CN101515572B - Novel LED and a high-power radiator of a radiating element - Google Patents
Novel LED and a high-power radiator of a radiating element Download PDFInfo
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- CN101515572B CN101515572B CN2009100801780A CN200910080178A CN101515572B CN 101515572 B CN101515572 B CN 101515572B CN 2009100801780 A CN2009100801780 A CN 2009100801780A CN 200910080178 A CN200910080178 A CN 200910080178A CN 101515572 B CN101515572 B CN 101515572B
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- 238000009833 condensation Methods 0.000 claims abstract description 27
- 230000005494 condensation Effects 0.000 claims abstract description 27
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- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000001125 extrusion Methods 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000003380 propellant Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a LED and a high-power radiator of a radiating element, comprising flat plate heat pipes which are of two or more via-hole array flat plate structures arranged side by side; the via-hole array flat plate structures are formed by carrying out extrusion or punch forming on metal materials; the equivalent diameter of the via hole is 0.5-3mm; the via hole is filled with liquid propellant and both ends of the flat plate heat pipes are packaged by sealing; an evaporation section of the flat plate heat pipe contacts heating surfaces of the LED and the high-power radiating element and a condensation section thereof radiates through the radiating element. The LED and the high-power radiator of a radiating element overcome the disadvantages that the contact area of the existing circular heat pipes and the heating surfaces of the LED and the high-power radiating element is small, the equivalent resistance of heat conduction is large and the manufacturing process is complex, which have the advantages of high radiating efficiency and simple process.
Description
Technical field
The present invention relates to a kind of high-power radiating element heat dissipation technology, the radiator that is used for LED and the heat radiation of high-power radiating element that particularly a kind of flat-plate heat pipe forms.
Background technology
Along with the LED technology rapid development, caloric value and the density of heat flow rate of LED increase considerably, and at present, the density of heat flow rate of LED device is up to 400W/cm
2And the density of heat flow rate of general free convection cooling heat dissipation is no more than 0.8W/cm
2, the density of heat flow rate of wind-cooling heat dissipating is no more than 10W/cm
2, have only the liquid cooling of employing and hot pipe technique can make the density of heat flow rate of heat radiation reach 100W/cm
2Reaching and surpassing this density of heat flow rate value is a global difficult problem on the heat dissipation technology.Second difficulty is that the heat-dissipating space that can leave device for had also received huge restriction after the device integrated level improved, and the technical scheme that can adopt is restricted, and has more increased difficulty.Because what electronic device mainly adopted is semi-conducting material; Therefore the temperature resistant capability of device is more weak; For example for the LED device; The obviously decline of the efficient of device, the lost of life, color change when temperature raises, and particularly when the device nodes temperature was higher than about 130 ℃, device will be burnt out.Usually the liquid cooling system volume is big, and itself there is potential safety hazard in the liquid cooling technology, in case revealing appears in liquid cooling system, will cause LED to damage.The hot pipe technique heat transfer efficiency is very high, but the manufacture craft of general heat pipe is very complicated, and the contact area of general heat pipe such as circular heat pipe and electronic equipment heating face is very little, causes equivalent thermal resistance big, makes to use to be very limited.
Summary of the invention
The present invention is directed to the defective or the deficiency that exist in the prior art, the radiator of a kind of LED of being used for and high-power radiating element is provided, the radiator that forms with flat-plate heat pipe has radiating efficiency height, advantage of simple technology to electronic equipment dissipating heat.
Technical scheme of the present invention is following:
A kind of radiator that is used for LED and high-power radiating element; It is characterized in that: comprise flat-plate heat pipe; Said flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching; The equivalent diameter of said through hole is 0.5mm-3mm, is filled with the encapsulation of liquid working substance and flat-plate heat pipe sealed at both ends in the said through hole; The evaporation section of flat-plate heat pipe contacts with the heating face face of LED and high-power radiating element, and its condensation segment is through the thermal component heat radiation.
The some little fin that has extrusion modling on the said through-hole wall with augmentation of heat transfer effect.
The distance of adjacent two little fins is 0.01mm-0.5mm, and the height of little fin is 0.03mm-1.5mm.
The size of said little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall.
The groove width of said based on capillary slot is 0.01mm-0.4mm, and groove depth is 0.03mm-0.7mm.
Said thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
Said heat dissipation metal parts are outer fin, and said outer fin is equipped with by aluminium or copper.
Said through hole sealed at both ends encapsulation forms the micro heat pipe that works alone.
Said flat-plate heat pipe bends to " L " type; The bottom of said " L " type is an evaporation section, and the side is a condensation segment.
Said flat-plate heat pipe bends to " U " type; The bottom of said " U " type is an evaporation section, and both sides are condensation segment.
