CN207719189U - A kind of CPU high fevers radiator - Google Patents

Abstract

The utility model is related to dissipation from electronic devices fields, espespecially a kind of CPU high fevers radiator, heat conducting pipe by heat transfer by the heat absorption of CPU onto itself, and it flows through on radiating fin, it is connected by heat-conducting plate between several radiating fins and forms guiding region, thermal property is passed using convection current, and fan heat is carried out out of guiding region, and temperature can be uniformly distributed by heat-conducting plate by each radiating fin surface, increase the area of heat dissipation, air-flow is guided by the first fan to radiate, cooling liquid can make radiating fin cool down in fluid line, accelerate the radiating efficiency to radiating fin.

Description

A CPU high-heat cooling device

technical field

The utility model relates to the field of heat dissipation of electronic devices, in particular to a high-heat heat dissipation device for a CPU.

Background technique

As the number of transistors in a semiconductor integrated circuit increases, the thermal field of the device increases. At present, the problem of heat generation and heat dissipation of computer CPU chips has become an obstacle in the development of computers. The radiator composed of simple aluminum fins and fan structure can no longer meet the current heat dissipation requirements. Heat pipe radiators are generally used by desktop computer CPUs to dissipate heat. device adopts.

At present, the basic problems of desktop computer CPU radiators are large size, heavy, low heat dissipation, and high price. These problems have seriously hindered the wide application of heat pipe radiators in desktop computers. The principle of heat transfer is not clear, and the processing technology and procedures are even more unreasonable, so that the efficiency is low and the cost is high.

In all heat transfer processes of the radiator, the thermal resistance of air convection heat transfer is the largest. Now the radiator blindly increases the size and number of heat dissipation fins, hoping to increase the heat dissipation by increasing the heat dissipation surface, which not only increases the heat dissipation of the radiator The volume also increases the manufacturing cost, but the heat dissipation has not been effectively improved. With the increase of the heat dissipation area, the resistance of the corresponding air flowing through the heat dissipation fins also increases, resulting in a decrease in the air flow rate, making the air flow through the heat dissipation fins The air temperature of the sheet increases, which affects the convective heat transfer effect of the air.

Contents of the invention

In order to solve the above problems, the utility model provides a high-heat cooling device for CPU, which has the function of high-efficiency heat dissipation, has a simple structure, solves the problem of temperature rise of the air flowing through the heat dissipation fins, and has low production cost and good heat dissipation effect.

In order to achieve the above object, the technical solution adopted by the utility model is: a CPU high-heat cooling device, including a heat-absorbing assembly and a heat-dissipating assembly, and the heat-absorbing device includes several cooling fins, a first fan, a cooling fin, And a heat pipe for carrying the heat dissipation fins and the CPU for heat conduction, the heat pipe is attached to the surface of the CPU, the heat dissipation fins surround the surface of the heat pipe, and the surface of the heat dissipation fin is provided with a fan corresponding to the first fan. The positioning holes, the cooling fins are arranged on the sides of several cooling fins and the first fan is fixed on the cooling fins through the positioning holes, wherein, a heat conducting plate is arranged between the several cooling fins, and through the heat conducting plate connected, the heat dissipation assembly includes a fluid pipeline, a water tank, a water pump and a second fan, the water tank is arranged in the host, the two ends of the fluid pipeline communicate with the water tank, and the second fan is arranged on one side of the water tank, The water pump is arranged in the water inlet of the fluid pipeline, and the fluid pipeline is vertically attached to the other side of the plurality of cooling fins.

Further, a cover is also included, the water tank is provided with an opening, the cover is provided on the surface of the opening, and the edge of the opening is provided with a waterproof coating.

Further, the thickness of the heat dissipation fins is smaller than the thickness of the heat conduction plate of the heat dissipation fins.

Further, a flow guide area is formed between several cooling fins, and the heat conduction plate is arranged in the flow guide area.

Further, it also includes a fixing plate and a base, the base is provided with a reserved hole corresponding to the fixing plate and is arranged under the CPU, the fixing frame is arranged at the lower end of the heat pipe, and the fixing clip is connected to the base through screws fixed.

Further, the heat dissipation fins are arranged side by side through the heat conduction plate.

Further, the second fan is provided with buckles, and the side of the water tank is provided with grooves corresponding to the buckles, and the second fan is fixed to the water tank through the buckles and the grooves.

Further, an LED light and a controller are provided on the side of the first fan, and the LED light is connected to the controller.

Further, a water temperature detector and a temperature display are also included, the water temperature detector is arranged in the fluid pipeline and connected with the temperature display, and the temperature display is arranged on the outer wall of the fluid pipeline.

