CN104882424B - Liquid cooling heat radiator and corresponding IGBT module - Google Patents
Liquid cooling heat radiator and corresponding IGBT module Download PDFInfo
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- CN104882424B CN104882424B CN201410073029.2A CN201410073029A CN104882424B CN 104882424 B CN104882424 B CN 104882424B CN 201410073029 A CN201410073029 A CN 201410073029A CN 104882424 B CN104882424 B CN 104882424B
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- spoiler
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- cooling heat
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Abstract
The invention discloses a kind of liquid cooling heat radiator and corresponding IGBT modules, wherein liquid cooling heat radiator include ontology, the flow channel for liquids that is set on the ontology, one end of the flow channel for liquids is provided with liquid inlet, the other end of the flow channel for liquids is provided with liquid outlet, the flow direction of liquid is provided with several spoilers in the flow channel for liquids, the spacing in the flow channel for liquids of the fluid inlet end between spoiler is more than the spacing between spoiler in the flow channel for liquids at the liquid outlet end.The liquid cooling heat radiator of the present invention enhances the disturbance of coolant liquid by the way that spoiler is arranged in flow channel for liquids, to change the convection transfer rate at different location, its uniform temperature is improved while the heat dissipation effect that ensure that liquid cooling heat radiator, extends the service life of the device using the liquid cooling heat radiator.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of liquid cooling heat radiator, and apply the liquid-cooling heat radiation
The IGBT module of device.
Background technology
Igbt (IGBT), abbreviation IGBT module are a kind of more satisfactory wholly-controled devices, have
The advantages that working frequency is high, power capacity is big and driving is simple.It has been widely used in consumer electronics, Medical Devices, intelligence
The fields such as power grid and rail traffic, and play a significant role in energy saving, raising efficiency etc..IGBT module by igbt chip,
To an inside modules, formation one is fully functional, has certain versatility for driving circuit, control circuit and protection circuit package
Electronic power integrated module.It, will be towards volume with the increase of IGBT module application range and the raising of application requirement
Smaller, integrated level higher, performance and the stronger direction of reliability are developed.
With the continuous development of IGBT module, if single for the angle of power electronic technique, integrated level also has very big
Room for promotion.However the continuous improvement of integrated level necessarily makes calorific value improve, when the temperature of IGBT module is more than its work
After the range of permission, it is likely that cause component failure even to damage, cause serious financial consequences.Therefore, IGBT module heat dissipation is asked
Topic becomes the biggest obstacle for restricting electronic power integrated module towards the development of more high integration.
In numerous power electronic equipment radiating modes, wind-cooling heat dissipating mode is due to simple in structure, at low cost and can
By property as the main heat sink mode of current IGBT module the advantages that high.However, increasingly with IGBT module integration degree
Height, power is increasing, since air-cooled forced-convection heat transfer coefficient is relatively low to further increase the heat dissipation of IGBT module
Performance.Liquid-cooling heat radiation with high convection transfer rate due to making its cooling efficiency obtain further raising.
Liquid-cooling heat radiation is realized by liquid cooling heat radiator, and above-mentioned liquid cooling heat radiator generally includes liquid cooling pipeline, liquid cooling pipe
There is the coolant liquid of flowing in road.Coolant liquid can take away the heat in IGBT module, to realize the heat dissipation of IGBT module.Mesh
Preceding liquid cooling pipeline is normally s-shaped, with entrance and exit, above-mentioned inlet due to coolant temperature it is relatively low to than
Preferable heat dissipation effect, but its temperature gradually rises with the flowing of coolant liquid, exit coolant liquid due to its temperature compared with
Height declines to heat dissipation effect.It is such then to result in IGBT module internal temperature gradient larger, it is possible to not due to thermal stress
Damage that is same and causing IGBT module.In addition, in S-shaped liquid cooling pipeline corner due to suddenly change flow flow direction,
It will produce local turbulent section around the corner, the flow velocity of coolant liquid can obviously increase, and due to flow velocity difference, convection transfer rate is not yet
Together, and then cause heat dissipation effect different.In this way, using the temperature one of the IGBT module with S-shaped liquid cooling pipeline liquid cooling heat radiator
Cause property is poor, and uniform temperature is bad.
