CN202647294U

CN202647294U - Led lamp module

Info

Publication number: CN202647294U
Application number: CN2012202508043U
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-05-21
Filing date: 2012-05-21
Publication date: 2013-01-02
Anticipated expiration: 2022-05-21

Abstract

The utility model relates to an LED lamp module which comprises a three-dimensional heat radiating support lamp carrier, an viscous conductive medium arranged on the three-dimensional heat radiating support lamp carrier to form a circuit of the LED lamp module, and an LED adhered and fixed on the circuit formed by the viscous conductive medium and conductively communicated with the circuit, wherein the viscous conductive medium plays a role in conducting a line and also plays a role of adhering the LED and other electronic components. According to the LED lamp module provided by the utility model, a procedure of etching to manufacture a circuit board is not needed, the LED and other components are not mounted and welded by using an SMT (Surface Mount Technology), the whole manufacture process is shortened, materials are saved, the manufacture time is shortened, the production efficiency is greatly increased, the pollution to the environment by etching in the traditional process of producing and manufacturing the circuit board is reduced, the production cost is greatly lowered, therefore the LED lamp module is environmental-friendly.

Description

LED light fixture module

Technical field

The utility model belongs to the LED application, is specifically related to a kind of novel LED light fixture module.

Background technology

The combination that light fixture carrier and wiring board are supported in traditional heat radiation is to take to produce first an aluminum-based circuit board or copper base circuit board, perhaps ceramic base wiring board, after by SMT element being welded, again the wiring board back side is close to three-dimensional heat radiation and supports on the light fixture carrier, this kind method is because heat transfer distances is far away, add thermal resistance impedance layer by layer, cause thermal conduction rate low, the heat conduction is very slow, and production process is quite loaded down with trivial details, Production Time is long, but also environment is caused severe contamination.

How to reduce thermal resistance, the heat that LED is produced can distribute as soon as possible, all is a difficult problem of LED industry all the time, along with LED uses and develops rapidly in every field, solves this difficult problem just more and extremely more urgent.

Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable structure and related process.

Summary of the invention

Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition, term " wiring board " and " circuit board " can use interchangeably in the application, and term " circuit " and " circuit " also can use interchangeably in the application.

In view of the above-mentioned technological deficiency that exists in the prior art, the utility model creatively proposes, the solid heat radiation that conducting resinl directly is printed on the LED light fixture is supported on the light fixture carrier and is formed the LED operating circuit, LED is bonded and fixed on the conducting resinl circuit, thereby obtain being integrated with the solid heat radiation support light fixture carrier of LED operating circuit, and obtain the LED light fixture module that heat transfer distances shortens greatly.The manufacture craft of this LED light fixture module of the present utility model is cheap simply again, alternative existing loaded down with trivial details traditional manufacturing technique.Can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient are high, and very environmental protection.

The utility model relates to and can make the LED light fixture module that the light fixture carrier is supported in conducting wire and bonding LED and three-dimensional heat radiation with conducting resinl, particularly, according to a kind of preferred embodiment, available conducting resinl is according to the circuit of design, the solid heat radiation that directly is printed on the LED light fixture is supported on the light fixture carrier, form a kind of conducting wire of conducting resinl, then with LED, components and parts and power supply terminal are positioned over the corresponding position of conducting resinl circuit, Curing conductive adhesive, make conducting resinl with LED, components and parts and power supply terminal strong bonded and conducting, make the solid heat radiation of conducting resinl and LED light fixture support light fixture carrier strong bonded, conducting resinl works to do the conducting wire simultaneously, works again to do bonding LED and components and parts thereof.Thereby obtain that radiator combines together with wiring board and so that the LED light fixture module that heat transfer distances shortens greatly.The bonding LED of this kind conducting resinl circuit and three-dimensional heat radiation are supported the LED light fixture module of light fixture carrier making and are compared with traditional manufacture craft, do not need etching to make wiring board, LED and components and parts thereof also mount welding without SMT, whole manufacturing process flow shortens, also save simultaneously material and shortened Production Time, greatly improved production efficiency; Reduce traditional mode of production and made etching pollution on the environment in the wiring board process; Also greatly reduce production cost, thereby very environmental protection.

According to the utility model, a kind of LED light fixture module is provided, comprising: the light fixture carrier is supported in three-dimensional heat radiation;

Viscosity conducting medium, described viscosity conducting medium are arranged in described three-dimensional heat radiation and support on the light fixture carrier, form the circuit of described LED light fixture module; Be adhesively fixed on the formed circuit of described viscosity conducting medium and the LED of conductive communication with it.

According to an embodiment of the present utility model, described viscosity conducting medium is conducting resinl, conductive paste or conductive paste.

According to another embodiment of the present utility model, described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.

