CN108461461A - A kind of porous conductive material filled-type heat-pipe radiator - Google Patents
A kind of porous conductive material filled-type heat-pipe radiator Download PDFInfo
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- CN108461461A CN108461461A CN201810208024.4A CN201810208024A CN108461461A CN 108461461 A CN108461461 A CN 108461461A CN 201810208024 A CN201810208024 A CN 201810208024A CN 108461461 A CN108461461 A CN 108461461A
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- pipe
- conductive material
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- porous conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of porous conductive material filled-type heat-pipe radiators, including substrate, one or more heat pipe main pipe of be installed on substrate and positioned at substrate side and along far from orientation substrate successively spaced apart several radiating fins, each heat pipe main pipe is connected with one or more the hot pipe pipe for sequentially passing through each radiating fin, and porous conductive material piece is folded between at least a pair of adjacent radiating fin and/or between substrate and the radiating fin of adjacent substrates.The porous conductive material filled-type heat-pipe radiator have many advantages, such as it is simple in structure, be easy to make, at low cost, radiating efficiency and heat-sinking capability it is good.
Description
Technical field
The present invention relates to heat abstractor technical fields, and in particular to a kind of porous conductive material filled-type heat-pipe radiator.
Background technology
High speed, high frequency recently as electronic device, more and more integrated circuits and large scale integrated circuit
Miniaturized components are intended to high density assembly, and the calorific value of electronic device unit volume increases year by year.In the electronic device, hot merit
Rate loss is usually expressed as the form of " dissipate heat ", and any electronic component with certain resistance value is for running electricity
All it is an internal heat source for sub- equipment.The dissipation heat of component can directly result in the raising of electronic equipment temperature levels
With the increase of thermal stress strain, to further such that component, circuit board, component and equipment at a higher temperature cannot can
It works by ground, or even shortens its working life, that is, generate so-called " thermotropic failure ".Therefore, electronic equipment can reliably working,
Can durable be heavily dependent on electronic instrument and power device and can effectively radiate, this is allowed for power electronics
It is extremely important that equipment designs efficient heat dissipation.
Currently, power electronic equipment heat dissipation mainly passes through the heat transfer of radiator and convection type.Most widely used side
Method is that forced convection by metal solid radiator and air or free convection shed heat, but this radiating mode is only
Smaller heat flow density is can be suitably used for, when heat flow density is more than 100 W/cm2When, it can no longer meet radiating requirements.In addition, answering
With wider water cooling method, then the electrical conductivity problems of water are considered, and water cooling is unfavorable for improving safety, there is also fixed
Phase maintenance issues.The even heat of substrate is transferred to fin by heat-pipe radiator, and the heat dissipation that can effectively solve high heat flux density is asked
Topic, it is not only efficient but also compact-sized, securely and reliably, it need not safeguard.
Currently, existing heat-pipe radiator includes mainly radiating fin, heat pipe and substrate in the market.In existing heat pipe heat radiation
In device technology, heat pipe main pipe is mostly circle, and is buried in the groove of substrate, can not be in direct contact with heat source；The course of work
In, the heat of heat source surface reaches heat pipe and radiating fin by heat transfer by substrate, finally passes through convection current by radiating fin
Mode transfers heat in air.Since the thermal coefficient of substrate is far smaller than the thermal coefficient of heat pipe, lead to heat pipe heat radiation
The heat transfer efficiency of device is limited, and heat dissipation performance reduces.In addition, radiating fin and air heat-exchange limited area, the heat exchange with air side
Thermal resistance becomes most important thermal resistance in heat-pipe radiator heat transfer process, limits the heat dissipation performance of heat-pipe radiator.With electricity
The heating power of sub- device is increasing, and existing heat-pipe radiator has been difficult to meet cooling requirements.
