CN108235653A - A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method - Google Patents
A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method Download PDFInfo
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- CN108235653A CN108235653A CN201711470218.3A CN201711470218A CN108235653A CN 108235653 A CN108235653 A CN 108235653A CN 201711470218 A CN201711470218 A CN 201711470218A CN 108235653 A CN108235653 A CN 108235653A
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- cooling plate
- aluminum heat
- liquid cooling
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- 238000001816 cooling Methods 0.000 title claims abstract description 134
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 106
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000007788 liquid Substances 0.000 claims abstract description 120
- 239000003507 refrigerant Substances 0.000 claims abstract description 25
- 208000015943 Coeliac disease Diseases 0.000 claims abstract description 16
- 230000008878 coupling Effects 0.000 claims description 20
- 238000010168 coupling process Methods 0.000 claims description 20
- 238000005859 coupling reaction Methods 0.000 claims description 20
- 238000009434 installation Methods 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000033228 biological regulation Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000000926 separation method Methods 0.000 abstract description 7
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of liquid-cooling type flat aluminum heat-pipe radiators, including liquid cooling plate and tablet aluminothermy pipe, liquid cooling plate includes the accommodating space that liquid cooling plate ontology, cover, liquid cooling plate ontology and cover surround, several separation fins are equipped in accommodating space, liquid cooling plate ontology offers inlet and liquid outlet, between inlet and liquid outlet several sprues have been separated to form by separating fin, the S-type series arrangement of several sprues, filled with refrigerant in accommodating space, jack is offered in the planar side of liquid cooling plate ontology；The liquid-cooling type flat aluminum heat-pipe radiator of the application, realizes the accurate heat dissipation to heat-generating electronic elements, increases substantially radiating efficiency；Compared with direct water-cooling radiating mode, this radiator is radiated using indirect water-cooling, and liquid cooling plate and tablet aluminothermy pipe are sealed respectively, and sealing effect is good, and refrigerant is not easy to reveal, and stability is good；Compared with adding the radiator structure of heat-exchanger rig using copper water heat pipe, using light flat aluminum heat pipe.
Description
Technical field
The present invention relates to electronic product radiating field, more particularly to a kind of liquid-cooling type flat aluminum heat-pipe radiator and its system
Make method.
Background technology
With the development of manufacturing technology, semiconductor integration densities are higher and higher, and the performance of chip is also increasingly stronger, and performance improves
While the thing followed be electronic equipment heat dissipation problem.Traditional air-cooled radiator can not meet current high density heat
The radiating requirements of streaming server.
Some electronic equipments start in a manner that direct water-cooling radiates, and direct water-cooling heat dissipation is exactly by pipeline that liquid is cold
Refrigerant is passed directly to need the position of electronic component radiated by outside, and heat exchange, band are directly carried out with electronic component
The mode of the heat of electronic component is walked, although its advantage is clearly, i.e., heat dissipation performance greatly improves, its shortcoming is also same
Sample is apparent, easily reveals, difficult in maintenance, easily corrodes, there is security risks.
Also there is the radiating mode to radiate using indirect water-cooling, the heat dissipation of prior art indirect water-cooling is mainly added using copper water heat pipe
The radiator structure of heat-exchanger rig, copper water heat pipe absorb heat from electronic component, and carrying out heat exchange with heat-exchanger rig radiates
Mode, but copper water heat pipe is either still all smaller with the contact area of electronic component with heat-exchanger rig, while it is made
Technics comparing complexity is made, weight ratio is heavier, has certain pressure effect to mainboard, may damage mainboard.
Invention content
For the technical problems in the prior art, an object of the present invention is：A kind of liquid-cooling type flat aluminum is provided
Heat-pipe radiator, leakproofness is preferable, is not easy to reveal, and easily safeguards, reliability is high.
For the technical problems in the prior art, the second object of the present invention is to：A kind of liquid-cooling type flat aluminum is provided
The manufacturing method of heat-pipe radiator, it is preferable to produce leakproofness, is not easy to reveal, and easily safeguards, the high tablet of reliability
Aluminothermy tube radiator.
