CN104349648B - Combined radiating component - Google Patents
Combined radiating component Download PDFInfo
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- CN104349648B CN104349648B CN201310345083.3A CN201310345083A CN104349648B CN 104349648 B CN104349648 B CN 104349648B CN 201310345083 A CN201310345083 A CN 201310345083A CN 104349648 B CN104349648 B CN 104349648B
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- heat sink
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Abstract
The present invention relates to a kind of combined radiating component, it is mounted on an electronic installation, and this electronic installation has casing, circuit board and electrically plugs adapter on circuit boards.Combined radiating component includes one first heat abstractor and one second heat abstractor.Wherein first heat abstractor is arranged on the lateral surface of casing, second heat abstractor is arranged on adapter, when electronic installation operates, first heat abstractor and one second heat abstractor are radiated to electronic installation in the way of water-cooled, and the heat radiation power according to needed for the actual caloric value of electronic components is allocated, to meet the demand of different users, more meet economic benefit.
Description
【Technical field】
The present invention relates to a kind of heat dissipation equipment, more particularly to a kind of combined heat radiating group being made up of multiple heat abstractors
Part.
【Background technology】
Flourishing with high-tech industry in recent years, the volume of the electronic building brick in electronic product is more in small
Change, and the closeness in unit area is also more and more high, overall efficiency is even more and constantly strengthens, and under these factors, also needs
Ensure that the radiator having enough cooling capacities in narrow zone, allow the work of each electronic components in electronic installation
Temperature is maintained in rational scope, to promote the heat exchange of itself and environment, and then protects electronic components, it is to avoid zero group of electronics
The problems such as part generation damages or computer system works as machine because overheated.
The radiating mode commonly used is broadly divided into ventilation type and two kinds of water-cooled, and wherein air-cooled radiating mode is typically
Using radiator, the spare part of electronic installation is radiated.Commonly use the body that radiator includes having multiple radiating fins, be
Improving heat radiation efficiency, generally also can install a fan additional, it is fixed on radiating fin.Commonly use radiator use when, be with
The bottom surface of body is fitted on heat generating component, for example, central processing unit (Central Processing Unit, CPU) or figure
Can produce on the heat generating component of a large amount of used heat during the running such as shape processor (Graphic Processing Unit, GPU), pass through
Conduction of heat makes thermal source be transferred to radiating fin by body, then so that thermal source is dissipated by air-flow produced by fan, and then
The effect cooling is produced to heat generating component.
In addition, commonly using, water-cooled power converter is mainly arranged by a water-cooled, a water-cooled pump is composed in series, wherein in water-cooled row
It is filled with coolant, and is set directly on corresponding heating electronic package, draw what heating electronic package was distributed with direct
Heat energy, and water-cooled row be connected with water-cooled pump by conduit, thus, you can so that coolant is existed by the running of water-cooled pump
Flowing in water-cooled row, thereby carries out heat exchange circulation.
However, existing water-cooled power converter be all the electronic components for various type electronic installations size and
Position and the configuration relation of corresponding design, therefore water-cooled row and water-cooled pump and usage quantity will be forced fixing and cannot change.As
This one, if be intended to be radiated for the electronic components of different heat amount, commonly using water-cooled power converter cannot basis
The actual caloric value of electronic components does the configuration of full blast.
If that is, for the larger electronic components of caloric value, fixed configurations commonly use water-cooled power converter
Hydraulic pressure will be not enough to electronic components are timely radiated;If being directed to the less electronic components of caloric value, commonly use
Although water-cooled power converter can be antipyretic in time, the running of excessive hydraulic pressure will produce unnecessary noise.
【Content of the invention】
In view of the above problems, the present invention provides a kind of combined radiating component, thus solving to commonly use water cooled heat radiating dress
The not good problem of the suitability put.
In order to solve above-mentioned technical problem, the combined radiating component of the present invention is to be useful in electronic installation, and this electronics
Device has casing, the circuit board being arranged in casing and electrically plugs adapter on circuit boards, and casing its
Middle one side has an opening.Combined radiating component includes one first heat abstractor and one second heat abstractor, and wherein
One heat abstractor is provided on the lateral surface of casing, and corresponding opening, and the first heat abstractor has a body, one first wind
Fan, one first heat sink and at least one pump.First fan is to be installed on body and in the face of opening, and the first heat sink is installing
In the one side of body, and the first heat sink has at least one groove, and pump is in the groove be contained in the first heat sink, and pump
Part has the first water inlet and the first outlet, is to expose outside the first heat sink.
