CN110021570B - Three-dimensional phase change remote heat dissipation module - Google Patents
Three-dimensional phase change remote heat dissipation module Download PDFInfo
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- CN110021570B CN110021570B CN201910283803.5A CN201910283803A CN110021570B CN 110021570 B CN110021570 B CN 110021570B CN 201910283803 A CN201910283803 A CN 201910283803A CN 110021570 B CN110021570 B CN 110021570B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The invention relates to a three-dimensional (3D) phase change remote heat dissipation module, which comprises a heat dissipation cavity connected with the top of a heat absorption cavity to form a state of being far away from a heat source and a state of being communicated with a nozzle arranged in the heat absorption cavity, when the working fluid absorbs the heat energy of the heat source, the working fluid is vaporized from liquid state to gas state, and the nozzle structure design using the thermosyphon effect (thermosyphon) and Boyle's law (Boyle's law), flows upwards through a gas guide chamber, is sprayed upwards at high pressure by a nozzle and quickly and uniformly spreads to the heat dissipation cavity, and the working fluid exchanges heat in the heat dissipation cavity and is condensed into a liquid form from a gas form, the working fluid continuously circulates to perform phase change between liquid and gas states by utilizing the action of the micro-channel to flow back downwards for circulation, thereby forming a remote heat dissipation module type.
Description
Technical Field
The present invention relates to a heat dissipation module, and more particularly, to a three-dimensional (3D) phase-change remote heat dissipation module.
Background
As technology develops, the number of chips per unit area of an electronic component increases, which increases the heat generation amount during use, and a heat pipe (heat pipe) is a simple but very effective heat dissipation device, and thus, has been widely used for various electronic heat dissipation products. The working principle is that energy is transferred by latent heat of phase change between gas phase and liquid phase of working fluid, in an evaporation section (evaporation section), the working fluid takes away a large amount of heat energy from a heat source by the latent heat of evaporation, and is condensed into liquid in a condensation section (condensation section) and releases the heat energy, and the working fluid flows back to the evaporation section by capillary force provided by a capillary structure (wick) to perform phase change circulation, so that the heat energy is continuously transmitted to a remote place from the heat source.
Fig. 1 shows a one-dimensional (1D) heat dissipation module 10, in which the tail end (condensation area) of a heat pipe 11 of the heat dissipation module 10 is overlapped on a heat dissipation fin 12, and the head end (evaporation area) thereof extends outward to be attached to or contacted with a heat generating component (not shown), so that when the head end of the heat pipe 11 absorbs heat generated by the heat generating component, the heat is transmitted to the tail end of the heat pipe 11, and the tail end of the heat pipe 11 transmits the received heat to the heat dissipation fin 12 disposed thereon, and the heat is dissipated by the heat dissipation fin 12 through outward diffusion. Although such one-dimensional (1D) heat dissipation modules 10 may achieve some heat dissipation functions; however, the overall heat dissipation effect is not high, because the tail end of the heat pipe is the portion with the worst heat transfer efficiency, because the working fluid inside the heat pipe is easy to be retained at the tail end of the heat pipe to form a heat dissipation ineffective end when the vapor phase and the liquid phase change (phase change) occurs due to the factors of the inherent structure design of the heat pipe, the tail end (condensation area) of the heat pipe 11 cannot effectively transfer heat to the heat dissipation fins 12, and thus the heat transfer efficiency is low, and the heat dissipation efficiency is not good.
Fig. 2 shows a conventional two-dimensional (2D) heat dissipation module 20, which includes an upper cover plate 21 and a lower cover plate 22, wherein a plurality of heat dissipation fins 23 are formed on the surface of the upper cover plate 21, and the heat dissipation fins 23 and the upper cover plate 21 are integrally connected to form a hollow inner chamber 24 after the upper cover plate 21 and the lower cover plate 22 are combined. When the two-dimensional (2D) heat dissipation module 20 is used, it is attached to or in contact with a heat generating component (not shown), so that the lower cover plate 22 absorbs heat generated by the heat generating component, and then transfers the heat to the upper cover plate 21 through the inner chamber 24, and the upper cover plate 21 transfers the received heat to the heat dissipation fins 23 arranged thereon, and the heat is dissipated by the heat dissipation fins 23. Although the two-dimensional (2D) heat dissipation module 20 has better heat dissipation effect than the one-dimensional (1D) heat dissipation module 10, the current led has higher power and is mature, and is planned to be used in large or high power products, such as a fish gathering lamp, a projection lamp, a projector, and a 5G wave assembly …. However, the heat dissipation efficiency of the conventional one-dimensional (1D) heat dissipation module 10 or two-dimensional (2D) heat dissipation module 20 cannot be effectively applied to such high-power products, and there is still room for improvement.