According to another embodiment of the present utility model, it is that the light fixture carrier is supported in the cubic metal characters or patterns heat radiation that simultaneously is provided with insulating barrier that the light fixture carrier is supported in described three-dimensional heat radiation, and wherein said viscosity conducting medium is printed on described cubic metal characters or patterns heat radiation and supports on the described insulating barrier of light fixture carrier.

According to another embodiment of the present utility model, described cubic metal characters or patterns heat radiation is supported the light fixture carrier and is made by aluminium, copper, aluminium alloy, copper alloy or stainless steel.

According to another embodiment of the present utility model, it is to support the light fixture carrier by the solid heat radiation that the nonmetallic materials of insulation are made that the light fixture carrier is supported in described three-dimensional heat radiation, and wherein said viscosity conducting medium directly is printed on described three-dimensional heat radiation and supports on the light fixture carrier.

According to another embodiment of the present utility model, described LED light fixture module also comprises the reflective membrane on the side that described LED is installed that is arranged in described three-dimensional heat radiation support light fixture carrier.

According to another embodiment of the present utility model, connect between the circuit of described LED and described viscosity conducting medium or be connected in parallel conducting.

According to another embodiment of the present utility model, described LED light fixture module also comprises and being adhesively fixed on described circuit and other components and parts of conductive communication with it, such as resistance etc.

According to another embodiment of the present utility model, described LED light fixture module also comprises and being adhesively fixed on described circuit and the power supply terminal of conductive communication with it.

According to another embodiment of the present utility model, described LED is fixing and conducting by the conducting resinl bonding.

In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.

Description of drawings

Fig. 1 is the schematic diagram that supports the light fixture carrier according to the cubic metal characters or patterns heat radiation of the LED light fixture module of the utility model one embodiment.

Fig. 2 supports the schematic diagram that forms the conducting resinl circuit on the insulating barrier of light fixture carrier for the cubic metal characters or patterns heat radiation that directly is printed on LED light fixture module shown in Figure 1 according to the conducting resinl of the utility model one embodiment.

Fig. 3 is for being bonded and fixed at LED and power supply terminal schematic diagram on the conducting resinl circuit shown in Figure 2 according to the utility model one embodiment.

Fig. 4 pastes the schematic diagram of reflective membrane according to the utility model one embodiment at the conducting resinl circuit of LED light fixture module shown in Figure 3.

Fig. 5 is for preparing to cover the decomposing schematic representation of lampshade according to the utility model one embodiment at LED light fixture module shown in Figure 4.

Fig. 6 is the schematic diagram after LED light fixture module shown in Figure 4 covers lampshade.

The specific embodiment

The below will be described in more detail the specific embodiment that supports the LED light fixture module that the light fixture carrier makes with the direct bonding LED of conducting resinl circuit and three-dimensional heat radiation of the present utility model.

But those skilled in the art are appreciated that obviously these embodiments have only enumerated some preferred embodiments of the present utility model, to the utility model and protection domain thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.

According to a preferred embodiment of the present utility model, provide the solid heat radiation of LED light fixture module to support the light fixture carrier.Fig. 1 is the schematic diagram that light fixture carrier 1 is supported in a kind of cubic metal characters or patterns heat radiation of LED light fixture module.Light fixture carrier 1 is supported in cubic metal characters or patterns heat radiation as shown in Figure 1 to be cleaned and oven dry with the insulating barrier 2 that overlays on the cubic metal characters or patterns heat radiation support light fixture carrier 1.Cubic metal characters or patterns heat radiation is supported light fixture carrier 1 and is preferably made by the metal of the high thermal conductivity of being convenient to dispel the heat, for example aluminium, copper, aluminium alloy, copper alloy, etc.

Certainly, those of ordinary skill in the art it is also understood that, it also can be that the light fixture carrier is supported in nonmetallic three-dimensional heat radiation that the light fixture carrier is supported in the solid heat radiation of LED light fixture module of the present utility model, for example is the good insulating polymer carrier of ceramic monolith, thermal conductivity, etc.Then according to the circuit of design, the cubic metal characters or patterns heat radiation that conducting resinl 3 is printed on LED light fixture shown in Figure 1 is supported on the insulating barrier 2 of light fixture carrier 1, and obtains structure as shown in Figure 2.Fig. 2 is for forming the schematic diagram of conducting resinl circuit on the insulating barrier 2 that supports the light fixture carrier according to the cubic metal characters or patterns heat radiation that conducting resinl 3 directly is printed on LED light fixture module shown in Figure 1 of the utility model one embodiment.