Technique effect of the present invention is following:
The radiator that is used for LED and high-power radiating element of the present invention; Form via-hole array with the through hole of equivalent diameter and constitute flat-plate heat pipe to form specific radiator with the particular range that adapts with factors such as the condition of work of LED and high-power radiating element and heat generation characteristics; The evaporation section of flat-plate heat pipe is contacted with the heating face face of LED and high-power radiating element, and its condensation segment is through the thermal component heat radiation.Filling liquid working medium forms micro heat pipe in the through hole, forms the heat pipe effect naturally.Owing to have the high advantage of hot pipe technique heat transfer efficiency, again because be flat-plate heat pipe, its evaporation section contacts with the heating face face of LED and high-power radiating element simultaneously; Make that the contact area of heating face of flat-plate heat pipe and LED and high-power radiating element can be very big; So make that the heat conduction equivalent thermal resistance is very little, improved heat transfer efficiency, also improved the radiating efficiency of LED and high-power radiating element simultaneously; Overcome the shortcoming that contact area is little, the heat conduction equivalent resistance is big of the heating face of existing circular heat pipe and LED and high-power radiating element; And owing to be extrusion modling, technology is simple, when having saved existing heat pipe and making such as technology such as capillary wick material preparation.Consider heat generation characteristic and the LED and the architectural characteristics such as high-power radiating element installation environment, condition and environment for use of the heating face of LED and high-power radiating element; The equivalent diameter that through hole is set is 0.5mm-3mm; In through hole, be filled with liquid working substance and form micro heat pipe; Both strengthen the exchange capability of heat of liquid working substance, and can effectively reduce contact heat resistance again.
Have the further exchange capability of heat of enhance liquid working medium of some little fins on the through-hole wall; And has capillary force between little fin that is provided with in the through hole and the through-hole wall; Also can produce capillary force if distance is suitable between little fin and the little fin; The formation of capillary force has promoted flowing of working medium, also helps the enhance heat transfer ability.
The distance that adjacent two little fins are set is 0.01mm-0.5mm, and the height of little fin is 0.03mm-1.5mm, not only very high heat-transfer capability can be arranged, and significantly strengthens mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant.
The size of little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall, can produce high-intensity phase-change heat transfer.
The groove width that based on capillary slot is set is 0.01mm-0.4mm; Groove depth is 0.03mm-0.7mm; The kind of liquid working substance cooperates the size and the structure of suitable based on capillary slot; Can strengthen the density of heat flow rate that LED and high-power radiating element when heat radiation forms, increasing substantially heat transfer efficiency, thereby make LED and high-power radiating element by cooling rapidly.
The encapsulation of through hole sealed at both ends forms the micro heat pipe that works alone; Like this; Flat-plate heat pipe contain two and more than join side by side and micro heat pipe that work alone, can not influence other micro heat pipe work even certain micro heat pipe is damaged as take place revealing yet, and help security maintenance.
Thermal component is that the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment carry out air cooling; The heat dissipation metal parts are outer fin etc.; Can augmentation of heat transfer, accelerate flat-plate heat pipe in the condensation segment heat release, make the quick heat release condensation of liquid working substance flow back to the evaporation section of flat-plate heat pipe.
Flat-plate heat pipe bends to " L " type, and flat-plate heat pipe bends to " U " type, forms the heat pipe effect because this flat-plate heat pipe is a nature; With the flat-plate heat pipe brake forming, as the radiator that is used for LED and high-power radiating element, liquid working substance heat absorption back carburation by evaporation in its evaporation section; Naturally travel up to condensation segment; Condensation segment heat release liquefaction, and rely on gravity or capillary force effect to flow back to evaporation section downwards, accomplish circulation automatically; This structure is more conducive to heat exchange, reaches the quick cooling purpose of electronic equipment.
Description of drawings
Fig. 1 is used for the structural representation of first kind of preferred embodiment of the radiator of LED and high-power radiating element for the present invention;
Fig. 2 is used for the structural representation of second kind of preferred embodiment of the radiator of LED and high-power radiating element for the present invention;
Fig. 3 is used for the structural representation of the third preferred embodiment of the radiator of LED and high-power radiating element for the present invention.
Embodiment
The present invention will be described below in conjunction with accompanying drawing.