Invention content
In view of this, the present invention provides the IGBT modules of a kind of liquid cooling heat radiator and the application liquid cooling heat radiator.
One of to achieve the goals above, a kind of liquid cooling heat radiator of the invention comprising ontology is set to the ontology
On flow channel for liquids, one end of the flow channel for liquids is provided with liquid inlet, and the other end of the flow channel for liquids is provided with liquid
It exports, the flow direction of liquid is provided with several spoilers, the flow channel for liquids of the fluid inlet end in the flow channel for liquids
Spacing between middle spoiler is more than the spacing in the flow channel for liquids at the liquid outlet end between spoiler.
As a further improvement on the present invention, the S-shaped arrangement of the flow channel for liquids, if the flow channel for liquids of the S-shaped includes
The curved channel of the dry line flowing channel being mutually parallel and connection several line flowing channels, the adjacent line flowing channel it
Between, it is smaller than spoiler in line flowing channel adjacent thereto between spoiler in the line flowing channel of the liquid outlet
Between spacing.
As a further improvement on the present invention, the shape of the spoiler is cylinder.
As a further improvement on the present invention, the spoiler is made of one piece with the flow channel for liquids.
As a further improvement on the present invention, the spoiler and the material of flow channel for liquids are aluminium.
As a further improvement on the present invention, several spoilers are dislocatedly distributed, any spoiler and its both sides
Spoiler adjacent thereto be located at three vertex of triangle.
In order to achieve the above-mentioned another object of the invention, a kind of IGBT module of the invention comprising liquid-cooling heat radiation as described above
Device.
Compared with prior art, the beneficial effects of the invention are as follows：The liquid cooling heat radiator of the present invention passes through in flow channel for liquids
Spoiler is set to enhance the disturbance of coolant liquid, to change the convection transfer rate at different location, ensure that liquid cooling is scattered
Its uniform temperature is improved while the heat dissipation effect of hot device, extends the service life of the device using the liquid cooling heat radiator.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments described in invention, for those of ordinary skill in the art, without creative efforts,
Other drawings may also be obtained based on these drawings.
Fig. 1 is the planar structure schematic diagram of one specific implementation mode of liquid cooling heat radiator of the present invention.
The correspondence of dependency structure and its label is as follows in figure：
Ontology -10；Flow channel for liquids -20, liquid inlet -201, liquid outlet -202, line flowing channel -203, curved channel -
204；Spoiler -30.
Specific implementation mode
The present invention discloses a kind of liquid cooling heat radiator comprising ontology, the flow channel for liquids being set on the ontology, the liquid
One end of body runner is provided with liquid inlet, and the other end of the flow channel for liquids is provided with liquid outlet, in the flow channel for liquids
The flow direction of liquid is provided with several spoilers, the spacing in the flow channel for liquids of the fluid inlet end between spoiler is big
Spacing in the flow channel for liquids at the liquid outlet end between spoiler.
Preferably, the flow channel for liquids of the S-shaped arrangement of the flow channel for liquids, the S-shaped includes several straight lines being mutually parallel
The curved channel of runner and connection several line flowing channels, between the adjacent line flowing channel, close to the liquid discharge
The spacing being smaller than in line flowing channel adjacent thereto between spoiler in the line flowing channel of mouth between spoiler.
Preferably, the shape of the spoiler is cylinder.
Preferably, the spoiler is made of one piece with the flow channel for liquids.
Preferably, the spoiler and the material of flow channel for liquids are aluminium.
Preferably, several spoilers are dislocatedly distributed, the flow-disturbing adjacent thereto of any spoiler and its both sides
Part is located at three vertex of triangle.
Invention additionally discloses a kind of IGBT modules comprising liquid cooling heat radiator as described above.
In order to make those skilled in the art more fully understand the technical solution in the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
The every other embodiment that technical staff is obtained without making creative work, should all belong to protection of the present invention
Range.
As shown in Figure 1, the liquid cooling heat radiator 100 of the present invention includes ontology 10, the flow channel for liquids 20 being set on ontology 10.
