CN108417543A - Heat-pipe radiator based on porous conductive material - Google Patents
Heat-pipe radiator based on porous conductive material Download PDFInfo
- Publication number
- CN108417543A CN108417543A CN201810207998.0A CN201810207998A CN108417543A CN 108417543 A CN108417543 A CN 108417543A CN 201810207998 A CN201810207998 A CN 201810207998A CN 108417543 A CN108417543 A CN 108417543A
- Authority
- CN
- China
- Prior art keywords
- pipe
- heat
- conductive material
- porous conductive
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 239000003575 carbonaceous material Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000008961 swelling Effects 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000009434 installation Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 210000003041 ligament Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Abstract
The invention discloses a kind of heat-pipe radiators based on porous conductive material, one or more the heat pipe main pipe including substrate and be installed on substrate, each heat pipe main pipe is connected with one or more to the hot pipe pipe extended outside substrate, it further include porous conductive material body, porous conductive material body corresponds to each hot pipe pipe and is equipped with sleeve joint hole, the corresponding hot pipe pipe of sleeve joint hole tight.The heat-pipe radiator have many advantages, such as it is simple in structure, be easy to make, at low cost, radiating efficiency and heat-sinking capability it is good.
Description
Technical field
The present invention relates to heat abstractor technical fields, and in particular to a kind of heat-pipe radiator based on porous conductive material.
Background technology
Electronic technology rapidly develops in recent years, the intensive and miniaturization of the high frequency, high speed and integrated circuit of electronic device,
So that the calorific value of unit volume electronic device increased dramatically.Research data shows：The temperature of single semiconductor element increases 10
DEG C, the reliability of system reduces by 50%.Simultaneously as the extension of electronic component application range, needs in many occasion electronic devices
It is put together in a closed shell, to prevent dust, corrosive gas, rainwater in external environment etc. to electronic device
Infringement, further increase its heat dissipation difficulty.Therefore, in a sense, the heat dissipation technology of small space high heat flux density has been
One of an important factor for developing as constraint information, electronics and space flight and national defense and military technology.Therefore, it is very to reinforce heat dissipation
Important, the development of electronic technology must have good heat dissipation to ensure, this heat dissipation require compactedness,
Reliability, high cooling efficiency, the conditions such as need not repair at flexibility, and can most meet the means of these conditions, and head belongs to heat pipe and dissipates
Hot device.
The basic principle of hot pipe technique is to transmit heat with condensation using the evaporation of inside heat pipe working media.Evaporator section
Interior liquid absorbs heat and evaporates, and steam flows to condensation segment through cavity, and gas vaporizes through tube wall with extraneous refrigerant body heat exchange releasing latent
Heat and condense into liquid, suction force of the liquid through capillary structure or gravity reflux to evaporator section are into next working cycles.Heat
The appearance of pipe makes the cooling system of power electronic equipment have new development.
Currently, the existing heat-pipe radiator in market includes mainly cooling fin, heat pipe and substrate.Substrate is contacted with heat source, heat
Amount passes through heat pipe to cooling fin again from heat source by being thermally conducted to substrate, the heat of substrate.Cooling fin is usually aluminum fin-stock, a piece of
Piece is sleeved on sub- pipe, and outside air takes away the heat of cooling fin by heat convection again.Cooling fin is very thin, with sub- pipe and the external world
The contact area of air is limited, and the heat on sub- pipe highly effective can not pass on cooling fin, and the heat of cooling fin is not yet
Outside air can be effectively passed to, this just makes the heat dissipation performance of heat-pipe radiator be restricted.
Invention content
The technical problem to be solved in the present invention is to overcome the shortcomings of the prior art, provide it is a kind of it is simple in structure, be easy to
Making, at low cost, radiating efficiency and the good heat-pipe radiator based on porous conductive material of heat-sinking capability.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of heat-pipe radiator based on porous conductive material, including substrate and one or more heat pipe of be installed on substrate mother
Pipe, it further includes porous conductive material body to the hot pipe pipe extended outside substrate that each heat pipe main pipe, which is connected with one or more, described
Porous conductive material body corresponds to each hot pipe pipe and is equipped with sleeve joint hole, the corresponding hot pipe pipe of the sleeve joint hole tight.
Above-mentioned heat-pipe radiator, it is preferred that the porosity of the porous conductive material body is 5 ~ 25ppi.
Above-mentioned heat-pipe radiator, it is preferred that the porous conductive material body is foamed carbon material block or foam copper material
Expect block.
Above-mentioned heat-pipe radiator, it is preferred that the porous conductive material body is fitted closely with substrate with the face way of contact.
Above-mentioned heat-pipe radiator, it is preferred that the outer wall of the hot pipe pipe coordinates with sleeve joint hole swelling.
