CN209731686U - A kind of circuit board - Google Patents
A kind of circuit board Download PDFInfo
- Publication number
- CN209731686U CN209731686U CN201822067792.0U CN201822067792U CN209731686U CN 209731686 U CN209731686 U CN 209731686U CN 201822067792 U CN201822067792 U CN 201822067792U CN 209731686 U CN209731686 U CN 209731686U
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- CN
- China
- Prior art keywords
- circuit board
- heat
- electronic component
- release hole
- heat sink
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of circuit board, belongs to circuit board processing and manufacturing technology.It solves the problems such as available circuit plate heat dissipation performance is poor.This circuit board includes at least two-layer substrate, dielectric layer is provided between adjacent substrate, the front of circuit board is provided with multiple electronic components, a heat release hole is at least offered on circuit board, heat release hole is corresponding with the position of electronic component, and the back side of circuit board is provided with the first heat sink of covering heat release hole.The utility model has many advantages, such as perfect heat-dissipating.
Description
Technical field
The utility model belongs to circuit board processing and manufacturing technology, in particular to a kind of circuit board.
Background technique
The fast development of China's information electronic industries provides good market environment for printed circuit board industry, and electronics is logical
The sustainable growth for interrogating the electronic products yield such as equipment, electronic computer, household electrical appliance is the rapid growth of printed circuit board industry
Strong impetus is provided, circuit board is the core component of electronic product, and the stable operation of circuit board is the performance of electronic product
It provides safeguard, circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.
Circuit board integration degree on existing market is higher, a large amount of heat can be generated in continuous operation, in order to improve
The radiating efficiency of circuit board, many production firms plug together spliced method using two circuit boards to solve when manufacturing processing
The problem of certainly radiating, but will cause that circuit board space possessive volume is excessive in this way, but since the volume of existing product is often more next
It is smaller, therefore this circuit board has limitation during use, can not be widely applied.There are also many production firm's meetings
It is equipped with heat sink in the reverse side of multilayer circuit board, although heat sink is bonded with the lower surface of circuit board can help to improve heat dissipation
Efficiency, due to being equipped with insulating medium layer between two-tier circuit plate, the heating conduction of insulating medium layer is poor, and since aluminium sheet is located at
The lower surface of circuit board, but the heat of circuit board is usually focused on the upper surface of circuit board, so that heat is difficult to lead from front
For heat to the back side, heat dissipation effect is enough undesirable.
Summary of the invention
The purpose of this utility model is to provide a kind of perfect heat-dissipating for the above-mentioned problems in the prior art
Circuit board.
The purpose of this utility model can be realized by the following technical scheme: a kind of circuit board, including at least two-layer substrate,
Dielectric layer is provided between adjacent substrate, the front of the circuit board is provided with multiple electronic components, which is characterized in that institute
A thermal hole is at least offered on the circuit board stated, the thermal hole is corresponding with the position of electronic component, the electricity
The back side of road plate is provided with the heat-conducting block of covering thermal hole.
Working principle of the utility model is: electronic component is set to the front of circuit board, electronic component work makes to produce
Heat amount and the front for accumulating in circuit board, due to offering thermal hole corresponding with electronic component position on circuit board,
Heat can be conducted to the heat-conducting block of back of circuit board from thermal hole, then be distributed by heat-conducting block to the back side of circuit board.This
It is arranged so that heat-conducting block is located at the back side of circuit board, heat-conducting block will not influence the arrangement of electronic component, and thermal hole can be real
Now the positive heat of circuit board is conducted to back of circuit board, electronic component overheat damage can be prevented, also reduce circuit
The size of plate reduces circuit board real estate, to reduce the volume of electronic equipment.
In above-mentioned circuit board, metal heat-conducting layer is covered on the peripheral wall of the thermal hole.
In above-mentioned circuit board, the material of the metal heat-conducting layer is copper.
