CN203340400U - Printed circuit board with heat conduction column for LED installation - Google Patents
Printed circuit board with heat conduction column for LED installation Download PDFInfo
- Publication number
- CN203340400U CN203340400U CN201320101357XU CN201320101357U CN203340400U CN 203340400 U CN203340400 U CN 203340400U CN 201320101357X U CN201320101357X U CN 201320101357XU CN 201320101357 U CN201320101357 U CN 201320101357U CN 203340400 U CN203340400 U CN 203340400U
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- heating column
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model provides a printed circuit board with a heat conduction column for LED installation, comprising an FR-4 substrate and a copper layer circuit formed on the surface of the FR-4substrate. At least one through hole is configured on the printed circuit board; a mental heat conduction column is arranged within the through hole; the height of the mental heat conduction column is identical to the thickness of the printed circuit board; and the mental heat conduction column is insulated from the copper layer circuit by electric insulation. By positioning the heat conduction column in the position where an LED lamp is installed on the FR-4 printed circuit board in the prior art, the heat generated by the LED lamp can be fully and promptly discharged out of the printed circuit board by using mental high heat conduction efficiency, so that the operation temperature of the LED can be maintained at a low level and the service life and reliability of the LED lamp can also be improved.
Description
Technical field
The utility model relates to the printed-board technology field, is specifically related to a kind of printed circuit board (PCB) with heating column of installing for LED.
Background technology
In recent years, LED light source, due to the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption, is widely applied in various fields.
Along with the development of LED lighting technology, more and more for the quantity of the LED that carries on the printed circuit board (PCB) that LED is installed, power is increasing.If the heat that printed circuit board (PCB) can not produce LED is derived in time, the heat run-up that LED produces makes its operational environment change to the high temperature direction, cause LED that the problems such as colour cast, brightness reduction, shortening in useful life occur, even there will be fault immediately.Therefore, for life-span and the reliability that guarantees LED, must make the timely dissipation of heat produced go out, this just has higher requirement to the heat conductivility of printed circuit board (PCB).Yet the thermal conductivity of traditional FR-4 printed circuit board (PCB) is only the 0.40W/mK left and right, can't meet the demand of existing LED to the heat conduction of printed circuit plate hight.
The utility model content
In view of this, be necessary the problem of mentioning for background technology, the printed circuit board (PCB) that provides a kind of heat dispersion better to install for LED.
The purpose of this utility model is achieved through the following technical solutions:
A kind of printed circuit board (PCB) with heating column of installing for LED, it comprises:
The FR-4 substrate;
Be formed at the copper sandwich circuit on a surface of described FR-4 substrate;
It is characterized in that:
Described printed circuit board (PCB) is provided with at least one through hole run through, be fixedly installed a metal guide plume in each described through hole, the height of described metal guide plume is identical with the thickness of described printed circuit board (PCB), electric insulation between described metal guide plume and described copper sandwich circuit.
The thermal conductivity of described metal guide plume is greater than 150W/mK.
Described metal guide plume is copper heating column.
Described metal guide plume is aluminium matter heating column, this aluminium matter heating column for electroplating copper, nickel, tin, silver or the golden thin layer of the weldability for improving aluminium matter heating column on the end face of mounted LED lamp bulb.
Individual layer or the double-layer printing circuit board of described printed circuit board (PCB) for being formed by the described FR-4 base plate structure of one deck.
Described printed circuit board (PCB) is multilayer board, and described multilayer board comprises two-layer above described FR-4 substrate, bonding by adhesive layer between adjacent described FR-4 substrate.
The quantity of described through hole and described metal guide plume is more than two.
Compared with prior art, the utility model possesses following advantage:
The utility model arranges the metal guide plume by the LED lamp pearl installation site at existing FR-4 printed circuit board (PCB), utilize the high heat conductance of metal, the heat produced while fully LED lamp pearl being worked in time, conducts to outside printed circuit board (PCB), can make the working temperature of LED maintain reduced levels, and can improve useful life and the reliability of LED lamp pearl.