In view of the above problems, the present inventors have made extensive studies and developments, and finally have made the present invention through a plurality of tests and modifications.
Disclosure of Invention
The main objective of the present invention is to provide a three-dimensional phase change remote heat dissipation module, which is in a three-dimensional (3D) design, so that the heat dissipation end is far away from the heat source end, thereby improving the heat dissipation efficiency and reducing the influence on the work environment of the product.
The main objective of the present invention is to provide a three-dimensional phase change remote heat dissipation module, which utilizes the nozzle structure design of thermo siphon effect (thermo syphon) and Boyle's law (Boyle's law) to make the evaporated gas be ejected upwards from the nozzle under high pressure and quickly and uniformly diffused to the heat dissipation cavity, thereby achieving the improvement of high-efficiency heat dissipation.
The heat absorbing cavity is in a straight shape and is provided with a bottom part for contacting a heat source, and an opening part is arranged at the top part of the opposite end of the bottom part, so that an accommodating space is formed between the bottom part of the heat absorbing cavity and the opening part; a gas guiding device, which is arranged at the position of the containing space close to the opening part and comprises a cover plate, the outer periphery of the cover plate is matched with the inner periphery of the containing space, so that the cover plate can be fixed in the containing space and close to the opening part, and the middle of the cover plate is provided with a reduced caliber of which the outer diameter is smaller than that of the containing space, a nozzle shape is formed, a straight gas guiding chamber is formed in the middle of the heat absorption cavity, and a working fluid is filled in the gas guiding chamber; a heat dissipation cavity connected to the opening of the heat absorption cavity to form a bottom part far away from the heat absorption cavity and communicated with the nozzle of the heat absorption cavity, and multiple heat dissipation fins arranged on the surface of the heat dissipation cavity; at least one straight capillary structure layer arranged on the inner peripheral wall of the heat absorption cavity and having an upper end communicated with the heat dissipation cavity and a lower end close to the bottom of the heat absorption cavity to form a micro-channel structure; and when the working fluid absorbs the heat energy of the heat source, the working fluid is vaporized from a liquid state into a gas state, flows upwards through the gas guide chamber by utilizing a thermosyphon effect, is sprayed upwards at high pressure through the nozzle and is rapidly and uniformly diffused to the heat dissipation cavity, the heat dissipation is carried out by the heat dissipation fins, the working fluid is subjected to heat exchange in the heat dissipation cavity, and is condensed into the liquid state from the gas state, and then flows back to the lower end part from the upper end part of the straight capillary structure layer downwards by utilizing the action of a micro-channel, so that the working fluid continuously circulates to carry out liquid and gaseous phase change (phase change), and the state of the remote heat dissipation module is formed.
As a further improvement, the straight capillary structure layer can form a step surface at the position of the gas guiding chamber for the cover plate to straddle and position.
As a further improvement, the cover plate of the gas guiding device can be designed into a flat plate shape, and the nozzle arranged in the middle of the cover plate further comprises a convex taper hole which can be designed to be narrow at the top and wide at the bottom.
As a further improvement, the cover plate of the gas guiding device can be a hollow cone with a narrow top and a wide bottom, so that the nozzle with a reduced diameter is positioned at the top of the hollow cone.
As a further improvement, the inner edge of the bottom of the hollow cone body of the cover plate can be provided with a micro-structured surface.
As a further improvement, the inner edge of the bottom of the hollow cone body of the cover plate can be provided with a spiral line structure.
As a further improvement, the inner bottom of the heat absorption cavity can be further provided with a transverse capillary structure layer.
