CN2575847Y - Metal air fuel cell capable of changing supplementary fuel - Google Patents
Metal air fuel cell capable of changing supplementary fuel Download PDFInfo
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- CN2575847Y CN2575847Y CN 02257291 CN02257291U CN2575847Y CN 2575847 Y CN2575847 Y CN 2575847Y CN 02257291 CN02257291 CN 02257291 CN 02257291 U CN02257291 U CN 02257291U CN 2575847 Y CN2575847 Y CN 2575847Y
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Abstract
The utility model relates to a radiating device used for chip radiation, which comprises a main radiator and at least one secondary radiator, wherein, a flow passage is arranged in the main radiator, a liquid low melting point metal or an alloy flow working medium of the low melting point metal is arranged in the flow passage, the other surface of the main radiator, which contacts the surface of the chip, is provided with thermal sinks, the chip needs cooling, a flow passage is arranged in the secondary radiator and a liquid low melting point metal or an alloy flow working medium of the low melting point metal is arranged in the flow passage, and thermal sinks are arranged on the surface of the secondary radiator; a connecting pipeline is communicated between the main radiator and the secondary radiator, and the connecting pipeline is provided with a minipump which is used for driving the liquid low melting point metal or the alloy flow working medium of the low melting point metal; the flow working medium is low melting point metal gallium or the alloy of the low melting point metal gallium which can be molted by room temperature; the utility model has the advantages that the radiator element radiation and the convection cooling radiation are integrated into one body, the volume size is small, the radiating surface is large, and the heat transport efficiency is high; the integral structure has various forms, the application range is wide, the circulation process is close, and the effect to environment is avoided.
Description
Technical field
The utility model relates to the heat abstractor that is used for computer chip, particularly a kind of radiating device of chip radiation with low-melting-point metal or its alloy as flow working medium.
Background technology
A notable feature of current microelectronics industry development is that personal computer, work station and palmtop PC etc. are and increase as the blast, and major issue of the thing followed is how the high heat that produces in these systems to be loose rapidly and effectively.The difficulty of cooling microsystem is: at first, too high cooling air speed can cause big acoustic noise; Secondly, the component compact requirement only allows to keep limited cooling fluid space; The 3rd, it is heat sink to avoid installing big surface on the module as far as possible.More than these problems the importance of development high power density radiating element has all been proposed, and volume is little, high one of the most important index wherein just of efficient.We can say that at heat source density quite high in all kinds of electronic devices, seek the heat dissipating method with efficient thermotransport usefulness is the target that people pursue for many years always.
At present, people generally adopt the forced convection air to cool off heater members, promptly utilize fan that the cooling air force feed was loose should locate heat to the radiating element surface, but this kind mode heat dissipation capacity are limited, and cooling effectiveness is directly proportional with fan speed, thereby can cause obvious noise; In case and the micro element heat generation density is when too high, air cooling will be difficult to be competent at.Along with the growth at full speed of computer chip integrated level, desired heat transfer intensity is also more and more higher, adopts the mode of water-cooled or heat pipe heat radiation to put on the agenda, and corresponding product also sporadicly appears on the market.Analyze according to the people in the industry, water-cooled may become a main flow.Yet, though water-cooled efficient is higher, be in operation because evaporation etc. can cause device aging, corrosion, to having relatively high expectations of water quality and flow duct, exist and reveal, reliability still has much room for improvement, and it is reported, adopts the chip of water-cooled to be easy to burn at present, reason is that water-cooling system is still unreliable, in case because some fault causes current to stop, the chip temperature that then loses cooling will rise rapidly, until burning.
Consider above-mentioned factor, the researcher is just considering to adopt the phase-change heat-exchange mode to drain heat.Adopt phase-change heat transfer to compare with single-phase heat transfer or heat conduction, required working medium is few, and the heat transfer amount is big, but thereby weight reduction.In this class heat dissipating method, most typical no more than hot pipe technique, it as the main mode of conducting heat, has characteristics such as heat-transfer capability is big, temperature control capability is strong, heat transfer efficiency height with phase transformation (evaporate with condense) heat exchange, draws attention in the application aspect the heat radiation of computer components and parts.But the preparation of heat pipe manufacture technology such as core material, working medium encapsulation, maintenance etc. are quite complicated, and this is very limited its application.