The beneficial effect of the utility model is that: the utility model is provided with several cooling fins, and the cooling fins are connected by a heat conduction plate, and the cooling fins are arranged on the surface of the heat conduction pipe in an encircling manner, increasing the At the same time, the heat conduction plate is used to conduct heat evenly on the heat dissipation fins, which effectively improves the efficiency of heat dissipation. The two sides of the heat dissipation fins are respectively connected with the first fan and the fluid pipe, and the first fan further accelerates the heat dissipation. The heat dissipation efficiency of the heat dissipation fins is improved, the cooling liquid is stored in the fluid pipe, the heat of the heat pipe is dissipated through the cooling liquid in the fluid pipe, and the cooling liquid in the fluid pipe is dissipated by the second fan, and the cooling liquid is driven by the water pump It has been continuously flowing in the fluid pipe. Among them, the fluid pipe is vertically arranged on the surface of the heat dissipation fins, which increases the heat receiving area with the fluid pipe, thereby speeding up the heat dissipation of the heat pipe. Through the above effects, it solves the problem that the traditional radiator flows through The air temperature rise of the cooling fins has the advantages of simple structure, low manufacturing cost and good cooling effect.

Description of drawings

Fig. 1 is a structural diagram of the utility model.

Fig. 2 is a side view of the utility model.

Description of reference numerals: 1. cooling fins; 2. first fan; 3. heat sink; 4. heat pipe; 5. heat conducting plate; 6. fluid pipe; 7. water tank; 8. water pump; 9. second fan .

Detailed ways

Please refer to Fig. 1-2, the utility model relates to a heat sink for CPU heat dissipation, including a heat-absorbing assembly and a heat-dissipating assembly, the heat-absorbing device includes several cooling fins 1, a first fan 2 , the heat sink 3, and the heat pipe 4 for carrying the heat dissipation fin 1 and the CPU for heat conduction, the heat pipe 4 is attached to the surface of the CPU, and the heat dissipation fin 1 surrounds the surface of the heat pipe 4. The surface of the cooling fin 3 is provided with positioning holes corresponding to the first fan 2, and the cooling fin 3 is arranged on the sides of several cooling fins 1 and the first fan 2 is fixed on the cooling fin 3 through the positioning holes, wherein the A heat conduction plate 5 is arranged between several heat dissipation fins 1, and is connected through the heat conduction plate 5. The heat dissipation assembly includes a fluid pipeline 6, a water tank 7, a water pump 8 and a second fan 9. The water tank 7 is arranged on the main engine Inside, the two ends of the fluid pipeline 6 communicate with the water tank 7, the second fan 9 is arranged on one side of the water tank 7, the water pump 8 is arranged in the water inlet of the fluid pipeline 6, and the fluid pipeline 6 is vertically attached On the other side of several cooling fins 1 .

Further, it also includes a cover, the water tank 7 is provided with an opening, the cover is set on the surface of the opening, and the edge of the opening is provided with a waterproof coating, the water loss is reduced through the waterproof coating, and the Moisture cannot flow out of the opening causing damage to the device.

Further, the thickness of the heat dissipation fins 1 is smaller than the thickness of the heat conduction plate 5 of the heat dissipation fin 3, and increasing the thickness of the heat conduction plate 5 is used to accelerate the contact area between the heat dissipation fins 1, so that the heat dissipation efficiency is faster.

Further, a diversion area is formed between several heat dissipation fins 1, and the heat conduction plate 5 is arranged in the diversion area, and the air flow drives the heat on the surface of the heat dissipation fins 1 to transfer to the air through the diversion area to realize convection. heat effect.

Further, it also includes a fixing plate and a base, the base is provided with a reserved hole corresponding to the fixing plate and is arranged under the CPU, the fixing frame is arranged at the lower end of the heat pipe 4, and the fixing clip is connected with the The base is fixed, and the heat pipe 4 is firmly attached to the surface of the CPU through the fixing plate and the base, so that the CPU will not burn out due to unstable attachment.

Further, the heat dissipation fins 1 are arranged side by side through the heat conduction plate 5, which can evenly absorb the heat of the heat conduction pipe 4 and provide an ornamental effect.

Further, the second fan 9 is provided with a buckle, and the side of the water tank 7 is provided with a groove corresponding to the buckle, and the second fan 9 is fixed with the water tank 7 through the buckle and the groove. The connection between the fixed water tank 7 and the second fan 9 strengthens the connection effect between the second fan 9 and the water tank 7 .

Further, the side of the first fan 2 is provided with an LED lamp and a controller, the LED lamp is connected to the controller, the color of the LED lamp can be changed through the controller, and the switch of the LED lamp can be controlled, which has the function of viewing sex.

Further, it also includes a water temperature detector and a temperature display, the water temperature detector is arranged in the fluid pipeline 6 and connected with the temperature display, the temperature display is arranged on the outer wall of the fluid pipeline 6, and the water temperature can be monitored in real time through the temperature display Celsius, observe whether the water temperature is within the normal range.

