CN101013010A - Pulsating heat pipe heating panel using microcapsule phase-change thermal storage fluid as operating means - Google Patents
Pulsating heat pipe heating panel using microcapsule phase-change thermal storage fluid as operating means Download PDFInfo
- Publication number
- CN101013010A CN101013010A CN 200710026286 CN200710026286A CN101013010A CN 101013010 A CN101013010 A CN 101013010A CN 200710026286 CN200710026286 CN 200710026286 CN 200710026286 A CN200710026286 A CN 200710026286A CN 101013010 A CN101013010 A CN 101013010A
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- thermal storage
- storage fluid
- change thermal
- phase
- heat pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Abstract
The invention discloses a pulse heat tube radiating plate which uses the phase-variable fluid of micro capsule as work medium, comprising a base plate (1) and a cover plate (4) to form a sealed chamber. The base plate (1) is arranged with a curved groove (2) with at least two bended heads and the section diameter of groove is smaller than 2mm. the groove (2) contains the phase-variable fluid medium, while the groove (2) is communicated with the inlet (3) of base plate (1). The fluid medium is FS-39E micro capsule phase-variable material. The invention can avoid movable element and noise while it is driven by waste heat completely.
Description
Technical field
The present invention relates to the heat pipe-type heat sink, particularly relating to the microcapsule phase-change thermal storage fluid is the pulsating heat pipe formula heat sink of working medium.
Background technology
Along with the continuous development of electron trade, the function and the complexity of electronic equipment are growing, and in limited volume range, the power consumption of electronic equipment constantly increases, and heat dissipation capacity sharply rises.With the microelectronic chip is example, and heat flow density has reached 60～90W/cm at present
2, the highest 200W/cm that reached
2The heat convection method of traditional dependence monophasic fluid and air blast cooling method can only be used for heat flow density and be not more than 10W/cm
2Electronic device, reached 600W/cm for heat flow density
2Above situation has seemed powerless.The heat radiation cooling problem of electronic devices and components has become the bottleneck problem of restriction electronics industry development, and the heat transfer technology of being badly in need of micro high efficiency is paved the way for its development.Heat pipe arises at the historic moment in this case.Inner main phase transformation and the flow of vapor by material of pulsating heat pipe transmitted heat, therefore can transmit bigger heat.The equivalent heat output of heat pipe is the best metal: the title of " near superconduction hot body " as the hundred times of silver, copper, aluminium, even thousands of times, is therefore arranged, and this also is a recent two decades, and it attracts the reason of numerous researchers.
Pulsating heat pipe is a kind of new heat pipe technology that occurs early 1990s, and first pulsating heat pipe invented in nineteen ninety by Japanese's barren land in the world, and it is to bend to serpentine configuration by metal capillary, and inside need not any capillary wick.And as a kind of heat sinking cooling technology, it is simple in structure that pulsating heat pipe has, and size is little, in light weight, easy to manufacture, with low cost and advantage that performance is remarkable.Now successful Application and will be showed the application prospect that it is wide in field of aerospace in power equipment and microelectronic cooling.But traditional heat pipe inside pipe wall must have the imbibing core material material, therefore makes heat pipe sizes big, and weight increases, and is unwell to the application of aerospace field and electronics cooling technology aspect.
Akachi has summarized 24 kinds of loop heat pipes first in nineteen ninety, and they structurally are loop, and has a flow direction control valve at least, guarantee fluid in the loop along one-way flow.These novel loop heat pipes can overcome the defective of conventional heat pipe, as the capillary limit, delivery limits etc.Because there is the insecure problem of long-time running in flow direction control valve, Akachi is (US5219020 in its patent in 1993,1993) the novel loop heat pipe of no flow direction control valve has been proposed, and open circuit and two kinds of structures of closed circuit have been proposed, but this structure is directly packed heat pipe in the chip, thermal contact resistance can be very big, influences heat-sinking capability.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, what a kind of miniaturization that has realized radiating element when increasing heat-sinking capability was provided is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid.
Purpose of the present invention is achieved through the following technical solutions:
A kind of is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, comprises substrate, cover plate, and substrate and cover plate lump together forms a complete closed cavity; Have snakelike groove on the described substrate, snakelike groove elbow number is more than or equal to 2, and the trench cross section hydraulic radius is less than 2mm; It is microcapsule phase-change thermal storage fluid FS-39E that snakelike groove is equipped with fluid working substance, and described snakelike groove is communicated with inlet on the substrate.