We know that metal generally has the thermal conductivity far above nonmetallic materials, thereby have important use at some special occasions.And computer is generally operational in more than 0 ℃, below 100 ℃, imagination if can be in this warm area with liquid metals as cooling fluid, then be expected to produce good heat dispersion.Just be based on above-mentioned consideration, the utility model proposes a kind of new radiator that can under minor structure, realize big heat discharge, can realize that size is littler, performance is better dispelled the heat.At present nearly all computer chip cooling means is all nothing more than based on gas or non-metal kind liquid, and the practice of making flow working medium with liquid metals is not suggested in chip cooling industry so far as yet.
Summary of the invention
The purpose of this utility model is: a kind of radiating device of chip radiation with low-melting-point metal or its alloy as flow working medium that has rib structure and inner coolant flow channel simultaneously is provided.
The technical solution of the utility model is as follows:
The radiating device of chip radiation that the utility model provides is characterized in that, this heat abstractor comprises:
One inside has circulation passage, and the main radiator 1 of liquid low-melting-point metal or its alloy flow working medium is housed in the circulation passage, and this main radiator 1 is provided with radiated rib 5 with contacted another surface of chip surface to be cooled;
At least one inside has circulation passage, and the secondary radiator 2 of liquid low-melting-point metal or its alloy flow working medium is housed in the circulation passage;
Be communicated with by connecting tube 3 between main radiator 1 and the secondary radiator 2, and form connected loop, connecting tube 3 is provided with and is used to drive liquid low-melting-point metal or the mobile micropump 4 of its alloy flow working medium;
Described secondary radiator 2 can be inside and has circulation passage, and liquid low-melting-point metal or its alloy flow working medium are housed in the circulation passage, and the surface is provided with the radiator of radiated rib 6; Described secondary radiator 2 also can be the coil radiator that liquid low-melting-point metal or its alloy flow working medium are housed in the coil pipe, and its top is provided with fan 7;
Described radiated rib 5 and radiated rib 6 are of a size of 10nm * 10nm * 10nm to 5cm * 5cm * 5cm, and its shape of cross section can be square, rectangle, triangle or circle;
Radiated rib 5 tops of described main radiator 1 and radiated rib 6 tops of secondary radiator 2 also can be provided with fan 7;
Described connecting tube 3 is made by high-thermal conductive metal materials of aluminum, copper or silver or glass; Described connecting tube 3 can be the flexible duct of being made by plastics;
Described main radiator 1, secondary radiator 2 are made by high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material;
The flowing liquid low-melting-point metal is fusible low-melting-point metal gallium at room temperature in the circulation passage of described main radiator 1, secondary radiator 2, and its alloy is the alloy of at room temperature fusible low-melting-point metal gallium and tin, bismuth or indium composition;
The shape of cross section of circulation passage can be square, rectangle, triangle or circle in described main radiator 1, the secondary radiator 2.
The utlity model has following advantage: collecting and distributing hot fin heat radiation/coiled heat radiation and convection current cooling heat dissipation are in one, and volume size is little, and heat-delivery surface is big, the heat transfer efficiency height; Overall structure form is various, and applicable surface is wideer; Its cyclic process sealing does not have influence to environment.
The radiating device of chip radiation that the utility model provides, be provided with radiated rib with contacted another surface of chip surface to be cooled, and inside has runner, and being used for the secondary radiator (its outer surface also is distributed with fin) that heat that in the future autonomous radiator liquid low-melting-point metal or its alloy flow working medium brings looses and, the radiated rib on the major and minor radiator all is used to strengthen the heat exchange purpose; This heat abstractor also comprises: be used to be communicated with the connecting tube of major and minor radiator, be arranged on being used on the connecting tube to drive the micropump that liquid low-melting-point metal or its alloy flow working medium flow; Circulation passage shape in the major and minor radiator can be diversified, and existing in principle all circulation duct forms all can be used as its structure; When secondary radiator places air, heat is discharged by the mode of air forced convection and radiation in it, and can be provided with fan on the secondary radiator this moment; Also can be placed in the cooling water and (at this moment, fan should be taken away), its heat is taken away by water by the form of convection current cooling; Radiated rib form on the major and minor spreader surface can be diversified, and the radiated rib top is provided with fan to strengthen cross-ventilation; Major and minor radiator is made by materials such as high-thermal conductive metal such as aluminium, copper or silver, connecting tube therebetween can be made by above-mentioned metal or plastics etc., liquid low-melting-point metal or its alloy flow working medium are encapsulated in the circulation passage and the interior peripheral passage that constitutes of connecting tube of major and minor radiator, can realize stable thus and operation reliably.
