CN110660760A - Chip cooling device for miniaturized processor - Google Patents
Chip cooling device for miniaturized processor Download PDFInfo
- Publication number
- CN110660760A CN110660760A CN201910991263.6A CN201910991263A CN110660760A CN 110660760 A CN110660760 A CN 110660760A CN 201910991263 A CN201910991263 A CN 201910991263A CN 110660760 A CN110660760 A CN 110660760A
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- cooling device
- chip
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- processor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of chips and discloses a chip cooling device for a miniaturized processor. The method comprises the following steps: the front end of the fixing structure is provided with a boss, the outer surface of the boss is connected with the chip, the inside of the boss is of a hollow structure, the hollow structure adopts a mesh grid to isolate two channels, one channel I is filled with a carbon foam material, the carbon foam material is in contact with the inner surface of the boss, and the other channel II is communicated with the circulating cooling device and used for self circulation of cooling liquid. The structure of the scheme integrates the carbon foam material, the chip is cooled in a large area for a long time under the condition of long-time wettability, and the heat exchange efficiency of the chip is greatly improved by combining the advantages of the micro-channel; meanwhile, the fixing structure is communicated with the circulating cooling device through the cavity, and the circulating pipelines are arranged on two sides of the circulating cooling device, so that the size of the whole device is effectively reduced.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a chip cooling device for a miniaturized processor.
Background
With the development of internet technology, especially the development of internet of things, the storage and operation of the chip are higher and faster. The heat exchange device for the air-blowing cooling of the carbon foam material is designed on the basis of improving the heat exchange efficiency of the server chip in the working process, and has a very practical value in a large server base station. In the existing cooling device, the volume of the cooling device is often neglected when the cooling effect is considered, which is not favorable for the miniaturization development requirement of the chip.
In combination with the existing cooling mode, based on the above situation and based on the practical application of engineering, the invention provides an engineered chip cooling control device.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in view of the above problems, the present invention provides a chip cooling device for a miniaturized processor based on the practical application of engineering.
The technical scheme adopted by the invention is as follows: a chip cooling apparatus for a miniaturized processor, comprising: the front end of the fixing structure is provided with a boss, the outer surface of the boss is connected with the chip, the inside of the boss is of a hollow structure, the hollow structure adopts a mesh grid to isolate two channels, one channel I is filled with a carbon foam material, the carbon foam material is in contact with the inner surface of the boss, and the other channel II is communicated with the circulating cooling device and used for self circulation of cooling liquid.
Furthermore, the joint of the outer surface of the boss and the chip is coated with high-thermal-conductivity silicone grease.
Further, the carbon foam particle size is larger than the microchannel size of the mesh grid.
Further, the periphery of the pipeline of the circulating cooling device is surrounded by dense fin cooling fins.
Furthermore, threaded holes are formed in the surface of the cooling structure and used for being connected with a cooling fan, and the cooling fan is used for dissipating heat of a pipeline of the circulating cooling device.
Further, the fixing structure and the chip contact are assembled with a preset tolerance.
Furthermore, a valve is arranged on the side surface of the circulating cooling device, and the valve is communicated with a cooling pipeline of the circulating cooling device and is used for filling cooling liquid into the circulating cooling device.
Further, the mesh grid is fixed with the fixing structure through screws.
Furthermore, a sealing ring is arranged at the communication position of the channel II and the circulating cooling device, the sealing ring is arranged in a groove at the rear end of the fixing structure, and the thickness of the sealing ring is larger than that of the groove where the sealing ring is located.
Further, the fixing structure is made of aluminum material.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:
1) compared with a common server chip cooling device, the device integrates the carbon foam material, can keep the wettability for a longer time, can cool the chip in a large area for a long time, and greatly improves the heat exchange efficiency of the chip by combining the advantages of the micro-channel.
2) The fixed structure is communicated with the circulating cooling device through the cavity, and the circulating pipelines are arranged on two sides of the circulating cooling device, so that the size of the whole device is effectively reduced, and the product has the advantage of small size and wide application range in engineering application.
3) The carbon foam adopted in the invention has high thermal conductivity and fast heat transfer efficiency.
4) The invention has the advantage that the cooling property right made by the two circulating pipelines in the circulating cooling device can be very thin under the condition of ensuring the working efficiency.
5) The invention can be used in high-energy laser projection, laser radar and other digital processing chips.
Drawings
FIG. 1 is a plan view of a chip cooling device for a miniaturized processor according to the present invention.
Fig. 2 is a front view of the chip cooling device for the miniaturized processor of the present invention.
