CN204347742U - A kind of computer water-cooling cabinet - Google Patents
A kind of computer water-cooling cabinet Download PDFInfo
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- CN204347742U CN204347742U CN201520047265.7U CN201520047265U CN204347742U CN 204347742 U CN204347742 U CN 204347742U CN 201520047265 U CN201520047265 U CN 201520047265U CN 204347742 U CN204347742 U CN 204347742U
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- conductive silicon
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Abstract
The utility model provides a kind of computer water-cooling cabinet, comprise cabinet, be provided with computer motherboard, computer module and thermal source components and parts in described cabinet, the below of computer motherboard is provided with the first thermal conductive silicon lipid layer, and the top of thermal source components and parts is provided with the second thermal conductive silicon lipid layer; The bottom of cabinet is provided with some radiating fins for dispelling the heat, and the first thermal conductive silicon lipid layer is connected by superconducting pipe with between radiating fin; The top sidewall of cabinet is provided with water-cooled copper; The left and right sides of cabinet is respectively equipped with independently air channel, and the top of cabinet is provided with air-flow blower fan.The utility model is to computer motherboard being arranged the first thermal conductive silicon lipid layer, and connect radiating fin with to computer motherboard fast cooling by superconducting pipe, simultaneously, thermal source components and parts arrange the second thermal conductive silicon lipid layer, and by water-cooled copper to its fast cooling, effectively reduce the temperature of cabinet, in addition, the both sides of cabinet are also provided with heat dissipation wind channel, reduce further the temperature of cabinet.
Description
Technical field
The utility model relates to computer equipment field, and specifically, the utility model relates to a kind of computer water-cooling cabinet.
Background technology
Computer cabinet is as the part in computer fittings; the Main Function that it rises places and fixing each computer fittings; play a support and protective effect, simultaneously along with the development of computer equipment, its thermal value is also increasing; if cabinet can not dispel the heat fast; can make the work efficiency step-down of computing machine, make the aging speed of its hardware accelerate, now traditional cabinet all adopts wind-cooling heat dissipating simultaneously; radiating effect is not good, and in hot environment, radiating effect is poorer simultaneously.
Utility model content
The technical problems to be solved in the utility model is: the computer cabinet providing a kind of high heat dispersion.
The utility model solves the technical scheme that its technical matters adopts: provide a kind of computer water-cooling cabinet, comprise cabinet, be provided with in described cabinet under up cumulative successively computer motherboard, computer module and thermal source components and parts, the below of described computer motherboard is provided with the first thermal conductive silicon lipid layer, and the top of described thermal source components and parts is provided with the second thermal conductive silicon lipid layer; The bottom of described cabinet is provided with some radiating fins for dispelling the heat, and described first thermal conductive silicon lipid layer is connected by superconducting pipe with between radiating fin; The top sidewall of described cabinet is provided with water-cooled copper, and one end of described water-cooled copper is connected with the cooling tank storing liquid coolant, and its other end is connected with described second thermal conductive silicon lipid layer; The left and right sides of described cabinet is respectively equipped with independently air channel, and the top of described cabinet is provided with air-flow blower fan, and described air-flow blower fan is communicated with the air outlet in described air channel.
Preferably, described superconducting pipe is the cylindrical-shaped structure of hollow, and its inner chamber is high vacuum and superconducting fluid is housed.
Preferably, described cooling tank connects ebullator, flows in described water-cooled copper to make described liquid coolant.
Preferably, described cooling tank is provided with liquid level sensor, with the height of liquid coolant in controlled cooling model case.
Preferably, some radiating fins are provided with in described air channel.
Preferably, temperature sensor, control module and alarm is provided with in described cabinet, the temperature value of detection for detecting the temperature in described cabinet, and is fed back to described control module by described temperature sensor, and described control module is for controlling the switch of alarm.
Preferably, be provided with radiator fan in described cabinet, the sidewall of described cabinet is provided with cellular louvre.
The utility model provides a kind of high heat dispersion computer cabinet, to computer motherboard being arranged the first thermal conductive silicon lipid layer, and connect radiating fin with to computer motherboard fast cooling by superconducting pipe, meanwhile, thermal source components and parts arrange the second thermal conductive silicon lipid layer, and by water-cooled copper to its fast cooling, effectively reduce the temperature of cabinet, in addition, the both sides of cabinet are also provided with heat dissipation wind channel, reduce further the temperature of cabinet; The utility model good heat dissipation effect and fast, structure is simple, saves energy consumption, is easy to marketing.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of computer water-cooling cabinet preferred embodiment of the present utility model.
