CN202927509U

CN202927509U - Light-emitting diode (LED) lamp module with LED chip arranged on heat dissipating carrier circuit directly in packaging mode

Info

Publication number: CN202927509U
Application number: CN2012202507943U
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-05-21
Filing date: 2012-05-21
Publication date: 2013-05-08
Anticipated expiration: 2022-05-21

Abstract

The utility model relates to a light-emitting diode (LED) lamp module with an LED chip arranged on a heat dissipating carrier circuit directly in a packaging mode. The LED lamp module comprises a three-dimensional heat dissipating support lamp carrier circuit which comprises a three-dimensional heat dissipating support lamp carrier, a circuit integrated with the three-dimensional heat dissipating support lamp carrier, and the LED chip directly arranged on the heat dissipating carrier circuit in the packaging mode. Compared with the prior art, heat conducting distance is greatly shortened through the LED lamp module with the LED chip arranged on the heat dissipating carrier circuit directly in the packaging mode, heat conducting effect is good, an LED and an element of the LED do not need to be weld in an attaching mode by a surface mount technology (SMT), the whole manufacturing technological process is shortened, materials are saved, manufacturing time is shortened, production efficiency is greatly improved, and production cost is lowered.

Description

Directly LED chip is encapsulated in the LED light fixture module on heat radiation prop carrier circuit

Technical field

The utility model belongs to the LED application, is specifically related to directly LED chip is encapsulated in the LED light fixture module on three-dimensional heat radiation support light fixture carrier circuit.

Background technology

The combination that light fixture carrier and wiring board are supported in traditional solid heat radiation is to take first to produce an aluminum-based circuit board or copper base circuit board, perhaps ceramic base wiring board, after by SMT, element being welded, again the wiring board back side is sticked on three-dimensional heat radiation and support on the light fixture carrier, this kind method is added thermal resistance impedance layer by layer because heat transfer distances is far away, cause the conduction velocity of heat low, the heat conduction is very slow, and production process is quite loaded down with trivial details, and Production Time is long.

How to reduce thermal resistance, the heat that LED is produced can distribute as soon as possible, is all a difficult problem of LED industry all the time, along with LED uses and develops rapidly in every field, solves this difficult problem just more and extremely more urgent.

Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable technique.

Summary of the invention

The utility model creatively proposes, directly LED chip is encapsulated on the sets of lines zoarium that three-dimensional heat radiation support light fixture carrier and circuit combine together with the COB technology, LED does not relate to the surface mount welding procedure, its manufacture craft is cheap simply again, alternative existing loaded down with trivial details traditional manufacturing technique, efficient is high, low cost of manufacture, can be used for the LED field, and be widely used in various LED products.

Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition, term " circuit " and " circuit " can use interchangeably in the application.

The utility model relates to the LED light fixture module that directly LED chip is encapsulated on three-dimensional heat radiation support light fixture carrier circuit.More specifically, according to a preferred embodiment of the present utility model, directly support in the solid heat radiation and make the LED circuit on the light fixture carrier, make three-dimensional heat radiation support the light fixture carrier and combine together with the LED circuit; With COB (Chip On Board) technology, LED chip nation fixed (bonding) is supported on the light fixture carrier circuit in the solid heat radiation; Sealing is solidified; Make LED light fixture module.This kind directly compared the LED light fixture module that chip package supports on the light fixture carrier circuit in the solid heat radiation with traditional structure and technology, greatly shortened heat transfer distances, heat-transfer effect is good, LED and components and parts thereof also mount welding without SMT, whole manufacturing process flow shortens, also saved simultaneously material and shortened Production Time, greatly having improved production efficiency; Reduced production cost.

According to the utility model, a kind of LED light fixture module that directly LED chip is encapsulated on three-dimensional heat radiation support light fixture carrier circuit is provided, comprise: the light fixture carrier circuit is supported in three-dimensional heat radiation, and described solid heat radiation is supported the light fixture carrier circuit and comprised three-dimensional heat radiation support light fixture carrier and support with described three-dimensional heat radiation the circuit that the light fixture carrier becomes one; Directly be encapsulated in the LED chip on described three-dimensional heat radiation support light fixture carrier circuit.

According to an embodiment of the present utility model, it is that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulating that the light fixture carrier is supported in described three-dimensional heat radiation.

According to an embodiment of the present utility model, the solid heat radiation support light fixture carrier that the light fixture carrier is metal is supported in described three-dimensional heat radiation.