Above-mentioned heat-pipe radiator, it is preferred that be filled with and lead between the outer wall and the inner wall of sleeve joint hole of the hot pipe pipe
Hot silica gel.
Above-mentioned heat-pipe radiator, it is preferred that opposite two side surfaces of the substrate are respectively for being contacted with heat source
Thermal contact conductance plane and mounting surface for installing heat pipe main pipe, the mounting surface correspond to every heat pipe main pipe and be equipped with a peace
Groove is filled, each heat pipe main pipe is accommodating to be mounted in corresponding installing groove, and the inner wall of installing groove closely coats heat pipe main pipe
Outer wall.
Above-mentioned heat-pipe radiator, it is preferred that the angle of each hot pipe pipe and thermal contact conductance plane is 80 °~90 °.
Above-mentioned heat-pipe radiator, it is preferred that all hot pipe pipes are equal with the angle of thermal contact conductance plane, and all heat
Pipe pipe is consistent relative to the inclined direction of thermal contact conductance plane.
Compared with the prior art, the advantages of the present invention are as follows：The heat-pipe radiator based on porous conductive material of the present invention
In, porous conductive material body is replaced to traditional radiating fin, since each hot pipe pipe is by the sleeve joint hole of porous conductive material body
Tight, the contact area of porous conductive material body and each hot pipe pipe is big, thermal contact resistance is small, and heat can be from each hot pipe
Pipe is efficient, is quickly transmitted to porous conductive material body, while the large specific surface area of porous conductive material body, thermal conductivity are good, energy
The heat convection area with air is enough greatly increased, to greatly improve the radiating efficiency and heat-sinking capability of heat-pipe radiator.And
And each hot pipe pipe is threaded through in the sleeve joint hole of porous conductive material body, can be improved the structural strength of heat-pipe radiator and be consolidated
Property.The heat-pipe radiator also have the advantages that it is simple in structure, be easy to make, it is at low cost.
Description of the drawings
Fig. 1 is the main structure diagram of the heat-pipe radiator based on porous conductive material.
Fig. 2 is the side structure schematic view of the heat-pipe radiator based on porous conductive material.
Fig. 3 is that heat-pipe radiator removes the main structure diagram after porous conductive material body.
Fig. 4 is that heat-pipe radiator removes the side structure schematic view after porous conductive material body.
Fig. 5 is the overlooking structure diagram of substrate.
Marginal data：
1, substrate；11, thermal contact conductance plane；12, mounting surface；13, installing groove；2, heat pipe main pipe；3, hot pipe pipe；4, porous
Heat Conduction Material body.
Specific implementation mode
The present invention is described in further detail below in conjunction with the drawings and specific embodiments.
As shown in Figures 1 to 5, the heat-pipe radiator based on porous conductive material of the present embodiment, including substrate 1 and installation
More heat pipe main pipes 2 on substrate 1, each heat pipe main pipe 2 are connected with more to the hot pipe pipe 3 extended outside substrate 1, also wrap
Porous conductive material body 4 is included, porous conductive material body 4 is made of the material for being made of network structure the hole being mutually communicated,
Porous conductive material body 4 corresponds to each hot pipe pipe 3 and is equipped with sleeve joint hole, the corresponding hot pipe pipe of sleeve joint hole tight 3.Due to
Each hot pipe pipe 3 is connect by the sleeve joint hole tight of porous conductive material body 4, porous conductive material body 4 with each hot pipe pipe 3
Contacting surface product is big, thermal contact resistance is small, and heat efficiently, quickly can be transmitted to porous conductive material body 4 from each hot pipe pipe 3, together
When porous conductive material body 4 large specific surface area, thermal conductivity it is good, the heat convection area with air can be greatly increased, to
Greatly improve the radiating efficiency and heat-sinking capability of heat-pipe radiator so that radiating efficiency and heat-sinking capability will be significantly larger than commonly only
Using the heat-pipe radiator of radiating fin socket and hot pipe pipe 3.And each hot pipe pipe 3 is threaded through porous conductive material body 4
Sleeve joint hole in, the structural strength and stability of heat-pipe radiator can be improved.The heat-pipe radiator also has simple in structure, easy
In making, advantage at low cost.
In the present embodiment, the porosity ranges of porous conductive material body 4 are 5 ~ 25ppi, can obtain best heat dissipation effect
Rate, the porosity are preferably 5ppi.
In the present embodiment, porous conductive material body 4 is foamed carbon material block or foam copper material block, foamed carbon material block
Or foam copper material block all has the characteristics that high porosity, high thermal conductivity, light weight.Wherein, foamy carbon is by continuous net
Shape graphitization banded structure is formed by, and the ligament thermal conductivity of graphitizable foams carbon is more than 1500W/ (mK), body phase thermal conductivity
Rate is more than 100W/（m·K）, highest can reach 200W/ (mK), and specific heat conductance (W/ ρ) is 5 times of Cu or so, is Al
4 times or so.In other embodiments, porous conductive material body 4 can also the high material making of other thermal coefficients.It is porous to lead
Hot material body 4 has a large amount of hole, big with the sliding area of cross-ventilation heat exchange.