The utility model notion novelty, be different from the non-metal kind working medium that adopts in the existing computer cooling technology, but low-melting-point metal or its alloy are used to cool off the flow working medium of purpose, utilized metal or its alloy type material to have characteristic fully far above the non-metal kind material thermal conductivity, and this working medium can flow, thereby has heat transportation ability greatly and fast.
Crucial part of the present utility model has been to introduce low-melting-point metal or its alloy fluid working substance as the transmission heat, promptly, the cooling working medium that in circulation passage and connecting tube, flows and unconventional used water or other organic fluid-mixings, but be to be fusible low-melting-point metal such as gallium or its alloy etc. near room temperature, because liquid metals has the thermal conductivity far above water and air, it has far above nonmetallic thermal conductivity and thermal diffusivity, and has flowability, thereby can transport heat fast and efficiently, this practice of making flow working medium with respect to using gases or nonmetal liquid in the past is an innovation.At present, although the fusing point of many metals such as mercury etc. is all lower, but proper low-melting-point metal should be gallium, its fusing point under atmospheric environment only is 29.77 ℃, and more stable and almost non-toxic below 100 ℃, and the fusing point of its alloy is lower, and the gallium alloy fusing point of stanniferous 8% is 20 ℃, and the gallium alloy that contains indium 25% melts in the time of 16 ℃.Further, adopt multicomponent mixture, also can obtain fusing point metal fluid widely, as ternary eutectic: 62.5%Ga, 21.5%In, the fusing point of 16%Sn are 10.7 ℃.Above-mentioned characteristic shows that the low-melting-point metal gallium can perform well in transporting of heat, and as long as a micropump (can be mechanical pump or electromagnetic pump) is set in connecting tube, the metal liquid working medium that can drive in circulation passage and the connecting tube flows; In addition, the radiator that the utility model provides is combined the realization control transfer of heat with radiated rib heat radiation and heat convection simultaneously, this has expanded existing single chip cooling method (as only depending on air forced convection or water-cooled etc.) conceptive, and the measure of the above-mentioned two kinds of radiating modes of efficient realization of this while also only just is expected to realize after introducing the high heat conductance liquid metals.And even liquid metals stops to flow, the radiated rib that is provided with in this device also can be exercised the function of heat radiation fully, thereby guarantee the chip stable and reliable operation, and when temperature was higher than certain numerical value, liquid metals promptly put into operation, greatly strengthened the transport capability of heat thus; In fact, liquid metals generally has very big degree of subcooling, such as gallium fusing in a single day, it can even more keep liquid at 0 ℃ for a long time more than the low temperature, thereby in fact be difficult to occur solidifying, and in most of the cases remaining liquid state, this is highly beneficial for the radiator operation.
At present, because the demand of high heat flux discharging, people are like a raging fire all the time to the pursuit of the efficient type of cooling, but the heat-sinking capability of relevant approach almost reaches capacity; The utility model provide with liquid metals as cooling fluid and be the technology of a conception of species novelty simultaneously in conjunction with the mode of radiated rib heat radiation and convection current cooling heat dissipation, be the new cutting point of the efficient cooled wafer of searching.