For further realizing purpose of the present invention, described snakelike groove (2) cross section is preferably rectangle.Described snakelike groove (2) cross section is preferably the rectangle of 0.5mm * 0.5mm.Described snakelike groove (2) elbow number is preferably 2,4, more than 6,8,10 or 12.Described fluid working substance be latent heat of phase change more than 150J/g, the microcapsule phase-change thermal storage fluid of the particle diameter of capsule particle about 1 micron, the FS-39E type microencapsulated phase change material of preferred Mitsubishi system paper production.
Microencapsulated phase change material is microcapsules technology to be applied to composite phase-change material preparation and the NEW TYPE OF COMPOSITE phase-change material that obtains.Because the material that undergoes phase transition is closed in the ball-type capsule, thereby the leakage that can effectively solve phase-change material is separated and problem such as corrosivity, thereby has the performance of improving phase-change material and even widen the important value of latent heat technical applications.FS-39E is a kind of in the heat-storing material series of being produced by Mitsubishi system paper company, and its phase transition temperature is 39.66 ℃, and latent heat of phase change is 165.5J/g, and the particle diameter of capsule particle is about 1 micron.During use, this emulsion-like material further is diluted to the concentration range of 1%-10%.
Principle of the present invention: the phase change heat storage material FS-39E that phase transition temperature is lower by the usefulness specific heat of combustion is higher is as fluid working substance, flow in the pulsating heat pipe on chip substrate, thereby the heat that has guaranteed in small space the high heat flow density that produces when chip moved is got rid of effectively, and chip temperature is remained on reduced levels.
The present invention compared with prior art has following advantage:
1, compare with traditional heat pipe because the pulsating heat pipe inwall does not have imbibition material, can size do littler; So just be fit to the application of Aero-Space and microelectronics cooling more.
2, adopt the board-like level of being convenient to install, occupy little space; Especially be fit to the cooling of the device that heat dissipation element such as notebook computer must horizontal positioned.
3, of the present invention is that the pulsating heat pipe formula heat sink of working medium does not have moving component with the microcapsule phase-change thermal storage fluid, does not have noise, drives by used heat fully, belongs to energy-saving device.
4, adopt the microcapsule phase-change thermal storage material as fluid working substance (concentration is) at 3% o'clock, make hot conveying capacity ratio make the high 25%-30% of water, and startability is stronger than water.This is because latent heat has accounted for very big proportion, and the temperature that undergoes phase transition is not very high.
Description of drawings
Fig. 1 is a board structure schematic diagram of the present invention;
Fig. 2 is a covering plate structure schematic diagram of the present invention.
The specific embodiment
The present invention is further detailed explanation below in conjunction with drawings and Examples, but embodiments of the present invention are not limited thereto.
As shown in Figure 1, 2, be that the pulsating heat pipe formula heat sink of working medium comprises substrate 1, cover plate 4 with the microcapsule phase-change thermal storage fluid, substrate 1 and cover plate 4 lump together forms a complete closed cavity; Have snakelike groove 2 on the substrate 1, snakelike groove 2 elbow numbers are 8, and the cross section is the rectangle of 0.5mm * 0.5mm; Snakelike groove 2 is equipped with the described snakelike groove 2 of microcapsule phase-change thermal storage fluid FS-39E fluid working substance and is communicated with inlet 3 on the substrate 1.Microcapsule phase-change thermal storage fluid FS-39E is a kind of in the heat-storing material series of being produced by Mitsubishi system paper company, and its phase transition temperature is 39.66 ℃, and latent heat of phase change is 165.5J/g, and the particle diameter of capsule particle is about 1 micron.When the present invention used, it was 3% that this emulsion-like material is diluted to concentration.In fact, during application, this material can be diluted to the arbitrary value in the 1%-10% concentration range.
The heat sink overall dimension is 35mm * 20mm * 1mm, and the elbow number can be 6,8,10,12 or more, and single rectangular duct is of a size of 0.5mm * 0.5mm.Substrate 1 and cover plate 4 all are that copper coin is made.
During use, to vacuumize in the snakelike conduit 2 earlier, then from the 3 filled part working medium that enter the mouth, because the snakelike groove 2 runner hydraulic radiuses in the pulsation heat sink are less than 2mm, enough little, snakelike groove 2 will form the state that random distribution was arranged and be to bubble post and liquid column at interval.At evaporation ends, the heat that working media produces when absorbing the chip operation produces bubble, expands rapidly and boosts, and the medium that pushes the work forward carries the latent heat of vaporization and flows to the cryogenic condensation end.At condensation end, bubble shrinks heat transferred condensation end and cooling, and pressure descends and flows back to evaporation ends.Like this, owing to have the pressure imbalance that exists between pressure reduction and the adjacent pipe between two ends, make working media continuous Oscillation Flows between evaporation ends and condensation end, thereby realize the cooling of chip.Owing to have the pressure imbalance that exists between pressure reduction and the adjacent pipe between two ends, make working media continuous Oscillation Flows between evaporation ends and condensation end, constantly heat absorption and heat release, thus realize the cooling of chip.In whole process, need not to consume exterior mechanical merit and electric work, be the oneself's concussion under heat drives fully.