As a further improvement, the vertical capillary structure layer and the horizontal capillary structure layer can be formed by a micropore structure body arranged on the inner peripheral wall of the heat absorption cavity.
As a further improvement, the lower end of the straight capillary structure layer and the lateral capillary structure layer may be connected or disconnected.
As a further improvement, the bottom of the heat absorption cavity comprises any one position or combination of the bottom edge surface of the heat absorption cavity and the wall surface at the periphery of the bottom edge surface, and can be contacted with different types of heat sources.
Through the technical means, the invention skillfully combines the structural design of the nozzle of the thermosyphon effect (thermosyphon) and Boyle's law, and the two supplement each other, so that the evaporated gas flows upwards through a gas guide chamber and is sprayed upwards by the nozzle under high pressure to quickly and uniformly diffuse to the heat dissipation cavity, thereby having high-efficiency heat dissipation characteristic, being particularly suitable for high-power LED lamps or electronic products and effectively solving the heat dissipation problem. Furthermore, the invention is in a three-dimensional (3D) design form, so that the heat dissipation end is far away from the heat source end, thereby improving the heat dissipation efficiency, reducing the influence on the work of the product environment and further improving the effect of temperature control.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a conventional one-dimensional (1D) heat dissipation module.
Fig. 2 is a schematic structural diagram of a conventional two-dimensional (2D) heat dissipation module.
FIG. 3 is a schematic structural diagram of a preferred embodiment of the present invention.
FIG. 4 is a schematic diagram showing the vaporization of a working fluid from a liquid to a gas in a preferred embodiment of the invention.
FIG. 5 is a schematic diagram showing the liquid and gas phase changes that are continuously circulated by the return path after the working fluid is condensed from the gas to the liquid and then returned from the return path in accordance with the preferred embodiment of the present invention.
FIG. 6 is a schematic view of the nozzle in use according to the preferred embodiment of the present invention.
Fig. 7 is an enlarged schematic view of a part of the structure of the present invention.
Fig. 8 is a schematic view of another possible embodiment of the gas guiding device of the present invention.
Fig. 9 is a schematic view of another possible embodiment of the gas guiding device of the present invention.
FIG. 10 is a schematic view of another possible embodiment of the gas guiding device of the present invention.
Detailed Description
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. In this specification and in the claims that follow, reference will be made to the differences in names which are not intended as means for distinguishing between components, and thus the differences in function of components will be used as criteria for distinguishing between components. In the description and in the claims that follow, reference to "comprising" is intended to be an open-ended term that should be interpreted to mean "including, but not limited to.
First, referring to fig. 3 to 6, a first possible embodiment of a three-dimensional phase change remote heat dissipation module 50 of the present invention includes: a heat absorbing chamber 30, the heat absorbing chamber 30 is in a straight shape and has a bottom 31 for contacting a heat source (H), and an opening 32 is formed at the top of the opposite end of the bottom 31, so that a receiving space 33 is formed between the bottom 31 and the opening 32 of the heat absorbing chamber 30. In the present embodiment, the bottom 31 of the heat absorbing cavity 30 includes any one of the bottom edge surface of the heat absorbing cavity 30 and the wall surface around the bottom edge surface, or a combination thereof, and can be contacted with different types of heat sources.
A gas guiding device 34, the gas guiding device 34 is disposed at the position of the containing space 33 close to the opening 32, and includes a cover plate 341, the outer peripheral shape of which is configured to match the inner peripheral edge of the containing space 33, so that the cover plate 341 can be fixed in the containing space 33 and close to the position of the opening 32, and the middle of the cover plate 341 is provided with a reduced caliber of which the outer diameter is smaller than the containing space 33, forming a nozzle 342 pattern, so that a straight gas guiding chamber 35 is formed at the middle of the heat absorbing cavity 30, and the gas guiding chamber 35 is filled with a working fluid (W); in this embodiment, the shape of the heat absorption cavity 30 may be circular, polygonal or other geometric shapes, and the nozzle 342 of the gas guiding device 34 may be directly formed by the middle reduced pipe diameter 342a of the cover plate 341, and the cover plate 341 is configured as a flat plate 341a, such as the forms shown in fig. 3-6 in this embodiment, but is not limited thereto; it may also be constructed in other forms and will be described later.