In order to achieve the above object, the present invention adopts the following technical scheme that：
A kind of liquid-cooling type flat aluminum heat-pipe radiator, including liquid cooling plate and tablet aluminothermy pipe,
Liquid cooling plate includes the accommodating space that liquid cooling plate ontology, cover, liquid cooling plate ontology and cover surround, and is set in accommodating space
There are several to separate fin, liquid cooling plate ontology offers inlet and liquid outlet, by separating wing between inlet and liquid outlet
Piece has been separated to form several sprues, the S-type series arrangement of several sprues, filled with refrigerant, liquid cooling plate in accommodating space
Jack is offered in the planar side of ontology；
Flat aluminum heat pipe includes flat flat aluminum heat pipe body, and flat aluminum heat pipe body is internally provided with several mutually
Independent microchannel, filled with refrigerant in microchannel；
Flat aluminum heat pipe includes heat absorbing end and release end of heat, and the release end of heat of flat aluminum heat pipe is inserted by jack in liquid cooling plate ontology
Portion, and a distance in the accommodating space of liquid cooling plate is stretched into, the release end of heat stretched into the accommodating space of liquid cooling plate is connected to several
A separation fin, heat absorbing end are equipped with electronic component installation position.
Further, several shunting fins arranged in parallel, adjacent shunting fin etc. are respectively equipped in each sprue
Spacing is arranged, and runner is formed between adjacent shunting fin.
Further, several mutually independent microchannels equidistantly arrange in the width direction of flat aluminum heat pipe body.
Further, the length direction of several mutually independent microchannels is along heat absorbing end to release end of heat.
Further, flat aluminum heat pipe body and several microchannels inside it are structure as a whole.
Further, several separate fin and several shunting fins may be contained within liquid cooling plate ontology, if liquid cooling plate ontology,
Dry separation fin and several shunting fins are structure as a whole.
Further, several separate fin and several shunting fins may be contained within cover, cover, several separation fins
And several shunting fins are structure as a whole.
Further, inlet and liquid outlet are connected with quick coupling or are connected with the hose of quick coupling.
Further, the material of liquid cooling plate ontology and fin is copper or aluminium.
A kind of manufacturing method of liquid-cooling type flat aluminum heat-pipe radiator, includes the following steps,
(1) Step 1: the manufacture of flat aluminum heat pipe：The inside that both ends open is shaped to by squeezing aluminium ingot carries microchannel
Flat aluminum heat pipe, one end open is closed, injects liquid refrigerants, by other end closure of openings, then passes through bender, will
The flat aluminum heat pipe of plane is bent into the flat aluminum heat pipe of regulation shape, corresponds to electronic component installation position in flat aluminum heat pipe later
Open up screw hole or through-hole；
(2) Step 2: the manufacture of liquid cooling plate:Liquid cooling plate ontology, accommodating space are processed by Milling Process on aluminium ingot,
Cover is processed, several fins are processed on liquid cooling plate ontology or cover by Milling Process, then pass through agitating friction weldering
Cover and liquid cooling plate ontology are welded together；
(3) Step 3: the welding of liquid cooling plate and flat aluminum heat pipe：Liquid cooling plate and flat aluminum heat pipe are subjected to Nickel Plating Treatment,
Certain thickness low temperature tin cream is smeared in the jack of liquid cooling plate, which is 130 DEG C~180 DEG C, then by flat aluminum
The release end of heat of heat pipe is inserted into the jack of liquid cooling plate, and liquid cooling plate is fixed with flat aluminum heat pipe by special fixture, is put into reflux
In soldering equipment, after cooling, fixture is removed；
(4) Step 4: quick coupling connects：Using glue special, by quick coupling or hose with quick coupling
At the inlet and liquid outlet on liquid cooling plate.Generally speaking,
The invention has the advantages that：
(1) the liquid-cooling type flat aluminum heat-pipe radiator of the application, realizes the accurate heat dissipation to heat-generating electronic elements, substantially
Degree improves radiating efficiency；
(2) compared with direct water-cooling radiating mode, this radiator is radiated using indirect water-cooling, liquid cooling plate and tablet aluminothermy pipe
It is sealed respectively, sealing effect is good, and refrigerant is not easy to reveal, and stability is good；
(3) compared with adding the radiator structure of heat-exchanger rig using copper water heat pipe, using light flat aluminum heat pipe, can subtract
The weight and volume of few radiator entirety；
(4) a kind of manufacturing method of liquid-cooling type flat aluminum heat-pipe radiator can process solid easily on flat aluminum heat pipe
Determine mounting hole, convenient for installation and maintenance, entire radiator manufacturing process is simple, at low cost.
