CN104349648A - Composite type heat radiating assembly - Google Patents
Composite type heat radiating assembly Download PDFInfo
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- CN104349648A CN104349648A CN201310345083.3A CN201310345083A CN104349648A CN 104349648 A CN104349648 A CN 104349648A CN 201310345083 A CN201310345083 A CN 201310345083A CN 104349648 A CN104349648 A CN 104349648A
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- heating panel
- coldplate
- casing
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Abstract
The invention relates to a composite type heat radiating assembly. The composite type heat radiating assembly is arranged on an electronic device, and the electronic device is provided with a machine casing, a circuit board and an adapter card, wherein the adapter card is electrically inserted into the circuit board. The composite type heat radiating assembly comprises a first heat radiating device and a second heat radiating device, wherein the first heat radiating device is arranged at the outside surface of the machine casing, and the second heat radiating device is arranged on the adapter card. The composite type heat radiating assembly has the advantage that when the electronic device runs, the first heat radiating device and the second heat radiating device are used for radiating the heat of the electronic device in a water cooling way, and the required heat radiating power is adjusted according to the actual heating amount of the electronic device, so the requirements of different users are met, and the economic benefits are realized.
Description
[technical field]
The present invention relates to a kind of heat dissipation equipment, particularly relate to a kind of combined radiating component be made up of multiple heat abstractor.
[background technology]
Flourish along with high-tech industry in recent years, the volume of the electronic building brick in electronic product is more tending towards microminiaturization, and closeness in unit are is also more and more high, overall efficiency constantly strengthens especially, and under these factors, also the radiator that can ensure to have enough cooling capacities in narrow zone is needed, the working temperature of each electronic components in electronic installation is allowed to remain in rational scope, to promote the heat exchange of itself and environment, and then protection electronic components, electronic components generation damage or computer system is avoided to work as the problems such as machine because of overheated.
The radiating mode commonly used is broadly divided into ventilation type and water-cooled two kinds, and wherein air-cooled radiating mode normally adopts the spare part of radiator to electronic installation to dispel the heat.Commonly use radiator and comprise the body with multiple radiating fin, in order to improving heat radiation efficiency, usually also can install a fan additional, it is fixed on radiating fin.Commonly use radiator in use, be fitted on heat generating component with the bottom surface of body, be such as central processing unit (Central Processing Unit, or graphic process unit (Graphic Processing Unit CPU), etc. GPU) can produce on the heat generating component of a large amount of used heat during running, thermal source is made to be passed to radiating fin by body by conduction of heat, the air-flow produced by fan again makes thermal source disperse, and then heat generating component is produced to the effect cooled.
In addition, commonly use that water-cooled power converter is arranged primarily of a water-cooled, a water-cooled pump is composed in series, wherein be filled with cooling fluid in water-cooled row, and be set directly on corresponding heating electronic package, directly to draw the heat energy that heating electronic package distributes, and water-cooled row is connected with water-cooled pump by conduit, thus, namely the running by water-cooled pump makes cooling fluid flowing in water-cooled row, carries out heat exchange circulation by this.
But existing water-cooled power converter is all corresponding designs for the size of the electronic components of various type electronic installation and position, therefore the configuration relation of water-cooled row and water-cooled pump and usage quantity will be forced to fix and cannot change.Thus, if when will dispel the heat for the electronic components of different heat amount, commonly use water-cooled power converter cannot do full blast configuration according to the actual caloric value of electronic components.
That is, if for the larger electronic components of caloric value, the hydraulic pressure commonly using water-cooled power converter of fixed configurations will be not enough to dispel the heat timely to electronic components; If for the electronic components that caloric value is less, can be antipyretic in time although commonly use water-cooled power converter, the running of excessive hydraulic pressure will produce unnecessary noise.
[summary of the invention]
In view of above problem, the invention provides a kind of combined radiating component, thus solve the not good problem of suitability commonly using water-cooled power converter.
