CN202884530U - Light-emitting diode (LED) circuit module set - Google Patents
Light-emitting diode (LED) circuit module set Download PDFInfo
- Publication number
- CN202884530U CN202884530U CN2012203812252U CN201220381225U CN202884530U CN 202884530 U CN202884530 U CN 202884530U CN 2012203812252 U CN2012203812252 U CN 2012203812252U CN 201220381225 U CN201220381225 U CN 201220381225U CN 202884530 U CN202884530 U CN 202884530U
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- CN
- China
- Prior art keywords
- led
- circuit module
- cup
- circuit
- led circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model relates to a light-emitting diode (LED) circuit module set. Particularly, according to one side of the LED circuit module set, according to a circuit which needs to be designed, part metal of metal plates without any insulation support or metal stripes are selectively removed, and at the same time, pre-break connecting support position metal is reserved, and forms a cup-shaped support in an injection molding mode in a predetermined position, and then LED chips are sealed to form the LED module set with interconnection of a plurality of LEDs, the pre-break connecting support position metal which is not needed on the circuit is removed or turned off, and a plurality of LED circuit module sets are assembled into an LED lamp. The manufactured LED circuit module set is concise and short in manufacture step, a metal circuit does not need any insulating supporting carrier, and the LED circuit module set is good in heat dissipation, simple in structure, high in efficiency, and low in cost.
Description
Technical field
The utility model belongs to the LED application, is specifically related to the led circuit module.According to the utility model, available metallic plate or metal tape without any insulating supporting optionally removed unwanted part metals, keep simultaneously pre-connection breaking support level metal, form cup-shaped support and packaging LED chips in the direct injection moulding of design preposition, and form the interconnected led circuit module of a plurality of LED.
Background technology
The tradition led support all is the single led lamp that forms by injection moulding after metallic plate or the die-cut punching press of metal tape, and traditional LED module all is the bead weld of LED lamp to be connected on the wiring board or led chip is encapsulated in the circuit board formation with the mode of COB.
The utility model is optionally to remove unwanted part metals with metallic plate or metal tape without any insulating supporting, keep simultaneously pre-connection breaking support level metal, form cup-shaped support in the injection moulding of design preposition, then led chip is encapsulated in the cup-shaped support, forms two or more LED series connection or led circuit module in parallel, the series and parallel connections combination.The led circuit module that the utility model is made, metallic circuit be without the prop carrier of any insulation, good heat dissipation, and simple in structure, efficient is high, and cost is low.
Summary of the invention
Main design of the present utility model is, adopt not metallic plate or metal tape with any insulating supporting carrier, the circuit that designs as required, optionally remove unwanted part metals, keep simultaneously pre-connection breaking support level metal, form cup-shaped support in the injection moulding of design preposition, then led chip is encapsulated in the cup-shaped support, form the interconnected led circuit module of a plurality of LED, unwanted pre-connection breaking support level metal on removal or the disconnecting circuit is made into the LED light fixture with this a plurality of interconnected led circuit module group assemblings.
The led circuit module that the utility model is made, its manufacturing step is brief, and metallic circuit is without the prop carrier of any insulation, good heat dissipation, simple in structure, efficient is high, and cost is low.
In the utility model, " pre-connection breaking " refers to such connection, and it specially is arranged to can optionally keep according to the needs of circuit design or disconnect, so that different circuit arrangement to be provided." pre-connection breaking support level metal " refers to the pre-connection breaking support level metal that is formed by the circuit board metal material that keeps on the circuit board, and it specially is arranged to be used to provide " in advance connection breaking ".
More specifically, according to one side of the present utility model, a kind of led circuit module is provided, has comprised: removed unwanted part metals and keep pre-connection breaking support level metal and the blank circuit board that forms with optionally processing without the metallic plate of any insulating supporting or metal tape; Direct cup-shaped support in the injection mo(u)lding of the precalculated position of blank circuit board; Directly be encapsulated in the led chip in the cup-shaped support; Wherein, described pre-connection breaking support level metal can optionally be removed or disconnects according to circuit design in advance, thereby the led circuit module of the interconnected connection of two above LED is provided.
According to an embodiment of the present utility model, the interconnected connection of described LED is to be connected in series, to be connected in parallel, the combination that perhaps is connected in series and is connected in parallel.
According to an embodiment of the present utility model, also comprise the circuit surface that is arranged on described led circuit module so that described circuit surface needs the not capped resistance plating printing ink in the position of die bond nation line.