Fig. 1 is used for the structural representation of first kind of preferred embodiment of the radiator of LED and high-power radiating element for the present invention; This is used for the radiator of LED and high-power radiating element; Comprise flat-plate heat pipe 1; This flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching; Consider LED and high-power radiating element heating face factor such as heat generation characteristic and LED and the architectural characteristic that high-power radiating element is installed and the influence of installing space and operational environment factor and the through hole equivalent diameter of specific size is set; For example in 120 ℃, the density of heat flow rate of device work can reach 400W/cm to the working temperature of LED usually
2So the equivalent diameter that through hole is set is 0.5mm-3mm, preferred 2mm-3mm is filled with liquid working substance and forms micro heat pipe in through hole, strengthened the exchange capability of heat of liquid working substance greatly, can effectively reduce contact heat resistance again simultaneously.The single face of through-hole wall or all around in have little fin that several are processed by Heat Conduction Material; The distance of adjacent two little fins is 0.01mm-0.5mm; The height of little fin is 0.03mm-1.5mm, can significantly strengthen mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant like this.In through hole, be filled with liquid working substance, the encapsulation of flat-plate heat pipe sealed at both ends, the through hole two ends are also formed the micro heat pipe that works alone by sealed package, can guarantee that like this certain micro heat pipe is damaged as not influencing other micro heat pipe work after revealing.Size and structure that present embodiment can be provided with little fin make it to be suitable for to form along the based on capillary slot of through hole length direction trend with through-hole wall; The groove width that based on capillary slot is set is 0.01mm-0.4mm; Groove depth is 0.03mm-0.7mm, and the kind of liquid working substance cooperates the size and the structure of suitable based on capillary slot, the density of heat flow rate that forms in the time of can strengthening the heat radiation of LED and high-power radiating element; Increasing substantially heat transfer efficiency, thereby make LED and high-power radiating element by cooling rapidly.Make the optimum working temperature of the liquid working substance of encapsulation in the flat-plate heat pipe in 120 ℃, the maximum critical heat flux of flat-plate heat pipe approximately can reach 450W/cm
2Do not show the internal structure sketch map of flat-plate heat pipe among the embodiment 1, but it is done as a whole.The left-hand component of flat-plate heat pipe 1 is evaporation section, and this evaporation section contacts with the heating face face of LED2, and the right-hand component of flat-plate heat pipe 1 is a condensation segment; Outer fin 3 heat radiations of this condensation segment through installing; Should outer fin 3 be the heat dissipation metal parts, can be by aluminium or copper or the preparation of other metal material, this outer fin can increase area of dissipation with augmentation of heat transfer; Accelerate flat-plate heat pipe in the condensation segment heat release, make the quick heat release condensation of liquid working substance flow back to the evaporation section of flat-plate heat pipe.Outside fin 3 directly over fan 4 is installed, with the mode of forced convertion heat is dispersed in the atmosphere.Wherein, can the LED in the mark 2 be changed into other high-power radiating element, for example controllable silicon.
Fig. 2 is used for the structural representation of second kind of preferred embodiment of the radiator of LED and high-power radiating element for the present invention, this embodiment middle plateform heat pipe 1 bends to " L " type.The bottom of " L " type is an evaporation section, contacts with the heating face face of LED2; The side is a condensation segment, and the left and right sides of condensation segment all is equipped with outer fin 3.Liquid working substance heat absorption back carburation by evaporation travels up to condensation segment, condensation segment heat release liquefaction naturally in the evaporation section of flat-plate heat pipe; And rely on gravity or capillary force effect to flow back to evaporation section downwards; Automatically accomplish circulation, this structure is more conducive to heat exchange, reaches the cooling purpose with LED.Condensation segment also can be through this heat dissipation metal parts heat radiation of outer fin, and for example, condensation segment can be through connecting the water cooling equipment heat radiation.
Fig. 3 is used for the structural representation of the third preferred embodiment of the radiator of LED and high-power radiating element for the present invention, this embodiment middle plateform heat pipe 1 bends to " U " type.The bottom of " U " type is an evaporation section, contacts with the heating face face of LED2; Both sides are condensation segment, and the left and right sides of condensation segment all is equipped with outer fin 3.
Should be pointed out that the above embodiment can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation.Therefore; Although this specification has carried out detailed explanation with reference to accompanying drawing and embodiment to the invention,, those skilled in the art are to be understood that; Still can make amendment or be equal to replacement the invention; In a word, all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the invention, and it all should be encompassed in the middle of the protection range of the invention patent.
Claims (10)
1. radiator that is used for LED and high-power radiating element; It is characterized in that: comprise flat-plate heat pipe; Said flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching; The equivalent diameter of said through hole is 0.5mm-3mm, is filled with the encapsulation of liquid working substance and flat-plate heat pipe sealed at both ends in the said through hole; The evaporation section of flat-plate heat pipe contacts with the heating face face of LED and high-power radiating element, and its condensation segment is through the thermal component heat radiation.
2. the radiator that is used for LED and high-power radiating element according to claim 1 is characterized in that, has the some little fin with augmentation of heat transfer effect of extrusion modling on the said through-hole wall.