Invention content
The technical problem to be solved in the present invention is to overcome the shortcomings of the prior art, provide it is a kind of it is simple in structure, be easy to
It makes, the porous conductive material filled-type heat-pipe radiator that at low cost, radiating efficiency and heat-sinking capability are good.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of porous conductive material filled-type heat-pipe radiator includes one or more heat pipe main pipe of substrate, be installed on substrate
And positioned at substrate side and along far from orientation substrate, spaced apart several radiating fins, each heat pipe main pipe are connected with one successively
More than root sequentially pass through the hot pipe pipe of each radiating fin, between at least a pair of adjacent radiating fin and/or substrate with it is neighbouring
Porous conductive material piece is folded between the radiating fin of substrate.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that each porous conductive material piece corresponds to every heat
Pipe pipe is equipped with sleeve joint hole, the corresponding hot pipe pipe of each sleeve joint hole tight.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that the porous conductive material piece and radiating fin
Piece or substrate are fitted closely with the face way of contact.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that between each adjacent radiating fin and base
Porous conductive material piece is folded between plate and the radiating fin of adjacent substrates.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that the porous conductive material piece is foamy carbon
Material piece or foam copper material piece, and the porosity of porous conductive material piece is 5ppi.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that the substrate has for being contacted with heat source
Thermal contact conductance plane, correspond to every heat pipe main pipe in the thermal contact conductance plane and be equipped with an installing groove, each heat pipe main pipe
Accommodating to be mounted in corresponding installing groove, the heat pipe main pipe has the thermal contact conductance face concordant with thermal contact conductance plane.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that the substrate corresponds to every hot pipe Guan Jun
Equipped with a perforation location hole, each hot pipe pipe is threaded through in corresponding perforation location hole.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that the close cladding pair of the inner wall of each installing groove
Answer the outer wall of heat pipe main pipe.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that each hot pipe pipe and thermal contact conductance plane
Angle is 80 °~90 °.
Above-mentioned porous conductive material filled-type heat-pipe radiator, it is preferred that all hot pipe pipes and thermal contact conductance plane
Angle it is equal, and all hot pipe pipes are consistent relative to the inclined direction of thermal contact conductance plane.
Compared with the prior art, the advantages of the present invention are as follows：The porous conductive material filled-type heat-pipe radiator of the present invention
In, it is porous due to being folded between at least a pair of adjacent radiating fin and/or between substrate and the radiating fin of adjacent substrates
The heat of heat conduction material tablet, substrate and each radiating fin can directly efficiently, be quickly transmitted to porous conductive material piece, by more
Hole heat conduction material tablet carries out heat convection, since the large specific surface area of porous conductive material piece, thermal conductivity are good, Neng Gou great with air
The big heat convection area increased with air, to greatly improve the radiating efficiency and heat-sinking capability of heat-pipe radiator so that dissipate
The thermal efficiency and heat-sinking capability will be significantly larger than commonly only with the heat-pipe radiators of radiating fin socket and hot pipe pipe.This is porous
Heat Conduction Material filled-type heat-pipe radiator have the advantages that it is simple in structure, be easy to make, it is at low cost.
Description of the drawings
Fig. 1 is the main structure diagram of porous conductive material filled-type heat-pipe radiator.
Fig. 2 is the side structure schematic view of porous conductive material filled-type heat-pipe radiator.
Fig. 3 is that porous conductive material filled-type heat-pipe radiator removes the front view structure signal after porous conductive material piece
Figure.
Fig. 4 is that porous conductive material filled-type heat-pipe radiator removes the partial side sectional structure after porous conductive material piece
Schematic diagram.
Fig. 5 is the side schematic cross-sectional view of substrate.
Marginal data：
1, substrate；11, thermal contact conductance plane；12, installing groove；13, location hole is penetrated through；2, heat pipe main pipe；21, thermal contact conductance
Face；3, radiating fin；4, hot pipe pipe；5, porous conductive material piece.
Specific implementation mode
The present invention is described in further detail below in conjunction with the drawings and specific embodiments.
