CN201758491U - High heat-conducting circuit board manufactured by oil printing method - Google Patents
High heat-conducting circuit board manufactured by oil printing method Download PDFInfo
- Publication number
- CN201758491U CN201758491U CN 201020197665 CN201020197665U CN201758491U CN 201758491 U CN201758491 U CN 201758491U CN 201020197665 CN201020197665 CN 201020197665 CN 201020197665 U CN201020197665 U CN 201020197665U CN 201758491 U CN201758491 U CN 201758491U
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- Prior art keywords
- heat
- conducting
- layer
- circuit board
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title abstract description 13
- 238000007639 printing Methods 0.000 title abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 238000005530 etching Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 57
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a high heat-conducting circuit board manufactured by an oil printing method which is used for solving the radiation problem of a heating element on the circuit board. The high heat-conducting circuit board is characterized in that a heat-conducting post is assembled in a predetermined position in the circuit board before forming an electric connection circuit; a conductive layer is then performed by oil printing, thereby etching an electric circuit, which avoids the re-processing after molding the circuit board; the set metal heat-conducting layer can further radiate the heat energy on the heat-conducting post. The high heat-conducting circuit board is featured with good radiation effect, simple operation, simple structure and low cost.
Description
[technical field]
The utility model relates to the printed circuit board (PCB) of electricity field.
[background technology]
Power device generates heat obviously in the course of the work, if can not in time dispel the heat, may damage power device, even causes whole electronic product operation irregularity.With the LED luminous product is example, and it normally is arranged in a large amount of LED concentrated area on the circuit board, and when LED worked long hours, the savings of heat will cause the lost of life of LED, makes the product performance instability.
No. 200810241905.2 applications for a patent for invention of China disclose a kind of radiating circuit substrate that assembles heat sink method and the making of this method at wiring board.The heat sink method of its assembling may further comprise the steps: make at least one through hole in the circuit board; Make cooperate with via clearance heat sink; In heat sink through hole of inserting wiring board; And utilize mould to exert pressure to heat sink, fix in the circuit board until heat sink extrusion.Its radiating circuit substrate that provides comprises wiring board, through hole and heat sink, heat sink being assemblied in the through hole.
Yet only at the heat sink installation on the wiring board of finishing behind the electric wiring, its defective is above-mentioned patented technology: at first, heat sink operation is installed is the independent process after wiring board is finished, increased workload; Secondly, push when heat sink, may damage the electric wiring on the wiring board by mould.We can say that above-mentioned patented technology is fit to the installation of indivedual power devices, is not suitable for the installation of a large amount of power devices of high density, array distribution.In addition, heat heat sink in the above-mentioned patented technology does not further conduct, and radiating effect is limited.
Along with further developing and the development of the Highgrade integration of electronic product of semiconductor industry, the heat radiation solution of heater element is still waiting further lifting on the circuit board.
[utility model content]
The purpose of this utility model is to simplify the manufacture method of high-thermal conductivity circuit board and obtain corresponding high-thermal conductivity circuit board.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the mimeograph heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer is that the mimeograph conductive layer forms through etching; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of mimeograph heat-conducting layer.
A kind of high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer on metal conducting layer and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer on metal heat-conducting layer and surface thereof; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer and the heat conduction of mimeograph heat-conducting layer.
The method of the making high-thermal conductivity circuit board that the utility model provides, pass through general arrangement, before formation is electrically connected circuit, heating column is assemblied in precalculated position in the circuit board, do not influence subsequent handling (etching), avoid the processing once more behind the circuit board molding, the metal heat-conducting layer that is provided with can further leave the heat on the heating column, and radiating effect is better, and easy and simple to handle, simple in structure, cost is low.
[description of drawings]
Figure 1A-Fig. 1 F is the embodiment one that makes the utility model high-thermal conductivity circuit board.
Fig. 2 A-Fig. 2 F is the embodiment two that makes the utility model high-thermal conductivity circuit board.