[in figure Reference numeral]:
10. cabinet, 20. computer motherboards, 30. computer modules, 40. thermal source components and parts, 50. first thermal conductive silicon lipid layer, 60. second thermal conductive silicon lipid layer, 70. radiating fins, 80. superconducting pipes, 90. water-cooled coppers, 100. cooling tanks, 110. air channels, 120. air-flow blower fans, 130. ebullator, 140. temperature sensors, 150. control modules, 160. alarms.
Embodiment
For making content of the present utility model clearly understandable, below in conjunction with Figure of description, content of the present utility model is described further.Certain the utility model is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection domain of the present utility model.Secondly, the utility model detailed statement that utilized schematic diagram to carry out, when describing the utility model example in detail, for convenience of explanation, schematic diagram, should in this, as to restriction of the present utility model not according to general ratio partial enlargement.
Above-mentioned and other technical characteristic and beneficial effect, will in conjunction with the embodiments and accompanying drawing 1 computer water-cooling cabinet of the present utility model is described in detail.As shown in Figure 1, Fig. 1 is the structural representation of computer water-cooling cabinet preferred embodiment of the present utility model.
As shown in Figure 1, the utility model provides a kind of computer water-cooling cabinet, comprise cabinet 10, be provided with in cabinet 10 under up cumulative successively computer motherboard 20, computer module 30 and thermal source components and parts 40, the below of computer motherboard 20 is provided with the first thermal conductive silicon lipid layer 50, and the top of thermal source components and parts 40 is provided with the second thermal conductive silicon lipid layer 60; The bottom of cabinet 10 is provided with some radiating fin 70, first thermal conductive silicon lipid layer 50 for dispelling the heat and is connected by superconducting pipe 80 with between radiating fin 70; The top sidewall of cabinet 10 is provided with water-cooled copper 90, and one end of water-cooled copper 90 is connected with the cooling tank 100 storing liquid coolant, and its other end is connected with the second thermal conductive silicon lipid layer 60; The left and right sides of cabinet 10 is respectively equipped with independently air channel 110, and the top of cabinet 10 is provided with air-flow blower fan 120, and air-flow blower fan 120 is communicated with the air outlet in air channel 110.
Concrete, in the present embodiment, superconducting pipe 80 is the cylindrical-shaped structure of hollow, and its inner chamber is high vacuum and superconducting fluid is housed.Meanwhile, cooling tank 100 connects ebullator 130, to make liquid coolant flow in described water-cooled copper 90, cooling tank 100 also can be provided with liquid level sensor, with the height of liquid coolant in controlled cooling model case 100.
For improving radiating effect further, in air channel 110, some radiating fins can be provided with; In addition, also temperature sensor 140, control module 150 and alarm 160 can be provided with in cabinet 10, the temperature value of detection for detecting the temperature in cabinet 10, and is fed back to described control module 150 by temperature sensor 140, and control module 150 is for controlling the switch of alarm 160.
In preferred version, be provided with radiator fan in cabinet, the sidewall of described cabinet is provided with cellular louvre.
In sum, the utility model provides a kind of high heat dispersion computer cabinet, to computer motherboard 20 being arranged the first thermal conductive silicon lipid layer 50, and connect radiating fin 70 with to computer motherboard 20 fast cooling by superconducting pipe 80, simultaneously, thermal source components and parts 40 arrange the second thermal conductive silicon lipid layer 60, and by water-cooled copper 90 to its fast cooling, effectively reduce the temperature of cabinet 10, in addition, the both sides of cabinet 10 are also provided with heat dissipation wind channel 110, reduce further the temperature of cabinet 10; The utility model good heat dissipation effect and fast, structure is simple, saves energy consumption, is easy to marketing.
Although the utility model essentially describes above embodiment, just come as an example to be described, and the utility model is not limited to this.Those of ordinary skill in the art can make multiple modification and application and not depart from the essential characteristics of embodiment.Such as, each parts that embodiment is shown in detail can be revised and run, to described modification with apply relevant difference and can think and be included in protection domain of the present utility model that claims limit.
Embodiment involved in this instructions, its implication is that specially feature, structure or the characteristic described in conjunction with this embodiment is included at least one embodiment of the present utility model.These terms come across in instructions everywhere differ to establish a capital and relate to same embodiment.In addition, when describing special characteristic, structure or characteristic in conjunction with any embodiment, all think that it falls in the scope of these special characteristics, structure or the characteristic that those of ordinary skill in the art just can realize in conjunction with other embodiments.
