CN201259194Y - LED packaged illumination circuit board of high thermal conductivity - Google Patents
LED packaged illumination circuit board of high thermal conductivity Download PDFInfo
- Publication number
- CN201259194Y CN201259194Y CNU2008201616078U CN200820161607U CN201259194Y CN 201259194 Y CN201259194 Y CN 201259194Y CN U2008201616078 U CNU2008201616078 U CN U2008201616078U CN 200820161607 U CN200820161607 U CN 200820161607U CN 201259194 Y CN201259194 Y CN 201259194Y
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- light source
- wiring board
- led light
- led
- circuit
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Abstract
The utility model relates to a high heat conducting LED sealed illuminating circuit board. The illuminating circuit board is characterized by comprising a baseplate, a connecting circuit, an insulation laminated layer, an LED light source and a high heat conducting insulation sheet. The insulation laminated layer covers the surface of the baseplate which is provided with the connecting circuit; the insulation laminated layer, the baseplate and the connecting circuit together form the main body of the circuit board on which the LED light source is sealed. The illuminating circuit board is characterized in that the high heat conducting insulation sheet is attached to the back of the heat radiating base of the LED light source; a plurality of containing holes are arranged on the main body of the circuit board orderly; and the LED light source is sealed on the main body of the circuit board, and the heat radiating base of the LED light source passes through the containing holes on the main body of the circuit body. The illuminating circuit board with novel, reasonable and compact structure improves the security and stability of the application of product and reduces the production difficulty and cost; when the illuminating circuit board is installed behind a radiator, the heat radiating route of ''LED source to high heat conducting insulation sheet to radiator to the outside'' is achieved, thereby realizing excellent heat radiating performance.
Description
Technical field
The utility model discloses a kind of LED encapsulation technology of being convenient to high efficiency and heat radiation and being mainly used in great power LED, be embodied in a kind of LED illuminating line plate, belong to technical field of semiconductor illumination.
Background technology
LED (light emitting diode) technology starts from late 1960s, through semicentennial developing rapidly, led light source, particularly high-power highlighted led light source, with its light efficiency height, little, the long service life of volume, and many-sided advantage such as environmental protection and energy saving, occupied critical positions in the lighting source field, and still in continuing to develop rapidly.
Initial LED illuminating product; its led light source directly is packaged in lamp body inside; because of its lamp body material mostly is the conducting metal material; when circuit connects, must consider the insulation protection of circuit, waste time and energy and security, stability not high; therefore the encapsulation wiring board that led light source occurred; promptly be about to plurality of LEDs earlier and arrange and be packaged in the monoblock substrate, and prewiring connects so that encapsulation led light source is thereon carried out circuit on substrate, places lamp body inside to connect into lighting circuit this substrate again.Therefore, led light source directly is not connected with lamp body, between the two every a laminar substrate.
At present, the applied LED substrate of LED lighting field mainly contains conventional PCB substrate (being mainly papery and fiber, resinae substrate), pottery substrate and metal matter substrate (being mainly aluminium alloy base plate) from the material differentiation.
Great power LED is a heater members, and its light efficiency, power consumption and service life temperature influence bigger, therefore effectively the heat that produces of diverging LED light source is the key factor that improves the LED serviceability.Conventional PCB substrate, pottery substrate thermal resistance are big, the heat that substantially can't the diverging LED light source be produced, therefore and be not suitable for great power LED.Metal matter substrate thermal conductivity is better relatively, but this LED substrate directly is not exposed to the external world, also need this substrate is fixed in the radiator surface, disperse heat by radiator to the external world, therefore the contact-making surface to metal matter substrate and radiator requires very high, simultaneously between led light source and the substrate, substrate and radiator are installed and all are difficult to the gap that exists avoided between the surface, therefore also need to fill liquid heat-conducting glue fat, to form the heat dissipation path of " led light source → heat-conducting glue fat → metal matter substrate → heat-conducting glue fat → radiator → external world ", this heat dissipation path is repeatedly heat radiation indirectly, effect is also not obvious, simultaneously to the flatness of each contact-making surface in this heat dissipation path, fineness and installation requirement height have increased difficulty of processing and processing cost; Each contact-making surface easily produces contact gap, causes whole effective thermal conductivity to descend, and causes the LED junction temperature to raise, and light decay increases, the service life of having reduced led light source.