In order to solve the problems of the technologies described above, combined radiating component of the present invention is useful in electronic installation, and the adapter that this electronic installation has casing, is arranged on the circuit board in casing and electrically plugs on circuit boards, and the wherein side mask of casing has an opening.Combined radiating component includes one first heat abstractor and one second heat abstractor, wherein the first heat abstractor is arranged on the lateral surface of casing, and corresponding opening, the first heat abstractor has a body, one first fan, one first heating panel and at least one pump.First fan is installed on body also in the face of opening, first heating panel is the side being installed in body, and the first heating panel has at least one groove, and pump is contained in the groove of the first heating panel, and pump has the first water inlet and the first delivery port, be expose outside the first heating panel.
Second heat abstractor is arranged on adapter, and it has a coldplate, one second heating panel and one first lid, and the first surface of coldplate is provided with the multiple fins erect at interval, thus forms multiple runner.Coldplate has the second water inlet and the second delivery port, is be connected to runner, and wherein the second water inlet and the second delivery port are through casing and expose outside casing.Second heating panel is attached to second of coldplate with a wherein side, and is fitted in adapter with relative another side.First lid is arranged on the side of the second heating panel, and covers coldplate, to form airtight chamber.
Further, the combined radiating component of the invention described above, also comprises a water-cooling type radiator, is sticked on an electronic components of circuit board, water-cooling type radiator has one the 3rd water inlet and one the 3rd delivery port, and two pipelines pass casing and are connected to the 3rd water inlet and the 3rd delivery port.
Further, the combined radiating component of the invention described above, wherein the material of the second heating panel and coldplate is copper alloy.
Further, the combined radiating component of the invention described above, wherein the second heating panel and coldplate be combined with each other with welding manner.
The present invention separately provides a kind of combined radiating component, is be useful in electronic installation, and the adapter that this electronic installation has casing, is arranged on the circuit board in casing and electrically plugs on circuit boards, and the wherein side mask of casing has an opening.Combined radiating component includes one first heat abstractor and one second heat abstractor, wherein the first heat abstractor is arranged on the lateral surface of casing, and corresponding opening, the first heat abstractor has a body, one first fan, one first heating panel and at least one pump.First fan is installed on body also in the face of opening, first heating panel is the side being installed in body, and the first heating panel has at least one groove, and pump is contained in the groove of the first heating panel, and pump has the first water inlet and the first delivery port, be expose outside the first heating panel.
Second heat abstractor is arranged on adapter, and it has a coldplate, one second heating panel, and the first surface of coldplate has multiple runner.Coldplate has the second water inlet and the second delivery port, is be connected to runner, and wherein the second water inlet and the second delivery port are through casing and expose outside casing.Second heating panel is attached to the first surface of coldplate with a wherein side, to form airtight chamber, and is fitted in adapter with the another side that the second heating panel is relative.
Further, the combined radiating component of the invention described above, also comprises a water-cooling type radiator, is sticked on an electronic components of circuit board, water-cooling type radiator has one the 3rd water inlet and one the 3rd delivery port, and two pipelines pass casing and are connected to the 3rd water inlet and the 3rd delivery port.
Further, the combined radiating component of the invention described above, wherein the second heat abstractor also comprises a radiating fin group, one second fan and one second lid, radiating fin group is attached on second of coldplate, second fan is arranged in radiating fin group, and the second lid covers coldplate, the second heating panel, radiating fin group and the second fan.
Further, the combined radiating component of the invention described above, wherein the material of the second heating panel and coldplate is copper alloy.
Further, the combined radiating component of the invention described above, wherein the second heating panel and coldplate be combined with each other with welding manner.
Effect of the present invention is, combined radiating component is the design not only utilizing water-cooled pump and water-cooled row of modular, the heat radiation function reached, also can allocate required heat radiation power according to the actual caloric value of electronic components, to meet the demand of different users, and more meet economic benefit.Meanwhile, the water route interface utilizing water-cooled pump and water-cooled to arrange is arranged on the design of casing outside, making can not produce leakage water problem in casing, preventing the electronic components in casing from causing damage because leaking, to reach the effect of protection.
Feature for the present invention, implementation and effect, hereby coordinate and to be graphicly described in detail as follows as most preferred embodiment.
[accompanying drawing explanation]
Fig. 1 is the combined radiating component of first embodiment of the invention and the decomposing schematic representation of electronic installation.
Fig. 2 is the combined radiating component of first embodiment of the invention and the combination schematic diagram of electronic installation.
