CN211860651U - Integrated circuit board convenient to heat dissipation - Google Patents
Integrated circuit board convenient to heat dissipation Download PDFInfo
- Publication number
- CN211860651U CN211860651U CN202020660762.5U CN202020660762U CN211860651U CN 211860651 U CN211860651 U CN 211860651U CN 202020660762 U CN202020660762 U CN 202020660762U CN 211860651 U CN211860651 U CN 211860651U
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- circuit board
- heat dissipation
- heat
- fixedly connected
- integrated circuit
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of the circuit board technique and specifically relates to an integrated circuit board convenient to heat dissipation, including the circuit board, the bottom fixedly connected with a plurality of fixed block of circuit board has all seted up the fixed orifices on every fixed block, fixed orifices intercommunication circuit board, and the upper end fixedly connected with heat dissipation of circuit board is protruding, and the second louvre has been seted up to the upper surface of circuit board, and the upper end fixedly connected with a plurality of aluminium seat of circuit board, the upper end of every aluminium seat all is connected with the heat conduction post, and the upper end of every heat conduction post all is connected with first heating panel. The utility model discloses a fixed block supporting circuit board for there is the clearance between circuit board and the installation base face, after the circuit board generates heat, the heat of production can be followed the clearance release, the quick effectual temperature that reduces the circuit board, and the heat that the heat conduction post produced in with the circuit board working process is derived, and the heat of deriving by first heating panel release heat conduction post, the effectual temperature that reduces the circuit board, the heat dispersion of circuit board is good.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to an integrated circuit board convenient to heat dissipation.
Background
The flexible printed circuit board is a flexible printed circuit board with high reliability and excellent performance, and is classified into three categories, i.e., single-sided board, double-sided board, and multi-layered board, in terms of the number of layers. The double-sided board is coated with copper on both sides to form wires, and the circuit between the two layers can be conducted through the through holes to form the required network connection. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required.
Along with the functional structure of the circuit board is more and more complicated, the heat dissipation capacity is also more and more big, and the traditional self-heat dissipation mode of arranging the through hole on the circuit board can not effectively dissipate heat.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that can't effectual radiating exists among the prior art, and the radiating integrated circuit board of being convenient for that provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the design one kind is convenient for radiating integrated circuit board, including the circuit board, the bottom fixedly connected with a plurality of fixed block of circuit board, every the fixed orifices has all been seted up on the fixed block, the fixed orifices intercommunication the circuit board, the first louvre of a plurality of has been seted up on the circuit board, the upper end fixedly connected with heat dissipation of circuit board is protruding, the second louvre has been seted up to the upper surface of circuit board, a plurality of aluminium seat of upper end fixedly connected with of circuit board, every the upper end of aluminium seat all is connected with heat conduction post, every the upper end of heat conduction post all is connected with first heating panel.
Preferably, the circuit board and the fixing block are of an integrated structure.
Preferably, the heat dissipation protrusion is an aluminum heat dissipation protrusion.
Preferably, the upper surface of the circuit board is fixedly connected with a first heat-conducting silicone grease layer.
Preferably, a second heat-conducting silicone grease layer is connected in the second heat-radiating hole.
Preferably, the lower surface fixedly connected with a plurality of cooling tube of first heating panel, a plurality of recess has been seted up to the upper surface of first heating panel, equal fixedly connected with second heating panel in every recess.
The utility model provides a pair of integrated circuit board convenient to heat dissipation, beneficial effect lies in:
support the circuit board through the fixed block for there is the clearance between circuit board and the installation base face, after the circuit board generates heat, the heat of production can follow the clearance release, and quick effectual reduction circuit board's temperature, the heat that the heat conduction post produced in with the circuit board working process is derived, releases the heat that the heat conduction post derived by first heating panel, the effectual temperature that reduces the circuit board, and the heat dispersion of circuit board is good.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit board convenient for heat dissipation according to the present invention;
fig. 2 is a schematic structural diagram of an integrated circuit board convenient for heat dissipation according to the present invention;
fig. 3 is a schematic view of a connection structure between a heat-conducting post and a first heat-dissipating plate in an integrated circuit board convenient for heat dissipation.
In the figure: the heat dissipation structure comprises a circuit board 1, a fixing block 2, a fixing hole 3, a first heat dissipation hole 4, a first heat conduction silicone grease layer 5, a heat dissipation protrusion 6, a second heat dissipation hole 7, a second heat conduction silicone grease layer 8, an aluminum seat 9, a heat conduction column 10, a first heat dissipation plate 11, a heat dissipation pipe 12, a groove 13 and a second heat dissipation plate 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, an integrated circuit board convenient to heat dissipation, including circuit board 1, the bottom fixedly connected with a plurality of fixed block 2 of circuit board 1, the effect of fixed block 2 is supporting circuit board 1, make there is the clearance between circuit board 1 and the installation base face, after circuit board 1 generates heat, the heat of production can be released from the clearance, the quick effectual temperature that reduces circuit board 1, circuit board 1 and fixed block 2 structure as an organic whole, fixed orifices 3 have all been seted up on every fixed block 2, fixed orifices 3's effect is fixed circuit board 1 of being convenient for, fixed orifices 3 intercommunication circuit board 1, the last first louvre 4 of a plurality of having seted up of circuit board 1, the effect of first louvre 4 is accelerating the heat dissipation of circuit board 1.