As shown in Figure 1 to Figure 3, the porous conductive material filled-type heat-pipe radiator of the present embodiment, including substrate 1, installation
More heat pipe main pipes 2 on substrate 1 and positioned at 1 side of substrate and along spaced apart several successively far from 1 direction of substrate
Radiating fin 3, each heat pipe main pipe 2 are connected with the more hot pipe pipes 4 for sequentially passing through each radiating fin 3, each adjacent radiating fin
Porous conductive material piece 5, porous thermal conductive material are folded between piece 3 and between substrate 1 and the radiating fin of adjacent substrates 13
Tablet 5 is made of the material for being made of network structure the hole being mutually communicated.Due between each adjacent radiating fin 3 and
Porous conductive material piece 5, the heat of substrate 1 and each radiating fin 3 are folded between substrate 1 and the radiating fin of adjacent substrates 13
Amount can directly efficiently, be quickly transmitted to porous conductive material piece 5, by porous conductive material piece 5 and air progress convection current change
Heat can greatly increase the heat convection area with air since the large specific surface area of porous conductive material piece 5, thermal conductivity are good,
To greatly improve the radiating efficiency and heat-sinking capability of heat-pipe radiator so that radiating efficiency and heat-sinking capability are significantly larger than general
The logical heat-pipe radiator only with radiating fin 3 socket and hot pipe pipe 4.The porous conductive material filled-type heat pipe heat radiation utensil
Have the advantages that it is simple in structure, be easy to make, it is at low cost.
In the present embodiment, each porous conductive material piece 5 corresponds to every hot pipe pipe 4 and is equipped with sleeve joint hole, and each sleeve joint hole is tight
Close to wrap up corresponding hot pipe pipe 4, hot pipe pipe 4 is low with the thermal contact resistance of porous conductive material piece 5, and heat transfer efficiency is high, heat pipe
The heat of sub- pipe 4 can directly efficiently, be quickly transferred to porous conductive material piece 5, further increase radiating efficiency and heat-sinking capability.
In the present embodiment, porous conductive material piece 5 is fitted closely with radiating fin 3 or substrate 1 with the face way of contact, energy
Heat-conducting area is enough improved, thermal contact resistance is reduced, improves heat transfer efficiency.
The present embodiment is equal between each adjacent radiating fin 3 and between substrate 1 and the radiating fin of adjacent substrates 13
It is folded with porous conductive material piece 5, can also be controlled between radiating fin 3 by changing the thickness of porous conductive material piece 5
Spacing reduces the mounting process requirement to radiating fin 3.In other embodiments, it adjacent more than a pair can also dissipate
Porous conductive material piece 5 is folded between hot fin 3 and/or between substrate 1 and the radiating fin of adjacent substrates 13.
In the present embodiment, porous conductive material piece 5 is foamed carbon material piece or foam copper material piece, foamed carbon material block
Or foam copper material block all has the characteristics that high porosity, high thermal conductivity, light weight.The hole of porous conductive material piece 5
Rate is 5ppi, can obtain best radiating efficiency.
In the present embodiment, as shown in Figure 4 and Figure 5, substrate 1 has the thermal contact conductance plane 11 for being contacted with heat source, connects
Every heat pipe main pipe 2 is corresponded on tactile heat-conducting planar 11 and is equipped with an installing groove 12, and each heat pipe main pipe 2 is accommodating mounted on corresponding
In installing groove 12, heat pipe main pipe 2 is fixed with substrate 1 using scolding tin, and heat pipe main pipe 2 has concordant with thermal contact conductance plane 11
Thermal contact conductance face 21.Heat pipe main pipe 2 is mounted in installing groove 12, and installation positioning is convenient, and the stability after installation can be improved, and
The contact area that heat pipe main pipe 2 and substrate 1 can be improved, to improve heat transfer efficiency.Meanwhile heat pipe main pipe 2 have led with contact
The concordant thermal contact conductance face 21 of hot plane 11, makes heat pipe main pipe 2 that can directly be contacted with heat source, can improve heat transfer efficiency, to
Greatly improve the radiating efficiency and heat-sinking capability of heat-pipe radiator.
In the present embodiment, substrate 1 corresponds to every hot pipe pipe 4 and is equipped with a perforation location hole 13, and each hot pipe pipe 4 is worn
In corresponding perforation location hole 13, the sub- pipe 4 of perforation 13 opposite heat tube of location hole forms positioning, can improve firm after installation
Property.
In the present embodiment, the inner wall of each installing groove 12 closely coats the outer wall of corresponding heat pipe main pipe 2, makes heat pipe main pipe 2
Big with the contact area of installing groove 12, thermal contact resistance is small, is conducive to improve heat transfer efficiency.