Fig. 3 A-Fig. 3 E is the embodiment three that makes the utility model high-thermal conductivity circuit board.
Fig. 4 is the embodiment four that makes the utility model high-thermal conductivity circuit board.
[embodiment]
Embodiment one
See also Figure 1A-Fig. 1 F, the high-thermal conductivity circuit board that present embodiment provides is made as follows:
(1) on insulated base material layer 1 (can be FR4 sheet material or BT sheet material), offers some through holes 11; (2) make some metal heat-conducting posts 4 that cooperate with through hole; (3) with in metal heat-conducting post 4 receiving through-holes 11, and hot pressing, curing; (4) insulated base material layer 1 upper surface mimeograph conductive layer 2, lower surface mimeograph heat-conducting layer 3, conductive layer 2 and heat-conducting layer 3 are silver oil, copper is oily or material such as carbon oil; (5), form and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 1 E) at the unnecessary electric conducting material of insulated base material layer 1 upper surface etching; The method that present embodiment provides can further include step (6): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (7): wiring board front silk-screen character or mark.
It should be noted that the described circuit that is electrically connected is used to electrically connect heater members, also can play certain mechanical support effect simultaneously; Described pad 22 is used for the mechanical connection heater members, and is used for indirect thermal conduction, so during etching, pad 22 is not necessary reservation, can an etching formation be electrically connected circuit, and make heater members be set directly at metal heat-conducting post top, form heat conduction and connect.Certain formation of etching simultaneously is electrically connected circuit and pad is a preferred plan.
The high-thermal conductivity circuit board that embodiment 1 makes is shown in Fig. 1 F, and it comprises: insulated base material layer 1, the mimeograph conductive layer 2 that is positioned at the insulated base material layer upper surface, the mimeograph heat-conducting layer 3 that is positioned at the insulated base material layer lower surface and metal heat-conducting post 4; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place; Described metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element (not shown) heat conduction that pre-sets, and the lower end cooperates with 3 heat conduction of mimeograph heat-conducting layer.Comprise the electric wiring layer of insulated base material layer 1, insulated base material layer upper surface, the mimeograph heat-conducting layer 3 and the metal heat-conducting post 4 of insulated base material layer lower surface; The electric wiring layer is that mimeograph conductive layer 2 forms through etching; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place, and metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with 3 heat conduction of mimeograph heat-conducting layer.
Embodiment two
See also Fig. 2 A-Fig. 2 F, the manufacture method of the high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) provides insulated base material layer 1 (can be FR4 sheet material or BT sheet material),, thereby constitute one-side band metal level sheet material at the insulated base material layer 1 lower surface metal heat-conducting layer 3 that is sticked; (2) on one-side band metal level sheet material, offer some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11, hot pressing, curing; (5) at insulated base material layer 1 upper surface mimeograph conductive layer 2, conductive layer 2 is a silver oil, copper is oily or material such as carbon oil; (6) the unnecessary electric conducting material of insulated base material layer 1 upper surface etching forms and is electrically connected circuit and some pads 22 (pad only is shown among Fig. 2 E); The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment two makes has identical structure with embodiment one, repeats no more herein.
Embodiment three
See also Fig. 3 A-Fig. 3 E, the manufacture method of the high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) provide insulated base material layer 1 (can be FR4 sheet material or BT sheet material), at the insulated base material layer 1 upper surface metal conducting layer 51 that is sticked, the lower surface metal heat-conducting layer 61 that is sticked, thus constitute double-sided belt metal level sheet material; (2) on double-sided belt metal level sheet material, bore some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11, hot pressing, curing; (5),, make the contact of metal heat-conducting post and metal level tightr at metal heat-conducting laminar surface and then mimeograph heat-conducting layer 62 at metal conducting layer and then mimeograph conductive layer 52; (6), form and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 1 C) at the unnecessary electric conducting material of insulated base material layer 1 upper surface etching; The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment three makes shown in Fig. 3 E, its: comprise insulated base material layer 1, be attached at the metal conducting layer 51 of insulated base material layer upper surface, the mimeograph conductive layer 52 that is positioned at metal conducting layer 51 surfaces, the metal heat-conducting layer 61 that is attached at the insulated base material layer lower surface, the mimeograph heat-conducting layer 3 that is positioned at metal heat-conducting layer 61 surface and metal heat-conducting post 4; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place; Described metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element (not shown) heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer 61 and 62 heat conduction of mimeograph heat-conducting layer.Comprise the electric wiring layer of insulated base material layer 1, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post 4 of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer 52 on metal conducting layer 51 and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer 62 on metal heat-conducting layer 61 and surface thereof; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place, and metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer 61 and 62 heat conduction of mimeograph heat-conducting layer.