The upper end fixedly connected with heat dissipation of circuit board 1 is protruding 6, the effect of heat dissipation arch 6 is the heat derivation release that produces circuit board 1, accelerate circuit board 1's heat dissipation, it is protruding that heat dissipation arch 6 is the aluminium matter heat dissipation, second louvre 7 has been seted up to circuit board 1's upper surface, circuit board 1's upper end fixedly connected with a plurality of aluminium seat 9, the effect of a plurality of aluminium seat 9 is fixed heat conduction post 10, the upper end of every aluminium seat 9 all is connected with heat conduction post 10, heat conduction post 10's effect is the heat derivation that produces in the working process of circuit board 1, the upper end of every heat conduction post 10 all is connected with first heating panel 11, the effect of first heating panel 11 is the heat that heat conduction post 10 was derived in the release, accelerate thermal release.
Example 2
Referring to fig. 1-3, as another preferred embodiment of the present invention, the difference from embodiment 1 lies in the first heat-conducting silicone grease layer 5 of fixed surface of the upper surface of the circuit board 1, the effect of the first heat-conducting silicone grease layer 5 is to accelerate the heat dissipation of the circuit board 1, the second heat-conducting silicone grease layer 8 is connected in the second heat dissipation hole 7, the lower fixed surface of the first heat dissipation plate 11 is connected with a plurality of heat dissipation pipes 12, the effect of the heat dissipation pipes 12 is to increase the heat dissipation area of the first heat dissipation plate 11, accelerate the heat dissipation, a plurality of grooves 13 have been seted up on the upper surface of the first heat dissipation plate 11, the effect of the grooves 13 is to increase the heat dissipation area of the first heat dissipation plate 11, the equal fixedly connected with second heat dissipation plate 14 in each groove 13, the.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides an integrated circuit board convenient to heat dissipation, includes circuit board (1), bottom fixedly connected with a plurality of fixed block (2) of circuit board (1), every fixed orifices (3) have all been seted up on fixed block (2), fixed orifices (3) intercommunication circuit board (1), its characterized in that, the first louvre of a plurality of (4) has been seted up on circuit board (1), the upper end fixedly connected with heat dissipation arch (6) of circuit board (1), second louvre (7) have been seted up to the upper surface of circuit board (1), the upper end fixedly connected with a plurality of aluminium seat (9) of circuit board (1), every the upper end of aluminium seat (9) all is connected with heat conduction post (10), every the upper end of heat conduction post (10) all is connected with first heating panel (11).
2. The integrated circuit board convenient for heat dissipation according to claim 1, wherein the circuit board (1) and the fixing block (2) are of an integral structure.
3. An integrated circuit board facilitating heat dissipation according to claim 1, wherein the heat dissipation protrusion (6) is an aluminum heat dissipation protrusion.
4. The integrated circuit board facilitating heat dissipation according to claim 1, wherein a first thermal silicone layer (5) is fixedly connected to the upper surface of the circuit board (1).
5. The integrated circuit board facilitating heat dissipation according to claim 1, wherein a second heat-conducting silicone layer (8) is connected inside the second heat dissipation hole (7).
6. The integrated circuit board convenient for heat dissipation according to claim 1, wherein a plurality of heat dissipation pipes (12) are fixedly connected to a lower surface of the first heat dissipation plate (11), a plurality of grooves (13) are formed in an upper surface of the first heat dissipation plate (11), and a second heat dissipation plate (14) is fixedly connected to each groove (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020660762.5U CN211860651U (en) | 2020-04-27 | 2020-04-27 | Integrated circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020660762.5U CN211860651U (en) | 2020-04-27 | 2020-04-27 | Integrated circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860651U true CN211860651U (en) | 2020-11-03 |
Family
ID=73178525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020660762.5U Active CN211860651U (en) | 2020-04-27 | 2020-04-27 | Integrated circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860651U (en) |
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2020
- 2020-04-27 CN CN202020660762.5U patent/CN211860651U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211221 Address after: 215299 No. 365, Hengtong Road, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou Pengxie Intelligent Control Technology Co.,Ltd. Address before: 215215 No. 365, Hengtong Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Patentee before: Peng Xie Electronic Technology (Suzhou) Co.,Ltd. |