In the present embodiment, each hot pipe pipe 4 and the angle of thermal contact conductance plane 11 are 80 °~90 °, thermal contact conductance plane 11
The 4 bottom-up extension of each hot pipe pipe can be made by no matter being mounted on perpendicular or horizontal plane, ensure interior media energy
Enough evaporations rise or condensing reflux.
In the present embodiment, all hot pipe pipes 4 are equal with the angle of thermal contact conductance plane 11, and all 4 phases of hot pipe pipe
It is consistent for the inclined direction of thermal contact conductance plane 11, it is convenient for 5 integral installation of porous conductive material piece or dismounting.
In the present embodiment, it is preferred that heat pipe main pipe 2 is rectangular tube, and installing groove 12 is rectangular channel, simple for production, and
Heat pipe main pipe 2 and the contact area of substrate 1 are big.Each radiating fin 3 is preferably parallel to each other setting, radiating fin 3 and hot pipe pipe 4
Swelling coordinates, and can improve hot pipe pipe 4 and 3 closeness of contact of radiating fin, improves heat exchange efficiency.Each hot pipe pipe 4 with it is right
The heat pipe main pipe 2 answered is arranged in 90 ° of connections.Heat pipe main pipe 2 and hot pipe pipe 4 are made of copper material, inside have liquid-sucking core to promote
Heat pipe main pipe 2 is flowed back into working medium, internal working medium is water, and radiating fin 3 is made of aluminum material.Every heat pipe main pipe 2 connects
4 quantity of hot pipe pipe connect is consistent, and all hot pipe pipes 4, relative to 1 arrangement arranged in arrays of substrate, heat dissipation uniformity is good.
Preferably, it is filled with heat conductive silica gel between porous conductive material piece 5 and substrate 1 and radiating fin 3, thermal contact resistance can be reduced.
When the porous conductive material filled-type heat-pipe radiator work of the present embodiment, heat pipe main pipe 2 is heat pipe evaporator section, heat
Pipe pipe 4 is heat pipe condenser section, and the heat transfer of heat source is to substrate 1 and heat pipe main pipe 2, then is transferred to radiating fin 3 and porous
Heat conduction material tablet 5.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example.To those of ordinary skill in the art, obtained improvement and change in the case where not departing from the technology of the present invention concept thereof
It changes and also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of porous conductive material filled-type heat-pipe radiator, including substrate（1）, be mounted on substrate（1）On one or more
Heat pipe main pipe（2）And it is located at substrate（1）Side and along far from substrate（1）Direction spaced apart several radiating fins successively
（3）, each heat pipe main pipe（2）It is connected with one or more and sequentially passes through each radiating fin（3）Hot pipe pipe（4）, it is characterised in that：
At least a pair of adjacent radiating fin（3）Between and/or substrate（1）With adjacent substrates（1）Radiating fin（3）Between be folded with
Porous conductive material piece（5）.
2. porous conductive material filled-type heat-pipe radiator according to claim 1, it is characterised in that：Each porous thermal conductive material
Tablet（5）Corresponding every hot pipe pipe（4）It is equipped with sleeve joint hole, the corresponding hot pipe pipe of each sleeve joint hole tight（4）.
3. porous conductive material filled-type heat-pipe radiator according to claim 1, it is characterised in that：The porous thermal conductive
Material piece（5）With radiating fin（3）Or substrate（1）It is fitted closely with the face way of contact.
4. porous conductive material filled-type heat-pipe radiator according to claim 1, it is characterised in that：Each adjacent heat dissipation
Fin（3）Between and substrate（1）With adjacent substrates（1）Radiating fin（3）Between be folded with porous conductive material piece
（5）.
5. porous conductive material filled-type heat-pipe radiator according to claim 1, it is characterised in that：The porous thermal conductive
Material piece（5）For foamed carbon material piece or foam copper material piece, and porous conductive material piece（5）Porosity be 5ppi.
6. porous conductive material filled-type heat-pipe radiator according to any one of claim 1 to 5, it is characterised in that：
The substrate（1）With the thermal contact conductance plane for being contacted with heat source（11）, the thermal contact conductance plane（11）Upper correspondence is every
Root heat pipe main pipe（2）It is equipped with an installing groove（12）, each heat pipe main pipe（2）It is accommodating to be mounted on corresponding installing groove（12）
In, the heat pipe main pipe（2）With with thermal contact conductance plane（11）Concordant thermal contact conductance face（21）.