Compared with the prior art, the utility model is provided with several heat dissipation fins 1, which are connected by a heat conduction plate 5, and the heat dissipation fins 1 are arranged on the surface of the heat conduction pipe 4 in an encircling manner. , the contact area with the heat pipe 4 is increased, and the heat conduction plate 5 is used to conduct heat evenly on the heat dissipation fin 1, which effectively improves the efficiency of heat dissipation. The two sides of the heat dissipation fin 1 are respectively connected to the first fan 2, The fluid pipeline 6 is connected, and the heat dissipation efficiency of the heat dissipation fin 1 is further accelerated through the first fan 2. The cooling liquid is stored in the fluid pipeline 6, and the heat of the heat pipe 4 is dissipated through the cooling liquid in the fluid pipeline 6, and passed through the second The fan 9 dissipates heat to the cooling liquid in the fluid pipe 6, and the cooling liquid is driven to flow continuously in the fluid pipe 6 through the water pump 8, wherein the fluid pipe 6 is arranged on the surface of the cooling fin 1 in an upright manner, increasing the connection with the fluid pipe. 6 of the heating area, thereby speeding up the heat dissipation of the heat pipe 4, through the above effects, the problem of the temperature rise of the air flowing through the heat dissipation fins 1 of the traditional radiator is solved, the structure is simple, the production cost is low, and the heat dissipation effect is good.

The principle of use of the utility model: the heat pipe 4 absorbs the heat of the CPU to itself through heat conduction, and flows through the heat dissipation fins 1, and connects between several heat dissipation fins 1 through the heat conduction plate 5 to form a flow diversion area. Use the characteristics of convective heat transfer to fan heat from the diversion area, and the temperature can be evenly distributed on the surface of each heat dissipation fin 1 through the heat conduction plate 5, which increases the area of heat dissipation, and the first fan 2 guides the airflow to dissipate heat , the cooling liquid in the fluid pipeline 6 can cool down the cooling fins 1, and speed up the heat dissipation efficiency of the cooling fins 1.

In this specific embodiment, the heat conduction pipe 4 of the present utility model includes four heat conduction pipes 4 of equal size and is combined in a double-row staggered manner to speed up the heat transfer to the CPU; the first fan 2 and the second fan 9 are both It is a silent fan and the speed can be adjusted through the host computer.

In this specific embodiment, the cooling liquid is an aqueous solution.

The above embodiment is only a description of the preferred implementation of the utility model, and is not intended to limit the scope of the utility model. On the premise of not departing from the design spirit of the utility model, ordinary engineers and technicians in the field made the technical solution of the utility model Various modifications and improvements should fall within the protection scope determined by the claims of the present utility model.

Claims (9)

1. a kind of CPU high fevers radiator includes heat absorption component and radiating subassembly, which is characterized in that the heat sink Include several radiating fins, the first fan, cooling fin and carries out leading for heat transfer for carrying radiating fin and CPU Heat pipe, the heat conducting pipe are fitted in the surface of CPU, and the radiating fin is looped around the surface of heat conducting pipe, the fin surface Equipped with location hole corresponding with the first fan, cooling fin is arranged on the side of several radiating fins and makes by location hole One fan is fixed on a heat sink, wherein is equipped with heat-conducting plate between several described radiating fins, and is connected by heat-conducting plate It connects, the radiating subassembly includes fluid line, water tank, water pump and the second fan, the both ends of the fluid line and water tank Connection, the water tank are arranged in host, and second fan is arranged in the side of water tank, and the water pump is arranged in fluid nozzle Water inlet in, fluid line setting is fitted on the another side of several radiating fins.

2. a kind of CPU high fevers radiator according to claim 1, which is characterized in that also include lid, the water tank Equipped with opening, the cover cap is located at the surface of opening, and the edge being open is equipped with waterproof coating.

3. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the thickness of the radiating fin is small In the heat conduction plate thickness of cooling fin.

4. a kind of CPU high fevers radiator according to claim 1, which is characterized in that shape between several radiating fins At guiding region, the heat-conducting plate is arranged in guiding region.

5. a kind of CPU high fevers radiator according to claim 1, which is characterized in that further include having fixed plate and bottom Seat, the pedestal are equipped with preformed hole corresponding with fixed plate and are arranged in the lower section of CPU, and the fixed mount setting is in heat conducting pipe Lower end, the geometrical clamp are fixed by screw and pedestal.

6. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the radiating fin passes through heat conduction Plate laid out in parallel.

7. a kind of CPU high fevers radiator according to claim 1, which is characterized in that second fan is equipped with buckle, The side of the water tank is equipped with groove corresponding with buckle, and second fan is fixed by buckling with groove and water tank.

8. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the side of first fan is set There are LED light and controller, the LED light to be connect with controller.

9. a kind of CPU high fevers radiator according to claim 1, which is characterized in that further include have temperature detector with And it is used for temperature indicator, it is connect in the temperature detector setting fluid line and with temperature indicator, the temperature display The outer wall in fluid line is arranged in device.