A heat dissipation chamber 40, wherein the heat dissipation chamber 40 is connected to the opening 32 of the heat absorption chamber 30, and forms a bottom 31 far away from the heat absorption chamber 30, and forms a communication pattern with the nozzle 342 of the heat absorption chamber 30, and a plurality of heat dissipation fins 41 are disposed on the surface of the heat dissipation chamber 40; in this embodiment, the heat dissipation cavity 40 is formed to match the shape of the heat absorption cavity 30; can be circular, polygonal or other geometric shapes.
At least one vertical capillary structure layer 36, which is disposed on the inner peripheral wall of the heat absorption cavity 30 and has an upper end 361 connected to the heat dissipation cavity 40 and a lower end 362 close to the bottom 31 of the heat absorption cavity, so as to form a micro-channel structure; in this embodiment, the straight capillary structure layer 36 forms a step surface 363 at the position of the gas guiding chamber 35 for the cover plate 341 to straddle, but not limited thereto; the cover 341 may be secured to the gas guiding chamber 35 by other means such as bonding, clipping, adhering, etc.
In a preferred embodiment, the inner bottom of the heat absorption cavity 30 is further provided with a lateral capillary structure layer 37, and as shown in fig. 7, the vertical capillary structure layer 36 and the lateral capillary structure layer 37 can be formed by a microporous structure 364, 371 formed by sintering on the inner peripheral wall of the heat absorption cavity 30, so as to form a microchannel structure having a capillary force. In the embodiment, the lower end 362 of the vertical capillary structure layer 36 is not connected to the horizontal capillary structure layer 37, but may be connected (not shown). The horizontal capillary structure layer 37 is disposed at the bottom of the inner edge of the heat absorption cavity 30, and can be penetrated by the working fluid (W) and control the evaporation rate of the working fluid (W) after absorbing heat energy.
Based on the above structure, when the working fluid (W) absorbs the heat energy of the heat source (H), the working fluid (W) is vaporized from liquid (L) to gas (V) form, flows upward through the gas guiding chamber 35 by using thermosiphon effect (thermosyphon), and is rapidly and uniformly diffused to the heat dissipation cavity 40 by high pressure upward injection through the nozzle 342, and is dissipated by the heat dissipation fins 41, and the working fluid (W) exchanges heat in the heat dissipation cavity 40, and is condensed from gas (V) form to liquid (L) form, and then flows back to the lower end 362 from the upper end 361 of the straight capillary structure layer 36 by using micro channel effect, so that the working fluid (W) continuously circulates to perform phase change (phase change) of liquid (L) and gas (V), thereby forming a form of a remote heat dissipation module 50.
In addition, the working fluid (W) of the present invention can comprise liquid working fluid selected from pure water, ammonia water, methanol, acetone, heptane, etc., and can also further add heat conductive material particles suspended in the liquid working fluid to enhance the heat transfer performance of the working fluid; the particles of the heat conductive material include copper powder, carbon nanotubes, buckyballs, or carbon nanotubes or buckyballs filled with nano-level copper powder, but not limited thereto.
In this embodiment, the back flow path is formed by the straight capillary structure layer 36 formed on the inner peripheral wall of the heat absorption cavity 30 after the gas (V) is condensed into the liquid (L) form, and since the gas (V) is condensed into the liquid (L) form, the back flow path is formed by the straight capillary structure layer 36, and the capillary force and the gravity force are applied, the back flow path can be ensured from top to bottom after the gas (V) is condensed into the liquid (L) form near the lower end 362 without additionally installing a check valve or a one-way valve (not shown), and the working fluid (W) can not flow upward from the lower end 362 of the straight capillary structure layer 36, and the present invention utilizes the design structure of thermo-siphon effect (thermo-syphon) and Boyle's law (Boyle's law) to form a high pressure upward jet gas (V) from the position of the nozzle 342 for circulation, therefore, the working fluid (W) does not flow upward from the lower end 362 of the straight capillary structure layer 36.
