CN201788966U - Non-thermoelectric separated metal substrate and light emitting component with same - Google Patents
Non-thermoelectric separated metal substrate and light emitting component with same Download PDFInfo
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- CN201788966U CN201788966U CN2010202753313U CN201020275331U CN201788966U CN 201788966 U CN201788966 U CN 201788966U CN 2010202753313 U CN2010202753313 U CN 2010202753313U CN 201020275331 U CN201020275331 U CN 201020275331U CN 201788966 U CN201788966 U CN 201788966U
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- metal plate
- metal substrate
- dielectric layer
- separate type
- type metal
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Abstract
Disclosed are a non-thermoelectric separated metal substrate and a light emitting component with the same. The non-thermoelectric separated metal substrate used for reducing the temperature of a heating component comprises a circuit layer, a dielectric layer, a patterning metal plate and at least one thermal conducting hole, the dielectric layer is arranged below the circuit layer, the patterning metal plate is arranged below the dielectric layer, the thermal conducting holes penetrating through the circuit layer and the dielectric layer are connected with the patterning metal plate, and each thermal conducting hole is provided with a thermal conducting member contacting with the patterning metal plate. When the heating component is arranged above the circuit layer, heat generated by the heating component can be transferred to the patterning metal plate by the thermal conducting member, and the heat is dissipated by the aid of the patterning metal plate to achieve the effect of reducing the temperature of the heating component.
Description
Technical field
The utility model relates to a kind of non-thermoelectric separate type metal substrate and has the luminescence component of this metal substrate, particularly a kind of non-thermoelectric separate type metal substrate and luminescence component of strengthening the heat generating component heat radiation.
Background technology
Metal substrate (Metal Core PCB, MCPCB) because of cost is cheap, thus often be used heat-radiating substrate as heat generating component, however the heat conduction path of metal substrate all must pass through dielectric layer, and it is required to meet heat radiation for the heat generating component of need high-cooling property.In the prior art, a kind of solution is to use the high dielectric layer of thermal diffusivity instead, and quickening conduction heat to metallic plate, but its cost will significantly improve, and radiating effect is still less than the thermal diffusivity of copper, aluminium or alloy.
Along with being showing improvement or progress day by day of technical development, light-emitting diode (Light-Emitting Diode, LED) brightness and luminous efficiency are significantly made a leapleap forward, and especially (High-brightness Light-Emitting Diode HBLED) also has been applied in each field high brightness LED.Yet, its power consumption and caloric value also improve thereupon, if in the time of can't promptly heating being excluded, then will cause the brightness decline of light-emitting diode and the deterioration of acceleration component, so the heat dissipation of heat-radiating substrate is the important topic of light-emitting diode.
Therefore, be necessary to provide a kind of non-thermoelectric separate type metal substrate and luminescence component, to improve the existing problem of prior art.
The utility model content
Main purpose of the present utility model is to provide a kind of non-thermoelectric separate type metal substrate and luminescence component that increases thermal diffusivity, particularly a kind of non-thermoelectric separate type metal substrate and luminescence component with blind hole.
For reaching above-mentioned purpose, non-thermoelectric separate type metal substrate of the present utility model is used to reduce the temperature of a heat generating component, this non-thermoelectric separate type metal substrate comprises a line layer, a dielectric layer, a pattern metal plate and at least one thermal hole, and this dielectric layer is arranged on the below of this line layer; This pattern metal plate is arranged on the below of this dielectric layer; And this at least one thermal hole wears this line layer and this dielectric layer and is connected with this pattern metal plate, and this at least one thermal hole is provided with a heat conduction member, and this heat conduction member contacts with this pattern metal plate.The below of this patterned metal layer is provided with insulating barrier.
In an embodiment of the present utility model, heat conduction member comprises electroplates filling perforation or metal cream member.
For reaching above-mentioned purpose, luminescence component of the present utility model comprises a heat generating component, a heat conductive pad and a non-thermoelectric separate type metal substrate, and this heat generating component is arranged at the top of this heat conductive pad; This non-thermoelectric separate type metal substrate comprises a line layer, a dielectric layer, a pattern metal plate and at least one thermal hole, and this heat conductive pad is arranged at the top of this line layer; This dielectric layer is arranged on the below of this line layer; This pattern metal plate is arranged on the below of this dielectric layer; And this at least one thermal hole wears this line layer and this dielectric layer and is connected with this pattern metal plate, and this at least one thermal hole is provided with a heat conduction member, and this heat conduction member contacts with this pattern metal plate.The below of this patterned metal layer is provided with insulating barrier.