Description of the drawings
Fig. 1 is a kind of structure diagram of liquid-cooling type flat aluminum heat-pipe radiator of the present invention.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is a kind of liquid-cooling type flat aluminum heat-pipe radiator decomposition texture schematic diagram of the present invention.
Fig. 4 is a kind of decomposition texture schematic diagram of another angle of liquid-cooling type flat aluminum heat-pipe radiator of the present invention.
Fig. 5 is a kind of cross-sectional structure schematic diagram of the flat aluminum heat pipe of liquid-cooling type flat aluminum heat-pipe radiator of the present invention.
Fig. 6 is the partial enlargement structural representation at A in Fig. 5.
Fig. 7 is a kind of structure diagram of the liquid cooling plate for removing cover of liquid-cooling type flat aluminum heat-pipe radiator of the present invention.
Wherein Fig. 7 a are the structure diagram for the liquid cooling plate for removing cover.
Fig. 7 b be Fig. 7 a in B to structure diagram.
Include in wherein Fig. 1 to Fig. 7：
1 --- quick coupling, 11 --- inlet quick coupling, 12 --- liquid outlet quick coupling；
2 --- liquid cooling plate, 21 --- cover, 22 --- liquid cooling plate ontology, 23 --- jack, 24 --- inlet,
25 --- --- --- sprue, 28 --- shunting fin, 29 --- runners of separation fin, 27 of liquid outlet, 26；
3 --- flat aluminum heat pipe, 31 --- flat aluminum heat pipe body, 32 --- microchannel, 33 --- heat absorbing end, 34 ---
Release end of heat, 35 --- electronic component installation position, 36 --- screw hole；
4 --- screw.
Specific embodiment
It is next below that the present invention will be further described in detail.
A kind of liquid-cooling type flat aluminum heat-pipe radiator, including liquid cooling plate 2 and tablet aluminothermy pipe 3,
Liquid cooling plate 2 includes the accommodating space that liquid cooling plate ontology 22, cover 21, liquid cooling plate ontology 22 and cover 21 surround, and holds
Several separation fins 26 are equipped in emptying, liquid cooling plate ontology 22 offers inlet 24 and liquid outlet 25.24 He of inlet
Several sprues 27 are separated to form by separating fin 26 between liquid outlet 25, the S-type series connection row of several sprues 27
Cloth.Increase heat exchange area is played, strengthens the effect of heat exchange.Refrigerant is flowed into after accommodating space by inlet 24 along S types sprue 27
Flowing is finally flowed out by liquid outlet 25, and refrigerant residence time in liquid cooling plate 2 is longer, and heat exchange is abundant.Filled with cold in accommodating space
Matchmaker offers jack 23 in the planar side of liquid cooling plate ontology 22.Cover 21 is easily deformed under the action of air pressure inside, 5
The width for separating fin 26 is wide compared with other fins, plays a supporting role.Water conservancy diversion effect simultaneously, support is played for cover 21
Effect.Several shunting fins 28 arranged in parallel are respectively equipped in each sprue 27, adjacent shunting fin 28 is equidistant
Arrangement, adjacent formation runner 29 between shunting fin 28.Several separate fin 26 and several shunting fins 28 are respectively provided with
In liquid cooling plate ontology 22, liquid cooling plate ontology 22, several separate fin 26 and several shunting fins 28 are structure as a whole.
Inlet 24 and liquid outlet 25 are connected with quick coupling 1 or are connected with the hose of quick coupling 1.Wherein inlet 24 connect into
The outspoken quick coupling 11 of liquid, liquid outlet 25 connect liquid outlet quick coupling 12.The material of cover 21, liquid cooling plate ontology 22 and fin is
Copper or aluminium.There are one buffering areas for 27 end of each sprue inside liquid cooling plate 2, which is preferably used with fillet
Rectangular area, which can efficiently reduce liquid refrigerants and form turbulent flow so that refrigerant is under equal flow, in liquid cooling plate
It is less compared to the other structures pressure loss in 2 runner during flowing.The position of inlet 24 and liquid outlet 25 is in liquid cooling plate 2
The centre position of thickness direction, while the intermediate position of buffering area is in, it can ensure that refrigerant enters the mainstream of liquid cooling plate 2 in this way
State during road 27 keeps roughly the same.For joint sealing on liquid cooling plate 2, which may be used thread seal and glue sealing
Cooperate, sealing ring can also be used to seal.