With the above configuration, when the working fluid (W) absorbs the thermal energy of the heat source (H), the working fluid (W) is vaporized from a liquid (L) form to a gas (V) form, as shown in fig. 4 and 5, flows upward through the gas guiding chamber 35 by using thermosyphon effect (thermosyphon), and is sprayed upward at high pressure through the nozzle 342 to be rapidly and uniformly diffused to the heat dissipation chamber 40, and the heat dissipation is performed by the heat dissipation fins 41, and the working fluid (W) is heat exchanged in the heat dissipation chamber 40, and condensed into a liquid (L) form from a gas (V) form, by using the capillary force of the micro channel, the working fluid (W) continuously circulates and changes the phase of the liquid (L) and the gas (V) by flowing back from the upper end 361 to the lower end 362 for circulation, thereby forming a pattern 50 of the remote heat dissipation module.
The thermal siphon effect (thermosyphon) is a process in which a liquid portion of the working fluid (W) is vaporized by heating with a heat source (H) to form a vapor-liquid mixture, the density of the mixture is reduced, and the difference in density is used as a driving force, and a siphon phenomenon is generated using heat as a driving force. The working fluid (W) expands in volume after being heated, the density of the working fluid is reduced and becomes lighter and rises, the cold liquid around the working fluid is supplemented to form circulation, and the circulation is carried out by using the density difference between the gas phase and the liquid phase as the driving force.
Further, according to the principle of compressibility of gas and Boyle's law: the volume of the compressible gas is inversely proportional to the applied pressure, i.e. P1V1 ═ P2V2, the pressure increases as the volume becomes smaller, while the liquid (L) has incompressibility, but becomes compressible as it evaporates into the gas (V); the reduced outlet diameter of the nozzle 342 is a natural gas compressor for the gas (V) flowing upward through the gas guiding chamber 35. Therefore, the present invention utilizes the body compressor function formed by the reduced outlet pipe diameter of the nozzle 342, so that the gas (V) introduced by the thermal siphon effect (thermo) and flowing upward through the gas guiding chamber 33 is compressed to reduce its volume, and then expands and increases instantly by the change of the difference between the internal and external pressures when flowing out of the nozzle 342, thereby increasing the diffusion force of the gas (V). In other words, the ascending gas (V) flows through the reduced outlet pipe diameter of the nozzle 342, so that the flow velocity of the gas (V) is increased and the pressure is increased, the ascending gas (V) is compressed by the pressure and becomes smaller in volume, and when the compressed gas (V) flows to the outlet end, the pressure around the ascending gas (V) is reduced; therefore, as shown in fig. 6, the volume of the gas (V) compressed by the pressure becomes smaller and the gas expands and becomes larger instantaneously as the pressure becomes smaller; therefore, high pressure upward injection gas (V) can be formed from the position of the nozzle 342, and rapidly and uniformly spread to the heat dissipation cavity 40, and the heat dissipation is performed by the heat dissipation fins 41, so as to achieve the best heat dissipation efficiency.
Referring to fig. 8, another possible embodiment of the gas guiding device 34 of the present invention is shown, which has the same structure as the above embodiment and is represented by the same reference numerals, except that the cover plate 341 is still configured as a flat plate 341a, but the nozzle 342 disposed in the middle of the cover plate 341 is a convex taper hole 342b with a narrow top and a wide bottom.
Alternatively, as shown in fig. 9, in another possible embodiment of the gas guiding device 34, the cover 341 is a hollow cone 341b with a narrow top and a wide bottom, such that the nozzle 342 with a reduced diameter is located on the top of the hollow cone 341b of the cover 341. In this embodiment, the inner edge of the bottom of the hollow cone 341b of the cover plate 341 can further be provided with a microstructure surface 343, and the present invention uses the microstructure surface 343, such as a rough surface, a micro-pore, and other structures; this allows the gas (V) to flow more smoothly when passing through the gas guiding device 34, so that the gas (V) can be rapidly and uniformly diffused after being sprayed from the nozzle 342, thereby increasing the heat dissipation efficiency.