3. the radiator that is used for LED and high-power radiating element according to claim 2 is characterized in that, the distance of adjacent two little fins is 0.01mm-0.5mm, and the height of little fin is 0.03mm-1.5mm.
4. according to claim 2 or the 3 described radiators that are used for LED and high-power radiating element, it is characterized in that the size of said little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall.
5. the radiator that is used for LED and high-power radiating element according to claim 4 is characterized in that, the groove width of said based on capillary slot is 0.01mm-0.4mm, and groove depth is 0.03mm-0.7mm.
6. the radiator that is used for LED and high-power radiating element according to claim 1 is characterized in that, said thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
7. the radiator that is used for LED and high-power radiating element according to claim 6 is characterized in that, said heat dissipation metal parts are outer fin, and said outer fin is equipped with by aluminium or copper.
8. the radiator that is used for LED and high-power radiating element according to claim 1 is characterized in that, said through hole sealed at both ends encapsulation forms the micro heat pipe that works alone.
9. the radiator that is used for LED and high-power radiating element according to claim 1 is characterized in that, said flat-plate heat pipe bends to " L " type; The bottom of said " L " type is an evaporation section, and the side is a condensation segment.
10. the radiator that is used for LED and high-power radiating element according to claim 1 is characterized in that, said flat-plate heat pipe bends to " U " type; The bottom of said " U " type is an evaporation section, and both sides are condensation segment.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100801780A CN101515572B (en) | 2009-03-24 | 2009-03-24 | Novel LED and a high-power radiator of a radiating element |
| PCT/CN2009/072362 WO2010060302A1 (en) | 2008-11-03 | 2009-06-19 | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system |
| EP09828602.4A EP2357440B1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
| JP2011533524A JP2012507680A (en) | 2008-11-03 | 2009-11-03 | MICRO HEAT PIPE ARRAY HAVING FINE TUBE ARRAY, ITS MANUFACTURING METHOD, AND HEAT EXCHANGE SYSTEM |
| PCT/CN2009/074775 WO2010060342A1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
| ES09828602.4T ES2578291T3 (en) | 2008-11-03 | 2009-11-03 | Heat duct with microtube matrix and procedure for manufacturing it and heat exchange system |
| HUE09828602A HUE029949T2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
| US13/127,444 US11022380B2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe |
| US17/246,597 US11852421B2 (en) | 2008-11-03 | 2021-05-01 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100801780A CN101515572B (en) | 2009-03-24 | 2009-03-24 | Novel LED and a high-power radiator of a radiating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101515572A CN101515572A (en) | 2009-08-26 |
| CN101515572B true CN101515572B (en) | 2012-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009100801780A Active CN101515572B (en) | 2008-11-03 | 2009-03-24 | Novel LED and a high-power radiator of a radiating element |
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| Country | Link |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5562769B2 (en) * | 2010-09-01 | 2014-07-30 | 三菱重工業株式会社 | Heat exchanger and vehicle air conditioner equipped with the same |
| CN102122648A (en) * | 2010-10-18 | 2011-07-13 | 安徽瑞煌光电科技有限公司 | Heat pipe radiator |
| CN103217036A (en) * | 2012-01-18 | 2013-07-24 | 张跃 | Heat fin |
| CN102692003A (en) * | 2012-05-14 | 2012-09-26 | 惠州市优科光电科技有限公司 | Liquid-circulation-based LED array cooling system |
| CN103615921A (en) * | 2013-11-04 | 2014-03-05 | 赵耀华 | Novel radiator |
| CN103807835A (en) * | 2014-03-03 | 2014-05-21 | 赵耀华 | Plate-shaped heat pipe insertion type heat dissipation device of large-power LED |
| CN104165341B (en) * | 2014-08-07 | 2018-06-08 | 鸿利智汇集团股份有限公司 | A kind of LED filament with transparent material micro heat pipe and preparation method thereof |
| CN105371214A (en) * | 2015-12-16 | 2016-03-02 | 广州共铸科技股份有限公司 | LED automobile head lamp |
| CN107548263B (en) * | 2016-06-29 | 2024-02-20 | 赵耀华 | High heat flux density cabinet heat dissipation cooling method and composite heat exchanger thereof |
| CN106168334A (en) * | 2016-08-24 | 2016-11-30 | 广州共铸科技股份有限公司 | LED light source component, car light radiating module and automobile LED headlight system |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN108534103A (en) * | 2018-06-28 | 2018-09-14 | 北京工业大学 | A kind of great power LED fin-super heat-conductive pipe integral heat dissipation device |
| CN108614627B (en) * | 2018-06-28 | 2024-05-28 | 北京工业大学 | Fin-superconducting heat pipe integrated heat radiator for CPU |
-
2009
- 2009-03-24 CN CN2009100801780A patent/CN101515572B/en active Active
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