7. porous conductive material filled-type heat-pipe radiator according to claim 6, it is characterised in that：The substrate（1）
Corresponding every hot pipe pipe（4）It is equipped with a perforation location hole（13）, each hot pipe pipe（4）It is threaded through corresponding perforation location hole
（13）In.
8. porous conductive material filled-type heat-pipe radiator according to claim 6, it is characterised in that：Each installing groove
（12）Inner wall closely coat corresponding heat pipe main pipe（2）Outer wall.
9. porous conductive material filled-type heat-pipe radiator according to claim 6, it is characterised in that：Each hot pipe pipe
（4）With thermal contact conductance plane（11）Angle be 80 ° ~ 90 °.
10. porous conductive material filled-type heat-pipe radiator according to claim 9, it is characterised in that：All hot pipes
Pipe（4）With thermal contact conductance plane（11）Angle it is equal, and all hot pipe pipes（4）Relative to thermal contact conductance plane（11）Incline
Tilted direction is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810208024.4A CN108461461A (en) | 2018-03-14 | 2018-03-14 | A kind of porous conductive material filled-type heat-pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810208024.4A CN108461461A (en) | 2018-03-14 | 2018-03-14 | A kind of porous conductive material filled-type heat-pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108461461A true CN108461461A (en) | 2018-08-28 |
Family
ID=63217425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810208024.4A Pending CN108461461A (en) | 2018-03-14 | 2018-03-14 | A kind of porous conductive material filled-type heat-pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108461461A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244050A (en) * | 2018-09-21 | 2019-01-18 | 浙江嘉熙科技有限公司 | High-power hot superconductive plate wing combined radiator |
| CN110572983A (en) * | 2019-08-09 | 2019-12-13 | 郭培囵 | Direct-contact low-thermal-resistance heat pipe radiator for heating device |
| CN110660760A (en) * | 2019-10-18 | 2020-01-07 | 成都航天科工微电子系统研究院有限公司 | Chip cooling device for miniaturized processor |
| CN110987503A (en) * | 2019-12-19 | 2020-04-10 | 吉林建筑大学 | Heat pipe cooling system based on porous heat conduction material |
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|---|---|---|---|---|
| US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
| CN101533810A (en) * | 2009-04-20 | 2009-09-16 | 浙江大学 | Pulsating heat pipe radiator having foam |
| CN105960150A (en) * | 2016-07-10 | 2016-09-21 | 李增珍 | Method for manufacturing air-cooled radiator |
| CN107466194A (en) * | 2017-08-31 | 2017-12-12 | 国网湖南省电力公司 | Air-cooled heat-pipe radiator for Large Copacity SVG |
-
2018
- 2018-03-14 CN CN201810208024.4A patent/CN108461461A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
| CN101533810A (en) * | 2009-04-20 | 2009-09-16 | 浙江大学 | Pulsating heat pipe radiator having foam |
| CN105960150A (en) * | 2016-07-10 | 2016-09-21 | 李增珍 | Method for manufacturing air-cooled radiator |
| CN107466194A (en) * | 2017-08-31 | 2017-12-12 | 国网湖南省电力公司 | Air-cooled heat-pipe radiator for Large Copacity SVG |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244050A (en) * | 2018-09-21 | 2019-01-18 | 浙江嘉熙科技有限公司 | High-power hot superconductive plate wing combined radiator |
| CN110572983A (en) * | 2019-08-09 | 2019-12-13 | 郭培囵 | Direct-contact low-thermal-resistance heat pipe radiator for heating device |
| CN110572983B (en) * | 2019-08-09 | 2023-12-19 | 郭培囵 | Direct contact low thermal resistance type heat pipe radiator for heating device |
| CN110660760A (en) * | 2019-10-18 | 2020-01-07 | 成都航天科工微电子系统研究院有限公司 | Chip cooling device for miniaturized processor |
| CN110987503A (en) * | 2019-12-19 | 2020-04-10 | 吉林建筑大学 | Heat pipe cooling system based on porous heat conduction material |
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Application publication date: 20180828 |
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