Wherein, aforesaid liquid runner 20 is the flow duct of coolant liquid, and one end of the flow channel for liquids 20 offers liquid inlet 201, separately
One end offers liquid outlet 202.Coolant liquid enters flow channel for liquids 20 from aforesaid liquid outlet 202, and is flowed along flow channel for liquids 20
It is dynamic, it is finally flowed out from liquid outlet 202, in flow process, heat is taken away in flow channel for liquids 20 for coolant liquid, to reach drop
The purpose of low temperature.
In order to balance the difference of heat dissipation effect at aforesaid liquid entrance 201 and liquid outlet 202, in aforesaid liquid runner 20
Along the flow direction of coolant liquid, it is provided with several spoilers 30.The radiating surface that spoiler not only increases liquid cooling heat radiator is set
Product, meanwhile, increase the disturbance of coolant liquid so that convection transfer rate increases, and then improves the effect of heat dissipation.Further
Ground, the spacing in the flow channel for liquids 20 at 201 end of aforesaid liquid entrance between spoiler 30 are more than the liquid at 202 end of liquid outlet
Spacing in runner 20 between spoiler 30.So set, the flow velocity of the coolant liquid at 201 end of liquid inlet is less than liquid outlet
The heat dissipation effect of the flow velocity of the coolant liquid at 202 ends, i.e. 202 end of liquid outlet is enhanced, to solve liquid cooling heat radiator
Liquid inlet and liquid outlet heat dissipation effect the problem of differing greatly.
As an implementation, the flow channel for liquids 20 of 20 S-shaped arrangement of aforesaid liquid runner, the S-shaped includes several phases
Mutual parallel line flowing channel 203 and the curved channel 204 for being connected to above-mentioned several line flowing channels 203.Since coolant liquid is being bent
Flow velocity increases suddenly at runner 204, and convection transfer rate accordingly increases at this, and the flow channel for liquids 20 of such S-shaped is in curved channel
Good heat dissipation effect at 204 at heat dissipation effect relative rectilinear runner 203, so as to cause 100 uniform temperature of S-shaped liquid cooling heat radiator compared with
Difference.Therefore, several spoilers 30 are set in above-mentioned line flowing channel 203, and between adjacent line flowing channel 203, close to liquid
Spacing in the line flowing channel 203 of outlet 202 between spoiler 30 is less than spoiler 30 in line flowing channel 203 adjacent thereto
Between spacing.That is, along the flow direction of coolant liquid, the spoiler 30 in the line flowing channel 203 at liquid outlet 202
Quantity be more than, the quantity far from the spoiler 30 in line flowing channel 203 at liquid outlet 202.So set, straight line can be improved
The quantity of coolant liquid in runner 203, increases its heat dissipation effect, and the line flowing channel and bending to solve S type liquid cooling heat radiators flow
The unbalanced problem of road heat dissipation effect.
Preferably, above-mentioned spoiler 30 is cylinder, and it is made of one piece with flow channel for liquids 20.In this way, being convenient for liquid
The production and processing of cold heat sink.Pair in order to enhance the flow-disturbing effect of spoiler 30, above-mentioned several spoilers 30 are dislocatedly distributed, i.e.,
For any spoiler 30, the spoiler 30 spoiler 30 adjacent with its both sides is located at the three of triangle on position relationship
A vertex.In this way, coolant liquid collides with spoiler 30, after changing flow direction, can continue to send out with next spoiler 30
Raw collision, to make each spoiler 30 that can play the effect of flow-disturbing.
Above-mentioned spoiler 30 and the material of flow channel for liquids 20 can be aluminium, to which liquid cooling heat radiator is functional, and more
It is light.
Also a kind of IGBT module of the present invention, the IGBT module include substrate and liquid cooling heat radiator as described above,
The liquid cooling heat radiator is in contact by heat-conducting silicone grease with the substrate of IGBT module.
In conclusion the liquid cooling heat radiator of the present invention enhances disturbing for coolant liquid by the way that spoiler is arranged in flow channel for liquids
It is dynamic, to change the convection transfer rate at different location, improved while the heat dissipation effect that ensure that liquid cooling heat radiator
Its uniform temperature extends the service life of the device using the liquid cooling heat radiator.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the embodiments can also be through suitably closing, and forming those skilled in the art can
With the other embodiment of understanding.