Description of drawings
Accompanying drawing 1 is a structural representation of the present utility model;
Accompanying drawing 2a is the schematic diagram in the A-A cross section of accompanying drawing 2;
Accompanying drawing 2b is the schematic diagram in the B-B cross section of accompanying drawing 2;
Accompanying drawing 3 is the structural representation of an embodiment of secondary radiator 2 (all being provided with fin on the surrounded surface);
Accompanying drawing 4 is the structural representation that the utlity model has the heat abstractor of a plurality of secondary radiators 2;
Wherein, main radiator 1 secondary radiator 2 connecting tubes 3
Micropump 4 radiated ribs 5,6 fans 7
Liquid metals cooling working medium 8
Embodiment
Further describe the utility model below in conjunction with the drawings and specific embodiments: Fig. 1 is a structural representation of the present utility model, also is an embodiment of the present utility model; Accompanying drawing 2 is cross section (radiated rib 5 and the circulation passage) schematic diagram of the utility model master radiator 1; Accompanying drawing 2a is the schematic diagram in the A-A cross section of accompanying drawing 2; Accompanying drawing 2b is the schematic diagram in the B-B cross section of accompanying drawing 2; As seen from the figure, the radiating device of chip radiation that the utility model provides comprises:
One inside has circulation passage, and the main radiator 1 of liquid low-melting-point metal or its alloy flow working medium is housed in the circulation passage, and this main radiator 1 is provided with radiated rib 5 with contacted another surface of chip surface to be cooled;
At least one inside has circulation passage, and the secondary radiator 2 of liquid low-melting-point metal or its alloy flow working medium is housed in the circulation passage;
Be communicated with by connecting tube 3 between main radiator 1 and the secondary radiator 2, and form connected loop, connecting tube 3 is provided with and is used to drive liquid low-melting-point metal or the mobile micropump 4 of its alloy flow working medium;
Described secondary radiator 2 can be inside and has circulation passage, and liquid low-melting-point metal or its alloy flow working medium are housed in the circulation passage, and the surface is provided with the radiator of radiated rib 6; Described secondary radiator 2 also can be the coil radiator that liquid low-melting-point metal or its alloy flow working medium are housed in the coil pipe, and its top is provided with fan 7;
Described radiated rib 5 and radiated rib 6 are of a size of 10nm * 10nm * 10nm to 5cm * 5cm * 5cm, and its shape of cross section can be square, rectangle, triangle or circle;
Radiated rib 5 tops of described main radiator 1 and radiated rib 6 tops of secondary radiator 2 also can be provided with fan 7;
Described connecting tube 3 is made by high-thermal conductive metal materials of aluminum, copper or silver or glass; Described connecting tube 3 can be the flexible duct of being made by plastics;
Described main radiator 1, secondary radiator 2 are made by high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material;
The flowing liquid low-melting-point metal is fusible low-melting-point metal gallium at room temperature in the circulation passage of described main radiator 1, secondary radiator 2, and its alloy is the alloy of at room temperature fusible low-melting-point metal gallium and tin, bismuth or indium composition;
The shape of cross section of circulation passage can be square, rectangle, triangle or circle in described main radiator 1, the secondary radiator 2.
The radiating device of chip radiation that the utility model provides, the circulation passage shape of its main radiator 1, secondary radiator 2 can be diversified, and existing in principle all circulation duct forms all can be used as its structure; When it places air, heat is discharged by the mode of air forced convection and radiation in it, can be provided with fan 7 on the radiated rib 5 and 6 of main radiator 1 and secondary radiator 2 to strengthen cross-ventilation, or directly secondary radiator 2 is positioned in the cooling water, its heat is taken away by water by the form of convection current cooling; Radiated rib 5,6 forms of main radiator 1 and secondary radiator 2 can be diversified, and major and minor radiator 1,2 can be made by materials such as high-thermal conductive metal such as aluminium, copper or silver, and connecting tube 3 therebetween can be made by above-mentioned metal or plastics; Said structure is communicated as one, and liquid low-melting-point metal or its alloy flow working medium are encapsulated in the peripheral passage that is made of circulation passage in major and minor radiator 1 and 2 and connecting tube 3, can realize stable thus and operation reliably.