Fig. 3 is the combination schematic diagram of the first heat abstractor of the combined radiating component of first embodiment of the invention.
Fig. 4 A is the decomposing schematic representation of the second heat abstractor of the combined radiating component of first embodiment of the invention.
Fig. 4 B is the second heat abstractor of the combined radiating component of first embodiment of the invention and the combination schematic diagram of adapter.
Fig. 4 C is the water-cooled flow passage route schematic diagram in the second heat abstractor of the combined radiating component of first embodiment of the invention.
Fig. 5 A is the decomposing schematic representation of the second heat abstractor of the combined radiating component of second embodiment of the invention.
Fig. 5 B is the second heat abstractor of the combined radiating component of second embodiment of the invention and the combination schematic diagram of adapter.
Fig. 5 C is the water-cooled flow passage route schematic diagram of the second heat abstractor of the combined radiating component of second embodiment of the invention.
Fig. 6 is the second heat radiation of the combined radiating component of second embodiment of the invention and the decomposing schematic representation of radiating fin group, the second fan and the second lid.
Fig. 7 is the combination schematic diagram of the second heat abstractor installing radiating fin group of the combined radiating component of second embodiment of the invention, the second fan and the second lid.
Fig. 8 is the combined radiating component of second embodiment of the invention and the combination schematic diagram of electronic installation.
Primary clustering symbol description:
100 first heat abstractor 210 coldplates
110 body 211 first surfaces
120 first 212 second, fans
130 first heating panel 213 fins
131 groove 214 runners
140 pump 215 second water inlets
141 first water inlet 216 second delivery ports
142 first delivery port 220 second heating panels
200 second heat abstractor 230 first lids
300 second heat abstractor 350 second lids
310 coldplate 400 electronic installations
311 first surface 410 casings
312 second face 411 openings
313 runner 420 circuit boards
314 second water inlet 430 adapters
315 second delivery port 500 water-cooling type radiators
320 second heating panel 510 the 3rd water inlets
330 radiating fin group 520 the 3rd delivery ports
340 second fan 530 pipelines
[embodiment]
Please refer to the decomposing schematic representation of combined radiating component shown in Fig. 1 to Fig. 2 disclosed by first embodiment of the invention and electronic installation and combination schematic diagram.The combined radiating component of the present embodiment is useful in an electronic installation 400, and this electronic installation 400 has a casing 410, is arranged on the circuit board 420 in casing 410 and is electrically plugged in the adapter 430 on this circuit board 420, and the wherein side mask of casing 410 has an opening 411.Wherein, above-mentioned electronic installation 400 can be computer system host or machine box for server etc., and above-mentioned circuit board 420 is namely similar to commonly using the electronic components configured in computer, the preset function and application program etc. of computer can be performed equally, therefore applicant does not add to illustrate at this, is only described in detail for electronic components involved in the present embodiment.
Referring to Fig. 3, the combination schematic diagram of the first heat abstractor of the combined radiating component disclosed by first embodiment of the invention.The combined radiating component of the present embodiment includes one first heat abstractor 100 and one second heat abstractor 200, wherein the first heat abstractor 100 is arranged on the lateral surface of casing 410, and correspondence is in the position of opening 411, the first heat abstractor 100 has body 110,1 first fan 120,1 first heating panel 130 and an at least one pump 140.First fan 120 is installed on body 110, and the axial direction of the first fan 120 is in the face of in opening 411 position of casing 410, make the first fan 120 by opening 411, hot gas in casing 410 is extracted out or blows in casing 410, allow air and outside air in casing 410 produce the effect of mutual circulation, and reach effect of quick heat radiating.
Hold, first heating panel 130 is installed on a side of body 110, and position is in the bottom of the first fan 120, and the first heating panel 130 has at least one groove 131, be arranged on the relative another side of the first fan 120, and pump 140 is installed in the groove 131 bottom the first heating panel 130, and the bottom of pump 140 has one first water inlet 141 and one first delivery port 142, and the first water inlet 141 and the first delivery port 142 expose outside the first heating panel 130, so that connecting line (not shown), make the first water inlet 141 can input a cryogenic liquid (such as pure water, distilled water or cooling fluid) in pump 140, and the first delivery port 142 can discharge the high-temp liquid having adsorbed heat energy, form the effect of cool cycles, to reduce the temperature of electronic installation 400, reach effect of heat radiation.Wherein, the first heating panel 130 described in the present embodiment, it can be the good material of thermal conductivity, such as copper alloy, aluminium alloy or ferroalloy etc., and not as limit.