According to an embodiment of the present utility model, also comprise the periphery support that is retained on the blank circuit board.
According to an embodiment of the present utility model, described cup-shaped support is coated with is coated with silver coating, plating nickel gold layer or plating palladium layer.
According to an embodiment of the present utility model, described led circuit module also has the heat radiation branching carrier that sticks on the led circuit module.
According to an embodiment of the present utility model, the circuit of described blank circuit board is provided with and disconnects the position, and described cup-shaped support injection mo(u)lding forms cup at described disconnection position, so that the circuit of both sides, described disconnection position is inlayed and is fixed in the cup.
According to an embodiment of the present utility model, the circuit of both sides, described disconnection position partly is embedded in the cup, forms the electrode tie point so that the one side of circuit lead was exposed at the cup end of cup.
According to an embodiment of the present utility model, described led circuit module is for the led circuit module of making LED lamp band, LED Christmas lamp, LED neon light, LED fluorescent tube, LED panel light, LED ball bulb, LED corn lamp, LED Down lamp, LED shot-light, LED candle lamp, LED sign.
According to the utility model, also disclosed a kind of method of making the led circuit module, comprise: with metallic plate or the metal tape without any insulating supporting, optionally remove unwanted part metals according to circuit design in advance, and keep pre-connection breaking support level metal, thereby form the blank circuit board; Form cup-shaped support in the direct injection moulding of the preposition of blank circuit board; Led chip is encapsulated in the cup-shaped support; Wherein, optionally remove or disconnect pre-connection breaking support level metal on the circuit of blank circuit board according to circuit design in advance, thereby form the led circuit module of the interconnected connection of two above LED.
According to an embodiment of the present utility model, the interconnected connection of described LED is to be connected in series, to be connected in parallel, the combination that perhaps is connected in series and is connected in parallel.
According to an embodiment of the present utility model, resistance plating printing ink is set, to expose the position that needs die bond nation line on metallic circuit surface on the metallic circuit surface of described led circuit module.
According to an embodiment of the present utility model, also comprise, when forming the blank circuit board, keep peripheral the support.
According to an embodiment of the present utility model, described LED cup-shaped support is carried out silver-plated, plating nickel gold or plating palladium.
According to an embodiment of the present utility model, also comprise, directly the led circuit module is sticked on the heat radiation branching carrier and form the LED light fixture.
According to an embodiment of the present utility model, described cup-shaped support is injection-moulded in the disconnection position of circuit and forms cup, wherein, the circuit that disconnects the both sides, position is embedded in the cup and supported fixing.
According to an embodiment of the present utility model, the circuit that disconnects the both sides, position partly is embedded in the cup, so that the one side of circuit lead exposes at the cup end of cup, and forms the electrode tie point.
The led circuit module that the utility model is made, its manufacturing step is brief, and metallic circuit is without the prop carrier of any insulation, good heat dissipation, simple in structure, efficient is high, and cost is low.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is for to hold the metallic plate (or being called metal forming) of material or the schematic diagram of metal tape 1 successfully according to a kind of design.
Fig. 2 is for holding the metallic plate (or being called metal forming) of material or the schematic diagram of metal tape 1 successfully according to another kind design.
Fig. 3 keeps the schematic diagram of pre-connection breaking support level metal simultaneously for to remove unwanted part metals according to a kind of design.
Fig. 4 is that unwanted part metals is removed in design according to another kind, keeps simultaneously the schematic diagram of pre-connection breaking support level metal.
Fig. 5 is according to a kind of design, the schematic diagram after the preposition injection moulding forms cup-shaped support.
Fig. 6 is according to another kind design, the schematic diagram after the preposition injection moulding forms cup-shaped support.
Fig. 7 is according to a kind of design, the schematic diagram in cup-shaped support with led chip die bond and nation's line (wire bonding, or title wire bond).
Fig. 8 is according to the another kind design, with the schematic diagram of led chip die bond nation line in cup-shaped support.
Fig. 9 is according to a kind of design, with the schematic diagram of die bond nation line after the encapsulation of the led chip in cup-shaped support sealing.
Figure 10 is according to the another kind design, with the schematic diagram of die bond nation line after the encapsulation of the led chip in cup-shaped support sealing.
Figure 11 is according to a kind of design, the unwanted pre-connection breaking strong point on removal or the disconnecting circuit plate, a kind of led circuit module schematic diagram of formation.
Figure 12 is the schematic cross-section of Figure 11.