Electromagnetism Micropump 4 (purchasing on the market) are installed, so that the liquid low-melting-point metal or its alloy flow working medium that drive in the pipeline flow on the connecting tube 3 when radiator moves; When manufacturing, can manufacture major and minor radiator 1 by machine work or other mature technologies, circulation passage in 2, be connected with connecting tube 3 afterwards, but at one end leave opening, so as with liquid low-melting-point metal or its alloy flow working medium 8 along in this opening flow in pipes and the peripheral passage, treat to be full of in the whole circulation passage this liquid low-melting-point metal or its alloy flow working medium 8 after, above-mentioned opening is encapsulated, and promptly forming the inner loop passage is airtight efficient radiating apparatus.During use, it is attached at treats to realize the high efficiency of transmission of heat on the heat radiation chip surface.As required, connecting tube 3 can be made by metal or plastics, and its length can be adjusted as required, and this mode is comparatively flexible for the cooling of computer chip, and the entire heat dissipation device size can be made as required.Described liquid low-melting-point metal or its alloy flow working medium 8 also can adopt its alloy, as the indium gallium except that adopting modal gallium metal; The version of circulation passage can be prepared as required, and can realize the combination of various ways.The heat dissipating package device can be flat sheet type, also can be other shapes such as ring-type.
The heat abstractor that the utility model provides has substantive difference with the traditional heat-dissipating device in the selection of working media, promptly it adopts the fluid working substance (report that so far in domestic and foreign literature and patent all do not have same procedure) of low-melting-point metal as cooled wafer first.When the heat abstractor substrate connects thermal source, liquid low-melting-point metal or its alloy flow working medium 8 and radiated rib 5 that heat is promptly passed in it to be full of by main radiator 1 substrate tube wall, loose by the forced convection mode by fan 7 again, because liquid low-melting-point metal or its alloy flow working medium 8 have thermal conductivity and thermal diffusivity far above conventional fluid, thereby to conduct heat be efficiently and fast, and it flows and can cause soon the heat that is absorbed is walked by the transmission of flowing; Meanwhile, the surface radiating fin 5 of main radiator 1 is in nature heat extraction state, the other end then is communicated with secondary radiator 2 by connecting tube 3, like this, the heat that is brought by liquid low-melting-point metal or its alloy flow working medium 8 of main radiator 1 outflow can be scattered and disappeared away by radiated rib 6 surfaces of secondary radiator 2; In order to increase heat dispersion, the surface of radiated rib 6 can make various ways, and the fin that Fig. 3 shows secondary radiator 2 surfaces adopts the rib-type fin, thereby can heat be drained by the heat-delivery surface that greatly is expanded; In a word, liquid low-melting-point metal or its alloy flow working medium 8 high thermal conductivities can guarantee to conduct to the hot-fluid of radiated rib 5 on the main radiator 1 higher by chip, then thermal conductivity is lower for the nonmetal fluids of class such as used in the past water or organic mixture, the heat that can cause flowing to fin is less, so the introducing of liquid low-melting-point metal or its alloy flow working medium 8 makes that the mode that has fin heat radiation and fluid convection cooling heat transferring simultaneously is efficient and feasible.In addition, in this device, connecting tube is provided with micropump 4, can in circulation passage, cause certain pressure reduction, under differential pressure action, liquid low-melting-point metal or its alloy flow working medium 8 promptly flow to secondary radiator 2 by main radiator 1, and there heat discharge are gone out; After liquid low-melting-point metal or its alloy flow working medium 8 were emitted heat, the driving by micropump 4 was back to main radiator 1 again, continues to finish new heat transportation.
Micropore or groove can process by prior art in milli in the utility model, the micron-sized pipeline.Present progress has made and has processed by a plurality of hydraulic diameters at 10nm to 10
3Microchannel between the μ m becomes possibility.These conduits can be produced on the thin slice of silicon, metal or other suitable material, and each thin slice both can be formed a heat exchanger separately, also can pile up and weld together to form parallel following current or contra-flow heat exchanger.These technique guarantee the processing of this heat abstractor system.Such as, when making the circulation passage of radiator, if desired line size less (as in tens of micron dimensions) then need adopt some micro-/ nano process technologies such as LIGA technology, laser drilling etc. to go up in the substrate (can be metal such as aluminium or semiconductor silicon etc.) of major and minor radiator 1,2 and process a series of micro-grooves or duct by certain pipe method.If line size very big (arriving centimetre magnitude as millimeter) then adopts conventional method such as machine work or electric machining to make.Whole manufacturing process is also uncomplicated.