The utility model content
The purpose of this utility model is for overcoming the shortcoming of above-mentioned prior art, by a kind of new LED encapsulation technology, provide a kind of and have than high universalizable, lower to surface requirements is installed, the while is convenient to high efficiency and heat radiation more and is mainly used in the LED illuminating line plate of high-power LED light source.
The purpose of this utility model is achieved through the following technical solutions: high-termal conductivity LED package illumination wiring board is a kind of LED illuminating line plate, is provided with substrate 1, connects circuit 2, insulating coating layer 3, led light source 4 and high heat conductive insulating sheet 5.Insulating coating layer 3 covers the surface that is furnished with the substrate 1 that connects circuit 2, and the three constitutes the wiring board main body; High heat conductive insulating sheet 5 invests the heat dissipation base 4-2 back side of led light source 4, and led light source 4 is packaged in the wiring board main body, has several containing holes according to necessarily putting in order on the wiring board main body, and LED heat dissipation base 4-2 passes the containing hole that is provided with on the wiring board main body.
Described led light source 4 is packaged in the wiring board main body, be meant led light source 4 and connect being electrically connected of circuit 2, connect on the circuit 2 and connect pad 2-1 in the other LED that leaves of the package position of led light source 4, the pin 4-3 of led light source 4 is welded in by this pad and connects circuit 2.
The conductive film circuit of described connection circuit 2 for having certain toughness and ductility material also leaves external circuit and connects pad 2-2 on it, this pad, and LED connection pad 2-1 all is exposed to outside the insulating coating layer 3.
Described substrate 1 can be rigid substrates, is embodied in thickness even metal, thin plate or pcb board; Also can be flexible base, board, be embodied in the uniform resin material film of thickness or elastomeric material thin plate or plastic metal film.
Described insulating coating layer 3 and flexible base, board 1, connect between the circuit 2 for hot press or cohere and engage.
Described high heat conductive insulating sheet 5 carries out surface oxidation for the fine aluminium thin slice with high-termal conductivity, the high-termal conductivity electric insulation thin slice that obtains, be attached at the heat dissipation base 4-2 back side of led chip 4-1, its shape size is big or small consistent with the shape of heat dissipation base 4-2 bottom surface, is hot press between the two, seccotine is bonding or the high temperature seam.Simultaneously, for guaranteeing the applying degree of high heat conductive insulating sheet 5 and lamp body structure (radiator 7), high heat conductive insulating sheet 5 should slightly protrude from substrate 1.
Described LED illuminating line plate can be embodied as the modularization wiring board, and each module can realize illumination separately, also can the multimode series and parallel connects into module and realizes illumination jointly.Single led illuminating line plate module can cut along the led light source arragement direction, not influencing wiring after cutting and connecting, and perhaps only needs local little adjustment is carried out in wiring, can use and does not influence other wirings and connect.A plurality of LED illuminating line plate module can be docked along the led light source arragement direction, only carry out the soldering connection in the part and promptly can be combined to an extended type LED illuminating line plate.
Described LED illuminating line plate can be fixed in radiator 7 surfaces by riveted joint or frame for movement such as be threaded, and also can paste strong binding glue-line 6 at the back side of substrate 1, and adhere to radiator 7 surfaces by this strong binding glue-line 6.
When application strong binding glue-line 6 adhered to radiator 7 surfaces with LED illuminating line plate, strong binding glue-line 6 need be avoided led light source 4 positions.Strong binding glue-line 6 outsides also are provided with the protection of protection sheet film, during installation, tear the protection sheet film, LED illuminating line plate is close to radiator 7 surfaces can fixes.