According to an embodiment of the present utility model, the heat radiation of the solid of described metal is supported the light fixture carrier and is made by aluminium, copper, aluminium alloy, copper alloy or stainless steel.

According to an embodiment of the present utility model, described encapsulation is the encapsulation of COB formula.

According to an embodiment of the present utility model, described circuit and described three-dimensional heat radiation are supported the light fixture carrier and are become one with dielectric adhesive is bonding.

According to an embodiment of the present utility model, described circuit comprises metallic circuit layer and the insulating barrier that is bonded together.

According to an embodiment of the present utility model, described LED light fixture module also comprises the reflective membrane of that side that described LED chip is installed that is arranged in described three-dimensional heat radiation support light fixture carrier circuit.

According to an embodiment of the present utility model, described LED chip direct nation decides and is encapsulated in described three-dimensional heat radiation to support on the conducting wire of light fixture carrier circuit.

According to an embodiment of the present utility model, described LED module is used for making LED illuminating module, LED bulb lamp, LED street lamp, LED fluorescent tube, LED panel light, LED shot-light, LED Down lamp or LED sign module.

In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.

Description of drawings

Fig. 1 is the schematic diagram according to the circuit matrix structure of the utility model one preferred embodiment, has shown that the copper-clad plate that is comprised of copper layer and insulating barrier is as board substrate.

Fig. 2 is the schematic diagram of the line layer produced according to designed circuit with circuit base material shown in Figure 1.

Fig. 3 is that line layer shown in Figure 2 and three-dimensional heat radiation support light fixture carrier support the schematic diagram of light fixture carrier circuit structure with resulting three-dimensional heat radiation that dielectric adhesive directly is bonded together.

Fig. 4 supports schematic diagram on the light fixture carrier circuit for LED chip nation being fixed on three-dimensional heat radiation shown in Figure 3.

Fig. 5 is that LED chip nation fixes on three-dimensional heat radiation shown in Figure 3 and supports on the light fixture carrier circuit and the schematic diagram of sealing after solidifying.

Fig. 6 supports for the solid heat radiation at the LED light fixture module of making shown in Figure 5 the schematic diagram of pasting one deck reflective membrane on the light fixture carrier circuit.

Fig. 7 is LED light fixture module shown in Figure 6 and the decomposing schematic representation of lampshade to be covered.

Fig. 8 is the schematic diagram after LED light fixture module shown in Figure 6 covers lampshade.

The specific embodiment

The below will be described in more detail the concrete enforcement of directly chip package being supported the LED light fixture module on the light fixture carrier circuit in the solid heat radiation of the present utility model.

But those skilled in the art are appreciated that obviously these embodiments have only enumerated some preferred embodiments of the present utility model, to the utility model and protection domain thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in scope of the present utility model.Scope of the present utility model is only limited by claim.

The copper-clad plate that is comprised of copper layer 6 and insulating barrier 2 as shown in Figure 1 is used as board substrate, and carry out following processing treatment step on board substrate: be cut into the needed size of making circuit → boring or the anti-etching figure of punching → wire mark circuit → curing inspection and repair plate → etch copper → erosion and examine → go etchingresistant printing material, oven dry → opening, short-circuit test → complete the making of circuit 3, obtain line layer structure as shown in Figure 2.Fig. 2 is the schematic diagram of the circuit (layer) 3 produced according to designed circuit with circuit base material shown in Figure 1.Because above-mentioned making circuit belongs to traditional technique, belong to those skilled in the art and know, just no longer carefully state at this.

The one side that insulating barrier 2 is arranged of making circuit 3 is preferably sticked with glue agent be bonded together with three-dimensional heat radiation support light fixture carrier 1, the light fixture carrier circuit is supported in the solid heat radiation that forms as shown in Figure 3.

According to a preferred embodiment of the present utility model, it is that light fixture carrier 1 is supported in the cubic metal characters or patterns heat radiation that light fixture carrier 1 is supported in solid heat radiation shown in Figure 3.The heat radiation of this cubic metal characters or patterns is supported light fixture carrier 1 and is preferably made by the metal of the high thermal conductivity of being convenient to dispel the heat, for example aluminium, copper, aluminium alloy, copper alloy, etc.

Certainly, those of ordinary skill in the art it is also understood that, it can be also that the light fixture carrier is supported in nonmetallic three-dimensional heat radiation that light fixture carrier 1 is supported in the solid heat radiation of LED light fixture module of the present utility model, is for example the good insulating polymer carrier of ceramic monolith, thermal conductivity, etc.