The accompanying drawing explanation
Fig. 1 is the cross-sectional view of the utility model embodiment mono-;
Fig. 2 is the cross-sectional view of the utility model embodiment bis-;
Fig. 3 is the cross-sectional view of the utility model embodiment tri-;
Fig. 4 is the cross-sectional view of the utility model embodiment tetra-.
Embodiment
Embodiment mono-:
As shown in Figure 1, the printed circuit board (PCB) with heating column of installing for LED of the present embodiment is the single-layer printed circuit plate, and it comprises: a FR-4 substrate 10; The copper sandwich circuit 20 formed on a surface of described FR-4 substrate 10; Described FR-4 substrate 10 is provided with two through holes 11, two heating columns 30 are fixedly installed on respectively in two through holes 11, the height of described two heating columns 30 is all identical with the thickness of described printed circuit board (PCB), with the thickness of described FR-4 substrate 10 and described copper sandwich circuit 20 and identical.
Described heating column 30 is copper heating column, between itself and described copper sandwich circuit 20, has certain distance to guarantee electric insulation between the two.
Be appreciated that described heating column also can be prepared from by other metal materials such as aluminium, silver, the preparation of metals that preferably by thermal conductivity, is greater than 150W/mK forms.A printed circuit board (PCB) can arrange one or more heating columns, several preparations in the metal materials such as copper, aluminium, silver respectively of a plurality of heating columns in same printed circuit board (PCB).When heating column forms by aluminum is standby, can be at the aluminium heating column for electro-coppering on the end face of mounted LED lamp bulb, nickel, tin, silver or golden thin layer to improve the weldability of aluminium heating column.
Embodiment bis-:
As shown in Figure 2, the present embodiment provides a kind of Application Example one LED light source module that described printed circuit board (PCB) is made, and it comprises printed circuit board (PCB) as shown in Figure 1 and is individually fixed in the unidirectional end face of described two heating columns 30 the two LED lamp pearls 40 that are electrically connected with described copper sandwich circuit 20 by welding or bonding mode.
Described LED light source module is fixedly connected on the radiator of lighting device usually, and therefore an end of described copper heating column 30 is connected with described LED lamp pearl 40, and the other end is connected with described radiator.
Due to the thermal conductivity of copper up to 300-400W/mK, therefore in the present embodiment, the thermal resistance between LED lamp pearl 40 and radiator is very little, the heat produced when LED lamp pearl 40 is luminous can conduct to the radiator be connected with printed circuit board (PCB) in time, fully by described copper heating column 30, make the working temperature of LED lamp pearl 40 maintain reduced levels, and can improve useful life and the reliability of LED lamp pearl 40.
Embodiment tri-:
As shown in Figure 3, the present embodiment provides the another kind of printed circuit board (PCB) with heating column of installing for LED, and it is one or four layer printed circuit boards, and it comprises the two-layer two-sided FR-4 substrate 100 that all is covered with copper sandwich circuit 200; Two FR-4 substrates 100 connect as one by a dielectric adhesive layer 600; Between each layer of copper sandwich circuit 200, by via hole 500, be electrically connected; Offer two through hole 110, two heating columns 300 on described printed circuit board (PCB) and be fixedly installed on respectively in described two through holes 110, the height of described heating column 300 is identical with the thickness of described printed circuit board (PCB).
All there is certain distance between described two heating columns 300 and all copper sandwich circuit 200 so that electric insulation between the two.
Similar with embodiment mono-, described two heating columns 300 can be copper, also can be prepared from by other metal materials such as aluminium, silver, and the preparation of metals that preferably by thermal conductivity, is greater than 150 W/mK forms.Several preparations in the metal materials such as copper, aluminium, silver respectively of a plurality of heating columns in same printed circuit board (PCB).When heating column forms by aluminum is standby, can be at the aluminium heating column for electro-coppering on the end face of mounted LED lamp bulb, nickel, tin, silver or golden thin layer to improve the weldability of aluminium heating column.