Second heat abstractor is provided on adapter, and it has a coldplate, one second heat sink and one first lid,
First face of coldplate is provided with multiple fins that interval is erect, thus constituting multiple runners.Coldplate has the second water inlet
With the second outlet, it is to be connected to runner, the wherein second water inlet and the second outlet are to expose in machine through casing
Outside shell.Second heat sink is attached to the second face of coldplate with wherein one side, and is fitted in adaptation with relative another side
Card.First lid is arranged on the side of the second heat sink, and covers coldplate, to constitute airtight chamber.
Further, the combined radiating component of the invention described above, also includes a water-cooling type radiator, is sticked in circuit board
Electronic components on, water-cooling type radiator has one the 3rd water inlet and one the 3rd outlet, two pipelines pass through casing simultaneously
It is connected to the 3rd water inlet and the 3rd outlet.
Further, the combined radiating component of the invention described above, the material of the wherein second heat sink and coldplate is copper
Alloy.
Further, the combined radiating component of the invention described above, the wherein second heat sink and coldplate are with the side of welding
Formula be combined with each other.
The present invention separately provides a kind of combined radiating component, is to be useful in electronic installation, and this electronic installation have casing,
The circuit board that is arranged in casing and electrically plug adapter on circuit boards, and the wherein one side of casing has
One opening.Combined radiating component includes one first heat abstractor and one second heat abstractor, and the wherein first heat abstractor is
It is arranged on the lateral surface of casing, and corresponding opening, the first heat abstractor has a body, one first fan, one first dissipates
Hot plate and at least one pump.First fan is to be installed on body simultaneously in the face of opening, and the first heat sink is be installed in body one
Side, and the first heat sink has at least one groove, pump is in the groove be contained in the first heat sink, and pump has first
Water inlet and the first outlet, are to expose outside the first heat sink.
Second heat abstractor is provided on adapter, and it has a coldplate, one second heat sink, and the first of coldplate
Multiple runners are had on face.Coldplate has the second water inlet and the second outlet, is to be connected to runner, and wherein second enters
The mouth of a river and the second outlet are to expose outside casing through casing.Second heat sink is attached to coldplate with wherein one side
First face, to constitute airtight chamber, and is fitted in adapter with the relative another side of the second heat sink.
Further, the combined radiating component of the invention described above, also includes a water-cooling type radiator, is sticked in circuit board
Electronic components on, water-cooling type radiator has one the 3rd water inlet and one the 3rd outlet, two pipelines pass through casing simultaneously
It is connected to the 3rd water inlet and the 3rd outlet.
Further, the combined radiating component of the invention described above, the wherein second heat abstractor also includes a radiating fin
Group, one second fan and one second lid, radiating fin group is attached on the second face of coldplate, and the second fan is provided in dissipating
In hot fins group, the second lid covers coldplate, the second heat sink, radiating fin group and the second fan.
Further, the combined radiating component of the invention described above, the material of the wherein second heat sink and coldplate is copper
Alloy.
Further, the combined radiating component of the invention described above, the wherein second heat sink and coldplate are with the side of welding
Formula be combined with each other.
Effect of the present invention is, combined radiating component is the not design merely with water-cooled pump and water-cooled row of modular,
Come the heat radiation function to have reached, also can heat radiation power according to needed for the actual caloric value of electronic components is allocated, to meet
The demand of different users, and more meet economic benefit.Meanwhile, it is arranged on machine using the water route interface of water-cooled pump and water-cooled row
Design outside shell, makes to produce the problem of leak in casing, prevents the electronic components in casing from causing because of leak to damage
Bad, to reach protection effect.
Feature for the present invention, implementation and effect, hereby coordinate schema to make most preferred embodiment detailed description as follows.
【Brief description】
Fig. 1 is the decomposing schematic representation with electronic installation for the combined radiating component of first embodiment of the invention.
Fig. 2 is the combination diagram with electronic installation for the combined radiating component of first embodiment of the invention.
Fig. 3 is the combination diagram of first heat abstractor of combined radiating component of first embodiment of the invention.
Fig. 4 A is the decomposing schematic representation of second heat abstractor of combined radiating component of first embodiment of the invention.
Fig. 4 B is that the second heat abstractor of the combined radiating component of first embodiment of the invention is shown with combining of adapter
It is intended to.