During installation,, then fill heat-conducting medium in this applying slit if having the applying slit between high heat conductive insulating sheet 5 and radiator 7 surfaces.
During installation, also high heat conductive insulating sheet 5 and radiator 7 can be carried out the high temperature seam, but then LED heat dissipation base 4-2, high heat conductive insulating sheet 5, radiator 7 seam are integral, and obtain higher heat dispersion.
The utility model novel and reasonable structure compactness is manufactured easily, and cost is low, uses convenient for installation and maintenancely, easy to utilize, is particularly suitable for the high-power LED illumination field, with existing applied LED substrate comparison, has following advantage:
1, directly be packaged in the mode comparison of radiator with led light source, the utility model is packaged in the LED electrically insulating base with led light source, has improved application security and stability, has reduced the production difficulty; When led light source breaks down, be beneficial to maintenance and change, help to improve the suitable versatility of product.
2, the heat dissipation path that has " led light source → high heat conductive insulating sheet → radiator → external world ", because of the high heat conductive insulating sheet combines as a whole with the heat dissipation base of led light source, therefore has the heat dissipation path in " led light source → radiator 7 → external world ", significantly reduced middle heat radiation link, improve heat dispersion, thereby effectively controlled the led light source junction temperature, helped reducing light decay, improve efficiency, increase service life.
3, with respect to traditional LED substrate large tracts of land heat conduction contact, the utility model adopts the heat dissipation base small size effectively to contact, and the applying degree height of thermal interface is beneficial to efficiently radiates heat more.Simultaneously, the utility model is used once and is filled, and filling area is little, has significantly reduced expensive heat-conducting medium consumption, has controlled cost.
4, can adopt the flexible circuitry plate technique, make wiring board can be applicable to the smooth non-smooth installation surface of the surface being installed and being not more than certain variation curvature simultaneously, have higher suitable versatility.Simultaneously, this flexible LED illuminating line plate can also bear bending, the distortion, Texturized of certain intensity, occurs at installed surface after the installation not damaging its serviceability under the situation of such distortion, has further widened its scope of application.
5, be easy to realize modularization and modularity, help the seriation and the batch process of product.
The utility model is further specified with specific embodiment below in conjunction with accompanying drawing.
Description of drawings
Figure 1A is the contour structures schematic diagram of the utility model embodiment;
Figure 1B is the decomposition texture schematic diagram of the utility model embodiment;
Fig. 2 is the cross section structure schematic diagram of the utility model in the led light source package position;
Fig. 3 A is the series arrangement connected mode schematic diagram that the utility model connects circuit;
Fig. 3 B is parallel connection that the utility model the connects circuit connected mode schematic diagram of arranging;
Fig. 3 C is connection in series-parallel that the utility model the connects circuit connected mode schematic diagram of arranging;
Fig. 4 A is that the utility model connects the cutting wire structures schematic diagram that circuit is connected in parallel;
Fig. 4 B is that the utility model connects the cutting wire structures schematic diagram that circuit is connected in series;
Fig. 5 A is the structural representation that embodiment 1 of the present utility model is installed on flat surface;
Fig. 5 B be embodiment 1 of the present utility model when being installed on flat surface in the heat radiation schematic cross-section of led light source package position;
Fig. 6 A is that embodiment 2 of the present utility model is installed on the structural representation that cylinder is installed the surface;
Fig. 6 B be embodiment 2 of the present utility model be installed on cylinder when the surface is installed in the heat radiation schematic cross-section of led light source package position.
Among the figure: 1 substrate, 2 connect circuit, 2-1LED connects pad, the 2-2 external circuit connects pad, 3 insulating coating layers, the 4LED light source, the 4-1LED chip, 4-2 heat dissipation base, 4-3 pin, 5 high heat conductive insulating sheets, 6 strong binding glue-lines, 7 radiators, 8 wiring board main bodys, 0-1 module one, 0-2 module two.
