CN206402627U - A motherboard with good heat dissipation - Google Patents

Abstract

The utility model discloses a mounting mainboard with good heat dissipation, which relates to the field of electronic components and includes a mainboard body, a microprocessor and a heat dissipation base. The mainboard body includes a circuit board and a device installation interface. An air-cooling device and a water-cooling device are provided, the air-cooling device includes a fan, a ventilation duct and an air outlet, the air outlet and the fan are respectively provided on both sides of the ventilation duct, the water-cooling device includes a water pump, a cooling water pipe and a circulating water pipe, The circulating water pipe is connected to the water pump, the fan and the water pump are connected to the microprocessor through the controller, a heat conduction layer is provided at the bottom of the installation main board body, and the ventilation pipes and heat dissipation water pipes are arranged at intervals in the lower part of the heat conduction layer. There is a temperature sensor on the installation board body, and the temperature sensor is connected to the microprocessor. This type of installation board with good heat dissipation has a simple structure and can dissipate heat through self-dissipation, air-cooling device and water-cooling device respectively. The effect is good, it is very practical, and it is worth promoting.

Description

A motherboard with good heat dissipation

technical field

The utility model relates to the field of electronic components, in particular to a mounting board with good heat dissipation.

Background technique

The installation motherboard used in electrical appliances usually integrates a circuit composed of a large number of electronic components on the circuit board. The circuit board is installed in a relatively small sealed case. Components will generate a lot of heat when they are working. If effective technical measures are not taken to dissipate heat from the main board, especially the power components, the electronic components often work under overheating conditions, and the service life of the main board will inevitably be reduced. Affected, and even cause the installed motherboard to burn due to overheating. At present, in order to solve this problem, there have been beneficial explorations on the market for installing motherboards: a kind of installing motherboard, which is provided with heat dissipation holes on the two side plates of the shell, and heat dissipation fins are arranged at the heat dissipation holes to achieve heat dissipation. purpose, but the volume of the heat sink is too large, and it is installed on both sides. If it is installed in the small space of the shell where the motherboard is installed, it will inevitably squeeze the installation space of the circuit board and electronic components, causing more trouble for the circuit installation. Big inconvenience; and, although this heat sink can carry out overall heat dissipation to the interior of mounting motherboard, there is no special heat dissipation device for power components, so the heat dissipation effect is not good.

Contents of the invention

The purpose of this utility model is to provide a mounting board with good heat dissipation, so as to solve the above-mentioned multiple defects caused by the prior art.

An installation motherboard with good heat dissipation, including an installation motherboard body, a microprocessor and a heat dissipation base, the installation motherboard body includes a circuit board and a device installation interface, and an air cooling device and a water cooling device are arranged in the heat dissipation base. The air-cooling device includes a fan, a ventilation duct and an air outlet. The air outlet and the fan are respectively provided on both sides of the ventilation duct. The water-cooling device includes a water pump, a cooling water pipe and a circulating water pipe. The circulating water pipe is connected to the water pump. The fan The water pump is connected to the microprocessor through the controller, the bottom of the installation main board body is provided with a heat conduction layer, the ventilation pipes and heat dissipation water pipes are arranged at intervals in the lower part of the heat conduction layer, and the installation main board body is provided with a temperature sensor. The temperature sensor is connected with the microprocessor.

Preferably, the circulating water pipe is vertically arranged with the cooling water pipe, and the position of the circulating water pipe is higher than the ventilation pipe.

Preferably, the heat conduction layer includes a graphite layer and a copper sheet layer stacked.

Preferably, the inner surface of the heat dissipation base is provided with sound-absorbing holes.

Preferably, a waterproof membrane is provided on the outside of the heat dissipation base, and a circulating fluid is provided in the circulating water pipe and the heat dissipation water pipe.

Beneficial effects of the utility model: the installation of the main board with good heat dissipation can dissipate heat through self-radiation, air-cooling device and water-cooling device through this structural design, self-radiation can dissipate heat through the surface of the main board body and the air, and the fan will It is used to realize air-cooled heat dissipation and provide second-level heat dissipation intensity. When the temperature is too high, water-cooled heat dissipation can be realized through a water pump to further speed up heat dissipation. The heat dissipation device is also equipped with a microprocessor. The temperature inside can automatically adjust the cooling device and save electric energy, and the whole cooling module is installed on the lower part of the installation board body, which is convenient for maintenance work and daily monitoring, and realizes the balance between resource saving and temperature control. It is worth promoting. The circulating water pipe and the cooling water pipe Vertically arranged, the position of the circulating water pipe is higher than that of the ventilation pipe. Through this design, the circulating fluid can always circulate between the circulating water pipe and the cooling water pipe without referencing an external water source. The heat conduction layer includes stacked graphite layers and copper sheets Layer, through the copper sheet layer and graphite layer, the heat generated by installing the main board body can be quickly transferred to the base, and the inner surface of the heat dissipation base is provided with a sound-absorbing hole, through which the noise generated by the fan and the water pump during heat dissipation can be reduced. The heat dissipation base is provided with a waterproof membrane, and the circulating water pipe and the heat dissipation water pipe are provided with a circulating fluid. The waterproof membrane can prevent liquid leakage from causing device damage and dangerous situations. The circulating fluid can provide more efficient heat dissipation than water.

Description of drawings

FIG. 1 is a structural schematic diagram of a mounting board with good heat dissipation described in the present invention.