In an embodiment of the present utility model, heat conduction member comprises electroplates filling perforation or metal cream member.
By this, when hot assembly placed the top of line layer, the heat that heat generating component produced can conduct to the pattern metal plate via heat conduction member, dispelled the heat by the pattern metal plate, to reach the effect of the temperature that reduces heat generating component.
Description of drawings
Fig. 1 is the flow chart of steps about an embodiment of the manufacture method of non-thermoelectric separate type metal substrate of the present utility model.
Fig. 2 to Fig. 5 is the schematic diagram about an embodiment of the manufacture method of non-thermoelectric separate type metal substrate of the present utility model.
Fig. 6 is the schematic diagram about an embodiment of luminescence component of the present utility model.
The primary clustering symbol description:
Non-thermoelectric separate type metal substrate 1 pattern metal plate 131
Anodal 1111 heat conduction members 141
Embodiment
For above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, cited below particularlyly go out preferred embodiment, and cooperate appended accompanying drawing, be described in detail below.
Below please in the lump with reference to figure 1 and Fig. 2 to Fig. 5, Fig. 1 is the flow chart of steps about an embodiment of the manufacture method of non-thermoelectric separate type metal substrate of the present utility model, and Fig. 2 to Fig. 5 is the schematic diagram about an embodiment of the manufacture method of non-thermoelectric separate type metal substrate of the present utility model.It is noted that, the schematic diagram of embodiment of the present utility model is the schematic diagram after the simplification, the manufacture method of non-thermoelectric separate type metal substrate of the present utility model only is described in a schematic way, the mode that its shown assembly is non-when being actual enforcement, component count, shape and dimension scale during its actual enforcement is an optionally design, and its assembly layout form can be more complicated.
In an embodiment of the present utility model, non-thermoelectric separate type metal substrate is a metal base printed circuit board.
As shown in Figure 1, the utility model at first carries out step S71: metallic plate is provided.
As shown in Figure 2, in an embodiment of the present utility model, the material of metallic plate 13 is a metallic copper, but the utility model is not as limit; For instance, the material of metallic plate 13 also can be metallic aluminium or the good metal of other thermal conductivity.
In an embodiment of the present utility model, the one side of metallic plate 13 pastes dielectric layer 12, and the one side of dielectric layer 12 pastes copper layer 11.
Then carry out step S72: form at least one thermal hole to connect copper layer and metallic plate.
As shown in Figure 3, in an embodiment of the present utility model, the manufacture method of non-thermoelectric separate type metal substrate of the present utility model is made at least one thermal hole 14 and is passed copper layer 11 and dielectric layer 12.In an embodiment of the present utility model, thermal hole 14 is a blind hole, but the utility model is not as limit.In an embodiment of the present utility model, the production method of thermal hole 14 can be light shield collocation laser drill, directly laser drill (Direct Laser Drilling, DLD) or machine drilling, but the utility model is not as limit.
Then carry out step S73: in thermal hole, form heat conduction member.
As shown in Figure 4, in an embodiment of the present utility model, the manufacture method of non-thermoelectric separate type metal substrate of the present utility model is to insert heat conduction member 141 in thermal hole 14, heat conduction member 141 is a metal cream, by this, heat conduction member 141 is connected with copper layer 11 and metallic plate 13, but the utility model is not as limit.For instance, the manufacture method of non-thermoelectric separate type metal substrate of the present utility model can also be electroplated filling perforation, electroplated filling perforation collocation metal cream, (PinThrough Hole, PTH) collocation metallic copper or through hole mounting means collocation metal cream etc. is to form heat conduction member 141 for the through hole mounting means.
Carry out step S74 at last: carry out the patterned circuit making.