The specific embodiment
Embodiment 1
As shown in Figure 1 and Figure 2, a kind of LED illuminating line plate module is made up of substrate 1, connection circuit 2, insulating coating layer 3, led light source 4 and high heat conductive insulating sheet 5.The substrate of using in the present embodiment 1 is aluminium alloy sheet, and Copper Foil connects circuit 2 and is distributed in substrate 1 front to cohere juncture, and sprays the transparent insulation glue to form insulating coating layer 3 on substrate 1, connection circuit 2 surfaces, and the three constitutes LED illuminating line plate main body.Fine aluminium thin slice with high-termal conductivity carries out surface insulation oxidation processes formation high heat conductive insulating sheet 5, and high temperature is welded in the heat dissipation base back side of led light source 4, the shape size of its approximate LED heat dissipation base 4-2 bottom surface of shape size.Have the led light source containing hole by necessarily putting in order on the wiring board main body, led light source 4 is packaged in the wiring board main body, and its heat dissipation base 4-2 passes the led light source containing hole.When not being installed on radiator 7, high heat conductive insulating sheet 5 slightly protrudes from the back side of substrate 1.
LED illuminating line plate module in the present embodiment comprises the led light source 4 of six rated power 1W, and with series system, the linear array formula is arranged and is packaged in flexible LED illuminating line plate module inside.Leave LED connection pad 2-1 on the connection circuit 2 and be connected pad 2-2 with external circuit, pad is exposed to outside the insulating coating layer 3, and LED pin 4-3 is welded in connection circuit 2 respectively with external circuit input line and realizes that circuit are connected.
Shown in Fig. 5 A, Fig. 5 B, the described LED illuminating line of present embodiment plate module is fixed in the radiator 7 with smooth installed surface by helicitic texture, high heat conductive insulating sheet 5 is welded in the radiator surface with heat conduction silver paste high temperature, forms the heat dissipation path of " led light source → high heat conductive insulating sheet → radiator → external world " in the whole LED lighting module.Be welded in the heat dissipation base 4-2 of led light source 4 because of high heat conductive insulating sheet 5, visual as a whole, therefore this heat dissipation path can be considered the heat dissipation path of " led light source → radiator → external world ", high heat conductive insulating sheet 5 is welded in radiator 7 surfaces simultaneously, guaranteed effective contact, its heat dissipation path is more unobstructed, can obtain better radiating effect.
A kind of LED illuminating line plate module is made up of substrate 1, connection circuit 2, insulating coating layer 3, led light source 4 and high heat conductive insulating sheet 5 equally.The substrate of using in the present embodiment 1 is polyimides (PI) film, is flexible material; Copper Foil connects circuit 2 and is distributed in substrate 1 front in the hot pressing mode, and pastes the insulating paper film to form insulating coating layer 3 on substrate 1, connection circuit 2 surfaces, and the three constitutes LED illuminating line plate main body.Fine aluminium thin slice with high-termal conductivity carries out surface insulation oxidation processes formation high heat conductive insulating sheet 5, and high temperature is welded in the heat dissipation base back side of led light source 4, the shape size of its approximate LED heat dissipation base 4-2 bottom surface of shape size.Have the led light source containing hole by necessarily putting in order on the wiring board main body, led light source 4 is packaged in the wiring board main body, and its heat dissipation base 4-2 passes the led light source containing hole.When not being installed on radiator 7, high heat conductive insulating sheet 5 slightly protrudes from the back side of substrate 1.
LED illuminating line plate module in the present embodiment comprises the led light source 4 of six rated power 1W, and with series system, the linear array formula is arranged and is packaged in flexible LED illuminating line plate module inside.Leave LED connection pad 2-1 on the connection circuit 2 and be connected pad 2-2 with external circuit, pad is exposed to outside the insulating coating layer 3, and LED pin 4-3 is welded in connection circuit 2 respectively with external circuit input line and realizes that circuit are connected.