If it is that the light fixture carrier is supported in the nonmetal three-dimensional heat radiation of insulating that the light fixture carrier is supported in the heat radiation of the solid of LED light fixture module, then can omit insulating barrier 2.So, the nonmetal three-dimensional heat radiation that just can directly conducting resinl 3 be printed on insulation is supported on the light fixture carrier, and can obtain equally the conducting wire 3 that formed by conducting resinl 3.

Then, according to the corresponding position (as shown in Figure 3) that LED 4 (and/or other electronic devices and components) preferably is bonded on conducting resinl 3 circuits, Curing conductive adhesive 3, make conducting resinl 3 and LED4 strong bonded and conducting, and make conducting resinl 3 and the solid heat radiation of LED light fixture support light fixture carrier 1 strong bonded.Wherein, conducting resinl 3 plays a part to do to serve as the conducting wire simultaneously, works again to do bonding LED and other components and parts.Like this, just can obtain a kind of novel radiator is combined together with wiring board and so that the LED light fixture module that heat transfer distances shortens greatly.

As shown in Figure 3, the power supply terminal 5 corresponding position on conducting resinl 3 circuits that also can be adhesively fixed is so that the leading-out terminal wiring.

According to another embodiment of the present utility model, can also be behind the LED light fixture module that completes as mentioned above, with the reflective membrane 6 of holding in advance window according to the position of LED lamp pearl 4 and power supply terminal 5 successfully, be pasted on the conducting resinl circuit 3, as shown in Figure 4), Fig. 4 pastes the schematic diagram of reflective membrane 6 according to the utility model one embodiment at the conducting resinl circuit of LED light fixture module shown in Figure 3.This reflective membrane 6 plays the effect of the luminosity in the effect of protection conducting resinl circuit 3 and the front by the reflective LED of increasing light fixture module.

Then, can test and cover lampshade 7 to LED light fixture module shown in Figure 4, shown in Fig. 5,6.Fig. 5 is for preparing to cover the decomposing schematic representation of lampshade 7 according to the utility model one embodiment at LED light fixture module shown in Figure 4.Fig. 6 is the schematic diagram after LED light fixture module shown in Figure 4 covers lampshade 7.

Next, the product that can dispatch from the factory to the LED module of finishing through above-mentioned operation detects and packs, and is qualified through detecting, and can dispatch from the factory.

Below by reference to the accompanying drawings and with the specific embodiment that the LED light fixture module that the light fixture carrier makes is supported in the bonding LED of conducting resinl circuit and three-dimensional heat radiation the utility model is described in detail.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.

Claims

1. a LED light fixture module is characterized in that, described LED light fixture module comprises:

The light fixture carrier is supported in three-dimensional heat radiation;

Viscosity conducting medium, described viscosity conducting medium are arranged in described three-dimensional heat radiation and support on the light fixture carrier, and form the circuit of described LED light fixture module; With

Be adhesively fixed on the formed circuit of described viscosity conducting medium and with the LED of described circuit conductive communication.

2. LED light fixture module according to claim 1, it is characterized in that: described viscosity conducting medium is conducting resinl, conductive paste or conductive paste.

3. LED light fixture module according to claim 2, it is characterized in that: described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.

4. LED light fixture module according to claim 1 and 2, it is characterized in that: it is that the light fixture carrier is supported in the cubic metal characters or patterns heat radiation that simultaneously is provided with insulating barrier that the light fixture carrier is supported in described three-dimensional heat radiation, and wherein said viscosity conducting medium is printed on described cubic metal characters or patterns heat radiation and supports on the described insulating barrier of light fixture carrier.

5. LED light fixture module according to claim 4 is characterized in that: described cubic metal characters or patterns heat radiation is supported the light fixture carrier and is made by aluminium, copper, aluminium alloy, copper alloy or stainless steel.

6. LED light fixture module according to claim 1 and 2, it is characterized in that: it is to support the light fixture carrier by the solid heat radiation that the nonmetallic materials of insulation are made that the light fixture carrier is supported in described three-dimensional heat radiation, and wherein said viscosity conducting medium directly is printed on described three-dimensional heat radiation and supports on the light fixture carrier.

7. LED light fixture module according to claim 1 and 2 is characterized in that: described LED light fixture module comprises that also being arranged in described three-dimensional heat radiation supports reflective membrane on the side that described LED is installed of light fixture carrier.

8. LED light fixture module according to claim 1 and 2 is characterized in that: connect or be connected in parallel between the circuit of described LED and described viscosity conducting medium.

9. LED light fixture module according to claim 1 and 2 is characterized in that: described LED light fixture module also comprises and is adhesively fixed on described circuit and the resistance or the electric capacity that connect of conduction with it.

10. LED light fixture module according to claim 1 and 2 is characterized in that: described LED light fixture module also comprises and is adhesively fixed on described circuit and the power supply terminal of conductive communication with it.