Claims (5)
1. a kind of liquid cooling heat radiator comprising ontology, the flow channel for liquids being set on the ontology, one end of the flow channel for liquids
It is provided with liquid inlet, the other end of the flow channel for liquids is provided with liquid outlet, which is characterized in that edge in the flow channel for liquids
The flow direction of liquid is provided with several spoilers, and the spacing in the flow channel for liquids of the fluid inlet end between spoiler is more than
Spacing in the flow channel for liquids at the liquid outlet end between spoiler；The S-shaped arrangement of flow channel for liquids, the liquid flow of S-shaped
Road includes the curved channel of several line flowing channels being mutually parallel and connection several line flowing channels, is set in line flowing channel
Be equipped with the spoiler, between adjacent line flowing channel, between spoiler in the line flowing channel of the liquid outlet between
Away from less than the spacing between spoiler in line flowing channel adjacent thereto；
Spoiler is arranged one by one along the length direction of line flowing channel, and the arrangement that misplaces, and spoiler is adjacent with its front and rear sides to disturb
It flows three vertex that part is located at triangle on position relationship and changes flow direction in this way, coolant liquid collides with spoiler
Afterwards, can continue to collide with next spoiler, to make each spoiler that can play the effect of flow-disturbing.
2. liquid cooling heat radiator according to claim 1, which is characterized in that the shape of the spoiler is cylinder.
3. liquid cooling heat radiator according to claim 1, which is characterized in that the spoiler and the flow channel for liquids one at
Type forms.
4. liquid cooling heat radiator according to claim 3, which is characterized in that the spoiler and the material of flow channel for liquids are
Aluminium.
5. a kind of IGBT module, which is characterized in that the IGBT module includes liquid cooling heat radiator according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410073029.2A CN104882424B (en) | 2014-02-28 | 2014-02-28 | Liquid cooling heat radiator and corresponding IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410073029.2A CN104882424B (en) | 2014-02-28 | 2014-02-28 | Liquid cooling heat radiator and corresponding IGBT module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104882424A CN104882424A (en) | 2015-09-02 |
| CN104882424B true CN104882424B (en) | 2018-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410073029.2A Active CN104882424B (en) | 2014-02-28 | 2014-02-28 | Liquid cooling heat radiator and corresponding IGBT module |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281734A (en) * | 2018-03-23 | 2018-07-13 | 安徽汇展热交换系统股份有限公司 | New energy battery radiator |
| CN110634823A (en) * | 2019-09-08 | 2019-12-31 | 南京金龙新能源汽车研究院有限公司 | Segmented flow blocking type heat dissipation structure of motor controller and heat dissipation method thereof |
| CN111490448B (en) * | 2020-04-28 | 2023-09-22 | 华中科技大学 | Laser module |
| CN113056173B (en) * | 2021-03-15 | 2023-02-28 | Tcl华星光电技术有限公司 | Display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950822A (en) * | 2010-09-14 | 2011-01-19 | 联合汽车电子有限公司 | Controller and battery cold plate |
| CN202013880U (en) * | 2011-01-28 | 2011-10-19 | 艾默生网络能源有限公司 | Liquid-cooled radiator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005019905A (en) * | 2003-06-30 | 2005-01-20 | Matsushita Electric Ind Co Ltd | Cooler |
| CN201894034U (en) * | 2010-11-12 | 2011-07-06 | 奇鋐科技股份有限公司 | Improved runner structure of water-cooling device |
-
2014
- 2014-02-28 CN CN201410073029.2A patent/CN104882424B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950822A (en) * | 2010-09-14 | 2011-01-19 | 联合汽车电子有限公司 | Controller and battery cold plate |
| CN202013880U (en) * | 2011-01-28 | 2011-10-19 | 艾默生网络能源有限公司 | Liquid-cooled radiator |
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| Publication number | Publication date |
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| CN104882424A (en) | 2015-09-02 |
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Address after: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |
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