According to the requirement of heat radiation, heat abstractor of the present utility model can be various ways, can drive a plurality of secondary radiator 2 (see figure 4)s as a main radiator 1.The entire heat dissipation device can be the combination of a main radiator and plural secondary radiator, adopts certain connecting tube 3 therebetween, when the connecting tube 3 that adopts plastics to manufacture, promptly constitutes the flexible heat sink device, is suitable for the heat radiation of multiple requirement;
For reaching better radiating effect, generally should satisfy following requirement as liquid low-melting-point metal of the present utility model or its alloy flow working medium 8: nontoxic, institute's contact material is not played corrosion and chemical action, chemical reaction does not take place under the high temperature about 100 ℃; Be convenient to obtain; Has certain thermal stability; Specific heat, thermal conductivity and thermal diffusivity are higher, thereby when transmitting certain heat, can make flow little, conduct heat rapidly; This liquid low-melting-point metal or its alloy flow working medium 8 working medium should be compatible with structural material, selected liquid low-melting-point metal or its alloy flow working medium 8 can not cause heat sink assembly is produced the unfavorable factor that corrosion and rustization etc. influence useful life, in addition, this liquid low-melting-point metal or its alloy flow working medium 8 also should have the bigger latent heat of fusion and less viscosity, such as, same sodium as liquid metals, even 97.82 ℃ of its fusing points, the fusing point of potassium is 63.2 ℃, they all are not suitable for the chip cooling and use, on the one hand be because of its fusing point say for chip cooling higher, be on the other hand because of sodium and potassium very easily with water generation chemical reaction; In addition, for another example,, be-38.87 ℃,, also should not be considered as working medium of the present utility model because of toxic though the fusing point of mercury is very low.
At present, relatively being suitable for as liquid low-melting-point metal of the present utility model or its alloy flow working medium 8 can be to sow or its alloy; Gallium is soft silvery white metal, and its fusing point under atmospheric environment is very low, only is 29.77 ℃, and boiling point is 2204.8 ℃, and the latent heat of fusion is the 19.16cal/ gram, and the density of solid-state gallium is 5.904g/cm
3, the density of the liquid-gallium in the time of 32.38 ℃ is 6.093g/cm
3(Qian Zengyuan, the hot rerum natura of low-melting-point metal, Beijing: Science Press, 1985); The specific heat of solid-state gallium in the time of 27 ℃ is 0.089cal/g. ℃, the coefficient of linear expansion of solid-state gallium 0 ℃ to melting range be 18.1 * 10
-6/ ℃; Volume reduces during the gallium fusion; The conductive coefficient of liquid-gallium when fusing point is 25.2kcal/m.h. ℃, far above empty G﹠W; The specific heat of liquid-gallium in the time of 100 ℃ is 0.082cal/g. ℃; The absolute viscosity of liquid gallium is: be 1.89 * 10 in the time of 52.9 ℃
-2G/cm.s is 1.03 * 10 in the time of 301 ℃
-2G/cm.s; These thermal characteristicss show that the coolant that gallium is used as chip cooling is very suitable; At normal temperatures, gallium is stable in air, when temperature more than 260 ℃ the time, dry oxygen can make the gallium metal oxidation, and (" rare metal knowledge " writes group, uncommon dispersed metallic but the oxide-film that generates can prevent it to continue oxidation, Beijing: metallurgical industry publishing house, 1978); So, have good stability and reliability based on the radiator of gallium; In atomic pile, people also once used liquid gallium to make thermophore; But do not see as yet then that in the situation below 100 ℃ report is arranged, only be used as and be filled between chip hot side and the radiator bottom to reduce the interface coating material of contact heat resistance; It is worthy of note that gallium can generate low-melting alloy with many metals such as bismuth, tin, indium etc., for example, the gallium alloy fusing point of stanniferous 8% is 20 ℃, and the gallium alloy that contains indium 25% melts in the time of 16 ℃; Further, adopt multicomponent mixture, also can obtain fusing point metal fluid widely, such as (Gu Xuemin, Gong Yisheng, Zang Xiwen, the soup Caro, Lv Yunyang, Ceng Wenzhen, inorganic chemistry book series second volume, Beijing: Science Press, 1990), ternary eutectic: 62.5%Ga, 21.5%In, the fusing point of 16%Sn are 10.7 ℃, and ternary eutectic: 69.8%Ga, 17.6%In, the fusing point of 12.6%Sn are 10.8 ℃.They all can be used as working media of the present utility model.