Fig. 2 is a top view of a heat dissipation base mounted on a motherboard with good heat dissipation according to the utility model.

Among them: 1—mainboard installation, 2—microprocessor, 3—heat dissipation base, 4—circuit board, 5—device installation interface, 6—fan, 7—ventilation duct, 8—air outlet, 9—water pump, 10— Heat dissipation water pipe, 11—circulating water pipe, 12—temperature sensor, 13—copper sheet layer, 14—graphite layer.

detailed description

In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific embodiments.

As shown in Fig. 1 and Fig. 2, a kind of installation motherboard with good heat dissipation performance includes installation motherboard body 1, microprocessor 2 and heat dissipation base 3, and described installation motherboard body 1 includes circuit board 4 and device installation interface 5, so An air cooling device and a water cooling device are provided in the heat dissipation base 3, and the air cooling device includes a fan 6, a ventilation duct 7 and an air outlet 8, and the air outlet 8 and the fan 6 are respectively provided with both sides of the ventilation duct 7. The water cooling device includes a water pump 9, a heat dissipation water pipe 10 and a circulating water pipe 11, the circulating water pipe 11 is connected to the water pump 9, the fan 6 and the water pump 9 are connected to the microprocessor 2 through the controller, and the bottom of the main board body 1 is provided with a heat conduction Layer, the ventilation pipes 7 and heat dissipation water pipes 10 are arranged at intervals in the lower part of the heat conduction layer, and a temperature sensor 12 is provided on the main board body 1 of the installation, and the temperature sensor 12 is connected to the microprocessor 2 . This kind of installation motherboard with good heat dissipation, through this structural design, heat dissipation is carried out through self-radiation, air-cooling device and water-cooling device, self-radiation is through the surface of the installation motherboard body 1 contacting the air to dissipate heat, and the fan is used to realize air-cooling and heat dissipation , to provide the second level of heat dissipation intensity, when the temperature is too high, water cooling can be realized through the water pump 9, and the heat dissipation speed can be further accelerated. The heat dissipation device is also provided with a microprocessor 2, and the microprocessor 2 analyzes the temperature , realize automatic adjustment of heat dissipation device, save electric energy, and the entire heat dissipation module is installed on the lower part of the main board body 1, which is convenient for maintenance work and daily monitoring, and achieves a balance between resource saving and temperature control, which is worth popularizing.

In this embodiment, the circulating water pipe 11 is vertically arranged with the cooling water pipe 10, and the position of the circulating water pipe 11 is higher than the ventilation pipe 7. With this design, the circulating fluid can always circulate between the circulating water pipe 10 and the cooling water pipe 11 , without referencing an external water source, the heat conduction layer includes a stacked graphite layer 13 and a copper sheet layer 14, through which the heat generated by the main board body 1 can be quickly transferred to the base, and the heat dissipation The inner surface of the base 3 is provided with a sound-absorbing hole, through which the noise generated by the fan 6 and the water pump 9 during heat dissipation can be reduced. , through the waterproof membrane, it can avoid the damage of the device caused by liquid leakage, and the occurrence of dangerous situations. The circulating fluid can provide more efficient heat dissipation than water.

Based on the above, the utility model has a simple structure for mounting a main board with good heat dissipation, and radiates heat through self-radiation, air-cooling devices and water-cooling devices. When the temperature is too high, water cooling and heat dissipation can be realized through a water pump. The temperature in the device can automatically adjust the heat dissipation device, which can save electric energy and realize the balance between resource saving and temperature control, which is worthy of popularization.

It can be known from technical knowledge that the utility model can be realized through other implementations without departing from its spirit or essential features. Accordingly, the above-disclosed embodiments are, in all respects, illustrative and not exclusive. All changes within the scope of the utility model or within the range equivalent to the utility model are included in the utility model.

Claims (5)

1. the good installation mainboard of a kind of thermal diffusivity, it is characterised in that including installing mainboard body, microprocessor and heat dissipation base, The installation mainboard body is included in wiring board and device mounting interface, the heat dissipation base provided with air cooling equipment and water cooling dress Put, the air cooling equipment includes blower fan, ventilation shaft and air outlet, and the air outlet and blower fan are respectively equipped with ventilation shaft two Side, the water cooling plant includes water pump, heat dissipation pipe and circulating water pipe, the circulating water pipe and water pump connection, the blower fan and Water pump by controller connect microprocessor, the installation mainboard body bottom portion be provided with heat-conducting layer, the ventilation shaft and, radiating Water pipe is intervally arranged in heat-conducting layer bottom, and the installation mainboard body is provided with temperature sensor, the temperature sensor with it is micro- Processor is connected.

2. a kind of good installation mainboard of thermal diffusivity according to claim 1, it is characterised in that：The circulating water pipe and radiating Water pipe is vertically arranged, and the circulating water pipe position is higher than ventilation shaft.

3. a kind of good installation mainboard of thermal diffusivity according to claim 1, it is characterised in that：The heat-conducting layer includes stacking Graphite linings and the copper sheet layer of setting.

4. a kind of good installation mainboard of thermal diffusivity according to claim 1, it is characterised in that：Table on the inside of the heat dissipation base Face is provided with bloop.

5. a kind of good installation mainboard of thermal diffusivity according to claim 1, it is characterised in that：Set outside the heat dissipation base There is waterproof membrane, the circulating water pipe is with being provided with circulation fluid in heat dissipation pipe.