Flat aluminum heat pipe 3 includes flat flat aluminum heat pipe body 31, and flat aluminum heat pipe body 31 is internally provided with several
A mutually independent microchannel 32, microchannel 32 are interior filled with refrigerant.Several mutually independent microchannels 32 are in flat aluminum heat pipe
It is equidistantly arranged in the width direction of ontology 31.The length direction of several mutually independent microchannels 32 is arrives along heat absorbing end 33
Release end of heat 34.Flat aluminum heat pipe body 31 and several microchannels 32 inside it are structure as a whole.Flat aluminum heat pipe 3 wraps
Heat absorbing end 33 and release end of heat 34 are included, the release end of heat 34 of flat aluminum heat pipe 3 is inserted by jack 23 inside liquid cooling plate ontology 22, and stretch into
A distance in the accommodating space of liquid cooling plate 2, the release end of heat 34 stretched into the accommodating space of liquid cooling plate 2 are connected to 5 separation wings
Piece 26.The intermediate position of liquid cooling plate 2 offers jack 23, which runs through liquid cooling plate 2.Flat aluminum heat pipe 3 can pass through weldering
It connects and is fixed in jack 23.
Heat absorbing end 33 is equipped with electronic component installation position 35.Electronic component installation position 35 offer for fix electronic component and
The screw hole 36 of flat aluminum heat pipe 3, screw hole 36 are fixed by coordinating with screw 4.Flat aluminum heat pipe 3 is in a thickness direction very
It is thin, the thickness of the liquid cooling plate being attached thereto 2 can be caused also accordingly to reduce.In addition, the thickness of flat aluminum heat pipe 3 can be according to not
It with selection different-thickness is needed, can need to select than relatively thin according to volume, be needed to select ratio according to heat exchange property and intensity
Thicker.In addition, 3 surface of flat aluminum heat pipe can carry out appearance processing, while play the role of corrosion-resistant.In flat aluminum heat pipe 3
Portion possesses multiple parallel 32 structures of microchannel, and each microchannel 32 is identical, and equidistant array is in the direction of the width.Using the structure
It is equivalent to while there are multiple heat pipes working, strengthen heat-conducting effect.In addition, 3 inside of flat aluminum heat pipe is near vacuum state.
3 inside of flat aluminum heat pipe is filled with the refrigerant that can be undergone phase transition, and under vacuum, outside heat can be easily when changing for the refrigerant
Undergo phase transition, i.e., when heated, steam state can be changed into from liquid, to the cold when, can be liquid from vapor state.It is in addition, flat
The principle that plate aluminothermy pipe 3 works is that the heat absorbing end 33 of flat aluminum heat pipe 3 absorbs heat, and heat is transmitted to heat release by heat absorbing end 33
End 34, release end of heat 34 discharge the heat that heat absorbing end 33 absorbs.
The specific works of this radiator are crossed referred to as：
Along with the work of heater element, heat is transmitted to flat aluminum heat pipe 3 by the heat absorbing end 33 of flat aluminum heat pipe 3
Release end of heat 34 is then passed to liquid cooling plate 2, and on the other hand, refrigerant is entered by inlet 24 in liquid cooling plate 2, passes through liquid cooling plate 2
29 structure of sprue 27 and runner, transfer heat in refrigerant, and as refrigerant circulation goes out except liquid cooling plate 2.
The refrigerant exactly circulated is not direct to be contacted with heater element, and heat is transmitted in centre by the preferable flat aluminum heat pipe 3 of leakproofness
Amount, reduce secondary refrigerant leakage to electronic component hurtful possibility.