The utlity model has lot of advantages, at first, the chip radiator size of making based on low-melting-point metal or its alloy can be very little, and heat-transfer capability is then higher relatively, because transporting by fin and liquid metals of radiator heat finished, thereby heat transfer efficiency is higher; Collecting and distributing backing heat radiation of the utility model and convection current cooling heat dissipation have been expanded the heat-delivery surface of traditional heat-dissipating mode greatly in one; The multiple combination of a main radiator and a plurality of secondary radiators, its applicable surface is wideer; The entire heat dissipation device seals, and can not impact environment;
Heat abstractor of the present utility model can be advantageously used in the heat that device produces is led away from its surface; With embodiment 1 is example, uses mode of the present utility model as follows: according to treating the heat removal surface area size, select the heat abstractor of different sizes, it is close to the chip heating surface, the contact-making surface between the two adopts the high thermal conductivity grease to increase heat-transfer effect; So the heat that is produced can be transferred to heat extraction end (radiated rib 5,6 ends) and be drained by radiator substrate and liquid metals, thereby makes chip maintain a normal working temperature.
Claims (11)
1, a kind of radiating device of chip radiation is characterized in that, this heat abstractor comprises:
One inside has circulation passage, and the main radiator 1 of liquid low-melting-point metal or its alloy is housed in the circulation passage, and this main radiator 1 is provided with radiated rib 5 with contacted another surface of chip surface to be cooled;
At least one inside has circulation passage, and the secondary radiator 2 of liquid low-melting-point metal or its alloy is housed in the circulation passage;
Be communicated with by connecting tube 3 between main radiator 1 and the secondary radiator 2, and form connected loop, connecting tube 3 is provided with and is used to drive liquid low-melting-point metal or the mobile micropump 4 of its alloy flow working medium.
2, by the described radiating device of chip radiation of claim 1, it is characterized in that, described secondary radiator 2 is for inside has circulation passage, and liquid low-melting-point metal or its alloy flow working medium are housed in the circulation passage, and the surface is provided with the radiator of radiated rib 6.
By the described radiating device of chip radiation of claim 1, it is characterized in that 3, described secondary radiator 2 is for being equipped with the coil radiator of liquid low-melting-point metal or its alloy flow working medium in the coil pipe.
4, by claim 1 or 2 described radiating device of chip radiation, it is characterized in that the top of the radiated rib 5 of described main radiator 1 and the radiated rib 6 of secondary radiator 2 is provided with fan 7.
5, by claim 1 or 2 described radiating device of chip radiation, it is characterized in that, described radiated rib 5 and radiated rib 6 are of a size of 10nm * 10nm * 10nm to 5cm * 5cm * 5cm, and its shape of cross section can be square, rectangle, triangle or circle.
6, by the described radiating device of chip radiation of claim 4, it is characterized in that, described radiated rib 5 and radiated rib 6 are of a size of 10nm * 10nm * 10nm to 5cm * 5cm * 5cm, and its shape of cross section can be square, rectangle, triangle or circle.
7, by the described radiating device of chip radiation of claim 1, it is characterized in that described main radiator 1, secondary radiator 2 are made by high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
8, by the described radiating device of chip radiation of claim 1, it is characterized in that described connecting tube 3 is made by high-thermal conductive metal materials of aluminum, copper or silver or polymethyl methacrylate.
9, by the described radiating device of chip radiation of claim 1, it is characterized in that the flexible duct of described connecting tube 3 for making by plastics.
By the described radiating device of chip radiation of claim 1, it is characterized in that 10, the liquid low-melting-point metal of dress or its alloy are to be fusible low-melting-point metal gallium or its alloy in described major and minor radiator 1 and 2 circulation passages near room temperature.