Of the present invention is that the pulsating heat pipe formula heat sink of working medium is mainly by substrate, cover plate with only be made up of heat sink and fluid working substance with the microcapsule phase-change thermal storage fluid, lacked the imbibition core than conventional heat pipe, have simple in structure, volume is little, in light weight, and characteristics such as bending more optionally, and because employing FS-39E microcapsule phase-change thermal storage fluid is a fluid working substance, heat flow density can be very big and can not dryouies, and has good application prospects aspect the heat radiation of electronic devices and components; After its structure and design parameter be optimized, its runnability is the not influence of gravitate substantially.Therefore can be inverted at gravitational field, move under the environment such as microgravity field and VARIATION OF GRAVITY FIELD, and will show the application prospect that it is wide in field of aerospace.
Claims (7)
1, a kind of is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that comprising substrate (1), cover plate (4), and substrate (1) and cover plate (4) lump together forms a complete closed cavity; Have snakelike groove (2) on the described substrate (1), snakelike groove (2) elbow number is greater than or equal to 2, and the trench cross section hydraulic radius is less than 2mm; Snakelike groove (2) is equipped with microcapsule phase-change thermal storage fluid working medium, and described snakelike groove (2) is communicated with inlet (3) on the substrate (1).
2, according to claim 1 is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that described snakelike groove (2) cross section is a rectangle.
3, according to claim 2 is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that described snakelike groove (2) cross section is the rectangle of 0.5mm * 0.5mm.
4, according to claim 1,2 or 3 described be the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that described snakelike groove (2) elbow is several more than 2,4,6,8,10 or 12.
5, according to claim 1,2 or 3 described be the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that being in the described snakelike groove (2) vacuum.
6, according to claim 1 is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that described fluid working substance be latent heat of phase change more than 150J/g, the microcapsule phase-change thermal storage fluid of the particle diameter of capsule particle about 1 micron.
7, according to claim 6 is the pulsating heat pipe formula heat sink of working medium with the microcapsule phase-change thermal storage fluid, it is characterized in that described microcapsule phase-change thermal storage fluid is the FS-39E type microencapsulated phase change material that Mitsubishi system paper is produced.
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| CN 200710026286 CN101013010A (en) | 2007-01-12 | 2007-01-12 | Pulsating heat pipe heating panel using microcapsule phase-change thermal storage fluid as operating means |
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| CN 200710026286 CN101013010A (en) | 2007-01-12 | 2007-01-12 | Pulsating heat pipe heating panel using microcapsule phase-change thermal storage fluid as operating means |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157761A (en) * | 2011-03-18 | 2011-08-17 | 华南理工大学 | Thermal management system for power battery based on pulsating heat pipe |
| CN102425966A (en) * | 2011-09-23 | 2012-04-25 | 江苏大学 | Manufacturing method of nanoemulsion pulsating heat pipe |
| CN102759291A (en) * | 2011-04-25 | 2012-10-31 | 吴育林 | Self-excitation oscillating-flow heat pipe with netted pipeline |
| CN102944052A (en) * | 2012-11-09 | 2013-02-27 | 上海交通大学 | Plate type pulsating heat pipe fresh air heat regenerator |
| CN104180696A (en) * | 2014-09-01 | 2014-12-03 | 络派模切（北京）有限公司 | Ultra-thin reticular self-vibration heat pipe heat dissipation film and processing method thereof |
| CN104654871A (en) * | 2013-11-17 | 2015-05-27 | 成都奥能普科技有限公司 | Solid particle block circulation heat pipe heat accumulator |