In the present embodiment, porous conductive material body 4 is fitted closely with substrate 1 with the face way of contact, makes the part heat of substrate 1
Amount can be directly delivered to porous conductive material body 4, can further improve heat exchange efficiency and exchange capability of heat.Preferably, porous to lead
Hot material body 4 is fixed with substrate 1 using scolding tin.
In the present embodiment, outer wall and the sleeve joint hole swelling of hot pipe pipe 3 coordinate, and can improve hot pipe pipe 3 and be led with porous
4 closeness of contact of hot material body, to improve heat exchange efficiency.
In the present embodiment, it is filled with heat conductive silica gel between the outer wall of hot pipe pipe 3 and the inner wall of sleeve joint hole, heat pipe can be reduced
The thermal contact resistance of sub- pipe 3 and sleeve joint hole inner wall contact surface.
In the present embodiment, opposite two side surfaces of substrate 1 are respectively the thermal contact conductance plane 11 for being contacted with heat source
With the mounting surface 12 for installing heat pipe main pipe 2, mounting surface 12 corresponds to every heat pipe main pipe 2 and is equipped with an installing groove 13, respectively
Heat pipe main pipe 2 is accommodating to be mounted in corresponding installing groove 13, and the inner wall of installing groove 13 closely coats the outer of heat pipe main pipe 2
Wall keeps heat pipe main pipe 2 and the contact area of substrate 1 big, and thermal contact resistance is small, is conducive to improve heat transfer efficiency.Since heat pipe main pipe 2 is pacified
In installing groove 13, installation positioning is convenient, the stability after installation can be improved, and improve heat pipe main pipe 2 and substrate 1
Contact area, to improve heat transfer efficiency.
In the present embodiment, each hot pipe pipe 3 and the angle of thermal contact conductance plane 11 are 80 °~90 °, thermal contact conductance plane 11
The 3 bottom-up extension of each hot pipe pipe can be made by no matter being mounted on perpendicular or horizontal plane, ensure interior media energy
Enough evaporations rise or condensing reflux.
In the present embodiment, all hot pipe pipes 3 are equal with the angle of thermal contact conductance plane 11, and all 3 phases of hot pipe pipe
It is consistent for the inclined direction of thermal contact conductance plane 11, it is convenient for 4 integral installation of porous conductive material body or dismounting.
In the present embodiment, each hot pipe pipe 3 is arranged with corresponding heat pipe main pipe 2 in 90 ° of connections.Heat pipe main pipe 2 and heat pipe
Sub- pipe 3 is made of copper material, inside has liquid-sucking core to promote working medium to flow back into heat pipe main pipe 2, internal working medium is water.Every heat pipe
3 quantity of hot pipe pipe that main pipe 2 connects is consistent, and all hot pipe pipes 3, relative to 1 arrangement arranged in arrays of substrate, heat dissipation is equal
Even property is good.3 one end far from heat pipe main pipe 2 of each hot pipe pipe is extend out to outside porous conductive material body 4.
The course of work and principle of the heat-pipe radiator of the present embodiment are as follows：
When heat source generates heat, partial heat directly passes to heat pipe main pipe 2 by substrate 1, and heat pipe main pipe 2 is evaporated for heat pipe
Section, hot pipe pipe 3 are heat pipe condenser section, and heat constantly will be transferred to condensation segment from evaporator section, then be transferred to by heat transfer
Porous conductive material body 4.Meanwhile porous conductive material body 4 is in direct contact with 1 top surface of substrate, so substrate 1 has partial heat straight
It connects and passes to porous conductive material body 4.The external world blows air over porous conductive material body 4, and porous conductive material is taken away by heat convection
The heat of body 4.Porous conductive material body 4 is because internal have a large amount of hole, heat convection area huge.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example.To those of ordinary skill in the art, obtained improvement and change in the case where not departing from the technology of the present invention concept thereof
It changes and also should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of heat-pipe radiator based on porous conductive material, including substrate（1）With mounted on substrate（1）On one or more
Heat pipe main pipe（2）, each heat pipe main pipe（2）One or more is connected with to substrate（1）The hot pipe pipe that outside extends（3）, feature
It is：It further include porous conductive material body（4）, the porous conductive material body（4）Corresponding each hot pipe pipe（3）It is equipped with socket
Hole, the corresponding hot pipe pipe of the sleeve joint hole tight（3）.