Claims (7)
1. a computer water-cooling cabinet, comprise cabinet, be provided with in described cabinet under up cumulative successively computer motherboard, computer module and thermal source components and parts, it is characterized in that, the below of described computer motherboard is provided with the first thermal conductive silicon lipid layer, and the top of described thermal source components and parts is provided with the second thermal conductive silicon lipid layer;
The bottom of described cabinet is provided with some radiating fins for dispelling the heat, and described first thermal conductive silicon lipid layer is connected by superconducting pipe with between radiating fin; The top sidewall of described cabinet is provided with water-cooled copper, and one end of described water-cooled copper is connected with the cooling tank storing liquid coolant, and its other end is connected with described second thermal conductive silicon lipid layer;
The left and right sides of described cabinet is respectively equipped with independently air channel, and the top of described cabinet is provided with air-flow blower fan, and described air-flow blower fan is communicated with the air outlet in described air channel.
2. computer water-cooling cabinet as claimed in claim 1, it is characterized in that, described superconducting pipe is the cylindrical-shaped structure of hollow, and its inner chamber is high vacuum and superconducting fluid is housed.
3. computer water-cooling cabinet as claimed in claim 1, is characterized in that, described cooling tank connects ebullator, flows in described water-cooled copper to make described liquid coolant.
4. computer water-cooling cabinet as claimed in claim 1, it is characterized in that, described cooling tank is provided with liquid level sensor, with the height of liquid coolant in controlled cooling model case.
5. computer water-cooling cabinet as claimed in claim 1, is characterized in that, be provided with some radiating fins in described air channel.
6. computer water-cooling cabinet as claimed in claim 1, it is characterized in that, temperature sensor, control module and alarm is provided with in described cabinet, described temperature sensor is for detecting the temperature in described cabinet, and the temperature value of detection is fed back to described control module, described control module is for controlling the switch of alarm.
7. computer water-cooling cabinet as claimed in claim 1, it is characterized in that, be provided with radiator fan in described cabinet, the sidewall of described cabinet is provided with cellular louvre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520047265.7U CN204347742U (en) | 2015-01-23 | 2015-01-23 | A kind of computer water-cooling cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520047265.7U CN204347742U (en) | 2015-01-23 | 2015-01-23 | A kind of computer water-cooling cabinet |
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| Publication Number | Publication Date |
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| CN204347742U true CN204347742U (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520047265.7U Expired - Fee Related CN204347742U (en) | 2015-01-23 | 2015-01-23 | A kind of computer water-cooling cabinet |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932633A (en) * | 2015-07-04 | 2015-09-23 | 王远志 | Water-cooling anti-radiation host of computer |
| CN106648002A (en) * | 2017-03-21 | 2017-05-10 | 程丽丽 | Computer heat dissipation structure |
| CN106992633A (en) * | 2017-05-18 | 2017-07-28 | 山东双源印铁制罐有限公司 | Self-cooled motor cooling protection device |
| CN107291199A (en) * | 2017-08-16 | 2017-10-24 | 安吉县安信信息有限公司 | A kind of computer host box for being easy to radiate |
| CN110719724A (en) * | 2019-11-21 | 2020-01-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
| CN111837093A (en) * | 2018-03-14 | 2020-10-27 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN112015248A (en) * | 2020-09-09 | 2020-12-01 | 河南工业职业技术学院 | Device and method for realizing stable transmission of computer information |
| WO2022161513A3 (en) * | 2022-04-29 | 2023-02-09 | 苏州云首软件科技有限公司 | Water-cooled rapid heat dissipation system for computer |
-
2015
- 2015-01-23 CN CN201520047265.7U patent/CN204347742U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932633A (en) * | 2015-07-04 | 2015-09-23 | 王远志 | Water-cooling anti-radiation host of computer |
| CN106648002A (en) * | 2017-03-21 | 2017-05-10 | 程丽丽 | Computer heat dissipation structure |
| CN106648002B (en) * | 2017-03-21 | 2024-04-09 | 程丽丽 | Heat radiation structure of computer |
| CN106992633A (en) * | 2017-05-18 | 2017-07-28 | 山东双源印铁制罐有限公司 | Self-cooled motor cooling protection device |
| CN107291199A (en) * | 2017-08-16 | 2017-10-24 | 安吉县安信信息有限公司 | A kind of computer host box for being easy to radiate |
| CN107291199B (en) * | 2017-08-16 | 2020-11-10 | 北京神州数码云科信息技术有限公司 | Computer mainframe convenient to heat dissipation |
| CN111837093A (en) * | 2018-03-14 | 2020-10-27 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN111837093B (en) * | 2018-03-14 | 2022-07-15 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN110719724A (en) * | 2019-11-21 | 2020-01-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
| CN112015248A (en) * | 2020-09-09 | 2020-12-01 | 河南工业职业技术学院 | Device and method for realizing stable transmission of computer information |
| WO2022161513A3 (en) * | 2022-04-29 | 2023-02-09 | 苏州云首软件科技有限公司 | Water-cooled rapid heat dissipation system for computer |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20160123 |
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| EXPY | Termination of patent right or utility model |