CN210381441U - High-temperature-resistant circuit board - Google Patents
High-temperature-resistant circuit board Download PDFInfo
- Publication number
- CN210381441U CN210381441U CN201920953616.9U CN201920953616U CN210381441U CN 210381441 U CN210381441 U CN 210381441U CN 201920953616 U CN201920953616 U CN 201920953616U CN 210381441 U CN210381441 U CN 210381441U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- integrated circuit
- heat
- exchange tube
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000003973 paint Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000498 cooling water Substances 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high temperature resistant circuit board, including first integrated circuit board and second integrated circuit board, first integrated circuit board is located the top of second integrated circuit board, and four corner position departments of first integrated circuit board and second integrated circuit board run through jointly has the heat conduction copper post, the upper and lower both ends of heat conduction copper post have all screwed locking bolt, the grafting of the inside equidistance of first integrated circuit board and second integrated circuit board has a plurality of heat exchange tube, all the front side of heat exchange tube is connected with into water jointly and is responsible for, all the rear side of heat exchange tube is connected with out water jointly and is responsible for. Through a plurality of heat exchange tube of the internal design at first integrated circuit board and second integrated circuit board, be responsible for to the leading-in cooling water of heat exchange tube inside through intaking, recycle the water and be responsible for the water of deriving the heat transfer, the utility model discloses utilize the heat exchange tube to siphon away the heat on the circuit board, make whole integrated circuit board can realize the heat dissipation fast, the radiating effect is better.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high temperature resistant circuit board.
Background
The wiring board is an important electronic component, is a support of an electronic component, and is a carrier for electrical connection of the electronic component. With the increasing development of modern electronic technology, the requirements on the circuit board are higher and higher, and more electrical components are arranged on the circuit board, so that the circuit board with a larger area is required to bear the electrical components, but in some environments, the use environment of the circuit board limits that the circuit board cannot occupy a larger area, and the application of the circuit board is limited.
And the circuit board can produce a large amount of heats in the use, these heats can seriously influence the operation of circuit board, current circuit board usually near electronic component installation fin come to dispel the heat to it, this kind of radiating effect is slow, long-term past, still can let the life-span of circuit board shorten. Therefore, a high temperature resistant circuit board is proposed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant circuit board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistant circuit board, includes first integrated circuit board and second integrated circuit board, first integrated circuit board is located the top of second integrated circuit board, and four corner positions of first integrated circuit board and second integrated circuit board department run through jointly has the heat conduction copper post, the upper and lower both ends of heat conduction copper post have all been screwed locking bolt, the grafting of the inside equidistance of first integrated circuit board and second integrated circuit board has a plurality of heat exchange tube, all the front side of heat exchange tube is connected with into water jointly and is responsible for, all the rear side of heat exchange tube is connected with out water jointly and is responsible for.
Preferably, the first integrated circuit board and the second integrated circuit board both comprise an aluminum substrate, aluminum foil pads are arranged on the front surface and the back surface of the aluminum substrate, a circuit layer is welded on the outer side of each aluminum foil pad, and insulating green paint is sprayed on the two circuit layers.
Preferably, one side of the water inlet main pipe is connected with a water inlet joint, and one side of the water outlet main pipe, which is far away from the water inlet joint, is connected with a water outlet joint.
Preferably, the lower ends of the first integrated circuit board and the second integrated circuit board are both stuck with heat-conducting silica gel pads penetrating through the heat-conducting copper cylinders.
The heat-conducting silica gel pad is adhered to the back surfaces of the first integrated circuit board and the second integrated circuit board, so that heat on the circuit boards can be further led out.
Compared with the prior art, the beneficial effects of the utility model are that: this high temperature resistant circuit board can realize the connection of first integrated circuit board and second integrated circuit board through four heat conduction copper posts, and the design of two-layer integrated circuit board can realize the installation of more electrical components, and the design of this circuit board has improved electrical components's bearing capacity promptly.
The utility model discloses four heat conduction copper posts still have the heat absorption function.
The utility model discloses, through a plurality of heat exchange tube of internal design at first integrated circuit board and second integrated circuit board, be responsible for to the leading-in cooling water of heat exchange tube inside through intaking, recycle out the water and be responsible for the water of deriving the heat transfer, the utility model discloses utilize the heat exchange tube to siphon away the heat on the circuit board, make whole integrated circuit board can realize the heat dissipation fast, the radiating effect is better.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the first ic board according to the present invention;
fig. 3 is a schematic diagram of the internal structure of the first integrated circuit board and the second integrated circuit board according to the present invention.