The described LED illuminating line of present embodiment plate module installs and fixes by strong binding glue-line 6, and strong binding glue-line 6 is attached at substrate 1 back side, and gets out of the way the position of led light source containing hole on the wiring board main body.When not being installed on radiator 7, strong binding glue-line 6 back sides also are covered with one deck protection sheet film.During installation, tear the protection sheet film, LED illuminating line plate can be attached at radiator 7 by strong binding glue-line 6.Because of the wiring board material of main part has certain bending, distortion, Texturized ability, can be applicable to the smooth non-smooth installation surface of the surface being installed and being not more than certain curvature simultaneously.
Shown in Fig. 6 A, Fig. 6 B, two annular in the same way cylindrical installation surfaces that are installed on cylindrical radiator 7 of LED illuminating line plate module.Two LED illuminating line plate module are formed module, the power line positive pole is welded in the positive terminal pad of LED illuminating line plate module one 0-1, module one 0-1 negative terminal pad is connected with module two 0-2 positive terminal pad bonding wires, and module two 0-2 negative terminal pad source of welding current line negative poles are finished module and are electrically connected.
This LED illuminating line template die group is bonded in the installation surface of radiator 7 by strong binding glue-line 6, high heat conductive insulating sheet 5 tightly is attached at radiator 7 surfaces, the heat conduction elargol is filled in the applying slit, and the whole LED lighting module forms the heat dissipation path of " led light source → high heat conductive insulating sheet → heat-conducting medium → radiator → external world "; Because of high heat conductive insulating sheet 5 is welded in LED heat dissipation base 4-2, visual as a whole, so this heat dissipation path is " led light source → heat-conducting medium → radiator → external world "; Slightly protrude from the back side of substrate 1 because of high heat conductive insulating sheet 5, therefore it is the tightst with being connected of radiator 7, be that high heat conductive insulating sheet 5 is the highest with the applying degree of radiator 7, therefore the thickness of filling the heat conduction elargol almost can be ignored, this heat dissipation path can be considered the heat dissipation path of " led light source → radiator → external world ", effectively the heat of diverging LED light source 4 generations.
Claims (10)
1, a kind of high-termal conductivity LED package illumination wiring board, it is characterized in that, be provided with substrate (1), connect circuit (2), insulating coating layer (3), led light source (4) and high heat conductive insulating sheet (5), insulating coating layer (3) covers the surface that is furnished with the substrate (1) that connects circuit (2), and the three constitutes the wiring board main body; Led light source (4) is packaged in this wiring board main body; Its feature is that also high heat conductive insulating sheet (5) invests the heat dissipation base back side of led light source (4); Have several containing holes according to necessarily putting in order on the wiring board main body, led light source (4) is packaged in the wiring board main body, and its heat dissipation base (4-2) passes the containing hole that is provided with on the wiring board main body.
2, high-termal conductivity LED package illumination wiring board as claimed in claim 1 is characterized in that, the conductive film circuit of described connection circuit (2) for having certain toughness and ductility material.
3, high-termal conductivity LED package illumination wiring board as claimed in claim 1 or 2, it is characterized in that, connect circuit (2) and go up in the other pad that leaves of the package position of led light source (4), the pin (4-3) of led light source (4) is welded in by this pad and connects circuit (2).
4, as the described high-termal conductivity LED package illumination of claim 1 to 3 wiring board, it is characterized in that, connect the pad that circuit (2) is gone up and the pin (4-3) of led light source (4) is welded to connect, and with the pad that external circuit is welded to connect, all expose outside insulating coating layer (3).
5, high-termal conductivity LED package illumination wiring board as claimed in claim 1 is characterized in that, described insulating coating layer (3) and flexible base, board (1), connects between the circuit (2) for hot press or coheres and engage.
6, high-termal conductivity LED package illumination wiring board as claimed in claim 1 is characterized in that, described substrate (1) can be rigid substrates, is embodied in thickness even metal thin plate or pcb board.