A kind of manufacturing method of liquid-cooling type flat aluminum heat-pipe radiator, includes the following steps,
(1) Step 1: the manufacture of flat aluminum heat pipe 3：The inside of both ends open is shaped to micro- logical by squeezing aluminium ingot
The flat aluminum heat pipe 3 in road 32, one end open is closed, and is injected liquid refrigerants, by other end closure of openings, is then passed through bending
The flat aluminum heat pipe 3 of plane is bent into the flat aluminum heat pipe 3 of regulation shape by machine, corresponds to electronics member in flat aluminum heat pipe 3 later
Part installation position 35 opens up screw hole 36 or through-hole；
(2) Step 2: the manufacture of liquid cooling plate 2:Liquid cooling plate ontology 22, accommodating sky are processed by Milling Process on aluminium ingot
Between, cover 21 is processed, several fins are processed on liquid cooling plate ontology 22 or cover 21 by Milling Process, then by stirring
Friction welding (FW) is mixed to weld together cover 21 and liquid cooling plate ontology 22；
(3) Step 3: the welding of liquid cooling plate 2 and flat aluminum heat pipe 3：Liquid cooling plate 2 and flat aluminum heat pipe 3 are carried out at nickel plating
Reason, smears certain thickness low temperature tin cream in the jack 23 of liquid cooling plate 2, which is 130 DEG C~180 DEG C, then will
The release end of heat 34 of flat aluminum heat pipe 3 is inserted into the jack 23 of liquid cooling plate 2, and liquid cooling plate 2 is consolidated with flat aluminum heat pipe 3 by special fixture
It sets, is put into solder reflow device, after cooling, remove fixture；
(4) Step 4: quick coupling 1 connects：Using glue special, by quick coupling 1 or with the soft of quick coupling 1
Pipe is fixed at the inlet 24 on liquid cooling plate 2 and liquid outlet 25.Generally speaking,
The invention has the advantages that：
(1) 3 radiator of liquid-cooling type flat aluminum heat pipe of the application, realizes the accurate heat dissipation to heat-generating electronic elements, greatly
Amplitude improves radiating efficiency；
(2) compared with direct water-cooling radiating mode, this radiator is radiated using indirect water-cooling, liquid cooling plate 2 and tablet aluminothermy
Pipe 3 is sealed respectively, and sealing effect is good, and refrigerant is not easy to reveal, and stability is good；
It (3), can using light flat aluminum heat pipe 3 compared with adding the radiator structure of heat-exchanger rig using copper water heat pipe
Reduce the weight and volume of radiator entirety；
(4) a kind of manufacturing method of 3 radiator of liquid-cooling type flat aluminum heat pipe, can be processed easily on flat aluminum heat pipe 3
Fixed installation holes, convenient for installation and maintenance, entire radiator manufacturing process is simple, at low cost.
Embodiment 2,
The primary structure of the present embodiment is identical with embodiment, and something in common is not repeating herein, the difference is that：
Several separate fins and several shunting fins may be contained within cover, if cover, several separate fins and
Dry shunting fin is structure as a whole.Milling Process goes out to separate fin simultaneously in cover when (not shown) processes cover
With shunting fin, sprue and runner are formed.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (10)
1. a kind of liquid-cooling type flat aluminum heat-pipe radiator, it is characterised in that：Including liquid cooling plate and tablet aluminothermy pipe,
Liquid cooling plate includes the accommodating space that liquid cooling plate ontology, cover, liquid cooling plate ontology and cover surround, if being equipped in accommodating space
Dry separates fin, and liquid cooling plate ontology offers inlet and liquid outlet, by separating fin point between inlet and liquid outlet
Every being formed with several sprues, the S-type series arrangement of several sprues, filled with refrigerant, liquid cooling plate ontology in accommodating space
Planar side on offer jack；
Flat aluminum heat pipe includes flat flat aluminum heat pipe body, and flat aluminum heat pipe body is internally provided with several independently of each other
Microchannel, filled with refrigerant in microchannel；
Flat aluminum heat pipe includes heat absorbing end and release end of heat, and the release end of heat of flat aluminum heat pipe is inserted into liquid cooling plate body interior by jack,
And a distance in the accommodating space of liquid cooling plate is stretched into, the release end of heat stretched into the accommodating space of liquid cooling plate is connected to several points
Every fin, heat absorbing end is equipped with electronic component installation position.
2. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：In each sprue
Several shunting fins arranged in parallel are respectively equipped with, adjacent shunting fin is equidistantly arranged, and is formed between adjacent shunting fin
Runner.
3. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：Several are independently of each other
Microchannel equidistantly arranged in the width direction of flat aluminum heat pipe body.
4. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 3, it is characterised in that：Several are independently of each other
The length direction of microchannel be along heat absorbing end to release end of heat.
5. according to a kind of liquid-cooling type flat aluminum heat-pipe radiator described in claim 4, it is characterised in that：Flat aluminum heat pipe body
It is structure as a whole with set on its several internal microchannel.
6. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：Several separate fin
Liquid cooling plate ontology is may be contained with several shunting fins, liquid cooling plate ontology, several separate fin and several shunt wings
Piece is structure as a whole.
7. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：Several separate fin
Cover is may be contained with several shunting fins, cover, several separate fin and several shunting fins are integrated knot
Structure.
8. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：Inlet and liquid outlet
It is connected with quick coupling or is connected with the hose of quick coupling.
9. a kind of liquid-cooling type flat aluminum heat-pipe radiator described in accordance with the claim 1, it is characterised in that：Liquid cooling plate ontology and wing
The material of piece is copper or aluminium.
10. a kind of manufacturing method of liquid-cooling type flat aluminum heat-pipe radiator as in one of claimed in any of claims 1 to 9,
It is characterized in that：Include the following steps,
(1) Step 1: the manufacture of flat aluminum heat pipe：The inside of both ends open putting down with microchannel is shaped to by squeezing aluminium ingot
Plate aluminothermy pipe, one end open is closed, and injects liquid refrigerants, by other end closure of openings, then by bender, by plane
Flat aluminum heat pipe be bent into the flat aluminum heat pipe of regulation shape, correspond to electronic component installation position in flat aluminum heat pipe later and open up
Screw hole or through-hole；
(2) Step 2: the manufacture of liquid cooling plate:Liquid cooling plate ontology, accommodating space are processed by Milling Process on aluminium ingot, processed
Cover processes several fins by Milling Process on liquid cooling plate ontology or cover, then will be covered by agitating friction weldering
Body and liquid cooling plate ontology weld together；
(3) Step 3: the welding of liquid cooling plate and flat aluminum heat pipe：Liquid cooling plate and flat aluminum heat pipe are subjected to Nickel Plating Treatment, in liquid
Certain thickness low temperature tin cream is smeared in the jack of cold plate, which is 130 DEG C~180 DEG C, then by flat aluminum heat pipe
Release end of heat be inserted into liquid cooling plate jack in, liquid cooling plate is fixed with flat aluminum heat pipe by special fixture, is put into Reflow Soldering and is set
In standby, after cooling, fixture is removed；
(4) Step 4: quick coupling connects：Using glue special, quick coupling or the hose with quick coupling are fixed
At inlet and liquid outlet on to liquid cooling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711470218.3A CN108235653A (en) | 2017-12-29 | 2017-12-29 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711470218.3A CN108235653A (en) | 2017-12-29 | 2017-12-29 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
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| CN108235653A true CN108235653A (en) | 2018-06-29 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109765976A (en) * | 2018-12-17 | 2019-05-17 | 北京比特大陆科技有限公司 | Radiator and calculating equipment with it |
| CN110534841A (en) * | 2019-08-22 | 2019-12-03 | 华南理工大学 | A kind of the phase transformation soaking plate structure and its manufacturing method of integrated water-cooling system |
| CN110548947A (en) * | 2019-08-21 | 2019-12-10 | 湖北三江航天险峰电子信息有限公司 | Welding method of cold plate assembly |
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| CN112207418A (en) * | 2020-09-25 | 2021-01-12 | 西安交通大学 | Micro-channel aluminum heat pipe pre-extrusion narrow-weld-joint spherical friction stir welding perfusion packaging process |
| CN112207418B (en) * | 2020-09-25 | 2021-12-28 | 西安交通大学 | Micro-channel aluminum heat pipe pre-extrusion narrow-weld-joint spherical friction stir welding perfusion packaging process |
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