Embodiment four
See also Fig. 4, embodiment four is with the difference of embodiment one, embodiment two or embodiment three: insulated base material layer is to contain glue non conductive substrate 33 lamination riveteds by some epoxy prepregs (PP sheet), glued membrane or other to form.
Above embodiment only for fully open unrestricted the utility model, is understandable that except that LED, other heater elements exist heat dissipation problem to need to solve equally, for example high power transistor, thyristor, bidirectional thyristor, GTO, MOSFET, IGBT etc.And the metal of being mentioned in the present embodiment is preferably copper, certainly, also can be other metal materials.Described metal heat-conducting post is before hot pressing, and its diameter is less than described through-hole diameter, and length is greater than described through hole length; After hot pressing, its volume is filled described through hole volume just.
Claims (4)
1. a high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the mimeograph heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer is that the mimeograph conductive layer forms through etching; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of mimeograph heat-conducting layer.
2. high-thermal conductivity circuit board according to claim 1 is characterized in that: the insulated base material layer upper surface is provided with pad, and this pad is that described mimeograph conductive layer forms through etching, is positioned at metal heat-conducting post top.
3. a high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer on metal conducting layer and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer on metal heat-conducting layer and surface thereof; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer and the heat conduction of mimeograph heat-conducting layer.
4. high-thermal conductivity circuit board according to claim 3 is characterized in that: the insulated base material layer upper surface is provided with pad, and this pad is that the mimeograph conductive layer on metal conducting layer and surface thereof forms through etching, is positioned at metal heat-conducting post top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020197665 CN201758491U (en) | 2010-05-12 | 2010-05-12 | High heat-conducting circuit board manufactured by oil printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020197665 CN201758491U (en) | 2010-05-12 | 2010-05-12 | High heat-conducting circuit board manufactured by oil printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201758491U true CN201758491U (en) | 2011-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020197665 Expired - Fee Related CN201758491U (en) | 2010-05-12 | 2010-05-12 | High heat-conducting circuit board manufactured by oil printing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN201758491U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384442A (en) * | 2013-03-13 | 2013-11-06 | 陈夏新 | Heat conducting structure with electronic power element adhered on circuit board |
| CN104425414A (en) * | 2013-09-09 | 2015-03-18 | 矽品精密工业股份有限公司 | Semiconductor device and method for fabricating the same |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
-
2010
- 2010-05-12 CN CN 201020197665 patent/CN201758491U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384442A (en) * | 2013-03-13 | 2013-11-06 | 陈夏新 | Heat conducting structure with electronic power element adhered on circuit board |
| CN104425414A (en) * | 2013-09-09 | 2015-03-18 | 矽品精密工业股份有限公司 | Semiconductor device and method for fabricating the same |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
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| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20130131 Granted publication date: 20110309 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20130731 Granted publication date: 20110309 |
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| PP01 | Preservation of patent right |
Effective date of registration: 20130731 Granted publication date: 20110309 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20140131 Granted publication date: 20110309 |
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| PD01 | Discharge of preservation of patent | ||
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20140131 Granted publication date: 20110309 |
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| PD01 | Discharge of preservation of patent |
Date of cancellation: 20140731 Granted publication date: 20110309 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110309 Termination date: 20130512 |