7, high-termal conductivity LED package illumination wiring board as claimed in claim 1, it is characterized in that, described substrate (1) can be flexible base, board, is embodied in the uniform resin material film of the thickness with certain bending, distortion, crimp property or elastomeric material thin plate or plastic metal film.
8, high-termal conductivity LED package illumination wiring board as claimed in claim 1, it is characterized in that, high heat conductive insulating sheet (5) is attached at heat dissipation base (4-2) back side of led chip (4-1), its shape size is similar to the shape size of heat dissipation base (4-2) bottom surface, is hot press between the two, seccotine is bonding or the high temperature seam.
9, as claim 1 or 8 described high-termal conductivity LED package illumination wiring boards, its feature is that further described high heat conductive insulating sheet (5) carries out surface oxidation, the high-termal conductivity electric insulation thin slice of acquisition for the fine aluminium thin slice with high-termal conductivity.
10, as the described high-termal conductivity LED package illumination of claim 1 to 9 wiring board, it is characterized in that, this LED illuminating line plate can be fixed in radiator (7) surface by riveted joint or frame for movement such as be threaded, also can paste strong binding glue-line (6) at the back side of substrate (1), and adhere to radiator (7) surface by this strong binding glue-line (6), its feature further is, high heat conductive insulating sheet (5) high temperature can also be welded in radiator (7) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201616078U CN201259194Y (en) | 2008-10-08 | 2008-10-08 | LED packaged illumination circuit board of high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201616078U CN201259194Y (en) | 2008-10-08 | 2008-10-08 | LED packaged illumination circuit board of high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201259194Y true CN201259194Y (en) | 2009-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2008201616078U Expired - Fee Related CN201259194Y (en) | 2008-10-08 | 2008-10-08 | LED packaged illumination circuit board of high thermal conductivity |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155667A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
| CN102255008A (en) * | 2011-04-13 | 2011-11-23 | 江苏中科宇泰光能科技有限公司 | Mounting method of Light-Emitting Diode (LED) chip |
| WO2012006834A1 (en) * | 2010-07-14 | 2012-01-19 | 深圳市华星光电技术有限公司 | Backlight module and luminous source encapsulation structure |
| US8288782B2 (en) | 2010-07-14 | 2012-10-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and light-emitting source package structure thereof |
| CN103346145A (en) * | 2013-07-23 | 2013-10-09 | 长兴芯亿微电子科技有限公司 | Flexible substrate packaging structure |
| RU196224U1 (en) * | 2019-08-02 | 2020-02-21 | Юрий Борисович Соколов | Light-emitting structure for an uninsulated driver |
-
2008
- 2008-10-08 CN CNU2008201616078U patent/CN201259194Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012006834A1 (en) * | 2010-07-14 | 2012-01-19 | 深圳市华星光电技术有限公司 | Backlight module and luminous source encapsulation structure |
| US8288782B2 (en) | 2010-07-14 | 2012-10-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and light-emitting source package structure thereof |
| CN102255008A (en) * | 2011-04-13 | 2011-11-23 | 江苏中科宇泰光能科技有限公司 | Mounting method of Light-Emitting Diode (LED) chip |
| CN102155667A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
| CN103346145A (en) * | 2013-07-23 | 2013-10-09 | 长兴芯亿微电子科技有限公司 | Flexible substrate packaging structure |
| CN103346145B (en) * | 2013-07-23 | 2016-01-27 | 长兴芯亿微电子科技有限公司 | A kind of flexible substrate package structure |
| RU196224U1 (en) * | 2019-08-02 | 2020-02-21 | Юрий Борисович Соколов | Light-emitting structure for an uninsulated driver |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu SFT Optoelectronic Science & Technology Co., Ltd. Assignor: Shi Jie Contract record no.: 2010320000141 Denomination of utility model: LED packaged illumination circuit board of high thermal conductivity Granted publication date: 20090617 License type: Exclusive License Record date: 20100226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20151008 |
|
| EXPY | Termination of patent right or utility model |