Fig. 4 C is the water-cooled flow passage route in second heat abstractor of combined radiating component of first embodiment of the invention
Schematic diagram.
Fig. 5 A is the decomposing schematic representation of second heat abstractor of combined radiating component of second embodiment of the invention.
Fig. 5 B is that the second heat abstractor of the combined radiating component of second embodiment of the invention is shown with combining of adapter
It is intended to.
Fig. 5 C is that the water-cooled flow passage route of second heat abstractor of combined radiating component of second embodiment of the invention is shown
It is intended to.
Fig. 6 is the second radiating and radiating fin group, second fan of the combined radiating component of second embodiment of the invention
And second lid decomposing schematic representation.
Fig. 7 is the second heat abstractor installing radiating fin group of the combined radiating component of second embodiment of the invention, the
Two fans and the combination diagram of the second lid.
Fig. 8 is the combination diagram with electronic installation for the combined radiating component of second embodiment of the invention.
Primary clustering symbol description:
100 first heat abstractor 220 second heat sink
110 body 230 first lid
120 first fan 300 second heat abstractor
130 first heat sink 310 coldplate
131 groove 311 first face
140 pump 312 second face
141 first water inlet 313 runner
142 first outlet 314 second water inlet
200 second heat abstractor 315 second outlet
210 coldplate 320 second heat sink
211 first face 330 radiating fin group
212 second face 340 second fan
213 fin 350 second lid
214 runner 400 electronic installation
215 second water inlet 410 casing
216 second outlet 411 opening
420 circuit board 510 the 3rd water inlet
430 adapter 520 the 3rd outlet
500 water-cooling type radiator 530 pipeline
【Specific embodiment】
Refer to the combined radiating component disclosed by first embodiment of the invention shown in Fig. 1 to Fig. 2 and electronic installation
Decomposing schematic representation and combination diagram.The combined radiating component of the present embodiment is to be useful in an electronic installation 400, and this electronics
Device 400 has a casing 410, the circuit board 420 being arranged in casing 410 and electrically plugs on this circuit board 420
One adapter 430, and the wherein one side of casing 410 has an opening 411.Wherein, above-mentioned electronic installation 400 can be
Computer system host or machine box for server etc., and above-mentioned circuit board 420 i.e. with commonly use the electronics being configured in computer
Spare part is similar, the preset function of equally executable computer and application program etc., thus applicant here is not added to illustrate, only
It is described in detail for electronic components involved in the present embodiment.
Referring to Fig. 3, the first heat abstractor of the combined radiating component disclosed by first embodiment of the invention
Combination diagram.The combined radiating component of the present embodiment includes one first heat abstractor 100 and one second heat abstractor
200, the wherein first heat abstractor 100 is provided on the lateral surface of casing 410, and corresponds in the position of opening 411, and first
Heat abstractor 100 has a body 110, one first fan 120, one first heat sink 130 and at least one pump 140.First wind
Fan 120 is to be installed on body 110, and the axial direction of the first fan 120 is in the face of in opening 411 position of casing 410, making
First fan 120 passes through opening 411, the steam in casing 410 is extracted out or blows towards in casing 410, allows empty in casing 410
Gas produces the effect of mutual circulation with outside air, and reaches effect of quick heat radiating.
Hold, the first heat sink 130 is on the one side be installed in body 110, and position be in the bottom of the first fan 120,
And first heat sink 130 there is at least one groove 131, be provided in the relative another side of the first fan 120, and pump 140
It is in the groove 131 be installed in the first heat sink 130 bottom, and the bottom of pump 140 has one first water inlet 141 and one
One outlet 142, and the first water inlet 141 and the first outlet 142 are to expose outside the first heat sink 130, to connect
Pipeline (not shown), enables the first water inlet 141 to input a cryogenic liquid (such as pure water, distilled water or coolant) to pump
In 140, and the first outlet 142 can discharge the high-temp liquid having adsorbed heat energy, forms the effect of cooling circulation, to reduce electronics
The temperature of device 400, reaches effect of radiating.Wherein, the first heat sink 130 described in the present embodiment, it can be heat conductivity
Good material, such as copper alloy, aluminium alloy or ferroalloy etc., and be not limited thereto.
It should be noted that disclosed herein pump 140 be water-cooled pump, the quantity that it uses is 3, and corresponding
Groove 131 quantity is also similarly 3, and each pump 140 mutually can increase cooling power in series, and the present invention
The quantity of pump 140 be not limited in the contained quantity of the present embodiment, one skilled in the art can be according to actual need
Ask and the configuration quantity of the corresponding pump 140 changing the present invention.