It should be noted that, pump 140 disclosed by the present invention is water-cooled pump, its quantity used is 3, and groove 131 quantity of correspondence is also similarly 3, and each pump 140 can increase cooling power in the mode of series connection mutually, and the quantity of pump 140 of the present invention is not confined to the contained quantity of the present embodiment, person skilled in the art person can the corresponding configuration quantity changing pump 140 of the present invention according to the actual requirements.
Referring to Fig. 4 A to Fig. 4 B, the second heat abstractor of the combined radiating component disclosed by first embodiment of the invention and the decomposing schematic representation of adapter and combination schematic diagram.Second heat abstractor 200 of the present embodiment is arranged on adapter 430, and the second heat abstractor 200 has coldplate 210,1 second heating panel 220 and one first lid 230.Wherein coldplate 210 has relative first surface 211 and one second face 212, and first surface 211 is provided with the multiple fins 213 erect at interval, thus forms multiple runner 214.And coldplate 210 has one second water inlet 215 and one second delivery port 216.Noticeable thing, runner 214 is divided into left and right two parts, and be interconnected in the position of bottom, and the second water inlet 215 is the runners 214 being communicated with a part wherein, and the second delivery port 216 is communicated with the runner 214 at another part.
Wherein, second heating panel 220 is attached to the first surface 211 of coldplate 210 with a wherein side, and be combined on adapter 430 with relative another side, wherein the second heating panel 220 can attach in a welding manner mutually with coldplate 210, such as diffusion welding (DW), tin cream weldering, spot welding etc., be not confined to this.
Referring to Fig. 4 C, the water-cooled flow passage route schematic diagram in the second heat abstractor of the combined radiating component disclosed by first embodiment of the invention.Further instruction, first lid 230 of the present embodiment is arranged on the side of the second heating panel 220, and the first lid 230 fastens mutually with coldplate 210, makes the first lid 230 cover the end face of coldplate 210 with all around, to form airtight chamber.Wherein when adapter 430 is electrically plugged on circuit board 420, second water inlet 215 and the second delivery port 216 are fed through casing 410 and expose at casing 410 outside, so that connecting line (not shown), in second water inlet 215 can be inputted airtight chamber that cryogenic liquid to the first lid 230 and coldplate 210 form, respectively through the runner 214 of left and right two part, the high-temp liquid with thermal source is discharged again by the second delivery port 216, form the water-cooled row with heat exchange action, temperature on second heating panel 220 is declined fast, and then make adapter 430 reach effect of heat radiation.
In addition, in order to possess more excellent radiating effect, the combined radiating component of the present embodiment separately optionally installs a water-cooling type radiator 500 additional, it is sticked on an electronic components (such as CPU) of circuit board 420, wherein water-cooling type radiator 500 is a water-cooled pump, and water-cooling type radiator 500 has one the 3rd water inlet 510 and one the 3rd delivery port 520, two pipelines are fed through casing 410 and are connected on the 3rd water inlet 510 and the 3rd delivery port 520, and water-cooling type radiator 500 is identical with the function mode of above-mentioned pump 140, therefore cooling effect can be carried out to the electronic components on circuit board 420, to reach the object of heat radiation, therefore applicant does not repeat to repeat at this.
The structural similarity of the overall structure of the combined radiating component disclosed by the second embodiment of the present invention and the radiating module of above-mentioned first embodiment, therefore following content is only described in detail for difference place between the two.
Referring to Fig. 5 A and Fig. 5 B.The architectural difference of the combined radiating component disclosed by second embodiment of the invention and the combined radiating component disclosed by above-mentioned first embodiment is, second heat abstractor 300 of the second embodiment, be be arranged on adapter 430, and the second heat abstractor 300 have coldplate 310 and one second heating panel 320.Wherein coldplate 310 has relative first surface 311 and one second face 312, and first surface 311 is formed multiple runner 313.And coldplate 310 has one second water inlet 314 and one second delivery port 315.Noticeable thing, runner 313 is divided into left and right two parts, and be interconnected in the position of bottom, and the second water inlet 314 is the runners 313 being communicated with a part wherein, and the second delivery port 315 is communicated with the runner 313 at another part.