In above-mentioned circuit board, the heat-conducting block is provided with heat sink, the heat dissipation far from the side fitting of circuit board
There is air interlayer between plate and circuit board.
In above-mentioned circuit board, the material of the heat-conducting block and heat sink is aluminium.
In above-mentioned circuit board, soldering layer, the soldering are provided between the electronic component and circuit board
Electronic component is fixed on circuit board by layer.
In above-mentioned circuit board, the soldering layer for being correspondingly arranged on the electronic component device of thermal hole extends to thermal hole and covers
It is placed on thermal hole peripheral wall.
In above-mentioned circuit board, the electronic component includes field-effect tube, and the thermal hole is located at imitates with field
It should pipe opposite position.
In above-mentioned circuit board, the heat-conducting block does not interfere the peace for not being correspondingly arranged on the electronic component of thermal hole
Dress.
Compared with prior art, the utility model has many advantages, such as perfect heat-dissipating.
Detailed description of the invention
Fig. 1 is the overall construction drawing of this circuit board.
Fig. 2 is the backside structure figure of this circuit board.
Fig. 3 is the side structure cross-sectional view of this circuit board.
In figure, 1, substrate；2, dielectric layer；3, electronic component；4, thermal hole；5, heat-conducting block；6, metal heat-conducting layer；7, it dissipates
Hot plate；8, air interlayer；9, soldering layer；10, field-effect tube.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
As shown in Figure 1 to Figure 3, this circuit board includes at least two-layer substrate 1, is provided with dielectric layer between adjacent substrate 1
2, the front of circuit board is provided with multiple electronic components 3, and a thermal hole 4, thermal hole 4 and electricity are at least offered on circuit board
The position of sub- component 3 is corresponding, and the back side of circuit board is provided with the heat-conducting block 5 of covering thermal hole 4.
It further describes in detail, metal heat-conducting layer 6 is covered on the peripheral wall of thermal hole 4.The positive heat of circuit board can pass through
In the conduction to heat-conducting block 5 of metal heat-conducting layer 6, heat transfer efficiency is promoted, the positive temperature of circuit board is further decreased.
Preferably, the material of metal heat-conducting layer 6 is copper.The thermal conductivity of copper product is good, and cheap, makes this heat sink
Heating conduction, production cost is low.
Further describe in detail, heat-conducting block 5 is provided with heat sink 7 far from the side fitting of circuit board, heat sink 7 and circuit board it
Between have air interlayer 8.The setting of heat sink 7 is capable of increasing heat dissipation area, can further heat radiation rate, and heat sink
It is provided with air interlayer 8 between 7 and circuit board and circuit board, will not interfere with the installation of electronic component 3.
Preferably, the material of heat-conducting block 5 and heat sink 7 is aluminium.Although the heating conduction of aluminum material does not have, copper is good,
Also it can satisfy the thermal conductivity as heat sink, and price is cheaper than copper, since heat-conducting block 5 and the volume of heat sink 7 are big, adopt
Use that aluminium can meet heating conduction as material and production cost is low.
It further describes in detail, is provided with soldering layer 9 between electronic component 3 and circuit board, soldering layer 9 is by electronic component 3
It is fixed on circuit board, the soldering layer 9 for being correspondingly arranged on the electronic component device of thermal hole 4, which extends to thermal hole 4 and is covered in, leads
On 4 peripheral wall of hot hole.This setting is so that electronic component 3 is fixed on circuit board by soldering layer 9, during the welding process, melting
Tin flow into thermal hole 4 in and be covered on peripheral wall, the area of heat transfer can be increased, further promoted heat from circuit board just
Face is transmitted to the rate of metal back, increases the heat dissipation performance of circuit board, prevents the overheat damage of electronic component 3.This setting
The contact area for also adding soldering layer 9 Yu circuit board is able to ascend the degree of firmly installing of electronic component 3.