Alternatively, as shown in fig. 10, in another possible embodiment of the gas guiding device 34, the inner edge of the bottom of the hollow cone 341b of the cover plate 341 may further have a spiral structure 344, and the spiral structure 344 is like a spiral rifling in a gun barrel, and the present invention uses the spiral structure 344 to make the gas (V) rotate on the longitudinal axis when passing through the gas guiding device 34, so that the gas (V) is spirally ejected from the nozzle 342, and the angular momentum conservation is maintained by the gyroscope effect, so as to achieve rapid and uniform diffusion, thereby achieving the improvement of heat dissipation efficiency.
Through the above technical means, the three-dimensional phase change remote heat dissipation module 50 of the present invention skillfully combines the structural design of the nozzle 33 of the thermosyphon effect (thermosyphon) and the Boyle's law, and the two are complementary to each other, so that the gas (V) evaporated by the heat source (H) flows upward through the gas guiding chamber 33 and is ejected upward by the nozzle 341 under high pressure to be rapidly and uniformly diffused to the heat dissipation cavity 40. Furthermore, the invention is in a three-dimensional (3D) design form, so that the heat dissipation end is far away from the heat source (H) end, thereby improving the heat dissipation efficiency and reducing the influence on the work of the product environment, and further achieving the effect of temperature control.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A three-dimensional phase change remote heat dissipation module, comprising:
a heat absorbing cavity, which is in a straight shape and has a bottom for contacting a heat source, and an opening part is arranged at the top of the opposite end of the bottom, so that an accommodating space is formed between the bottom of the heat absorbing cavity and the opening part;
a gas guiding device, which is arranged at the position of the containing space close to the opening part and comprises a cover plate, the outer periphery of the cover plate is matched with the inner periphery of the containing space, so that the cover plate can be fixed in the containing space and close to the opening part, and the middle of the cover plate is provided with a reduced caliber of which the outer diameter is smaller than that of the containing space, a nozzle shape is formed, a straight gas guiding chamber is formed in the middle of the heat absorption cavity, and a working fluid is filled in the gas guiding chamber;
a heat dissipation cavity connected to the opening of the heat absorption cavity to form a bottom far away from the heat absorption cavity, and connected to the nozzle of the heat absorption cavity, and having multiple heat dissipation fins on its surface, wherein the volume of the heat dissipation cavity is larger than that of the heat absorption cavity;
at least one straight capillary structure layer on the inner wall of the heat absorbing cavity and with one upper end communicated with the heat dissipating cavity and one lower end near the bottom of the heat absorbing cavity to form one micro flow channel structure; and
when the working fluid absorbs the heat energy of the heat source, the working fluid is vaporized from a liquid state into a gas state, flows upwards through the gas guide chamber, is sprayed upwards at high pressure through the nozzle to be rapidly and uniformly diffused to the heat dissipation cavity, is dissipated by the heat dissipation fins, is subjected to heat exchange in the heat dissipation cavity, is condensed into the liquid state by the gas state, and flows back to the lower end part from the upper end part of the straight capillary structure layer downwards by utilizing the action of the micro-channel to ensure that the working fluid continuously circulates to carry out liquid and gaseous phase change, thereby forming the state of a remote heat dissipation module;
the inner bottom of the heat absorption cavity further comprises a transverse capillary structure layer;
the lower end of the straight capillary structure layer and the transverse capillary structure layer are in a connected or disconnected state.
2. The heat dissipation module of claim 1, wherein the straight capillary structure layer forms a step surface at the position of the gas guiding chamber for the cover plate to straddle.
3. The heat dissipating module as claimed in claim 2, wherein the cover plate of the gas guiding device is formed in a flat plate shape, and the nozzle disposed in the middle of the cover plate is a convex taper hole with a narrow top and a wide bottom.
4. The heat dissipating module of claim 2, wherein the cover plate of the gas guiding device comprises a hollow cone with a narrow top and a wide bottom, such that the nozzle with a reduced diameter is located at the top of the hollow cone.
5. The heat dissipating module of claim 4, wherein the inner edge of the bottom of the hollow cone of the cover plate has a micro-structured surface.
6. The heat dissipating module of claim 4, wherein the inner edge of the hollow cone of the cover plate has a spiral structure.