2. heat-pipe radiator according to claim 1, it is characterised in that：The porous conductive material body（4）Porosity
For 5 ~ 25ppi.
3. heat-pipe radiator according to claim 1, it is characterised in that：The porous conductive material body（4）For foamy carbon
Material block or foam copper material block.
4. heat-pipe radiator according to claim 1, it is characterised in that：The porous conductive material body（4）With substrate（1）
It is fitted closely with the face way of contact.
5. heat-pipe radiator according to claim 1, it is characterised in that：The hot pipe pipe（3）Outer wall and sleeve joint hole
Swelling coordinates.
6. heat-pipe radiator according to claim 5, it is characterised in that：The hot pipe pipe（3）Outer wall and sleeve joint hole
Inner wall between be filled with heat conductive silica gel.
7. heat-pipe radiator according to any one of claim 1 to 6, it is characterised in that：The substrate（1）Opposite two
A side surface is respectively the thermal contact conductance plane for being contacted with heat source（11）With for installing heat pipe main pipe（2）Mounting surface
（12）, the mounting surface（12）Corresponding every heat pipe main pipe（2）It is equipped with an installing groove（13）, each heat pipe main pipe（2）It is accommodating
Mounted on corresponding installing groove（13）In, and installing groove（13）Inner wall closely coat heat pipe main pipe（2）Outer wall.
8. heat-pipe radiator according to claim 7, it is characterised in that：Each hot pipe pipe（3）With thermal contact conductance plane
（11）Angle be 80 ° ~ 90 °.
9. heat-pipe radiator according to claim 8, it is characterised in that：All hot pipe pipes（3）With thermal contact conductance plane
（11）Angle it is equal, and all hot pipe pipes（3）Relative to thermal contact conductance plane（11）Inclined direction it is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810207998.0A CN108417543A (en) | 2018-03-14 | 2018-03-14 | Heat-pipe radiator based on porous conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810207998.0A CN108417543A (en) | 2018-03-14 | 2018-03-14 | Heat-pipe radiator based on porous conductive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108417543A true CN108417543A (en) | 2018-08-17 |
Family
ID=63131403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810207998.0A Pending CN108417543A (en) | 2018-03-14 | 2018-03-14 | Heat-pipe radiator based on porous conductive material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108417543A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660760A (en) * | 2019-10-18 | 2020-01-07 | 成都航天科工微电子系统研究院有限公司 | Chip cooling device for miniaturized processor |
| CN110987503A (en) * | 2019-12-19 | 2020-04-10 | 吉林建筑大学 | Heat pipe cooling system based on porous heat conduction material |
-
2018
- 2018-03-14 CN CN201810207998.0A patent/CN108417543A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660760A (en) * | 2019-10-18 | 2020-01-07 | 成都航天科工微电子系统研究院有限公司 | Chip cooling device for miniaturized processor |
| CN110987503A (en) * | 2019-12-19 | 2020-04-10 | 吉林建筑大学 | Heat pipe cooling system based on porous heat conduction material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101619879B (en) | Heat radiator with air pump separate type thermosiphon for machine room or machine cabinet | |
| EP2170030B1 (en) | Electronic apparatus | |
| CN100590377C (en) | Heat pipe cooling system and its heat transfer connector | |
| CN104329871B (en) | Semi-conductor refrigeration refrigerator and cold end heat exchanging device thereof | |
| WO2018191834A1 (en) | Flat loop heat pipe-based notebook computer cooling system | |
| CN103167780A (en) | Combined type radiator for power module and combined type radiator assembly | |
| CN104197612B (en) | A kind of high efficiency and heat radiation assembly of semiconductor freezer | |
| WO2020211416A1 (en) | Air conditioner outdoor unit and air conditioner | |
| WO2020211489A1 (en) | Outdoor air-conditioning unit and air conditioner | |
| US20100032141A1 (en) | cooling system utilizing carbon nanotubes for cooling of electrical systems | |
| CN210070062U (en) | Radiator, air condensing units and air conditioner | |
| TW201937126A (en) | Heat sink device | |
| CN108461461A (en) | A kind of porous conductive material filled-type heat-pipe radiator | |
| CN108417543A (en) | Heat-pipe radiator based on porous conductive material | |
| CN111988965A (en) | High-heating electronic equipment immersion type phase change cooling cabinet | |
| JP2010079403A (en) | Cooling system for electronic equipment | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN210014472U (en) | Air condensing units and air conditioner | |
| CN201547898U (en) | Separate thermosiphon heat sink with pump for machine room or machine cabinet | |
| CN201571152U (en) | Radiating structure of liquid crystal display television | |
| CN208606627U (en) | A kind of evaporative phase-change radiator based on drop spring | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
| CN201039655Y (en) | Heat radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180817 |
|
| RJ01 | Rejection of invention patent application after publication |