It further describes in detail, electronic component 3 includes field-effect tube 10, and thermal hole 4 is located at position corresponding with field-effect tube 10
It sets.Since the heat that field-effect tube 10 generates is more, 10 corresponding position of scene effect pipe opens up thermal hole 4 can be by field-effect tube 10
The heat of generation is transmitted to back of circuit board by thermal hole 4, and heat transfer efficiency is high.
It further describes in detail, heat-conducting block 5 does not interfere the installation for not being correspondingly arranged on the electronic component 3 of thermal hole 4.This setting
So that only covering board offers 4 position of thermal hole to heat-conducting block 5, and it will not influence the installation of other electronic components 3.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (9)
1. a kind of circuit board, including at least two-layer substrate (1), dielectric layer (2), the electricity are provided between adjacent substrate (1)
The front of road plate is provided with multiple electronic components (3), which is characterized in that a heat dissipation is at least offered on the circuit board
Hole (4), the heat release hole (4) is corresponding with the position of electronic component (3), and the back side of the circuit board is provided with covering and dissipates
The first heat sink (5) of hot hole (4).
2. a kind of circuit board according to claim 1, which is characterized in that be covered with gold on the peripheral wall of the heat release hole (4)
Belong to heat-conducting layer (6).
3. a kind of circuit board according to claim 2, which is characterized in that the material of the metal heat-conducting layer (6) is copper.
4. a kind of circuit board according to claim 1, which is characterized in that first heat sink (5) is far from circuit board
Side fitting is provided with the second heat sink (7), has gap (8) between second heat sink (7) and circuit board.
5. a kind of circuit board according to claim 4, which is characterized in that first heat sink (5) and the second heat sink
(7) material is aluminium.
6. a kind of circuit board according to claim 1, which is characterized in that the electronic component (3) and circuit board it
Between be provided with soldering layer (9), electronic component (3) is fixed on circuit board by the soldering layer (9).
7. a kind of circuit board according to claim 6, which is characterized in that be correspondingly arranged on the electronic component of heat release hole (4)
The soldering layer (9) of device extends to heat release hole (4) and is covered on heat release hole (4) peripheral wall.
8. a kind of circuit board according to claim 1, which is characterized in that the electronic component (3) includes field-effect
It manages (10), the heat release hole (4) is located at and field-effect tube (10) opposite position.
9. a kind of circuit board according to claim 1, which is characterized in that it is not right that first heat sink (5) is not interfered
The installation of the electronic component (3) of heat release hole (4) should be provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822067792.0U CN209731686U (en) | 2018-12-11 | 2018-12-11 | A kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822067792.0U CN209731686U (en) | 2018-12-11 | 2018-12-11 | A kind of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209731686U true CN209731686U (en) | 2019-12-03 |
Family
ID=68677092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822067792.0U Active CN209731686U (en) | 2018-12-11 | 2018-12-11 | A kind of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209731686U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
| CN111148342A (en) * | 2020-01-14 | 2020-05-12 | 北京比特大陆科技有限公司 | Circuit board heat abstractor and server that has it |
-
2018
- 2018-12-11 CN CN201822067792.0U patent/CN209731686U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
| CN111148342A (en) * | 2020-01-14 | 2020-05-12 | 北京比特大陆科技有限公司 | Circuit board heat abstractor and server that has it |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 958 Jiulong Avenue, Chengxi street, Wenling City, Taizhou City, Zhejiang Province Patentee after: Wenling Huode Electronic Co.,Ltd. Address before: 317525 Room 114, 5 Blocks, Hongji Mall, 72 Xiangshan Road, Daxi Town, Wenling City, Taizhou City, Zhejiang Province Patentee before: WENLING HUODE ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A type of circuit board Effective date of registration: 20230725 Granted publication date: 20191203 Pledgee: Wenling Taiping sub branch of Bank of Taizhou Co.,Ltd. Pledgor: Wenling Huode Electronic Co.,Ltd. Registration number: Y2023980049690 |