As shown in Figure 5, in an embodiment of the present utility model, the manufacture method of non-thermoelectric separate type metal substrate of the present utility model is for carrying out the patterned circuit making to copper layer 11 and metallic plate 13 respectively, to form line layer 111 and pattern metal plate 131.In an embodiment of the present utility model, line layer 111 comprises positive pole 1111 and negative pole 1112, and line layer 111 zones with thermal hole 14 are the main thermal conductivity region for heat generating component, but the utility model is not as limit.In an embodiment of the present utility model, pattern metal plate 131 can etching or the mode of punching press insulate anodal 1111 and negative pole 1112, but the utility model is not as limit.In an embodiment of the present utility model, pattern metal plate 131 comprises insulating barrier 1311.
As shown in Figure 5, by above-mentioned manufacture method, non-thermoelectric separate type metal substrate 1 of the present utility model comprises line layer 111, dielectric layer 12, pattern metal plate 131 and at least one thermal hole 14.Dielectric layer 12 is arranged on the below of line layer 111; Pattern metal plate 131 is arranged on the below of dielectric layer 12, and the below of patterned metal layer 131 is provided with insulating barrier 1311; And at least one thermal hole 14 wears line layer 111 and dielectric layer 12 and is connected with pattern metal plate 131, and at least one thermal hole 14 is provided with heat conduction member 14, and heat conduction member 141 contacts with pattern metal plate 131.By this, when heat generating component (Fig. 5 does not show, please refer to Fig. 6) when placing the top of line layer 111, the heat that heat generating component produced can conduct to pattern metal plate 131 via heat conduction member 14, to reach the effect of the temperature that reduces heat generating component.
Next please refer to Fig. 6, Fig. 6 is the schematic diagram about an embodiment of luminescence component of the present utility model.
As shown in Figure 6, in an embodiment of the present utility model, luminescence component 2 comprises heat generating component 21, heat conductive pad 3 and non-thermoelectric separate type metal substrate 1.Heat generating component 21 is arranged at the top of heat conductive pad 3.Non-thermoelectric separate type metal substrate 1 comprises line layer 111, dielectric layer 12, pattern metal plate 131 and at least one thermal hole 14.Heat conductive pad 3 is arranged at the top of line layer 111, and in an embodiment of the present utility model, heat conductive pad 3 provides heat generating component 21 to be connected with line layer 111.Dielectric layer 12 is arranged on the below of line layer 111.Pattern metal plate 131 is arranged on the below of dielectric layer 12, and the below of patterned metal layer 131 is provided with insulating barrier 1311.At least one thermal hole 14 wears line layer 111 and dielectric layer 12 and is connected with pattern metal plate 131.At least one thermal hole 14 is provided with heat conduction member 141, and heat conduction member 141 contacts with pattern metal plate 131.
By this, when heat generating component 21 placed the top of line layer 111, the heat that heat generating component 21 is produced can conduct to pattern metal plate 131 via heat conduction member 141, dispelled the heat by pattern metal plate 131, to reach the effect of the temperature that reduces luminescence component.
In an embodiment of the present utility model, heat generating component 21 is a light-emitting diode, but the utility model is not as limit.
To sum up institute is old, and no matter the utility model everywhere all shows it totally different in the feature of known technology with regard to purpose, means and effect, earnestly asks the auditor to perceive, and grants quasi patent early, makes Jiahui society, and the true feeling moral just.Only it should be noted that above-mentioned many embodiment give an example for convenience of explanation, the utility model interest field required for protection should be as the criterion so that the scope of claims is described naturally, but not only limits to the foregoing description.
Claims (12)
1. non-thermoelectric separate type metal substrate is used to reduce the temperature of a heat generating component, it is characterized in that this non-thermoelectric separate type metal substrate comprises:
One line layer;
One dielectric layer, this dielectric layer is arranged on the below of this line layer;
One pattern metal plate, this pattern metal plate is arranged on the below of this dielectric layer; And
At least one thermal hole, this at least one thermal hole wear this line layer and this dielectric layer and are connected with this pattern metal plate, and this at least one thermal hole is provided with a heat conduction member, and this heat conduction member contacts with this pattern metal plate.
2. non-thermoelectric separate type metal substrate as claimed in claim 1 is characterized in that this at least one thermal hole wears this line layer and this dielectric layer with the through hole mounting means.
3. non-thermoelectric separate type metal substrate as claimed in claim 1 or 2 is characterized in that, this heat conduction member comprises that one electroplates a filling perforation or a metal cream member.