Referring to Fig. 4 A to Fig. 4 B, the second radiating of the combined radiating component disclosed by first embodiment of the invention
The decomposing schematic representation of device and adapter and combination diagram.Second heat abstractor 200 of the present embodiment is provided in adapter
On 430, and the second heat abstractor 200 has a coldplate 210, one second heat sink 220 and one first lid 230.Wherein cold
But plate 210 has the multiple fins being provided with interval setting on one first relative face 211 and one second face 212, and the first face 211
Piece 213, thus constitute multiple runners 214.And coldplate 210 has one second water inlet 215 and one second outlet 216.Value
The thing that must note, runner 214 is to be divided into left and right two parts, and is interconnected in the position of bottom, and the second water inlet 215 is
Connection runner 214 a part of wherein, and the second outlet 216 is the runner 214 connecting in another part.
Wherein, the second heat sink 220 is the second face 212 being attached to coldplate 210 with wherein one side, and with relative
Another side combines on adapter 430, and the wherein second heat sink 220 and coldplate 210 can mutually attach in a welding manner,
Such as diffusion welding (DW), tin cream weldering, spot welding etc., are not limited in this.
Referring to Fig. 4 C, in the second heat abstractor of the combined radiating component disclosed by first embodiment of the invention
Water-cooled flow passage route schematic diagram.Further instruction, first lid 230 of the present embodiment is arranged on the second heat sink 220
On side, and the first lid 230 is mutually fastened with coldplate 210, make the first lid 230 cover the top surface of coldplate 210 with
All around, to constitute airtight chamber.Wherein when adapter 430 is electrically plugged on circuit board 420, the second water inlet 215 He
Second outlet 216 is to be fed through casing 410 and exposes outside casing 410, so that connecting pipeline (not shown), makes second
Water inlet 215 can input in the airtight chamber that cryogenic liquid is constituted to the first lid 230 with coldplate 210, respectively through a left side
The runner 214 of right two parts, then the high-temp liquid with thermal source is discharged by the second outlet 216, formed and there is heat exchange action
Water-cooled row, make the temperature rapid decrease on the second heat sink 220, and then make adapter 430 reach effect of radiating.
Additionally, in order to possess more excellent radiating effect, the combined radiating component of the present embodiment separately optionally adds
Fill a water-cooling type radiator 500, it is sticked on electronic components (such as CPU) of circuit board 420, wherein water cooled heat radiating
Device 500 is a water-cooled pump, and water-cooling type radiator 500 has one the 3rd water inlet 510 and one the 3rd outlet 520, two pipelines
Be fed through casing 410 and be connected on the 3rd water inlet 510 and the 3rd outlet 520, and water-cooling type radiator 500 with
The function mode of above-mentioned pump 140 is identical, therefore can carry out cooling effect to the electronic components on circuit board 420, to reach
Radiating purpose, therefore applicant here does not repeat to repeat.
The overall structure of the combined radiating component disclosed by the second embodiment of the present invention and above-mentioned first embodiment
The structure of radiating module is similar, and therefore herein below is described in detail only at difference between the two.
Referring to Fig. 5 A and Fig. 5 B.Combined radiating component disclosed by second embodiment of the invention and above-mentioned the
The architectural difference of the combined radiating component disclosed by one embodiment is, the second heat abstractor 300 of second embodiment, is to set
Put on adapter 430, and the second heat abstractor 300 has a coldplate 310 and one second heat sink 320.Wherein coldplate
310 have and form multiple runners 313 on one first relative face 311 and one second face 312, and the first face 311.And coldplate
310 have one second water inlet 314 and one second outlet 315.Noticeable thing, runner 313 is to be divided into left and right two
Point, and be interconnected in the position of bottom, the second water inlet 314 is the runner 313 connecting a part wherein, and second goes out
The mouth of a river 315 is the runner 313 connecting in another part.
Hold, the second heat sink 320 is the first face 311 being attached to coldplate 310 with wherein one side, airtight to constitute
Chamber, and the relative another side of the second heat sink 320 is incorporated on adapter 430, the wherein second heat sink 320 and cooling
Plate 310 can mutually attach in a welding manner, such as diffusion welding (DW), tin cream weldering, spot welding etc., is not limited in this.