Figure 13 is according to another kind design, the unwanted pre-connection breaking strong point on removal or the disconnecting circuit plate, a kind of led circuit module schematic diagram of formation.
Figure 14 is the schematic cross-section of Figure 13.
The specific embodiment
The below will be described in more detail the specific embodiment of a kind of led circuit module of the utility model.
But these specific embodiments only play and specify and demonstrate effect of the present utility model, to scope of the present utility model without any restriction.Protection domain of the present utility model is only limited by claims.
Dimensional data according to design, metallic plate (or being called metal forming) or metal tape 1, for example copper strips opened expect into such as Fig. 1 or the size of profile as shown in Figure 2, optionally cut away the unwanted part metals of circuit with pre-designed mould, keep and connect support level metal 3 and peripheral support 4, circuit 2 is not scattered, unshift, obtain the circuit board (Fig. 3 is the schematic diagram of making the different contour structures that obtain according to two kinds of different design datas with Fig. 4) that connects support level that has as shown in Figure 3, Figure 4.Those skilled in the art will appreciate that this circuit is made also can adopt the method for traditional chemical etching to obtain.
The circuit board printing resistance plating printing ink that connects support level that has as shown in Figure 3, Figure 4 exposed the position that needs die bond nation line, with 120 ℃ to 150 ℃ baking-curings 5 to 10 minutes.Plate printing ink in the another side brush resistance of circuit board again, with 120 ℃ to 150 ℃ baking-curings 5 to 10 minutes, then need the position of die bond nation line to carry out silver-plated processing to exposing, circuit board after the silver-plated processing is inserted in the injection mold of injection machine, inject raw material, form cup-shaped support 5 (such as Fig. 5, shown in Figure 6, wherein Fig. 5 is the schematic diagram of making the different contour structures that obtain according to two kinds of different design datas with Fig. 6) in the injection moulding of design preposition.
Drip bonded adhesives → paste in the position of dripping bonded adhesives led chip 6 and oven dry at the cup end of cup-shaped support 5, and then fixed (bonding) led chip 6 of nation is (such as Fig. 7, shown in Figure 8) (Fig. 7 is the schematic diagram of making the different structure that obtains according to two kinds of different design datas with Fig. 8) → test-based examination → seal up encapsulation to use glue 7 (such as Fig. 9, shown in 10) unwanted pre-connection breaking support level metal 3 and peripherally support 4 on (Fig. 9 and Figure 10 are the schematic diagrames of making the different structure that obtains according to two kinds of different design datas) → solidify → rear curing → test → remove or the disconnecting circuit, form the led circuit module of various designs (such as Figure 11,12,13, shown in 14.Wherein, Figure 11 is according to a kind of design, the unwanted pre-connection breaking strong point on removal or the disconnecting circuit plate, a kind of led circuit module schematic diagram that forms, Figure 12 is the schematic cross-section of Figure 11, Figure 13 designs according to another kind, the unwanted pre-connection breaking strong point on removal or the disconnecting circuit plate, a kind of led circuit module schematic diagram that forms, Figure 14 is the schematic cross-section of Figure 13), be made into the LED light fixture with this a plurality of led circuit modules series connection interconnected or series and parallel interconnected or in parallel in conjunction with assembling.
Below by reference to the accompanying drawings a kind of specific embodiment of led circuit module is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (9)
1. led circuit module comprises:
Remove unwanted part metals and keep pre-connection breaking support level metal and the blank circuit board that forms with optionally processing without the metallic plate of any insulating supporting or metal tape;
Direct cup-shaped support in the injection mo(u)lding of the precalculated position of blank circuit board;
Directly be encapsulated in the led chip in the cup-shaped support;
Wherein, described pre-connection breaking support level metal can optionally be removed or disconnects according to circuit design in advance, thereby the led circuit module of the interconnected connection of two above LED is provided.
2. led circuit module according to claim 1 is characterized in that, the interconnected connection of described LED is to be connected in series, to be connected in parallel, the combination that perhaps is connected in series and is connected in parallel.
3. led circuit module according to claim 1 is characterized in that, also comprises the circuit surface that is arranged on described led circuit module and the capped resistance plating printing ink in position that makes described circuit surface need die bond nation line.
4. led circuit module according to claim 1 is characterized in that, also comprises the periphery support that is retained on the blank circuit board.
5. led circuit module according to claim 1 is characterized in that, described cup-shaped support is coated with is coated with silver coating, plating nickel gold layer or plating palladium layer.