| CN104654855A (en) * | 2013-11-17 | 2015-05-27 | 成都奥能普科技有限公司 | Fluid heat accumulator and heat accumulating vehicle |
| CN105547023A (en) * | 2016-01-27 | 2016-05-04 | 南昌大学 | Diameter-changeable pulsating heat pipe |
| CN105890412A (en) * | 2015-01-26 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | Plate type pulsating heat pipe and manufacturing method thereof |
| CN106091764A (en) * | 2016-08-11 | 2016-11-09 | 广东兆瓦热能科技股份有限公司 | Heat transmitter |
| CN106152842A (en) * | 2016-07-02 | 2016-11-23 | 洛阳文森科技有限公司 | A kind of groove pulsating heat pipe plate heat conduction band and technique |
| CN106455431A (en) * | 2016-10-12 | 2017-02-22 | 上海交通大学 | Board type loop thermosyphon uniform-temperature board |
| CN106767065A (en) * | 2017-03-16 | 2017-05-31 | 惠州市鼎丰泰科技有限公司 | A kind of loop circuit heat pipe |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
| CN109668459A (en) * | 2017-10-13 | 2019-04-23 | 讯凯国际股份有限公司 | Pulsed temperature-uniforming plate |
| CN112325251A (en) * | 2020-06-17 | 2021-02-05 | 深圳市海洋王照明工程有限公司 | High-temperature-resistant illuminating lamp |
| CN115052461A (en) * | 2022-06-16 | 2022-09-13 | 北京微焓科技有限公司 | Pulsating heat pipe heat dissipation device and heat dissipation system |
-
2007
- 2007-01-12 CN CN 200710026286 patent/CN101013010A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157761A (en) * | 2011-03-18 | 2011-08-17 | 华南理工大学 | Thermal management system for power battery based on pulsating heat pipe |
| CN102759291A (en) * | 2011-04-25 | 2012-10-31 | 吴育林 | Self-excitation oscillating-flow heat pipe with netted pipeline |
| CN102759291B (en) * | 2011-04-25 | 2014-09-03 | 吴育林 | Self-excitation oscillating-flow heat pipe with netted pipeline |
| CN102425966A (en) * | 2011-09-23 | 2012-04-25 | 江苏大学 | Manufacturing method of nanoemulsion pulsating heat pipe |
| CN102425966B (en) * | 2011-09-23 | 2013-03-13 | 江苏大学 | Manufacturing method of nanoemulsion pulsating heat pipe |
| CN102944052A (en) * | 2012-11-09 | 2013-02-27 | 上海交通大学 | Plate type pulsating heat pipe fresh air heat regenerator |
| CN104654871A (en) * | 2013-11-17 | 2015-05-27 | 成都奥能普科技有限公司 | Solid particle block circulation heat pipe heat accumulator |
| CN104654855A (en) * | 2013-11-17 | 2015-05-27 | 成都奥能普科技有限公司 | Fluid heat accumulator and heat accumulating vehicle |
| CN104180696A (en) * | 2014-09-01 | 2014-12-03 | 络派模切（北京）有限公司 | Ultra-thin reticular self-vibration heat pipe heat dissipation film and processing method thereof |
| CN104180696B (en) * | 2014-09-01 | 2016-01-20 | 络派模切（北京）有限公司 | A kind of ultrathin netted self-oscillation heat pipe heat radiation film and processing method thereof |
| CN105890412A (en) * | 2015-01-26 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | Plate type pulsating heat pipe and manufacturing method thereof |
| CN105547023A (en) * | 2016-01-27 | 2016-05-04 | 南昌大学 | Diameter-changeable pulsating heat pipe |
| CN106152842A (en) * | 2016-07-02 | 2016-11-23 | 洛阳文森科技有限公司 | A kind of groove pulsating heat pipe plate heat conduction band and technique |
| CN106091764A (en) * | 2016-08-11 | 2016-11-09 | 广东兆瓦热能科技股份有限公司 | Heat transmitter |
| CN106455431A (en) * | 2016-10-12 | 2017-02-22 | 上海交通大学 | Board type loop thermosyphon uniform-temperature board |
| CN106455431B (en) * | 2016-10-12 | 2018-06-08 | 上海交通大学 | Board-like loop thermal siphon temperature-uniforming plate |
| CN106767065A (en) * | 2017-03-16 | 2017-05-31 | 惠州市鼎丰泰科技有限公司 | A kind of loop circuit heat pipe |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
| CN109668459A (en) * | 2017-10-13 | 2019-04-23 | 讯凯国际股份有限公司 | Pulsed temperature-uniforming plate |
| CN112325251A (en) * | 2020-06-17 | 2021-02-05 | 深圳市海洋王照明工程有限公司 | High-temperature-resistant illuminating lamp |
| CN112325251B (en) * | 2020-06-17 | 2023-02-17 | 深圳市海洋王照明工程有限公司 | High-temperature-resistant illuminating lamp |
| CN115052461A (en) * | 2022-06-16 | 2022-09-13 | 北京微焓科技有限公司 | Pulsating heat pipe heat dissipation device and heat dissipation system |
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