Fig. 3 is a rear view of the chip cooling device for the miniaturized processor of the present invention.
Fig. 4 is a perspective view of a chip cooling device for a miniaturized processor according to the present invention.
FIG. 5 is a schematic view of the contact surface of the circulating cooling device at the contact position between the fixing structure and the circulating cooling device in the chip cooling device for the miniaturized processor according to the present invention.
FIG. 6 is a schematic view of the contact surface of the fixing structure at the contact position of the fixing structure and the circulating cooling device in the chip cooling device for the miniaturized processor according to the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 to 3, a chip cooling device for a miniaturized processor includes: the cooling device comprises a fixed structure 1 and a circulating cooling device 2, wherein a boss 11 is arranged at the front end of the fixed structure 1, the outer surface of the boss 11 is connected with a chip, the inner part of the boss 11 is of a hollow structure, two channels are isolated from the hollow structure by adopting a mesh grid 23, one channel I is filled with a carbon foam material, the carbon foam material is contacted with the inner surface of the boss 11, the other channel II is communicated with the circulating cooling device 2 for self circulation of cooling liquid, the cooling liquid in the circulating cooling device 2 flows to the channel II when circulating, the carbon foam material in the channel I is cooled through the mesh grid, the chip is cooled, and when the cooling device is communicated, the rear end of the fixed structure 1 is contacted and fixed with the circulating cooling device 2; in order to seal the contact part, a rubber ring for sealing is arranged at the communication part of the channel II and the circulating cooling device.
The above structure has the following installation process: firstly, carbon foam material with good moisture retention is filled in the middle structure of a boss 11 of a fixed structure, then a silicon rubber ring which is not easy to corrode is placed in a groove 32 with a small surface at the rear end of the boss 11, the position of the rubber ring is as shown in the groove 32 in fig. 6, an isolation grid 23 and a circulating cooling device 2 are installed in an aligning mode, after the installation, the whole cooling structure is aligned to the boss of the fixed structure and tightly presses the sealed rubber ring, the circulating cooling device 2 is fixed with the fixed structure through flat head screws with corresponding sizes (the grid 32 is also fixed with the fixed structure, the hollow structure is divided into a channel I and a channel II, the channel I is arranged on the boss 11 side, and the channel II is arranged on the circulating cooling device 2 side), and the carbon foam material is isolated in front of the boss and connected with a chip. It should be noted that the above installation process is only one way, and the present invention is not limited to the above way, as long as the hollow structure can be separated into two channels by the separation grid, one channel is used for containing the carbon foam material, and the other channel is used for communicating with the circulating cooling liquid, and the present invention is within the protection scope of the present application.
In the installation process, the thickness of the sealing ring of the rubber ring is larger than the depth of the groove 32, so that the isolation mesh grid is convenient to compress, and the structure is cooled.
Preferably, as shown in fig. 4, the mesh grid 23 for isolation is a cooling mode of micro-channels, and four corners of the mesh grid 23 are provided with 5 screw holes with threads, and the mesh grid 23 and the circulating cooling device 2 are fixed through the screw holes. The carbon foam particle size is larger than the size of the grid microchannel 22; in this embodiment, the particle size of the carbon foam material is greater than 5 microns, and the size of the isolation grid is 1 mm.
In fig. 4, the thick wall sealing hole 24 of the circulation cooling device 2 is used for sealing with the hollow structure of the fixed structure, the groove 25 is a butt joint groove of the internal cavity 33 of the circulation cooling device and the spacer, the mark 26 is an enlarged structure of the internal cavity 33, and the hole 27 is used for a butt joint hole of the internal cavity 33 and the isolation grid.
The duct ii is connected to the circulation cooling device 2 in the following manner: the circulation cooling device 2 has a double helical pipe which is structurally connected to the internal cavity 33 of the circulation cooling device, the internal cavity connected thereto is a three-way pipe, and the pipe on the side is connected to the valve 21. The double spiral pipe of the circulating cooling device 2 is communicated with the hollow internal cavity 33 as shown in fig. 5, and the internal cavity 33 and the double spiral pipe are welded together by means of laser welding.