Referring to Fig. 5 C.Wherein, when adapter 430 is electrically plugged on circuit board 420, the second water inlet 314
It is to be fed through casing 410 with the second outlet 315 and exposes outside casing 410, so that connecting pipeline (not shown), make
Two water inlets 314 can input in the airtight chamber that cryogenic liquid is constituted to the second heat sink 320 with coldplate 310, warp respectively
Cross the runner 313 of left and right two parts, then the high-temp liquid adsorbing heat energy is discharged by the second outlet 315, formed and there is heat exchange
The water-cooled row of effect, makes the temperature rapid decrease on the second heat sink 320, and then makes adapter 430 reach effect of radiating.
Referring to Fig. 6 to Fig. 7.Additionally, in order to possess more excellent radiating effect, the second radiating dress of the present embodiment
Put 300 and can install a radiating fin group 330, one second fan 340 and one second lid 350 additional, wherein radiating fin group 330 is patch
It is attached on the second face 312 of coldplate 310, and is be combined with each other in the way of welding or coated tin cream, make radiating fin group
330 with the heat conductivity of coldplate 310 more preferably.Second fan 340 is to be installed in the second lid 350, and corresponds in radiating
Fins group 330, the second lid 350 covers coldplate 310, the second heat sink 320, radiating fin group 330 and the second fan
340, when the second fan 340 produces an air-flow, radiating fin group 330 and the second fan 340 can assist the second heat abstractor 300
Faster adapter 430 is radiated, contribute to lifting the heat exchange action with outside air, to reach more preferable radiating
Efficiency and heat radiation function.
Referring to shown in Fig. 8.Additionally, in order to possess more excellent radiating effect, various embodiments of the present invention compound
Formula radiating subassembly separately optionally installs a water-cooling type radiator 500 additional, is sticked in an electronic components (example of circuit board 420
As CPU) on, wherein water-cooling type radiator 500 is a water-cooled pump, and water-cooling type radiator 500 has the 3rd water inlet 510 He
One the 3rd outlet 520, two pipelines are fed through casing 410 and are connected to the 3rd water inlet 510 and the 3rd outlet 520
On, and water-cooling type radiator 500 is identical with the function mode of above-mentioned pump 140, therefore can be to zero group of the electronics on circuit board 420
Part carries out cooling effect, to reach the purpose of radiating, therefore applicant here does not repeat to repeat.
The illustration of each embodiment disclosed by the invention described above, should be clear from the combined heat radiating group of the present invention
Part is by by the design of water-cooled pump and water-cooled row of modular, it is possible to resolve commonly use not good the asking of suitability of water-cooled power converter
Topic.
Compare down with prior art, the combined radiating component of the present invention is not arrange module merely with water-cooled pump with water-cooled
The design changed, the heat radiation function to have reached, also can radiating work(according to needed for the actual caloric value of electronic components is allocated
Rate, to meet the demand of different users, and more meets economic benefit.Meanwhile, connect using the water route that water-cooled pump is arranged with water-cooled
Mouth is arranged on the design outside casing, makes to produce the problem of leak in casing, prevents the electronic components in casing because of leakage
Water and cause damage, to reach the effect of protection.
Although embodiments of the invention are disclosed above described, so it is not limited to the present invention, any be familiar with related art techniques
Person, without departing from the spirit and scope of the present invention, such as according to the shape described in the present patent application scope, construction, feature and number
, when doing a little change, the therefore scope of patent protection of the present invention must be regarding claim institute circle appended by this specification for amount
The person of determining is defined.
Claims (9)
1. a kind of combined radiating component, is useful in an electronic installation, and described electronic installation has a casing, is arranged on described machine
A circuit board in shell and the adapter being electrically plugged on described circuit board, the wherein one side of described casing has out
Mouth is it is characterised in that described combined radiating component includes:
One first heat abstractor, is arranged on the described side of described casing, and corresponding described opening, described first radiating dress
Put and have:
One body;
One first fan, is installed in described body and in the face of described opening;
One first heat sink, is installed in the one side of described body, and described first heat sink has at least one groove;And
At least one pump, is contained in the described groove of described first heat sink, described pump has one first water inlet and one
First outlet, and described first water inlet and described first outlet are to expose outside described first heat sink;And
One second heat abstractor, is arranged on described adapter, and described second heat abstractor has:
One coldplate, has one first relative face and one second face, and one first face has multiple fins that interval is erect, with
Constitute multiple runners, described coldplate has one second water inlet and one second outlet, is connected to the plurality of runner,
Wherein said second water inlet and described second outlet are to expose outside described casing through described casing;
One second heat sink, is attached to described second face of described coldplate, described second heat sink is with phase with wherein one side
To another side be fitted in described adapter;And
One first lid, is arranged on the described side of described second heat sink, and covers residence and state coldplate, close to constitute one
Closed chamber room.
