding wire, then die bond bonding wire substrate is after overbaking dehumidifying, be fixed on injecting glue bed die, fixing firm and solid by fixed sleeve part, with preventing from cementing leakage, injecting glue bed die is sprayed and is coated with release agent so that prevent cannot be from mould at material loading front surface, dehumidifying is in hot briquetting, to produce bubble for fear of injection molding colloid, use accurate injecting glue syringe needle align substrates back side hole for injecting glue injecting glue, injecting glue base plate Automatic-heating after injecting glue completes, colloid solidification after 1～3 minute, final substrate is from mold forming.
The utility model is by using the COB technique of injection molded encapsulated moulding, box dam and the sealing link of traditional COB packaging technology are improved, reject box dam technique, directly use the moulding of mould injecting glue, so have substantial degradation on cost, allow LED module COB encapsulation step major step towards inexpensive direction.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is LED module COB encapsulating structure schematic diagram of the present utility model;
Fig. 2 accompanying drawing is the S1 step of LED module COB packaging technology of the present utility model;
Fig. 3 accompanying drawing is the S2 step of LED module COB packaging technology of the present utility model;
Fig. 4 accompanying drawing is the S3 step of LED module COB packaging technology of the present utility model;
Fig. 5 accompanying drawing is the S4 step of LED module COB packaging technology of the present utility model;
In Fig. 1-Fig. 4: 11 is that substrate, 12 is that hole for injecting glue, 13 is that line layer, 14 is that light source, 15 is fluorescent colloid; 21 is injecting glue bed die; 22 is injecting glue syringe needle.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1:
The utility model provides a kind of LED module COB encapsulating structure of being made by the utility model technique, comprising:
Be provided with the substrate 11 of hole for injecting glue 12:
Be arranged at the light source 14 on substrate 11;
Be arranged on substrate 11 and provide the line layer 13 of line for light source 14;
Inject fluorescent glue by described hole for injecting glue 12, solidify the fluorescent colloid 15 obtaining.
Please refer to Fig. 2-Fig. 5:
The encapsulating structure of the present embodiment in production technology without box dam, first on substrate 11, carry out die bond bonding wire, then die bond bonding wire substrate 11 is after overbaking dehumidifying, be fixed on injecting glue bed die 21, fixing firm and solid by fixed sleeve part, with preventing from cementing leakage, injecting glue bed die 21 is sprayed and is coated with release agent so that prevent cannot be from mould at material loading front surface, dehumidifying is in hot briquetting, to produce bubble for fear of injection molding colloid, use accurate injecting glue syringe needle 22 align substrates back side hole for injecting glue 12 injecting glues, injecting glue base plate Automatic-heating after injecting glue completes, colloid solidification after 1～3 minute, final substrate 11 is from mold forming.
This COB encapsulating structure, because chip is directly encapsulation on substrate 11, has saved the supporting structure layer in SMD, so corresponding thermal resistance is low, thermal diffusivity is good, and encapsulation and application cost and SMD are also lower.And cost is also lower, and be also more to simplify than traditional COB encapsulation production process, cost also reduces.
In order further to optimize technique scheme, the number of hole for injecting glue 12 is 2.2 hole for injecting glue 12 can make the fluorescent colloid forming in injecting glue process evenly spread, and there will not be textural anomaly; And efficiency is also improved.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates referring to method part.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. a LED module COB encapsulating structure, is characterized in that, comprising:
Be provided with the substrate (11) of hole for injecting glue (12):
Be arranged at the light source (14) on described substrate (11);
Be arranged at that described substrate (11) is gone up and be the line layer (13) that described light source (14) provides line;
Inject fluorescent glue by described hole for injecting glue (12), solidify the fluorescent colloid (15) obtaining.
2. LED module COB encapsulating structure according to claim 1, is characterized in that, the number of described hole for injecting glue (12) is 2.
3. LED module COB encapsulating structure according to claim 1, is characterized in that, described fluorescent colloid (15) is the mixture of fluorescent material and glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420179644.7U CN204029847U (en) | 2014-04-15 | 2014-04-15 | A kind of LED module COB encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420179644.7U CN204029847U (en) | 2014-04-15 | 2014-04-15 | A kind of LED module COB encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204029847U true CN204029847U (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420179644.7U Expired - Lifetime CN204029847U (en) | 2014-04-15 | 2014-04-15 | A kind of LED module COB encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204029847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943756A (en) * | 2014-04-15 | 2014-07-23 | 深圳市晶台股份有限公司 | LED module COB packaging technology and structure |
-
2014
- 2014-04-15 CN CN201420179644.7U patent/CN204029847U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943756A (en) * | 2014-04-15 | 2014-07-23 | 深圳市晶台股份有限公司 | LED module COB packaging technology and structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141217 |
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| CX01 | Expiry of patent term |