Embodiment tetra-:
The present embodiment provides a kind of Application Example three LED light source module prepared by described printed circuit board (PCB), as shown in Figure 4, it comprises: printed circuit board (PCB) as shown in Figure 3 and the two LED lamp pearls 400 that are individually fixed in the same end face of described two heating columns 300 and all are electrically connected with described copper sandwich circuit 200.
Easily understand, printed circuit board (PCB) of the present utility model can also be the printed circuit board (PCB) of other numbers of plies.
Claims (7)
1. the printed circuit board (PCB) with heating column of installing for LED, it comprises:
The FR-4 substrate;
Be formed at the copper sandwich circuit of described FR-4 substrate surface;
It is characterized in that:
Described printed circuit board (PCB) is provided with at least one through hole run through, be fixedly installed a metal guide plume in each described through hole, the height of described metal guide plume is identical with the thickness of described printed circuit board (PCB), electric insulation between described metal guide plume and described copper sandwich circuit.
2. the printed circuit board (PCB) with heating column of installing for LED according to claim 1, it is characterized in that: the thermal conductivity of described metal guide plume is greater than 150W/mK.
3. the printed circuit board (PCB) with heating column of installing for LED according to claim 2, it is characterized in that: described metal guide plume is copper heating column.
4. the printed circuit board (PCB) with heating column of installing for LED according to claim 2, it is characterized in that: described metal guide plume is aluminium matter heating column, this aluminium matter heating column for electroplating copper, nickel, tin, silver or the golden thin layer of the weldability for improving aluminium matter heating column on the end face of mounted LED lamp bulb.
5. the printed circuit board (PCB) with heating column of installing for LED according to claim 1, is characterized in that: individual layer or the double-layer printing circuit board of described printed circuit board (PCB) for being formed by the described FR-4 base plate structure of one deck.
6. the printed circuit board (PCB) with heating column of installing for LED according to claim 1, it is characterized in that: described printed circuit board (PCB) is multilayer board, described multilayer board comprises two-layer above described FR-4 substrate, bonding by adhesive layer between adjacent described FR-4 substrate.
7. the printed circuit board (PCB) with heating column of installing for LED according to claim 1, it is characterized in that: the quantity of described through hole and described metal guide plume is more than two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320101357XU CN203340400U (en) | 2013-03-06 | 2013-03-06 | Printed circuit board with heat conduction column for LED installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320101357XU CN203340400U (en) | 2013-03-06 | 2013-03-06 | Printed circuit board with heat conduction column for LED installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203340400U true CN203340400U (en) | 2013-12-11 |
Family
ID=49709050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320101357XU Expired - Fee Related CN203340400U (en) | 2013-03-06 | 2013-03-06 | Printed circuit board with heat conduction column for LED installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203340400U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874223A (en) * | 2017-12-05 | 2019-06-11 | 同泰电子科技股份有限公司 | Flexible circuitry plate structure that can be thermally conductive |
| CN110429071A (en) * | 2019-08-13 | 2019-11-08 | 丰鹏创科科技(珠海)有限公司 | Power device mould group and preparation method thereof |
-
2013
- 2013-03-06 CN CN201320101357XU patent/CN203340400U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874223A (en) * | 2017-12-05 | 2019-06-11 | 同泰电子科技股份有限公司 | Flexible circuitry plate structure that can be thermally conductive |
| CN110429071A (en) * | 2019-08-13 | 2019-11-08 | 丰鹏创科科技(珠海)有限公司 | Power device mould group and preparation method thereof |
| CN110429071B (en) * | 2019-08-13 | 2021-09-21 | 丰鹏创科科技(珠海)有限公司 | Power device module and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |