CN107702065B - Vapor-liquid phase cooling module of high-efficiency COBLED luminous component in unlimited direction - Google Patents
Vapor-liquid phase cooling module of high-efficiency COBLED luminous component in unlimited direction Download PDFInfo
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- CN107702065B CN107702065B CN201711111886.7A CN201711111886A CN107702065B CN 107702065 B CN107702065 B CN 107702065B CN 201711111886 A CN201711111886 A CN 201711111886A CN 107702065 B CN107702065 B CN 107702065B
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- emitting component
- module shell
- led light
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- 239000007791 liquid phase Substances 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 title claims description 4
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 238000009833 condensation Methods 0.000 claims abstract description 22
- 230000005494 condensation Effects 0.000 claims abstract description 22
- 238000001704 evaporation Methods 0.000 claims abstract description 18
- 230000008020 evaporation Effects 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000565 sealant Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000012209 synthetic fiber Substances 0.000 claims description 2
- 229920002994 synthetic fiber Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention relates to a high-efficiency COB LED luminous component vapor-liquid phase heat dissipation module without limitation, which comprises a COB LED luminous component (1) and a module shell (2), wherein a substrate (11) of the COB LED luminous component (1) is arranged on the module shell (2) to form a sealed heat exchange cavity (22), the back of the substrate (11) forms an evaporation surface, the inner wall of the module shell (2) forms a condensation surface, working liquid (3) is filled in the heat exchange cavity (22), and a porous capillary wick (4) is arranged in the heat exchange cavity (22). The heat dissipation device eliminates the thermal interface material, effectively reduces the contact thermal resistance in the heat dissipation process of the conventional COB LED luminous component, can timely and rapidly transfer and export the heat generated by the COB LED luminous component, does not form self-heating conditions, does not cause heat accumulation and superposition, ensures that the heat dissipation effect of the COB LED luminous component is ideal, can greatly prolong the service life of the COB LED luminous component, greatly improves the service performance and reliability, and overcomes the defect that the heat dissipation effect is not good enough to seriously influence popularization and application.
Description
Technical Field
The invention relates to LED light-emitting equipment, in particular to a vapor-liquid phase cooling module of an unlimited-direction COB LED light-emitting component.
Background
In recent years, the development of LED lighting equipment is very rapid, the luminous efficiency of the LED is obviously improved, the heating value is obviously reduced, the service life is obviously prolonged, and the heat dissipation effect is the root cause for influencing the service life. In order to improve the installation efficiency of the LED lighting equipment and reduce the volume, COB LED packaging technology has also developed, and the COB LED packaging technology packages a plurality of LED chip arrays on a substrate to manufacture a high-power LED luminous component, has the characteristics of high power density, high luminous flux, large heat flux density and the like, and compared with the LEDs which are separately installed, the COB LED luminous component has the advantages of high integration degree, large power, small volume, more concentrated heat productivity and more outstanding problem that the service life is influenced by the heat dissipation effect. At present, various heat dissipation modes commonly used for COB LED luminous assemblies mainly comprise natural convection heat dissipation, heat pipe auxiliary heat dissipation, fan forced convection heat dissipation and the like, and all the modes are that a COB LED luminous assembly substrate is arranged on a radiator to dissipate heat through the radiator by utilizing the various modes, contact thermal resistance exists between the COB LED luminous assembly substrate and the radiator, and the contact thermal resistance can directly influence the heat transfer effect between the COB LED luminous assembly substrate and the radiator. In order to improve the contact area between the COB LED luminous component substrate and the radiator and reduce the contact thermal resistance, thermal interface materials such as heat conduction silicone grease and the like are smeared between the contact surfaces of the COB LED luminous component substrate and the radiator, but the heat conduction coefficient of the thermal interface materials is smaller than that of the COB LED luminous component substrate and the radiator, and the heat conduction coefficient of the thermal interface materials from the COB LED luminous component substrate to the radiator is far smaller than that along the thermal interface direction of the thermal interface materials. Therefore, even if the thermal interface material is smeared, the contact thermal resistance between the COB LED light-emitting component substrate and the radiator cannot be eliminated at all, and along with the increase of the service time, the contact effect between the thermal interface material and the COB LED light-emitting component substrate and the radiator can be gradually reduced after the thermal interface material is heated for a long time, the thermal resistance can be further increased, and the heat transfer effect from the COB LED light-emitting component substrate to the radiator is further influenced.
The traditional LED light-emitting component packaged by a single chip has the defects of less heat productivity and small heat productivity, so that the heat is relatively easy to conduct and diffuse into the environment. The high-power COB LED luminous component has concentrated heat productivity and large heat productivity, and needs to transfer and lead out heat efficiently and rapidly, otherwise, a self-heating effect is generated on the substrate of the COB LED luminous component, the heat accumulation temperature is higher and higher, if the temperature exceeds the upper limit of the using temperature of the COB LED luminous component, the luminous efficiency of the COB LED luminous component is reduced or even damaged, the performance and the reliability of the COB LED luminous component are destructively influenced, the service life of the COB LED luminous component is greatly reduced, and the COB LED luminous component becomes a technical bottleneck for popularization and application of COB LED illumination products.
In addition, the COB LED light-emitting component using the heat pipe to assist in heat dissipation is limited by the installation direction, the COB LED light-emitting component cannot be installed in any direction, the use limit is very large, and the COB LED light-emitting component cannot be widely popularized and applied.
Disclosure of Invention
The invention aims at solving the defects that the existing COB LED luminous component has obvious contact thermal resistance, heat is not easy to be conducted out in time, heat accumulation and superposition are easy to occur, the radiating effect is not ideal, the service life is seriously influenced, and the installation is limited by the direction, and provides a high-efficiency COB LED luminous component vapor-liquid phase radiating module with no limitation on the direction.
The technical scheme of the invention is as follows: the COB LED heat exchange module comprises a COB LED light-emitting assembly and a module shell, wherein the module shell is a closed hollow body provided with a light-emitting assembly mounting opening, the periphery of a COB LED light-emitting assembly substrate is directly or indirectly sealed and mounted on the light-emitting assembly mounting opening on the module shell, a closed heat exchange cavity is formed in the module shell together with the module shell, the light-emitting surface of the COB LED light-emitting assembly faces out of the module shell, the back surface of the substrate on the back side of the light-emitting surface of the COB LED light-emitting assembly faces out of the module shell, the evaporation surface of the heat exchange cavity is formed by the back surface of the substrate on the back side of the light-emitting surface of the COB LED light-emitting assembly, the condensation surface of the heat exchange cavity is formed by the inner wall of the module shell, working liquid is partially filled in the heat exchange cavity, a porous structure capillary liquid suction core is tightly attached to the back surface of the substrate on the back surface of the COB LED light-emitting assembly faces the heat exchange cavity, the working liquid capillary force backflow channel is formed by the porous structure capillary liquid suction core in the condensation surface from the condensation surface, and working liquid vapor channels are formed from the evaporation surface to the condensation surface.
The invention has the technical effects that: the heat dissipation device eliminates the thermal interface material, effectively reduces the contact thermal resistance in the heat dissipation process of the conventional COB LED luminous component, can timely and rapidly transfer and export the heat generated by the COB LED luminous component, does not form self-heating conditions, does not cause heat accumulation and superposition, ensures that the heat dissipation effect of the COB LED luminous component is ideal, can greatly prolong the service life of the COB LED luminous component, greatly improves the service performance and reliability, and overcomes the defect that the heat dissipation effect is not good enough to seriously influence popularization and application.
The LED light-emitting module is not limited by directions in use, can be installed and used in any direction, further improves the application range, and provides powerful guarantee for popularization and application of the high-power COB LED light-emitting module. The heat on the COB LED substrate is directly transferred to the radiator by means of vapor-liquid phase change of the working liquid in the module, the working liquid is in direct contact with the COB LED light-emitting component substrate, a thermal interface material is omitted, contact thermal resistance between the COB LED substrate and the radiating component is greatly reduced, and heat at the bottom heat source of the COB LED light-emitting component substrate can be timely and effectively transferred out of the heat source. In the vapor-liquid phase heat transfer process, the heat resistance is small, the heat transfer effect is more reliable, the heat transfer capability is stronger, the efficiency is higher, and the purpose of quickly, efficiently and timely reducing the temperature of the substrate of the COB LED luminous component is achieved.
The device has a simple structure, heat transfer is carried out by means of self vapor-liquid phase change of the working liquid, other energy sources are not needed to be consumed for auxiliary heat transfer, and the use cost is lower. The method can reduce the process cost, realize standardized and industrialized production, and provide an ideal path for the efficient heat dissipation of other high-power semiconductor devices.
The invention has the advantages that:
1. the COB LED luminous component substrate is directly contacted with the working liquid to realize vapor-liquid phase heat dissipation, so that a thermal interface material is eliminated;
2. the COB LED luminous component substrate is directly contacted with the working liquid to dissipate heat in a vapor-liquid phase, so that a heat transfer mode is changed, and the contact thermal resistance is greatly reduced;
3. the heat on the COB LED luminous component substrate directly dissipates heat through the vapor phase and the liquid phase of the working liquid, and the heat transfer efficiency is extremely high;
4. the structure is simple, the processing and manufacturing cost is low, power is not needed, and the use cost is low;
5. the heat dissipation device is modularized, can be combined into various heat dissipation modes, and is more convenient to use.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
FIG. 2 is a schematic cross-sectional view of an embodiment of the present invention;
FIG. 3 is an axial view of an embodiment of the present invention;
FIG. 4 is a diagram illustrating a second cross-sectional structure of an embodiment of the present invention;
FIG. 5 is a three-sectional structural view of an embodiment of the present invention;
FIG. 6 is a diagram of a fourth cross-sectional structure of an embodiment of the present invention;
FIG. 7 is a fifth cross-sectional view of the embodiment of the present invention;
fig. 8 is a fifth axial view of an embodiment of the present invention.
Detailed Description
As shown in fig. 1 and 2, the module comprises a COB LED light emitting assembly 1 and a module housing 2, the module housing 2 is a closed hollow body provided with a light emitting assembly mounting opening 21, the periphery of a substrate 11 of the COB LED light emitting assembly 1 is directly or indirectly sealed and mounted on the light emitting assembly mounting opening 21 on the module housing 2, a closed heat exchange cavity 22 is formed by surrounding the COB LED light emitting assembly 1 and the module housing 2 in the module housing 2, the light emitting surface of the COB LED light emitting assembly 1 faces out of the module housing 2, the back surface of the substrate 11 on the back side of the light emitting surface of the COB LED light emitting assembly 1 faces into the module housing 2 to form an evaporation surface of the heat exchange cavity 22, the inner wall of the module housing 2 forms a condensation surface of the heat exchange cavity 22, working liquid 3 is filled in the heat exchange cavity 22, a porous capillary wick 4 closely attached to the back surface of the substrate 11 in the heat exchange cavity 22 is arranged in the heat exchange cavity 22, the porous capillary wick 4 forms a working liquid capillary force backflow channel from the condensation surface to the condensation surface, and a gap position outside the porous wick 4 in the heat exchange cavity 22 forms a working liquid vapor channel from the evaporation surface to the condensation surface.
The evaporation surface side condensation surface far away from the evaporation surface in the heat exchange cavity 22 is a main condensation surface, the main condensation surface is not provided with the porous capillary liquid suction cores 4, the porous capillary liquid suction cores 4 in the heat exchange cavity 22 extend from the evaporation surface to the edge of the main condensation surface along the inner wall of the module shell 2, and the working liquid condensed on the main condensation surface flows back to the porous capillary liquid suction cores 4 on the evaporation surface along the porous capillary liquid suction cores 4 by capillary force.
The outer wall of the module shell 2 is provided with a plurality of radiating fins 23, and the module shell 2 is provided with a vacuumizing liquid filling tube head 24, one end of which is connected with the outer wall of the module shell 2 and communicated with the interior of the module shell 2, and the other end of which is communicated with the exterior of the module shell 2.
The porous capillary wick 4 is a hard porous ceramic member attached to the inner wall of the heat exchange chamber 22.
The porous capillary liquid suction core 4 is a soft metal porous material component or a soft porous synthetic fiber component, and an elastic support 41 for externally supporting and tightly attaching the soft porous capillary liquid suction core 4 on the inner wall of the heat exchange cavity is arranged in the heat exchange cavity 22.
In the first embodiment, as shown in fig. 2 and 3, a module housing 2 is a cylindrical cup-shaped body with an axial direction perpendicular to a direction of a light emitting assembly mounting opening 21, a plurality of heat dissipation fins 23 are axially arranged on a side wall of the module housing 2, a plurality of heat dissipation fins 23 are arranged on an outer wall of an end face, and a vacuumizing liquid filling tube head 24 with one end connected with the outer wall of the module housing 2 and communicated with the inside of the module housing 2 and the other end communicated with the outside of the module housing 2 is arranged on the end face of the module housing 2. The end part of the vacuumized liquid filling pipe head 24 communicated with the outside of the module shell 2 is flattened and sealed by welding a leakage-free seal after vacuumized liquid filling in the module shell 2. The cup-shaped module shell 2 is formed by welding a cylindrical section bar and a disc-shaped bottom plate, wherein a plurality of radiating fins 23 are axially arranged on the outer wall of the cylindrical section bar, and a plurality of radiating fins 23 are arranged on the outer wall of the disc-shaped bottom plate. The outer wall of the module housing 2 at the end of the light-emitting assembly mounting opening 21 is provided with external threads 25 for mounting the heat dissipation module on the mounting plate.
The module shell 2 inner wall at the end of the light-emitting component mounting port 21 is provided with an internal thread 26, the COB LED light-emitting component 1 is mounted in the module shell 2, the back of the substrate 11 is clung to the porous capillary wick 4, the internal thread 26 of the module shell outside the COB LED light-emitting component 1 is provided with a mounting ring 5 through threads and sealant, the front periphery of the substrate 11 of the COB LED light-emitting component 1 is clung to the mounting ring 5 and is fixed on the mounting ring 5 through a plurality of screws 6, and the screws 6 penetrate through screw unthreaded holes in the mounting ring 5 from the outer side direction of the module shell 2 and are then mounted on threaded holes in the substrate 11 of the COB LED light-emitting component 1 through threads. And sealant is respectively arranged on the joint surface of the substrate 11 of the COB LED luminous component 1 and the mounting ring 5 and in gaps among the screws 6, the screw unthreaded holes and the threaded holes. The peripheral end face of the mounting ring 5 facing the outside of the module housing 2 is provided with a plurality of clamping grooves I51 matched with the mounting wrench.
In the second embodiment, as shown in fig. 4, the difference from the first embodiment is that the inner wall of the module housing 2 at the end of the mounting port 21 of the light emitting assembly is provided with an internal thread 26 for mounting the COB LED light emitting assembly 1, the substrate 11 of the COB LED light emitting assembly 1 is disc-shaped with an external thread on the periphery, the back of the substrate 11 of the COB LED light emitting assembly 1 is tightly attached to the porous capillary wick 4 in the module housing 2, and the periphery of the substrate 11 of the COB LED light emitting assembly 1 is mounted on the internal thread 26 of the module housing 2 by threads and sealant. The peripheral end face of the substrate 11 of the COB LED luminous assembly 1 facing the outside of the module shell 2 is provided with a plurality of clamping grooves II 12 matched with the mounting wrench.
In the third embodiment, as shown in fig. 5, the difference from the first embodiment is that the inner wall of the module housing 2 at the end of the mounting opening 21 of the light emitting assembly is provided with a mounting step 27 and an internal thread 26 from inside to outside, the COB LED light emitting assembly 1 is mounted in the module housing 2, the back surface of the substrate 11 is tightly attached to the porous capillary wick 4 in the module housing 2, the back edge of the substrate 11 is pressed against the end surface of the mounting step 27, and the internal thread 26 is provided with a mounting ring 5 for tightly pressing the periphery of the substrate 11 of the COB LED light emitting assembly 1 against the end surface of the mounting step 27 by threads and sealant. Sealant is respectively arranged between the mounting ring 5 and the substrate 11 of the COB LED light-emitting component 1 and between the periphery of the substrate 11 of the COB LED light-emitting component 1 and the end face of the mounting step 27. The peripheral end face of the mounting ring 5 facing the outside of the module housing 2 is provided with a plurality of clamping grooves I51 matched with the mounting wrench.
In the fourth embodiment, as shown in fig. 6, the difference from the first embodiment is that the inner wall of the module housing 2 at the end of the mounting opening 21 of the light emitting assembly is provided with a mounting step 27 and an internal thread 26 from inside to outside, the substrate 11 of the COB LED light emitting assembly 1 is disc-shaped with an external thread on the periphery, the back surface of the substrate 11 of the COB LED light emitting assembly 1 is tightly attached to the capillary wick 4 with a porous structure in the module housing 2, the edge of the back surface of the substrate 11 is pressed on the end surface of the mounting step 27, and the periphery of the substrate 11 of the COB LED light emitting assembly 1 is mounted on the internal thread of the module housing 2 in a sealing manner through threads and sealant. The peripheral end face of the substrate 11 of the COB LED luminous assembly 1 facing the outside of the module shell 2 is provided with a plurality of clamping grooves II 12 matched with the mounting wrench.
In a fifth embodiment, as shown in fig. 7 and 8, the module housing 2 is a flat square box-shaped body with a surface and opposite side areas larger than other sides, the module housing 2 is provided with a light emitting assembly mounting opening 21, the opposite side outer wall of the surface is provided with a plurality of radiating fins 23, the light emitting assembly mounting opening 21 is a circular hole formed in one large side of the module housing 2, the back surface of the substrate 11 of the COB LED light emitting assembly 1 is pressed on the porous capillary wick 4 in the module housing 2, the surface of the light emitting assembly mounting opening 21 of the module housing 2 is provided with a fixing ring 7, the periphery of the front surface of the substrate 11 of the COB LED light emitting assembly 1 is attached to the side surface of the fixing ring 7 and is mounted on the fixing ring 7 through a plurality of screws 6, the screws 6 respectively penetrate through screw light holes in the fixing ring 7 from the outer side direction of the module housing 2 and are mounted on the threaded holes in the substrate 11 of the COB LED light emitting assembly 1, the fixing ring 7 is attached to the outer wall of the module housing 2 toward the periphery of the module housing 21, and the screws 6 are mounted on the threaded holes in the module housing 2 respectively from the outer side direction of the module housing 2. An elastic support 41 for tightly attaching the outer support of the porous capillary wick 4 to the inner wall of the heat exchange cavity is arranged in the heat exchange cavity 22. Sealing glue is respectively arranged between the sealing matching surfaces of the fixing ring 7 and the module shell 2, between the sealing matching surfaces of the fixing ring 7 and the substrate 11 of the COB LED light-emitting assembly 1, and between each screw 6 and the gaps of the substrate 11 of the COB LED light-emitting assembly 1, the fixing ring 7 and the module shell 2.
The working principle of the invention is as follows:
after the COB LED light-emitting assembly 1 is directly or indirectly sealed and installed on the light-emitting assembly installation port 21 of the module shell 2, the interior of the heat exchange cavity 22 is vacuumized through the vacuumizing liquid filling pipe head 24. When the vacuum degree in the heat exchange cavity 22 meets the requirement, namely the tightness meets the standard, a proper amount of working liquid 3 is injected into the heat exchange cavity 22 through the vacuumizing liquid injection tube head 24, and the end part of the vacuumizing liquid injection tube head 24 is flattened and sealed and welded without leakage.
When the COB LED light-emitting component 1 works, a large amount of heat is emitted, the working liquid 3 in the porous capillary wick 4 closely attached to the substrate 11 of the COB LED light-emitting component 1 absorbs heat and evaporates into saturated steam to take away heat, and the pressure generated by the saturated steam can cause the saturated steam to permeate into the gaps in the whole heat exchange cavity 22. When the steam contacts the wall part of the module shell 2 in the low-temperature area in the module shell 2, the heat absorbed during evaporation is released to be condensed into liquid, the condensed working liquid 3 flows back to the porous structure capillary liquid suction core 4 at the position of the substrate 11 of the COB LED light-emitting component 1 along the porous structure capillary liquid suction core 4 and the wall part of the module shell 2 by capillary force, the heat is continuously absorbed and evaporated, the heat is further condensed into liquid to release the heat, the working liquid 3 in the porous structure capillary liquid suction core 4 at the position of the substrate 11 of the COB LED light-emitting component 1 is continuously evaporated and is supplemented by capillary force, and the processes are repeated, so that the heat transfer and the heat dissipation of low thermal resistance vapor-liquid phase can be continuously realized.
The heat on the substrate of the COB LED luminous component 1 is continuously transferred to the module shell 2 in the vapor-liquid phase heat transfer process, and then is radiated and transmitted out through the outer wall of the module shell 2, so that the purpose of rapid heat transfer and radiation is achieved. The capillary force continuously formed between the evaporation surface and the condensation surface by the porous capillary wick 4 in the module shell 2 is the driving force of the circulation of the working liquid 3 in the vapor-liquid phase transition heat transfer process, and the physical property and structure of the porous capillary wick 4 well overcome the problem that the reflux of the working liquid 3 is limited due to gravity, so that the heat dissipation module is not limited by the direction any more, has good heat transfer capability in the heat transfer processes in different directions, and further enables the COB LED luminous assembly to be widely applied.
Claims (7)
1. The utility model provides a high-efficient COB LED luminous element vapour-liquid phase cooling module of unlimited direction, it includes COB LED luminous element (1) and module casing (2), module casing (2) is for being equipped with the airtight cavity of luminous element mounting mouth (21), the periphery of COB LED luminous element (1) base plate (11) is direct or indirect sealed install on module casing (2) luminous element mounting mouth (21), enclose into airtight heat transfer chamber (22) together with module casing (2) in module casing (2), the luminous surface of COB LED luminous element (1) is outside module casing (2), the evaporation surface of the substrate (11) of the luminous surface back side of COB LED luminous element (1) constitutes heat transfer chamber (22) towards module casing (2) inside, the condensation surface of heat transfer chamber (22) is constituteed to the inner wall of module casing (2), the inside partial filling of heat transfer chamber (22) has working liquid (3), be equipped with in heat transfer chamber (22) and hug closely on the base plate (11) back in heat transfer chamber (22) and extend on the porous capillary wick structure 4 of module casing (4) and be close to the capillary wick structure from the back side of evaporation surface to the capillary wick, the gap positions outside the porous capillary wick (4) in the heat exchange cavity (22) form a working liquid steam channel from the evaporation surface to the condensation surface, and the device is characterized in that: the evaporation surface opposite side condensation surface far away from the evaporation surface in the heat exchange cavity (22) is a main condensation surface, the main condensation surface is not provided with a porous structure capillary liquid suction core (4), the porous structure capillary liquid suction core (4) in the heat exchange cavity (22) extends from the evaporation surface to the edge of the main condensation surface along the inner wall of the module shell (2) and is used for the working liquid condensed on the main condensation surface to flow back to the porous structure capillary liquid suction core (4) on the evaporation surface by capillary force along the porous structure capillary liquid suction core (4), the porous structure capillary liquid suction core (4) is a soft metal porous material component or a soft porous synthetic fiber component, an elastic support (41) for externally supporting the soft porous structure capillary liquid suction core (4) on the inner wall of the heat exchange cavity is arranged in the heat exchange cavity (22), the module shell (2) is a cylindrical cup-shaped body axially perpendicular to the direction of the mounting opening (21), a plurality of radiating fins (23) are axially arranged on the side wall of the module shell (2), and a plurality of radiating fins (23) are arranged on the outer wall of the end face.
2. The efficient COB LED light emitting assembly vapor-liquid phase heat dissipation module with the unlimited direction as claimed in claim 1 is characterized in that a plurality of heat dissipation fins (23) are arranged on the outer wall of the module shell (2), and a vacuumizing liquid injection tube head (24) with one end connected with the outer wall of the module shell (2) and communicated with the inside of the module shell (2) and the other end communicated with the outside of the module shell (2) is arranged on the module shell (2).
3. The efficient COB LED light-emitting component vapor-liquid phase heat dissipation module without limitation according to claim 1 is characterized in that an end face of the module shell (2) is provided with a vacuumizing liquid injection tube head (24) with one end connected with the outer wall of the module shell (2) and communicated with the inside of the module shell (2) and the other end communicated with the outside of the module shell (2), and the outer wall of the module shell (2) at the end of the light-emitting component mounting port (21) is provided with external threads (25) for mounting the heat dissipation module on a mounting plate.
4. The efficient COB LED light-emitting component vapor-liquid phase heat dissipation module according to claim 1, wherein internal threads (26) are arranged on the inner wall of a module shell (2) at the end of a light-emitting component mounting port (21), the COB LED light-emitting component (1) is mounted in the module shell (2), the back of a substrate (11) is tightly attached to a porous capillary liquid suction core (4), a mounting ring (5) is mounted on the internal threads (26) of the module shell outside the COB LED light-emitting component (1) through threads and sealant, the periphery of the front face of the substrate (11) of the COB LED light-emitting component (1) is tightly attached to the mounting ring (5) and is fixed on the mounting ring (5) through a plurality of screws (6), and the screws (6) penetrate through screw holes in the mounting ring (5) from the outer side direction of the module shell (2) and are mounted on threaded holes in the substrate (11) of the COB LED light-emitting component (1).