4. non-thermoelectric separate type metal substrate as claimed in claim 1 is characterized in that the below of this pattern metal plate is provided with an insulating barrier.
5. non-thermoelectric separate type metal substrate as claimed in claim 1 is characterized in that this heat generating component comprises an integrated circuit package or a light-emitting diode.
6. non-thermoelectric separate type metal substrate as claimed in claim 1 is characterized in that, this non-thermoelectric separate type metal substrate comprises a metal base printed circuit board.
7. luminescence component, this luminescence component comprises:
One heat generating component;
One heat conductive pad, wherein this heat generating component is arranged at the top of this heat conductive pad;
One non-thermoelectric separate type metal substrate is characterized in that, this non-thermoelectric separate type metal substrate comprises:
One line layer, wherein this heat conductive pad is arranged at the top of this line layer;
One dielectric layer, this dielectric layer is arranged on the below of this line layer;
One pattern metal plate, this pattern metal plate is arranged on the below of this dielectric layer; And
At least one thermal hole, this at least one thermal hole wear this line layer and this dielectric layer and are connected with this pattern metal plate, and this at least one thermal hole is provided with a heat conduction member, and this heat conduction member contacts with this pattern metal plate.
8. luminescence component as claimed in claim 7 is characterized in that, this at least one thermal hole wears this line layer and this dielectric layer with the through hole mounting means.
9. as claim 7 or 8 described luminescence components, it is characterized in that this heat conduction member comprises that one electroplates a filling perforation or a metal cream member.
10. luminescence component as claimed in claim 7 is characterized in that, this pattern metal plate below is provided with an insulating barrier.
11. luminescence component as claimed in claim 7 is characterized in that, this heat generating component comprises a light-emitting diode.
12. luminescence component as claimed in claim 7 is characterized in that, this non-thermoelectric separate type metal substrate comprises a metal base printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202753313U CN201788966U (en) | 2010-07-29 | 2010-07-29 | Non-thermoelectric separated metal substrate and light emitting component with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202753313U CN201788966U (en) | 2010-07-29 | 2010-07-29 | Non-thermoelectric separated metal substrate and light emitting component with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201788966U true CN201788966U (en) | 2011-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202753313U Expired - Lifetime CN201788966U (en) | 2010-07-29 | 2010-07-29 | Non-thermoelectric separated metal substrate and light emitting component with same |
Country Status (1)
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|---|---|
| CN (1) | CN201788966U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013082874A1 (en) * | 2011-12-05 | 2013-06-13 | 深圳市华星光电技术有限公司 | Circuit board structure and manufacturing method thereof |
| CN106572594A (en) * | 2016-11-15 | 2017-04-19 | 智恩电子(大亚湾)有限公司 | Convective high heat dissipation circuit board |
| CN106658942A (en) * | 2016-11-15 | 2017-05-10 | 智恩电子(大亚湾)有限公司 | High-heat dissipation circuit board |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN111276589A (en) * | 2018-12-05 | 2020-06-12 | 陈冠宇 | Package carrier and light emitting device |
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
| TWI743618B (en) * | 2019-12-11 | 2021-10-21 | 陳冠宇 | Package carrier and light emitting device |
-
2010
- 2010-07-29 CN CN2010202753313U patent/CN201788966U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013082874A1 (en) * | 2011-12-05 | 2013-06-13 | 深圳市华星光电技术有限公司 | Circuit board structure and manufacturing method thereof |
| CN106572594A (en) * | 2016-11-15 | 2017-04-19 | 智恩电子(大亚湾)有限公司 | Convective high heat dissipation circuit board |
| CN106658942A (en) * | 2016-11-15 | 2017-05-10 | 智恩电子(大亚湾)有限公司 | High-heat dissipation circuit board |
| CN106572594B (en) * | 2016-11-15 | 2022-01-25 | 智恩电子(大亚湾)有限公司 | Convection type high-heat-dissipation circuit board |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN111276589A (en) * | 2018-12-05 | 2020-06-12 | 陈冠宇 | Package carrier and light emitting device |
| CN111276589B (en) * | 2018-12-05 | 2021-06-22 | 陈冠宇 | Package carrier and light emitting device |
| TWI743618B (en) * | 2019-12-11 | 2021-10-21 | 陳冠宇 | Package carrier and light emitting device |
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110406 |