7. The heat dissipating module of claim 1, wherein the vertical wicking structure and the horizontal wicking structure comprise a microporous structure disposed on an inner peripheral wall of the heat sink cavity.
8. The heat dissipating module of claim 1, wherein the bottom of the heat absorbing cavity comprises a bottom edge surface of the heat absorbing cavity, a wall surface around the bottom edge surface, or any combination thereof, and can be contacted with different types of heat sources.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910283803.5A CN110021570B (en) | 2019-04-10 | 2019-04-10 | Three-dimensional phase change remote heat dissipation module |
| US16/528,857 US20200326130A1 (en) | 2019-04-10 | 2019-08-01 | Heat dissipating module with three-dimensional structure |
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| CN201910283803.5A CN110021570B (en) | 2019-04-10 | 2019-04-10 | Three-dimensional phase change remote heat dissipation module |
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| CN110021570A CN110021570A (en) | 2019-07-16 |
| CN110021570B true CN110021570B (en) | 2022-06-14 |
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| CN112696961B (en) * | 2019-10-23 | 2022-04-01 | 北京航空航天大学 | Three-stage phase change heat exchanger |
| CN113113370A (en) * | 2021-03-31 | 2021-07-13 | 杭州芯耘光电科技有限公司 | Double-circulation heat dissipation system and control method thereof |
| CN115175545A (en) * | 2022-08-19 | 2022-10-11 | 杭州海康威视数字技术股份有限公司 | Low thermal resistance phase change radiator |
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| CN1805675A (en) * | 2005-01-15 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Air-tight cavity heat radiation structure |
| CN1971893A (en) * | 2005-11-21 | 2007-05-30 | 台达电子工业股份有限公司 | Heat radiation module and its heat pipe |
| CN1987329A (en) * | 2005-12-19 | 2007-06-27 | 台达电子工业股份有限公司 | Heat radiation module and its heat pipe |
| CN102042778A (en) * | 2009-10-22 | 2011-05-04 | 富准精密工业(深圳)有限公司 | Flat plate type heat tube |
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| CN2732358Y (en) * | 2004-10-28 | 2005-10-12 | 三一重型装备有限公司 | Inner spraying nozzle |
| JP2007064532A (en) * | 2005-08-30 | 2007-03-15 | Cosel Co Ltd | Heat radiation system |
| CN101182976A (en) * | 2006-11-14 | 2008-05-21 | 诺亚公司 | Dissipating heat cavity and phase-change heat radiating device with the same |
| CN102760708A (en) * | 2011-04-28 | 2012-10-31 | 于德林 | Phase change turbocharging radiating cooling device |
| WO2014007354A1 (en) * | 2012-07-06 | 2014-01-09 | 国立大学法人九州大学 | Ebullient cooling device |
| WO2014190478A1 (en) * | 2013-05-28 | 2014-12-04 | Empire Technology Development Llc | Evaporation-condensation systems and methods of manufacturing and using the same |
| JP6276959B2 (en) * | 2013-10-11 | 2018-02-07 | 株式会社日立製作所 | Phase change module and electronic device equipped with the same |
| TWI551817B (en) * | 2015-06-05 | 2016-10-01 | 錦鑫光電股份有限公司 | Phase-change heat dissipation device and lamp |
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2019
- 2019-04-10 CN CN201910283803.5A patent/CN110021570B/en active Active
- 2019-08-01 US US16/528,857 patent/US20200326130A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805675A (en) * | 2005-01-15 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Air-tight cavity heat radiation structure |
| CN1971893A (en) * | 2005-11-21 | 2007-05-30 | 台达电子工业股份有限公司 | Heat radiation module and its heat pipe |
| CN1987329A (en) * | 2005-12-19 | 2007-06-27 | 台达电子工业股份有限公司 | Heat radiation module and its heat pipe |
| CN102042778A (en) * | 2009-10-22 | 2011-05-04 | 富准精密工业(深圳)有限公司 | Flat plate type heat tube |
Also Published As
| Publication number | Publication date |
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| US20200326130A1 (en) | 2020-10-15 |
| CN110021570A (en) | 2019-07-16 |
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