6. led circuit module according to claim 1 is characterized in that, described led circuit module also has the heat radiation branching carrier that sticks on the led circuit module.
7. led circuit module according to claim 1, it is characterized in that, the circuit of described blank circuit board is provided with and disconnects the position, and described cup-shaped support injection mo(u)lding forms cup at described disconnection position, so that the circuit of both sides, described disconnection position is inlayed and is fixed in the cup.
8. led circuit module according to claim 7 is characterized in that, the circuit of both sides, described disconnection position partly is embedded in the cup, forms the electrode tie point so that the one side of circuit lead was exposed at the cup end of cup.
9. led circuit module according to claim 1, it is characterized in that, described led circuit module is for the led circuit module of making LED lamp band, LED Christmas lamp, LED neon light, LED fluorescent tube, LED panel light, LED ball bulb, LED corn lamp, LED Down lamp, LED shot-light, LED candle lamp, LED sign.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203812252U CN202884530U (en) | 2012-07-28 | 2012-07-28 | Light-emitting diode (LED) circuit module set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203812252U CN202884530U (en) | 2012-07-28 | 2012-07-28 | Light-emitting diode (LED) circuit module set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202884530U true CN202884530U (en) | 2013-04-17 |
Family
ID=48075958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203812252U Expired - Lifetime CN202884530U (en) | 2012-07-28 | 2012-07-28 | Light-emitting diode (LED) circuit module set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202884530U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505455A (en) * | 2014-12-19 | 2015-04-08 | 苏州天微工业技术有限公司 | LED (Light-Emitting Diode) lamp filament and forming method thereof |
| CN106340512A (en) * | 2016-11-08 | 2017-01-18 | 佛山市国星光电股份有限公司 | Strip LED and manufacture method thereof and backlight device |
| CN106678573A (en) * | 2017-01-18 | 2017-05-17 | 广东英吉尔科技股份有限公司 | Lamp with conical LED lamp filaments and manufacturing method thereof |
| CN108666401A (en) * | 2017-03-27 | 2018-10-16 | 隆达电子股份有限公司 | Light emitting diode device and support thereof |
| CN109065524A (en) * | 2018-07-05 | 2018-12-21 | 代云生 | LED module, flexible filament, light source and LED module manufacturing method |
| CN109121287A (en) * | 2017-06-26 | 2019-01-01 | 马培中 | A kind of circuit board making insulating carrier by plastics made of injection molding |
| CN109287078A (en) * | 2018-11-20 | 2019-01-29 | 美智光电科技有限公司 | Manufacturing method, iron substrate circuit board and the light source assembly of iron substrate circuit board |
-
2012
- 2012-07-28 CN CN2012203812252U patent/CN202884530U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505455A (en) * | 2014-12-19 | 2015-04-08 | 苏州天微工业技术有限公司 | LED (Light-Emitting Diode) lamp filament and forming method thereof |
| CN104505455B (en) * | 2014-12-19 | 2017-05-17 | 苏州天微工业技术有限公司 | LED (Light-Emitting Diode) lamp filament and forming method thereof |
| CN106340512A (en) * | 2016-11-08 | 2017-01-18 | 佛山市国星光电股份有限公司 | Strip LED and manufacture method thereof and backlight device |
| CN106340512B (en) * | 2016-11-08 | 2019-01-15 | 佛山市国星光电股份有限公司 | A kind of LED light strip and its manufacturing method and its back lighting device |
| CN106678573A (en) * | 2017-01-18 | 2017-05-17 | 广东英吉尔科技股份有限公司 | Lamp with conical LED lamp filaments and manufacturing method thereof |
| CN108666401A (en) * | 2017-03-27 | 2018-10-16 | 隆达电子股份有限公司 | Light emitting diode device and support thereof |
| CN109121287A (en) * | 2017-06-26 | 2019-01-01 | 马培中 | A kind of circuit board making insulating carrier by plastics made of injection molding |
| CN109065524A (en) * | 2018-07-05 | 2018-12-21 | 代云生 | LED module, flexible filament, light source and LED module manufacturing method |
| CN109287078A (en) * | 2018-11-20 | 2019-01-29 | 美智光电科技有限公司 | Manufacturing method, iron substrate circuit board and the light source assembly of iron substrate circuit board |
| CN109287078B (en) * | 2018-11-20 | 2021-06-04 | 美智光电科技股份有限公司 | Manufacturing method of iron substrate circuit board, iron substrate circuit board and light source assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130417 |
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| CX01 | Expiry of patent term |