Next, according to a preferred embodiment of the present utility model, adopt COB (Chip OnBoard) technology that LED chip 4 nations are fixed on solid heat radiation shown in Figure 3 and support on the light fixture carrier circuit.A related exemplary specific embodiment is as follows:

Clean solid heat radiation shown in Figure 3 and support a light fixture carrier circuit → bonded adhesives → stickup LED chip 4 and oven dry on solid heat radiation support light fixture carrier circuit, and then nation decides LED chip 4 (as shown in Figure 4) → test → sealing 5 (as shown in Figure 5) → curing → test → warehouse-in, thereby LED light fixture module on the light fixture carrier circuit is supported in the three-dimensional heat radiation that directly LED chip 4 is encapsulated in that obtains as shown in Figure 5.

Wherein, Fig. 4 is for fixing on LED chip 4 direct nation in the schematic diagram on three-dimensional heat radiation support light fixture carrier circuit shown in Figure 3.Fig. 5 is that LED chip 4 direct nation fixes on three-dimensional heat radiation shown in Figure 3 and supports on the light fixture carrier circuit and the schematic diagram of sealing after solidifying.

According to another embodiment of the present utility model, can also be after the LED light fixture module shown in Figure 5 that completes, position according to LED lamp pearl 4 and power supply wiring, reflective membrane 7 is left window in advance, then it is pasted on (as shown in Figure 6) on circuit 3, Fig. 6 supports for the solid heat radiation at the LED light fixture module of making shown in Figure 5 the schematic diagram of pasting one deck reflective membrane 7 on the light fixture carrier circuit.This reflective membrane 7 plays the effect that the luminosity in the effect of light fixture carrier circuit and the front by the reflective LED of increasing light fixture module is supported in the three-dimensional heat radiation of protection.

Then, can test and cover lampshade 8 to LED light fixture module shown in Figure 6, as shown in Figure 7 and Figure 8.Fig. 7 is LED light fixture module shown in Figure 6 and the decomposing schematic representation of lampshade 8 to be covered.Fig. 8 is the schematic diagram after LED light fixture module shown in Figure 6 covers lampshade 8.

Below with the specific embodiment that directly chip package is supported the LED light fixture module on the light fixture carrier circuit in the solid heat radiation, the utility model is described in detail by reference to the accompanying drawings.But, it will be appreciated by those skilled in the art that the above is only to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim, do not have any restriction.Scope of the present utility model only is defined by the claims.

Claims

1. a LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit, is characterized in that, described LED light fixture module comprises:

The light fixture carrier circuit is supported in three-dimensional heat radiation, and described solid heat radiation is supported the light fixture carrier circuit and comprised three-dimensional heat radiation support light fixture carrier and support with described three-dimensional heat radiation the conducting wire that the light fixture carrier becomes one; With

Directly be encapsulated in the LED chip on described three-dimensional heat radiation support light fixture carrier circuit.

2. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 1 is characterized in that: it is that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulation that the light fixture carrier is supported in described three-dimensional heat radiation.

3. the LED light fixture module that directly LED chip is encapsulated on the prop carrier circuit that dispels the heat according to claim 1, is characterized in that: the solid heat radiation support light fixture carrier that described three-dimensional heat radiation support light fixture carrier is metal.

4. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 3, it is characterized in that: the solid heat radiation of described metal is supported the light fixture carrier and is made by aluminium, copper, aluminium alloy, copper alloy or stainless steel.

5. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 1, it is characterized in that: described encapsulation is the encapsulation of COB formula.

6. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 1, it is characterized in that: described circuit and described three-dimensional heat radiation are supported the light fixture carrier and are become one with dielectric adhesive is bonding.

7. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 1, it is characterized in that: described conducting wire comprises metallic circuit layer and the insulating barrier that is bonded together.

8. the LED light fixture module that directly LED chip is encapsulated on heat radiation prop carrier circuit according to claim 1 is characterized in that: described LED light fixture module also comprises and is arranged in the reflective membrane that side that described LED chip is installed of light fixture carrier circuit is supported in described three-dimensional heat radiation.

9. the LED light fixture module that directly LED chip be encapsulated in heat radiation prop carrier circuit on described according to any one in above claim is characterized in that: described LED chip direct nation decide and is encapsulated on the conducting wire of described three-dimensional heat radiation support light fixture carrier circuit.