2. combined radiating component according to claim 1, it is characterised in that also including a water-cooling type radiator, is sticked
On electronic components of described circuit board, described water-cooling type radiator has one the 3rd water inlet and one the 3rd outlet,
Two pipelines pass through described casing and are connected to described 3rd water inlet and described 3rd outlet.
3. combined radiating component according to claim 1 is it is characterised in that described second heat sink and described coldplate
Material be copper alloy.
4. combined radiating component according to claim 1 is it is characterised in that described second heat sink and described coldplate
It is to be combined with each other with welding manner.
5. a kind of combined radiating component, is useful in an electronic installation, and described electronic installation has a casing, is arranged on described machine
A circuit board in shell and the adapter being electrically plugged on described circuit board, the wherein one side of described casing has out
Mouth is it is characterised in that described combined radiating component includes:
One first heat abstractor, is arranged on the described side of described casing, and corresponding described opening, described first radiating dress
Put and have:
One body;
One first fan, is installed in described body and in the face of described opening;
One first heat sink, is installed in the one side of described body, and described first heat sink has at least one groove;And
At least one pump, is contained in the described groove of described first heat sink, described pump has one first water inlet and one
First outlet, and described first water inlet and described first outlet are to expose outside described first heat sink;And
One second heat abstractor, is arranged on described adapter, and described second heat abstractor has:
One coldplate, has one first relative face and one second face, and one first face has multiple runners, described coldplate tool
There are one second water inlet and one second outlet, be connected to the plurality of runner, wherein said second water inlet and described
Second outlet is to expose outside described casing through described casing;And
One second heat sink, is covered in described first face of described coldplate with wherein one side, to constitute an airtight chamber, and
Described second heat sink is fitted in described adapter with relative another side.
6. combined radiating component according to claim 5, it is characterised in that also including a water-cooling type radiator, is sticked
On electronic components of described circuit board, described water-cooling type radiator has one the 3rd water inlet and one the 3rd outlet,
Two pipelines pass through described casing and are connected to described 3rd water inlet and described 3rd outlet.
7. combined radiating component according to claim 5 it is characterised in that described second heat abstractor also include one dissipate
Hot fins group, one second fan and one second lid, described radiating fin group is attached on described second face of described coldplate,
Described second fan is provided in described radiating fin group, and described second lid covers described coldplate, described second radiating
Plate, described radiating fin group and described second fan.
8. combined radiating component according to claim 5 is it is characterised in that described second heat sink and described coldplate
Material be copper alloy.
9. combined radiating component according to claim 5 is it is characterised in that described second heat sink and described coldplate
It is to be combined with each other with welding manner.
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CN201310345083.3A CN104349648B (en) | 2013-08-09 | 2013-08-09 | Combined radiating component |
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CN104349648B true CN104349648B (en) | 2017-03-01 |
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TWI615088B (en) * | 2016-01-14 | 2018-02-11 | 訊凱國際股份有限公司 | Electronic system |
CN105975018B (en) * | 2016-06-13 | 2022-12-06 | 安徽四创电子股份有限公司 | Expandable processing device |
CN108806349A (en) * | 2018-06-29 | 2018-11-13 | 重庆电子工程职业学院 | computer network teaching platform and system |
Citations (3)
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CN1266213A (en) * | 1999-11-01 | 2000-09-13 | 董广计 | Microcomputer heat radiation system |
CN101311879A (en) * | 2007-05-24 | 2008-11-26 | 华硕电脑股份有限公司 | Radiating module and electronic device possessing the radiating module |
CN202771361U (en) * | 2012-09-14 | 2013-03-06 | 哈尔滨学院 | Circulating liquid-cooled server cooling system |
Family Cites Families (1)
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US6965513B2 (en) * | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1266213A (en) * | 1999-11-01 | 2000-09-13 | 董广计 | Microcomputer heat radiation system |
CN101311879A (en) * | 2007-05-24 | 2008-11-26 | 华硕电脑股份有限公司 | Radiating module and electronic device possessing the radiating module |
CN202771361U (en) * | 2012-09-14 | 2013-03-06 | 哈尔滨学院 | Circulating liquid-cooled server cooling system |
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