In the figure: 1. a first integrated circuit board; 2. a second integrated circuit board; 3. a main water inlet pipe; 4. a heat exchange pipe; 5. a water inlet joint; 6. a thermally conductive copper pillar; 7. locking the bolt; 8. a main water outlet pipe; 9. an aluminum substrate; 10. an aluminum foil bonding pad; 11. a water outlet joint; 12. a circuit layer; 13. insulating green paint; 14. heat conduction silica gel pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a high temperature resistant circuit board, includes first integrated circuit board 1 and second integrated circuit board 2, first integrated circuit board 1 is located the top of second integrated circuit board 2, and just four corner position departments of first integrated circuit board 1 and second integrated circuit board 2 run through jointly has heat conduction copper post 6, the upper and lower both ends of heat conduction copper post 6 have all been screwed locking bolt 7, the grafting of the inside equidistance of first integrated circuit board 1 and second integrated circuit board has a plurality of heat exchange tube 4, all the front side of heat exchange tube 4 is connected with into water jointly and is responsible for 3, all the rear side of heat exchange tube 4 is connected with out water jointly and is responsible for 8.
Specifically, the first integrated circuit board 1 and the second integrated circuit board 2 both include an aluminum substrate 9, the front and back surfaces of the aluminum substrate 9 are both provided with aluminum foil pads 10, a circuit layer 12 is welded on the outer side of each layer of the aluminum foil pads 10, and the circuit layer 12 is coated with an insulating green paint 13.
Specifically, one side of the water inlet main pipe 3 is connected with a water inlet joint 5, and one side of the water outlet main pipe 8, which is far away from the water inlet joint 5, is connected with a water outlet joint 11.
Specifically, the lower ends of the first integrated circuit board 1 and the second integrated circuit board 2 are both adhered with heat-conducting silica gel pads 14 penetrating through the heat-conducting copper columns 6.
When the integrated circuit board is used specifically, the first integrated circuit board 1 and the second integrated circuit board 2 can be connected through the four heat-conducting copper columns 6, the installation of more electrical elements can be realized through the design of the two layers of integrated circuit boards, and the bearing capacity of the electrical elements is improved through the design of the circuit boards.
The utility model discloses, through a plurality of heat exchange tube 4 of internal design at first integrated circuit board 1 and second integrated circuit board 2, be responsible for 3 through intaking to the inside leading-in cooling water of heat exchange tube 4, recycle out water and be responsible for 8 water of deriving the heat transfer, the utility model discloses utilize heat exchange tube 4 to siphon away the heat on the circuit board, make whole integrated circuit board can realize the heat dissipation fast, the radiating effect is better.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A high temperature resistant circuit board, includes first integrated circuit board (1) and second integrated circuit board (2), its characterized in that: first integrated circuit board (1) is located the top of second integrated circuit board (2), and four corner position departments of first integrated circuit board (1) and second integrated circuit board (2) have run through heat conduction copper post (6) jointly, the upper and lower both ends of heat conduction copper post (6) have all been screwed locking bolt (7), the grafting of the inside equidistance of first integrated circuit board (1) and second integrated circuit board has a plurality of heat exchange tube (4), all the front side of heat exchange tube (4) is connected with into water jointly and is responsible for (3), all the rear side of heat exchange tube (4) is connected with out water jointly and is responsible for (8).
2. The high temperature resistant circuit board of claim 1, wherein: the first integrated circuit board (1) and the second integrated circuit board (2) both comprise an aluminum substrate (9), aluminum foil pads (10) are arranged on the front side and the back side of the aluminum substrate (9), a circuit layer (12) is welded on the outer side of each layer of aluminum foil pad (10), and insulating green paint (13) is sprayed on each circuit layer (12).
3. The high temperature resistant circuit board of claim 1, wherein: one side of the water inlet main pipe (3) is connected with a water inlet connector (5), and one side of the water outlet main pipe (8) far away from the water inlet connector (5) is connected with a water outlet connector (11).
4. The high temperature resistant circuit board of claim 1, wherein: and heat-conducting silica gel pads (14) penetrating through the heat-conducting copper columns (6) are adhered to the lower ends of the first integrated circuit board (1) and the second integrated circuit board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920953616.9U CN210381441U (en) | 2019-06-24 | 2019-06-24 | High-temperature-resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920953616.9U CN210381441U (en) | 2019-06-24 | 2019-06-24 | High-temperature-resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381441U true CN210381441U (en) | 2020-04-21 |
Family
ID=70266641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920953616.9U Expired - Fee Related CN210381441U (en) | 2019-06-24 | 2019-06-24 | High-temperature-resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210381441U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533363A (en) * | 2020-12-30 | 2021-03-19 | 泰州市博泰电子有限公司 | High-efficient radiating composite circuit board |
-
2019
- 2019-06-24 CN CN201920953616.9U patent/CN210381441U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533363A (en) * | 2020-12-30 | 2021-03-19 | 泰州市博泰电子有限公司 | High-efficient radiating composite circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |