CN108801017B - Heat radiator for heat source - Google Patents
Heat radiator for heat source Download PDFInfo
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- CN108801017B CN108801017B CN201810610799.4A CN201810610799A CN108801017B CN 108801017 B CN108801017 B CN 108801017B CN 201810610799 A CN201810610799 A CN 201810610799A CN 108801017 B CN108801017 B CN 108801017B
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- 239000007791 liquid phase Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 239000011148 porous material Substances 0.000 claims description 23
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- 230000020169 heat generation Effects 0.000 abstract description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention provides a heat dissipating device of a heat generating source which is a plate-shaped heat generating source and is at least partially inclined with respect to a horizontal plane, comprising: a heat conductive plate disposed at one side of the plate-shaped heat generating source to thermally contact the plate-shaped heat generating source; the heat dissipation assembly is arranged at the opposite side of the heat conduction plate relative to the heat generation source, is connected to the peripheral part of the heat conduction plate and is used for enclosing a closed steam cavity with the heat conduction plate, and the steam cavity is suitable for storing liquid phase change heat dissipation medium; and a plate-shaped porous medium liquid absorption core which is positioned in the steam cavity and is in thermal contact with the heat conducting plate, wherein the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation component so as to be absorbed again by the porous medium liquid absorption core.
Description
Technical Field
The present disclosure relates to heat dissipation, and particularly to a heat dissipation device for a heat source.
Background
Most of the input power of a light-emitting source, such as an LED lamp, can be converted into heat, and the heat accumulation can cause the temperature of the light-emitting source to rise, so that the spectral line of the light-emitting source shifts, the light efficiency is reduced and the service life is shortened. Therefore, the heat sink is a critical component in the design of high power light emitting sources, such as LED fixtures. Common sectional materials are limited in heat dissipation capacity and heat pipe heat dissipation capacity, so that good heat dissipation effect is difficult to generate for a high-power luminous source. Liquid phase-change heat dissipation becomes the mainstream technology for solving the heat dissipation of high-power light-emitting sources at present.
Liquid phase-change heat dissipation has been used to solve the heat dissipation problem of bottom-emitting LED lamps. Along with strong cognition of society on environmental protection and energy saving, side-emitting LED lamps such as high-power projection lamps, fish-attracting lamps and the like are increasingly widely used. For the side-emitting LED lamp, as the heating source is at least partially inclined relative to the horizontal plane, and the flow of the phase-change liquid is influenced by gravity, the heating source is difficult to infiltrate for effective heat dissipation, so that no viable liquid phase-change heat dissipation solution exists at present.
Disclosure of Invention
The invention aims to provide a heat dissipation device for a heat source, in particular a side-emitting LED lamp, so as to solve the problem that the heat source is difficult to dissipate heat effectively through liquid phase change heat when at least partially inclined.
An embodiment of the present invention provides a heat dissipating device of a heat generating source which is a plate-shaped heat generating source and is at least partially inclined with respect to a horizontal plane, including:
a heat conductive plate disposed at one side of the plate-shaped heat generating source to thermally contact the plate-shaped heat generating source;
the heat dissipation assembly is arranged at the opposite side of the heat conduction plate relative to the heat generation source, is connected to the peripheral part of the heat conduction plate and is used for enclosing a closed steam cavity with the heat conduction plate, and the steam cavity is suitable for storing liquid phase change heat dissipation medium; and
and the plate-shaped porous medium liquid absorption core is positioned in the steam cavity and is in thermal contact with the heat conducting plate, wherein the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation component so as to be absorbed again by the porous medium liquid absorption core.
According to some embodiments, a heat dissipating assembly includes:
the top end cover is arranged at the top end of the steam cavity;
the bottom end cover is arranged at the bottom end of the steam cavity;
and the heat dissipation part is connected with the top end cover and the bottom end cover, forms an arched inner wall surface of the steam cavity opposite to the heat conducting plate, and the outer side of the arched inner wall surface is connected with heat dissipation fins.
According to some embodiments, the heat dissipating device further comprises: a baffle plate is arranged around the porous medium liquid absorption core in the steam cavity, and a guide channel is formed between the baffle plate and the porous medium liquid absorption core so as to guide the gas converted by the liquid phase-change heat dissipation medium in the porous medium liquid absorption core to flow upwards.
According to some embodiments, the plate-like heat generating source and the thermally conductive plate are connected by a thermal interface material.
According to some embodiments, in the porous media wick, the pores relatively near the bottom are smaller in pore size and greater in density than the pores relatively near the top.
According to some embodiments, a closable hole is provided in the center of the top end cap, the hole being used for feeding liquid phase change heat dissipation medium into the vapor chamber or for extracting air from the vapor chamber.
According to some embodiments, the arched inner wall surface of the steam cavity is coated with a hydrophobic material.
According to some embodiments, a plurality of micro channels are provided on the inner surface of the bottom end cap for directing the liquid phase change heat sink medium evenly to the bottom of the porous medium wick.
According to some embodiments, the top of the micro channel has a gap from the bottom of the porous media wick.
According to some embodiments, the microchannels are perpendicular to or form an acute angle with the porous media wick.
According to some embodiments, the heat generating source is a light emitting chip of a side-emitting LED lamp.
Compared with the prior art, the invention has at least the following advantages:
the heat dissipation device of the heat source effectively solves the heat dissipation problem of the heat source, is particularly suitable for side-emitting light sources, such as side-emitting LED lamps, and effectively solves the heat dissipation problem of the side-emitting light sources by arranging the heat conducting plate, the heat dissipation component and the porous medium liquid absorption core and utilizing liquid circulation phase change to dissipate heat.
Drawings
Other objects and advantages of the present invention will become apparent from the following description of the invention with reference to the accompanying drawings, which provide a thorough understanding of the present invention.
FIG. 1 is a schematic perspective view of a heat dissipating device according to an embodiment of the present invention;
FIG. 2 is a schematic side view of the heat dissipating device of FIG. 1;
FIG. 3 is a cross-sectional view of the heat sink of FIG. 2;
FIGS. 4A and 4B are side and plan schematic views, respectively, of a bottom end cap of the heat sink of FIG. 1;
fig. 5 is a schematic side view of a heat dissipating device according to another embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. In addition, the drawings are only schematic illustrations of embodiments of the invention and are not necessarily drawn to scale.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
The invention provides a heat dissipation device of a heat source, which utilizes the characteristic that liquid is converted into gas to absorb heat, and stores the liquid in a metal porous medium liquid suction core.
The invention is particularly suitable for applications in which the heat generating source is at least partially inclined with respect to the horizontal, such as the light emitting chips of side-emitting LED lamps. For the side-emitting LED lamp, as the heating source is at least partially inclined relative to the horizontal plane, the flow of the phase-change liquid is influenced by gravity, and the heating source is difficult to infiltrate for effective heat dissipation. Here, side-emission refers to side-emission of a light-emitting source (e.g., LED luminaire) whose heat-generating source is at least partially tilted with respect to the horizontal. Typical side-emitting light source devices are, for example, horizontally emitting LED lamps.
Exemplary embodiments of a heat sink of a heat generating source according to the present invention are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic perspective view of a heat dissipating device 100 of a heat generating source according to an embodiment of the present invention. Fig. 2 is a left side schematic view of the heat sink 100 of fig. 1. Fig. 3 is a sectional view of A-A of the heat sink of fig. 2.
As shown in fig. 1 and 3, the heat dissipating device 100 for a heat source is used for dissipating heat to a plate-like heat source 2, the plate-like heat source 2 being at least partially inclined with respect to a horizontal plane; the heat dissipating device 100 includes a heat conductive plate 6 disposed at one side of the plate-shaped heat generating source 2 to be in heat transfer contact with the plate-shaped heat generating source 2; a heat radiation assembly 3 disposed at an opposite side of the heat conduction plate 6 to the plate-shaped heat generation source 2, the heat radiation assembly 3 being connected to an outer peripheral portion of the heat conduction plate 6 to enclose a closed steam cavity 30 with the heat conduction plate 6, the steam cavity 30 being adapted to store a liquid phase change heat radiation medium; and a plate-shaped porous medium wick 7 positioned in the vapor chamber 30 and in heat transfer contact with the heat conducting plate 6, wherein the porous medium wick 7 is adapted to absorb the liquid phase-change heat-dissipating medium, so that the liquid phase-change heat-dissipating medium absorbs heat and is converted into gas to enter the vapor chamber 30, and is condensed again into a liquid state in the vapor chamber 30 by the heat-dissipating component to be re-absorbed by the porous medium wick.
According to the above structure, by providing the heat-conductive plate, the heat-radiating member, the porous-medium wick, and by circulating the phase-change heat-radiating medium for phase-change heat radiation, the plate-like heat-generating source 2 can be cooled effectively. The plate-shaped heat source 2 is, for example, a light emitting chip of an LED lamp, and particularly a side-emitting LED lamp such as a high-power projector lamp or a fish trap lamp.
The heat generated by the plate-like heat generating source 2 is transferred through the heat conducting plate 6 to the plate-like porous medium wick 7 in heat transfer contact with the heat conducting plate 6, and the heat conducting plate 6 is made of a material with low density and high heat conducting property, for example, an aluminum alloy. The heat conducting plate 6 is made of low-density materials, so that the weight of the whole device can be reduced, the whole heat radiating device is lighter, and the good heat conducting performance of the heat conducting plate 6 can better transfer heat generated by the plate-shaped heat generating source 2 into the steam cavity. The porous medium liquid absorption core 7 is filled with liquid phase change heat dissipation medium, heat is absorbed by the liquid phase change heat dissipation medium in the porous medium liquid absorption core 7, and phase change is generated after the liquid phase change heat dissipation medium absorbs heat, namely, the liquid phase is converted into a gaseous state. The porous medium liquid absorption core 7 is, for example, a metal porous medium, namely foam metal, has high heat conductivity and large specific surface area, and can increase the solid-liquid contact area; the pore diameter range of the metal porous medium can be nano-scale, the liquid infiltration height can be improved, and the heat dissipation effect is improved.
The gas generated by the phase change of the liquid in the porous medium wick 7 overflows from the top of the porous medium wick 7 under the action of the buoyancy force and enters the vapor chamber 30. The gas is condensed when it hits the inner wall of the steam chamber 30, and heat is transferred to the chamber of the steam chamber 30, and then the heat on the chamber of the steam chamber 30 is transferred to the environment by the flowing action of the external air. The condensed beads in the steam chamber 30 slide down along the inner wall of the steam chamber 30 under the action of gravity and flow into the bottom of the steam chamber 30. The liquid on the bottom will then re-enter the pores of the porous medium wick 7, effecting a phase change cycle of the liquid.
With continued reference to fig. 1, according to a preferred embodiment, the heat dissipating assembly 3 comprises: a top end cap 31 provided at the top end of the steam chamber 30; a bottom end cap 32 disposed at the bottom end of the steam chamber 30; and a heat radiating portion 33 connecting the top end cover 31 and the bottom end cover 32, the heat radiating portion 33 forming an arched inner wall surface 35 of the steam cavity 30 opposite to the heat conducting plate 6, and a heat radiating fin 36 being connected to the outer side of the arched inner wall surface 35.
The heat generated by the plate-shaped heat generating source 2 is transferred to the plate-shaped porous medium liquid absorption core 7 in heat transfer contact with the heat conducting plate 6 through the heat conducting plate 6, and the heat is absorbed by the liquid phase-change heat dissipation medium in the porous medium liquid absorption core 7, and the liquid phase-change heat dissipation medium generates phase change after absorbing the heat. The generated gas overflows from the top of the porous-medium wick 7 and enters the vapor chamber 30.
The gas is condensed when encountering the inner wall of the steam cavity 30, heat is transferred to the cavity of the steam cavity 30, and then the heat on the cavity of the steam cavity 30 is transferred to the environment under the flowing action of external air, so that the contact area between the air and the steam cavity 30 is enlarged by the arched inner wall surface 35 of the cavity, and the heat dissipation is accelerated. The maximum distance of the arched inner wall surface 35 from the surface of the porous medium wick 7 may be 2-10mm. The outer side of the arched inner wall surface 35 is connected with a plurality of radiating fins 36, the radiating fins 36 can be in an emission shape, the thickness range of each radiating fin can be 0.5-3mm, and the distance between fin roots can be 1-5mm. The gas in the vapor chamber 30, when converted to a liquid at the arched inner wall surface 35, transfers heat to the heat sink fins, which is carried away by the heat conduction of the fins and convection with air. The number of the radiating fins is large, the surface area of each radiating fin is large, and the total contact area with air is increased, so that heat can be quickly transferred, and the radiating effect is enhanced.
With continued reference to fig. 1, according to a preferred embodiment, the heat sink 100 further comprises a baffle 11 disposed around the porous-medium wick 7 in the vapor chamber 30, the thickness of the baffle 11 ranging, for example, between 0.2 and 1mm, a guide channel being formed between the baffle 11 and the porous-medium wick 7 to guide the upward flow of the gas converted by the liquid phase-change heat-dissipating medium in the porous-medium wick 7.
Since a large number of densely distributed small holes exist in the porous medium wick 7, gas overflows from the middle lower portion of the porous medium wick 7, and if the partition plate 11 is not provided, the gas may directly contact the middle lower portion of the steam cavity, so that heat dissipation of the whole arch-shaped inner wall surface cannot be fully utilized, and the cooling effect is reduced. The partition plate 11 is arranged around the porous medium wick 7, so that gas generated by the porous medium wick 7 can be guided to the top of the steam cavity 30 as much as possible, and then the gas starts to condense from the top of the steam cavity 30 and flows downwards along the arched inner wall surface 35, so that heat can be better dissipated through the large-area radiating fins, and the arched inner wall surface 35 of the steam cavity is utilized to radiate heat to the greatest extent, so that the cooling effect is greatly enhanced. The spacing between the separator 11 and the porous media wick 7 may be 0.5-2mm.
With continued reference to fig. 1, in a preferred embodiment, a plate-like heat generating source 2 and a thermally conductive plate 6 are connected by a thermal interface material 1. The thermal interface material is a material with high heat conduction performance and high ductility, for example, can be heat conduction silica gel or heat conduction silicone grease. The thermal interface material 1 is arranged between the plate-shaped heat generating source 2 and the heat conducting plate 6, so that the contact thermal resistance can be greatly reduced. Therefore, the thermal interface material can effectively enhance the heat conductive performance of the plate-shaped heat generating source 2 and the heat conductive plate 6.
According to a preferred embodiment, in the metal porous medium wick 7, the pores arranged relatively near the bottom are smaller in pore size and larger in density than the pores relatively near the top. That is, in the porous-medium wick 7, the arrangement of the pores is non-uniform, and the sizes of the pores are also different. For example, the pore diameter of the pores at the bottom is in the range of 0.05-0.1mm, and the pore diameter of the pores at the top is in the range of 0.1-0.5mm, so that the density of the pores at the bottom is large and the density of the pores at the top is small. The pores of the bottom are set to be relatively small in order to better utilize capillary action to absorb liquid, and the pores of the top are set to be relatively large in order to facilitate better escape of liquid converted gas.
The porous-medium wick 7 may be made of a metal porous medium. The metal porous medium has higher heat conductivity, namely good heat conductivity, can be copper foam, aluminum foam, and can be other metals with good heat conductivity. The porous media wick 7 has an internal porosity of 40% to 85%. "porosity" as used herein refers to the percentage of the internal pore volume of the porous media wick 7 to the total volume. Too small porosity can lead to too small contact area between the liquid and the inside of the porous medium liquid absorption core 7, and heat transfer can not be performed well; too much porosity can result in an insufficiently stable porous media wick 7 that is prone to breakage. The porous medium liquid suction core 7 is kept at 40% -85% in internal porosity, so that the contact area between the inside of the porous medium liquid suction core 7 and liquid is large, and the porous medium liquid suction core 7 is stable.
With continued reference to fig. 1, in the preferred embodiment, a closable aperture 5 is provided in the center of the top end cap 31, the aperture 5 being used to introduce liquid phase change heat sink medium liquid into the vapor chamber 30 or to draw air from the vapor chamber 30. The diameter of the holes is for example in the range of 2-6mm. The holes 5 may be sealed threaded holes, and the entire radiator is sealed with a fine screw after the vapor chamber 35 is evacuated or the liquid phase change heat dissipation medium liquid is injected into the vapor chamber 35. The whole steam cavity 35 is vacuumized, so that the evaporation of liquid is facilitated, the condensation of gas is facilitated, the liquid phase change circulation rate can be greatly accelerated, and the cooling effect is improved. In theory the phase change circulation of the liquid may not be lost, but is difficult to achieve in practice, so that when the phase change circulation of the liquid in the vapour chamber 30 reaches a certain level, the liquid will gradually decrease and it is necessary to feed the liquid from the aperture 5 into the vapour chamber 30 so that the phase change circulation of the liquid may continue.
According to a preferred embodiment, the arched inner wall surface 35 of the steam chamber is preferably an aluminum alloy material, the inner wall surface being smooth and coated with a hydrophobic material. Hydrophobic materials refer to materials that are difficult to bind to water, and even so to speak, to liquids. Not only are hydrophobic materials difficult to bind to liquids, but they also reduce the contact time with liquids. The arched inner wall of the steam cavity 30 is coated with a hydrophobic material, so that the converted liquid can fall down rapidly, thereby accelerating the phase change circulation of the liquid and enhancing the heat dissipation effect.
Referring to fig. 1 and 4A, 4B, according to a preferred embodiment, a plurality of micro channels 9 are provided on the inner surface of bottom end cap 32 for directing the liquid phase change heat sink medium evenly towards the bottom of porous medium wick 7. The plurality of microchannels 9 are arranged substantially in parallel and extend in a direction from the arched inner wall surface 35 of the vapour chamber 30 to the porous medium wick 7. The bottom end cap 32 may be an aluminum alloy block 8 with micro-channels 9, the micro-channels 9 being scored on the top surface of the aluminum alloy block 8. The micro-channel 9 can realize uniform liquid distribution of the aluminum alloy block. The micro-channel has a width of 0.1-0.5mm, a depth of 0.1-1mm, and a space between 0.1-1 mm. When the liquid in the steam cavity 30 flows down along the arched inner wall surface 35 and enters the micro-channel 9, the micro-channel can collect the liquid and then flows to the bottom of the porous medium liquid absorption core 7, so that the porous medium liquid absorption core 7 can absorb the liquid uniformly, and the liquid phase change circulation is accelerated.
According to a preferred embodiment, the top of the micro channel 9 has a gap 13 with the bottom of the porous medium wick 7. Because the liquid sometimes flows through the micro channel 9 during the liquid injection process, the gap between the top of the micro channel 9 and the bottom of the porous medium liquid suction core 7 can enable the whole area of the bottom of the porous medium liquid suction core 7 to be used for absorbing the liquid, so that the absorption efficiency is not affected because the partial area of the bottom of the porous medium liquid suction core 7 is contacted with the top end of the micro channel 9. The width of the gap is, for example, in the range of 0.5mm to 5mm.
Fig. 3 is a cross-sectional view of the heat sink 100 of the heat generating source. As shown in fig. 3, the heat dissipating device 100 of the plate-like heat generating source 2 includes heat dissipating fins 36, a thermal interface material 1, a top end cap 31, a hole 5 provided in the center of the top end cap 31, a heat conducting plate 6, a porous-medium wick 7, a bottom end cap 32, micro channels 9 provided on the top surface of the bottom end cap 32, a vapor chamber 30, and a separator 11.
According to a preferred embodiment, the microchannels 9 are perpendicular or form an acute angle with the porous medium wick 7. Thus, when the heat dissipation device is applied to different scenes, the liquid can flow to the bottom of the porous medium liquid absorption core 7 quickly. For example, the microchannels 9 are formed perpendicular to or at an acute angle to the porous media wick 7 by arranging the top surface of the aluminum alloy block 8 of the bottom end cap 32 perpendicular to or at an acute angle to the porous media wick 7.
Fig. 4A and 4B are schematic side and plan structural views, respectively, of a bottom end cap of the heat sink 100. As shown in fig. 4A-4B, the inner surface of the bottom end cap 32 is provided with a plurality of micro channels 9, the micro channels 9 form an acute angle with the horizontal plane, that is, the micro channels 9 form an acute angle with the porous medium liquid absorbing core 7, the arc surface 81 of the bottom end cap 32 corresponds to the arc inner wall surface of the steam cavity 30, when the liquid flows down from the arc inner wall surface of the steam cavity 30 to a certain position on the arc, due to the micro channels 9 having an angle with the horizontal plane, the liquid flows from a point on the arc to the tail end of the micro channels 9 along the channel of the micro channels 9 under the influence of gravity, and the tail end of the micro channels 9 corresponds to the bottom of the porous medium liquid absorbing core 7. The present embodiment can be applied to a horizontally operating heat source, such as a horizontally emitting LED lamp, such as a floodlight, a fish trap lamp, in which the light emitting chip (plate-like heat source) thereof is vertical to the horizontal plane; the micro-channel 9 can also be applied to an LED lamp capable of emitting light obliquely upwards (which is equivalent to the fact that the whole device in fig. 1 is inclined to the right side), and at the moment, the acute angle formed by the micro-channel 9 and the porous medium liquid suction core 7 is smaller, so that the micro-channel 9 and the horizontal plane can have a certain angle, and liquid can flow to the bottom of the porous medium liquid suction core 7 along the micro-channel 9 under the influence of gravity.
The embodiment that the micro channel 9 is perpendicular to the porous medium liquid absorption core 7 is suitable for being applied to an LED lamp (corresponding to the whole device of figure 1, which is inclined to the left) with light emitting obliquely downwards, so that the micro channel 9 is perpendicular to the porous medium liquid absorption core 7, but forms a certain included angle with the horizontal plane, and the liquid can smoothly flow to the bottom of the porous medium liquid absorption core 7 along the micro channel.
According to the preferred embodiment, the outside of the radiating fin can adopt natural convection air to radiate heat, or forced convection air to radiate heat, for example, a fan can be arranged in the radiating device, so that air flow from bottom to top is formed for the radiating device, and the radiating effect can be further improved. Fig. 5 is a schematic structural view of a heat dissipating device of a heat generating source according to an embodiment of the present invention. As shown in fig. 5, the fan 12 is disposed above the heat radiating fins 36, thereby forming a bottom-up air flow, and accelerating heat transfer of the heat radiating fins 36. Other aspects of this embodiment are the same as the embodiment of fig. 1 and will not be described in detail herein. Of course, in other embodiments, other auxiliary cooling devices may be provided, as long as the air flow in the vicinity of the heat dissipating fins is increased.
The light emitting chip of the side-emitting LED lamp is taken as an example for illustration of the light emitting source in the above embodiment, but it should be understood by those skilled in the art that the light emitting chip of the side-emitting LED lamp is only a specific example of the light emitting source, and all the objects capable of emitting heat belong to the heat emitting source of the present invention.
The invention adopts the metal porous medium liquid absorption core to realize the phase change of liquid, thereby realizing the heat dissipation of the heat generating source. The metal porous medium, namely foam metal, has high heat conductivity and large specific surface area, and can increase the solid-liquid contact area; the pore diameter range of the metal porous medium can be nano-scale, the liquid infiltration height can be improved, and the heat dissipation effect is improved; the arc-shaped curved surface steam cavity has smaller condensation heat resistance, so that the overall heat resistance of the radiator is reduced; the included angle between the bottom micro groove group and the metal porous medium liquid absorption core is acute, and the included angle has a certain gradient, so that liquid can be accelerated to flow into the bottom of the metal porous medium liquid absorption core, and the phenomenon that a gap exists between the liquid and the metal porous medium liquid absorption core to interrupt the phase change condensation cycle is prevented.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A heat dissipating device of a heat generating source, which is a plate-shaped heat generating source and is at least partially inclined with respect to a horizontal plane, characterized by comprising:
a heat conductive plate disposed at one side of the plate-shaped heat generating source to thermally contact the plate-shaped heat generating source;
a heat dissipation assembly disposed at an opposite side of the heat conductive plate from the heat generating source, the heat dissipation assembly being connected to an outer peripheral portion of the heat conductive plate to enclose a closed vapor chamber with the heat conductive plate, the vapor chamber being adapted to store a liquid phase change heat dissipation medium; and
the plate-shaped porous medium liquid absorption core is positioned in the steam cavity and is in thermal contact with the heat conducting plate, the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation component so as to be absorbed again by the porous medium liquid absorption core;
the heat dissipation device further includes: a baffle plate arranged around the porous medium liquid absorption core in the steam cavity, wherein a guide channel is formed between the baffle plate and the porous medium liquid absorption core so as to guide the gas converted by the liquid phase-change heat dissipation medium in the porous medium liquid absorption core to flow upwards;
in the porous medium liquid absorption core, the pore diameter of the pore relatively close to the bottom is smaller than that of the pore relatively close to the top, and the density is high;
the heat dissipation device further comprises a bottom end cover, wherein a plurality of micro-channels are arranged on the inner surface of the bottom end cover and used for guiding the liquid phase-change heat dissipation medium to uniformly flow to the bottom of the porous medium liquid absorption core.
2. The heat sink of claim 1, wherein the heat dissipating assembly comprises:
the top end cover is arranged at the top end of the steam cavity;
the bottom end cover is arranged at the bottom end of the steam cavity;
and the heat dissipation part is connected with the top end cover and the bottom end cover, the heat dissipation part forms an arched inner wall surface of the steam cavity, which is opposite to the heat conducting plate, and the outer side of the arched inner wall surface is connected with heat dissipation fins.
3. The heat sink of claim 1, wherein the plate-like heat generating source and the heat conducting plate are connected by a thermal interface material.
4. The heat sink of claim 1, wherein,
and a closable hole is arranged in the center of the top end cover, and the hole is used for inputting liquid phase-change heat dissipation medium into the steam cavity or extracting air of the steam cavity.
5. The heat sink of claim 2 wherein the arcuate inner wall surface of the vapor chamber is coated with a hydrophobic material.
6. The heat sink of claim 1, wherein a top of the micro channel is in clearance with a bottom of the porous media wick.
7. The heat sink of claim 1, wherein the microchannels are perpendicular to or form an acute angle with the porous media wick.
8. The heat sink of claim 1, wherein the heat generating source is a light emitting chip of a side-emitting LED lamp.
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| CN110798782B (en) * | 2019-11-04 | 2021-03-19 | 安徽省名泰电声科技有限公司 | Electroacoustic driver with good heat dissipation performance |
| CN112628687B (en) * | 2020-12-14 | 2022-03-01 | 电子科技大学 | Vehicle LED lamp based on 3D printing and liquid cooling system thereof |
| TWI804930B (en) * | 2021-07-26 | 2023-06-11 | 艾姆勒科技股份有限公司 | Immersion-cooled heat-dissipation structure |
| CN114705072B (en) * | 2022-04-02 | 2023-03-14 | 武汉理工大学 | Gravity type thermal diode based on porous medium and hydrophobic surface |
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