CN104411144B - Cooling system - Google Patents
Cooling system Download PDFInfo
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- CN104411144B CN104411144B CN201410693318.2A CN201410693318A CN104411144B CN 104411144 B CN104411144 B CN 104411144B CN 201410693318 A CN201410693318 A CN 201410693318A CN 104411144 B CN104411144 B CN 104411144B
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- radiator
- air channel
- fan
- cooling system
- heat
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Abstract
The embodiment of the present invention provides a kind of cooling system, including cabinet, and is arranged on the radiator structure, veneer and backboard of the cabinet inside, wherein, the radiator structure includes：Radiator, air channel partition component and fan subsystem；Wherein, the radiator is arranged at the air outlet of the fan subsystem, and the radiator includes radiator base plate, deep bead, heat radiator fin and heat pipe；The radiator base plate is arranged on the veneer；The deep bead is arranged on below the heat radiator fin；One end of the heat pipe is connected with the radiator base plate, and the other end of the heat pipe is connected with the heat radiator fin；The air channel partition component is set in the same horizontal line with the deep bead.So as to solve the radiating bottleneck of downstream veneer device, lifting system heat-sinking capability, and reduce system energy consumption and noise.
Description
Technical field
The present embodiments relate to a kind of heat dissipation technology, more particularly to a kind of cooling system.
Background technology
With the continuous lifting of information technoloy equipment performance, the big power consuming devices of system, such as central processing unit (Central
Processing Unit, CPU) power consumption gradually increase, quantity also gradually increases, and the thermal level of downstream veneer device, which is joined, to be influenceed
Increasing, conventional heat dissipation is hard to work, and the radiating of downstream components turns into the bottleneck of system radiating.As shown in figure 1,
Due to the influence of big power consuming devices, the temperature of downstream components exceeds its specification limit, and the heat-sinking capability of system is by downstream device
Part radiating restriction and be difficult to be lifted.
In the prior art, generally by lifting fan performance come lifting system heat-sinking capability, i.e. lifting fan work point
Pressure-air quantity (P-Q) performance, increase systematic air flow so that the radiating of system downstream device is improved.
However, P-Q performances can only also be lifted within the specific limits, can not infinitely increase, and the lifting of fan performance
Also bring along the increase of system energy consumption and noise.
The content of the invention
The embodiment of the present invention provides a kind of cooling system, and to solve the radiating bottleneck of downstream veneer device, lifting system dissipates
Heat energy power, and reduce system energy consumption and noise.
In a first aspect, the embodiment of the present invention provides a kind of cooling system, including cabinet, and it is arranged on the cabinet inside
Radiator structure, veneer and backboard, wherein, the radiator structure includes：Radiator, air channel partition component and fan subsystem
System；
Wherein, the radiator is arranged at the air outlet of the fan subsystem, and the radiator includes radiator base
Plate, deep bead, heat radiator fin and heat pipe；The radiator base plate is arranged on the veneer；The deep bead is arranged on institute
State below heat radiator fin；One end of the heat pipe is connected with the radiator base plate, and the other end of the heat pipe dissipates with described
Hot device fin connection；
The air channel partition component is set in the same horizontal line with the deep bead.
In the first possible implementation of first aspect, the air channel partition component include the first air channel barrier and
Second air channel barrier；First air channel barrier is fixedly installed between the fan subsystem and the radiator；It is described
Second air channel barrier is fixedly installed between the radiator and the backboard.
With reference to the first possible implementation of first aspect, in second of possible implementation of first aspect
In, the air channel partition component, which is bolted, to be arranged on the cabinet.
With reference to second of any possible implementation of first aspect to first aspect, the third in first aspect can
In the implementation of energy, the fan subsystem includes one group of fan, and first air channel barrier is arranged on one group of fan
Air outlet and the radiator between.
With reference to second of any possible implementation of first aspect to first aspect, the 4th kind in first aspect can
In the implementation of energy, the fan subsystem includes two groups of fans；First air channel barrier separates two groups of fans.
The third or the 4th kind of possible implementation, the 5th kind in first aspect with reference to first aspect is possible
In implementation, the gap between first air channel barrier, the deep bead, second air channel barrier is 1-2mm.
Cooling system provided in an embodiment of the present invention, including cabinet, and be arranged on the cabinet inside radiator structure,
Veneer and backboard, wherein, the radiator structure includes：Radiator, air channel partition component and fan subsystem；Wherein, it is described
Radiator is arranged at the air outlet of the fan subsystem, and the radiator includes radiator base plate, deep bead, heatsink fins
Piece and heat pipe；The radiator base plate is arranged on the veneer；The deep bead is arranged on below the heat radiator fin；Institute
The one end for stating heat pipe is connected with the radiator base plate, and the other end of the heat pipe is connected with the heat radiator fin；The wind
Road partition component is set in the same horizontal line with the deep bead.So as to solve the radiating bottleneck of downstream veneer device, carry
System radiating ability is risen, and reduces system energy consumption and noise.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some embodiments of bright embodiment, for those of ordinary skill in the art, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of cooling system in the prior art；
Fig. 2 is the structural representation of cooling system embodiment one of the present invention；
Fig. 3 is the structural representation of cooling system embodiment two of the present invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the embodiment of the present invention, this area
The every other embodiment that those of ordinary skill is obtained under the premise of creative work is not made, belongs to implementation of the present invention
The scope of example protection.
Fig. 2 is the structural representation of cooling system embodiment one of the present invention；Fig. 3 is cooling system embodiment two of the present invention
Structural representation.The cooling system provided referring concurrently to Fig. 2 and Fig. 3, the present embodiment, including cabinet 100, and be arranged on described
Radiator structure, veneer 200 and backboard 300 inside cabinet 100, wherein, the radiator structure includes：Radiator 410, air channel point
Every component 420 and fan subsystem 430；
Wherein, the radiator 410 is arranged at the air outlet of the fan subsystem 430, and the radiator 410 includes
Radiator base plate 411, deep bead 412, heat radiator fin 413 and heat pipe 414；The radiator base plate 411 is arranged on the list
On plate 200；The deep bead 412 is arranged on below the heat radiator fin 413；One end of the heat pipe 414 and the radiating
Device substrate 411 is connected, and the other end of the heat pipe 414 is connected with the heat radiator fin 413；The air channel partition component 420
Set in the same horizontal line with the deep bead 412.
The air channel partition component 420 can include the first air channel barrier and the second air channel barrier；The first air channel gear
Plate is fixedly installed between the fan subsystem 430 and the radiator 410；Institute is fixedly installed in second air channel barrier
State between radiator 410 and the backboard 300；Specifically, the air channel partition component 420 can be bolted and be arranged on
On the cabinet 100, or it is fixedly installed on by other means on the cabinet 100, the present embodiment does not limit the air channel
The mode that partition component 420 is fixedly connected with the cabinet 100.
It can be seen that, the heat radiator fin 413 passes through the heat pipe 414 and the radiator base plate from Fig. 2 and Fig. 3
411 separation, and air channel isolation is carried out by the deep bead 412, while in the same horizontal position with the deep bead 412
Place, in the both sides of the deep bead 412, first air channel barrier and second air channel barrier are set respectively so that institute
State heat radiator fin 413 and be individually located at a heat dissipation wind channel, so as to dissipating the radiating of high-power chip and downstream single board chip
Heat separates, and solves the radiating bottleneck of downstream single board chip, lifting system heat-sinking capability.
In a kind of feasible embodiment, fan subsystem 430 can include one group of fan, as shown in Fig. 2 described
One air channel barrier is arranged between the air outlet and the radiator 410 of one group of fan；The air outlet of one group of fan
The air-flow at place is divided into two air-flows by first air channel barrier, and an air-flow is used to radiate for the heat radiator fin 413, separately
One air-flow is used to radiate for downstream single board chip, because the radiating of big power dissipating chip is transferred to single heat dissipation wind channel, because
This radiating on downstream single board chip influences smaller, solves the radiating bottleneck of downstream single board chip, further, due to solving
The radiating bottleneck of downstream single board chip, accordingly, the fan in fan subsystem 430 can also select low performance fan, and low
The energy consumption and noise of performance fan are smaller, can effectively reduce the energy consumption and noise of cooling system.
In another feasible embodiment, fan subsystem 430 can include two groups of fans, as shown in figure 3, described
First air channel barrier separates two groups of fans, by first air channel barrier, the deep bead 412 inside the cabinet 100
And second air channel barrier is divided into two heat dissipation wind channels, two groups of fans are respectively that two heat dissipation wind channels provide gas
Stream, a heat dissipation wind channel are used to radiate for big power dissipating chip, and it is the chip cooling of downstream veneer 200 that another heat dissipation wind channel, which is used for,
Due to being radiated respectively to big power dissipating chip and downstream single board chip, therefore the radiating on downstream single board chip influences smaller, solution
The radiating bottleneck of downstream single board chip, it is further, accordingly, described due to solving the radiating bottleneck of downstream single board chip
Two groups of fans can select low performance fan, and the energy consumption of low performance fan and noise are smaller, can effectively reduce cooling system
Energy consumption and noise.
It should be noted that between first air channel barrier, the deep bead 412, second air channel barrier
Gap could be arranged to 1-2mm, and the present embodiment is not limited to this.
During the radiator structure that installation the present embodiment provides in the cabinet 100, the radiator can be first installed
410, and the radiator 410 is fixed on the veneer 200 by the screw on the radiator base plate 411；By described in
Fan subsystem 430 is arranged on the cabinet 100, installs first air channel barrier and second air channel barrier, then pacify
Load onto the cover plate of the cabinet 100；If the fan subsystem 430 includes two groups of fans, described can installed
After one air channel barrier and second air channel barrier, then another group of fan is installed, the cover plate of the cabinet 100 is finally installed i.e.
Can.
The cooling system that the present embodiment provides, by setting the first air channel barrier, the second air channel barrier and deep bead
412, cabinet inside is divided into two heat dissipation wind channels, and due to by the heat radiator fin 413 of the radiator of big power consuming devices
Separating with radiator base plate 411, connected by heat pipe 414 so that heat radiator fin 413 is located at a single heat dissipation wind channel,
Individually big power consuming devices are radiated, eliminate the shadow of radiating of the radiating of big power consuming devices in the prior art to downstream single board chip
Ring, solve the radiating bottleneck of downstream single board chip, and then energy consumption and the less low performance fan of noise can be selected so that radiating
The energy consumption and noise of system effectively reduce.
The cooling system that the present embodiment provides, including cabinet, and it is arranged on the radiator structure of the cabinet inside, veneer
And backboard, wherein, the radiator structure includes：Radiator, air channel partition component and fan subsystem；Wherein, the radiating
Device is arranged at the air outlet of the fan subsystem, the radiator include radiator base plate, deep bead, heat radiator fin and
Heat pipe；The radiator base plate is fixedly installed on the veneer；The deep bead is fixedly installed under the heat radiator fin
Face；One end of the heat pipe is fixedly connected with the radiator base plate, and the other end of the heat pipe is consolidated with the heat radiator fin
Fixed connection；The air channel partition component is set in the same horizontal line with the deep bead.So as to solve downstream veneer device
Radiating bottleneck, lifting system heat-sinking capability, and reduce system energy consumption and noise.
Finally it should be noted that：Various embodiments above is only illustrating the technical scheme of the embodiment of the present invention, rather than to it
Limitation；Although the embodiment of the present invention is described in detail with reference to foregoing embodiments, one of ordinary skill in the art
It should be understood that：It can still modify to the technical scheme described in foregoing embodiments, either to which part or
All technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this hair
The scope of bright each embodiment technical scheme of embodiment.
Claims (6)
1. a kind of cooling system, including cabinet, and the radiator structure, veneer and backboard of the cabinet inside are arranged on, it is special
Sign is that the radiator structure includes：Radiator, air channel partition component and fan subsystem；
Wherein, the radiator is arranged at the air outlet of the fan subsystem, and the radiator includes radiator base plate, gear
Aerofoil, heat radiator fin and heat pipe；The radiator base plate is arranged on the veneer；The deep bead is arranged on the radiating
Below device fin；One end of the heat pipe is connected with the radiator base plate, the other end of the heat pipe and the heatsink fins
Piece connects；
The air channel partition component is set in the same horizontal line with the deep bead, the radiator and the air channel separation group
Space be present between the deep bead and the radiator base plate between the fan subsystem and the backboard in part.
2. cooling system according to claim 1, it is characterised in that the air channel partition component includes the first air channel barrier
With the second air channel barrier；First air channel barrier is fixedly installed between the fan subsystem and the radiator；Institute
The second air channel barrier is stated to be fixedly installed between the radiator and the backboard.
3. cooling system according to claim 2, it is characterised in that the air channel partition component is bolted setting
On the cabinet.
4. cooling system according to claim 2, it is characterised in that the fan subsystem includes one group of fan, described
First air channel barrier is arranged between air outlet and the radiator of one group of fan.
5. cooling system according to claim 2, it is characterised in that the fan subsystem includes two groups of fans；It is described
First air channel barrier separates two groups of fans.
6. the cooling system according to claim 4 or 5, it is characterised in that first air channel barrier, the deep bead,
Gap between second air channel barrier is 1-2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693318.2A CN104411144B (en) | 2014-11-26 | 2014-11-26 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693318.2A CN104411144B (en) | 2014-11-26 | 2014-11-26 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104411144A CN104411144A (en) | 2015-03-11 |
| CN104411144B true CN104411144B (en) | 2017-11-24 |
Family
ID=52648724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410693318.2A Active CN104411144B (en) | 2014-11-26 | 2014-11-26 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411144B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106941768A (en) * | 2016-01-05 | 2017-07-11 | 中兴通讯股份有限公司 | Single plate cooling device |
| CN107018643A (en) * | 2017-06-16 | 2017-08-04 | 深圳市得城网络科技有限公司 | Communication equipment |
| CN110123024A (en) * | 2019-06-22 | 2019-08-16 | 苏州有单互联网科技有限公司 | A kind of Internet of Things computer radiation table |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848518A (en) * | 2005-03-25 | 2006-10-18 | 三星Sdi株式会社 | Secondary battery module |
| CN2901801Y (en) * | 2006-01-20 | 2007-05-16 | 英业达股份有限公司 | Heat radiator |
-
2014
- 2014-11-26 CN CN201410693318.2A patent/CN104411144B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848518A (en) * | 2005-03-25 | 2006-10-18 | 三星Sdi株式会社 | Secondary battery module |
| CN2901801Y (en) * | 2006-01-20 | 2007-05-16 | 英业达股份有限公司 | Heat radiator |
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| Publication number | Publication date |
|---|---|
| CN104411144A (en) | 2015-03-11 |
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