By the described radiating device of chip radiation of claim 1, it is characterized in that 11, the shape of cross section of the circulation passage in described main radiator 1, the secondary radiator 2 is square, rectangle, triangle or circle.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02257291 CN2575847Y (en) | 2002-10-10 | 2002-10-10 | Metal air fuel cell capable of changing supplementary fuel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 02257291 CN2575847Y (en) | 2002-10-10 | 2002-10-10 | Metal air fuel cell capable of changing supplementary fuel |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101764498B (en) * | 2008-12-25 | 2012-02-15 | 中国科学院理化技术研究所 | Electromagnetic pump with built-in slide block and for driving liquid metals |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| CN102562513A (en) * | 2010-12-17 | 2012-07-11 | 中国科学院理化技术研究所 | Convolute accelerating pump used for driving conducting fluid to flow |
| CN102570775A (en) * | 2010-12-14 | 2012-07-11 | 岳凡 | Double-faced water-cooling heat radiator of converter |
| CN101645674B (en) * | 2008-08-06 | 2012-09-05 | 中国科学院理化技术研究所 | Liquid metal-cooled focus type solar energy thermionic generating set |
| CN102949237A (en) * | 2011-08-24 | 2013-03-06 | 中国科学院理化技术研究所 | Probe heating device based on liquid metal |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Microfluidic chip heat radiation device |
| CN106791300A (en) * | 2016-12-09 | 2017-05-31 | 刘洋 | A kind of high resolution optical imaging equipment |
| CN106981464A (en) * | 2017-03-31 | 2017-07-25 | 山东超越数控电子有限公司 | A kind of temperature equalization system for large scale heat abstractor |
| CN108195213A (en) * | 2017-12-22 | 2018-06-22 | 云南靖创液态金属热控技术研发有限公司 | The radiator of heat resistanceheat resistant stream impact |
| CN110571203A (en) * | 2019-08-16 | 2019-12-13 | 全球能源互联网研究院有限公司 | Heat dissipation device for IGBT module |
-
2002
- 2002-10-10 CN CN 02257291 patent/CN2575847Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101645674B (en) * | 2008-08-06 | 2012-09-05 | 中国科学院理化技术研究所 | Liquid metal-cooled focus type solar energy thermionic generating set |
| CN101764498B (en) * | 2008-12-25 | 2012-02-15 | 中国科学院理化技术研究所 | Electromagnetic pump with built-in slide block and for driving liquid metals |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| CN102570775A (en) * | 2010-12-14 | 2012-07-11 | 岳凡 | Double-faced water-cooling heat radiator of converter |
| CN102562513A (en) * | 2010-12-17 | 2012-07-11 | 中国科学院理化技术研究所 | Convolute accelerating pump used for driving conducting fluid to flow |
| CN102949237B (en) * | 2011-08-24 | 2014-12-31 | 中国科学院理化技术研究所 | Probe heating device based on liquid metal |
| CN102949237A (en) * | 2011-08-24 | 2013-03-06 | 中国科学院理化技术研究所 | Probe heating device based on liquid metal |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Microfluidic chip heat radiation device |
| CN105914189B (en) * | 2016-04-20 | 2018-03-02 | 中国科学院理化技术研究所 | Micro-fluidic chip heat abstractor |
| CN106791300A (en) * | 2016-12-09 | 2017-05-31 | 刘洋 | A kind of high resolution optical imaging equipment |
| CN106791300B (en) * | 2016-12-09 | 2019-06-25 | 上饶市众联光电有限公司 | A kind of high resolution optical imaging equipment |
| CN106981464A (en) * | 2017-03-31 | 2017-07-25 | 山东超越数控电子有限公司 | A kind of temperature equalization system for large scale heat abstractor |
| CN108195213A (en) * | 2017-12-22 | 2018-06-22 | 云南靖创液态金属热控技术研发有限公司 | The radiator of heat resistanceheat resistant stream impact |
| CN110571203A (en) * | 2019-08-16 | 2019-12-13 | 全球能源互联网研究院有限公司 | Heat dissipation device for IGBT module |
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