5. The efficient COB LED light-emitting component vapor-liquid phase heat dissipation module without limitation as claimed in claim 1, wherein an inner thread (26) for installing the COB LED light-emitting component (1) is arranged on the inner wall of a module shell (2) at the end of a light-emitting component installing port (21), a substrate (11) of the COB LED light-emitting component (1) is disc-shaped with external threads on the periphery, the back surface of the substrate (11) of the COB LED light-emitting component (1) is tightly attached to a porous capillary wick (4) in the module shell (2), and the periphery of the substrate (11) of the COB LED light-emitting component (1) is installed on the inner thread (26) of the module shell (2) in a sealing mode through threads and sealing glue.
6. The efficient COB LED light-emitting component vapor-liquid phase heat dissipation module without limitation according to claim 1 is characterized in that an inner wall of a module shell (2) at the end of a light-emitting component mounting port (21) is externally provided with a mounting step (27) and an internal thread (26) from inside to outside, the COB LED light-emitting component (1) is mounted in the module shell (2), the back surface of a substrate (11) is tightly attached to a porous capillary wick (4) in the module shell (2), the back surface edge of the substrate (11) is pressed on the end surface of the mounting step (27), and a mounting ring (5) for tightly pressing the periphery of the substrate (11) of the COB LED light-emitting component (1) on the end surface of the mounting step (27) is mounted on the internal thread (26) through threads and sealing glue.
7. The efficient COB LED light-emitting component vapor-liquid phase heat dissipation module with the unlimited direction as claimed in claim 1 is characterized in that an inner wall of a module shell (2) at the end of a light-emitting component mounting port (21) is externally provided with a mounting step (27) and an internal thread (26) from inside to outside, a substrate (11) of the COB LED light-emitting component (1) is disc-shaped with external threads at the periphery, the back surface of the substrate (11) of the COB LED light-emitting component (1) is tightly attached to a porous capillary wick (4) in the module shell (2), the edge of the back surface of the substrate (11) is pressed on the end surface of the mounting step (27), and the periphery of the substrate (11) of the COB LED light-emitting component (1) is mounted on the internal thread of the module shell (2) in a sealing mode through threads and sealing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711111886.7A CN107702065B (en) | 2017-11-13 | 2017-11-13 | Vapor-liquid phase cooling module of high-efficiency COBLED luminous component in unlimited direction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711111886.7A CN107702065B (en) | 2017-11-13 | 2017-11-13 | Vapor-liquid phase cooling module of high-efficiency COBLED luminous component in unlimited direction |
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| Publication Number | Publication Date |
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| CN107702065A CN107702065A (en) | 2018-02-16 |
| CN107702065B true CN107702065B (en) | 2024-04-05 |
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| CN201711111886.7A Active CN107702065B (en) | 2017-11-13 | 2017-11-13 | Vapor-liquid phase cooling module of high-efficiency COBLED luminous component in unlimited direction |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108801017B (en) * | 2018-06-13 | 2024-02-06 | 中国科学院工程热物理研究所 | Heat radiator for heat source |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101865370A (en) * | 2009-04-16 | 2010-10-20 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
| CN103712111A (en) * | 2014-01-10 | 2014-04-09 | 广州大学 | LED lamp based on anti-gravity radiating |
| CN207422134U (en) * | 2017-11-13 | 2018-05-29 | 唐墨 | The unlimited efficient COBLED luminescence components liquid-gas phase transition radiating module in direction |
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2017
- 2017-11-13 CN CN201711111886.7A patent/CN107702065B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101865370A (en) * | 2009-04-16 | 2010-10-20 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
| CN103712111A (en) * | 2014-01-10 | 2014-04-09 | 广州大学 | LED lamp based on anti-gravity radiating |
| CN207422134U (en) * | 2017-11-13 | 2018-05-29 | 唐墨 | The unlimited efficient COBLED luminescence components liquid-gas phase transition radiating module in direction |
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