Preferably, the back of the circulation cooling device 2 (the back refers to the face opposite to the fixed structure 1, the back of the circulation cooling device 2 proves to be in contact with the fixed structure 1) is provided with a threaded hole for butting with the high-power cooling fan, and the high-power cooling fan blows air to the back of the spiral pipeline and the cooling cavity, so that the high-efficiency and rapid cooling of the whole structure can be realized.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
Claims (10)
1. A chip cooling apparatus for a miniaturized processor, comprising: the front end of the fixing structure is provided with a boss, the outer surface of the boss is connected with the chip, the inside of the boss is of a hollow structure, the hollow structure adopts a mesh grid to isolate two channels, one channel I is filled with a carbon foam material, the carbon foam material is in contact with the inner surface of the boss, and the other channel II is communicated with the circulating cooling device and used for self circulation of cooling liquid.
2. The chip cooling device for a miniaturized processor of claim 1, wherein a junction between the outer surface of the boss and the chip is coated with a silicone grease having a high thermal conductivity.
3. A chip cooling arrangement for a miniature processor as set forth in claim 1 wherein said carbon foam particles have a size greater than the size of the microchannels of the grid.
4. A chip cooling arrangement for a miniaturized processor of claim 1 wherein the tubes of the circulating cooling arrangement are surrounded by a dense fin cooling.
5. The chip cooling device for a miniaturized processor of claim 1, wherein a surface of the circulating cooling device is provided with a screw hole for connecting a heat radiating fan for radiating heat to a pipe of the circulating cooling device.
6. A chip cooling arrangement for a miniature processor according to claim 1, wherein the contact of said securing structure and chip is toleranced during assembly.
7. The chip cooling device for a miniaturized processor of claim 1, wherein a valve is provided to a side of the circulating cooling device, and the valve is connected to a cooling pipe of the circulating cooling device for filling the circulating cooling device with the cooling liquid.
8. A chip cooling arrangement for a miniature processor according to claim 1, wherein said grid is secured to a fixture by screws.
9. The chip cooling device for the miniaturized processor as set forth in claim 1, wherein a sealing ring is provided at a communication position of the channel II and the circulating cooling device, the sealing ring is installed in a groove at the rear end of the fixing structure, and the thickness of the sealing ring is larger than that of the groove in which the sealing ring is located.
10. The chip cooling apparatus for a miniaturized processor of claim 1, wherein the fixing structure is made of an aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910991263.6A CN110660760B (en) | 2019-10-18 | 2019-10-18 | Chip cooling device for miniaturized processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910991263.6A CN110660760B (en) | 2019-10-18 | 2019-10-18 | Chip cooling device for miniaturized processor |
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| Publication Number | Publication Date |
|---|---|
| CN110660760A true CN110660760A (en) | 2020-01-07 |
| CN110660760B CN110660760B (en) | 2021-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910991263.6A Active CN110660760B (en) | 2019-10-18 | 2019-10-18 | Chip cooling device for miniaturized processor |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202111984U (en) * | 2011-07-06 | 2012-01-11 | 青岛高泰新材料有限公司 | Novel heat sink |
| CN108417543A (en) * | 2018-03-14 | 2018-08-17 | 国网湖南省电力有限公司 | Heat-pipe radiator based on porous conductive material |
| CN108461461A (en) * | 2018-03-14 | 2018-08-28 | 国网湖南省电力有限公司 | A kind of porous conductive material filled-type heat-pipe radiator |
| CN108957920A (en) * | 2018-08-08 | 2018-12-07 | 四川长虹电器股份有限公司 | A kind of high power illumination dmd chip circulation foamed material liquid cooling device |
-
2019
- 2019-10-18 CN CN201910991263.6A patent/CN110660760B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202111984U (en) * | 2011-07-06 | 2012-01-11 | 青岛高泰新材料有限公司 | Novel heat sink |
| CN108417543A (en) * | 2018-03-14 | 2018-08-17 | 国网湖南省电力有限公司 | Heat-pipe radiator based on porous conductive material |
| CN108461461A (en) * | 2018-03-14 | 2018-08-28 | 国网湖南省电力有限公司 | A kind of porous conductive material filled-type heat-pipe radiator |
| CN108957920A (en) * | 2018-08-08 | 2018-12-07 | 四川长虹电器股份有限公司 | A kind of high power illumination dmd chip circulation foamed material liquid cooling device |
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| Publication number | Publication date |
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| CN110660760B (en) | 2021-01-26 |
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Address after: No. 269, North Hupan Road, zone B, Tianfu New Economic Industrial Park, Tianfu New District, Chengdu, Sichuan Province Applicant after: Aerospace Science, engineering, Microelectronics System Research Institute Co., Ltd Address before: 610000 Sichuan city of Chengdu province Tianfu Tianfu Avenue South Huayang Street No. 846 Applicant before: Chengdu Aerospace Science and technology Microelectronics System Research Institute Co., Ltd. |
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