Hold, second heating panel 320 is attached to the first surface 311 of coldplate 310 with a wherein side, to form airtight chamber, and the relative another side of the second heating panel 320 is combined on adapter 430, wherein the second heating panel 320 can attach in a welding manner mutually with coldplate 310, such as diffusion welding (DW), tin cream weldering, spot welding etc., be not confined to this.
Referring to Fig. 5 C.Wherein, when adapter 430 is electrically plugged on circuit board 420, second water inlet 314 and the second delivery port 315 are fed through casing 410 and expose at casing 410 outside, so that connecting line (not shown), in second water inlet 314 can be inputted airtight chamber that cryogenic liquid to the second heating panel 320 and coldplate 310 form, respectively through the runner 313 of left and right two part, the high-temp liquid of absorption heat energy is discharged again by the second delivery port 315, form the water-cooled row with heat exchange action, temperature on second heating panel 320 is declined fast, and then make adapter 430 reach effect of heat radiation.
Referring to Fig. 6 to Fig. 7.In addition, in order to possess more excellent radiating effect, second heat abstractor 300 of the present embodiment can install radiating fin group 330,1 second fan 340 and one second lid 350 additional, wherein radiating fin group 330 is attached on the second face 312 of coldplate 310, and with welding or the mode of coated tin cream be combined with each other, make radiating fin group 330 better with the heat conductivity of coldplate 310.Second fan 340 is installed in the second lid 350, and correspondence is in radiating fin group 330, second lid 350 covers coldplate 310, second heating panel 320, radiating fin group 330 and the second fan 340, when the second fan 340 produces an air-flow, radiating fin group 330 and the second fan 340 can assist the second heat abstractor 300 to dispel the heat to adapter 430 faster, contribute to promoting the heat exchange action with outside air, to reach better radiating efficiency and heat radiation function.
Shown in Fig. 8.In addition, in order to possess more excellent radiating effect, the combined radiating component of various embodiments of the present invention separately optionally installs a water-cooling type radiator 500 additional, be sticked on an electronic components (such as CPU) of circuit board 420, wherein water-cooling type radiator 500 is a water-cooled pump, and water-cooling type radiator 500 has one the 3rd water inlet 510 and one the 3rd delivery port 520, two pipelines are fed through casing 410 and are connected on the 3rd water inlet 510 and the 3rd delivery port 520, and water-cooling type radiator 500 is identical with the function mode of above-mentioned pump 140, therefore cooling effect can be carried out to the electronic components on circuit board 420, to reach the object of heat radiation, therefore applicant does not repeat to repeat at this.
Illustrating of each embodiment disclosed by the invention described above, can know and learn that combined radiating component of the present invention is by the design by water-cooled pump and water-cooled row of modular, can solve the problem that the suitability of commonly using water-cooled power converter is not good.
Compare down with prior art, combined radiating component of the present invention is the design not only utilizing water-cooled pump and water-cooled row of modular, the heat radiation function reached, also can allocate required heat radiation power according to the actual caloric value of electronic components, to meet the demand of different users, and more meet economic benefit.Meanwhile, the water route interface utilizing water-cooled pump and water-cooled to arrange is arranged on the design of casing outside, making can not produce leakage water problem in casing, preventing the electronic components in casing from causing damage because leaking, to reach the effect of protection.
Although embodiments of the invention disclose as mentioned above; so and be not used to limit the present invention; anyly have the knack of relevant art; without departing from the spirit and scope of the present invention; such as work as according to shape, structure, feature and the quantity described in the present patent application scope and can do a little change, therefore scope of patent protection of the present invention must be as the criterion depending on the claim person of defining appended by this specification.
Claims (9)
1. a combined radiating component, be useful in an electronic installation, the adapter that described electronic installation has a casing, is arranged on the circuit board in described casing and is electrically plugged on described circuit board, the wherein side mask of described casing has an opening, it is characterized in that, described combined radiating component comprises:
One first heat abstractor, is arranged on the described side of described casing, and corresponding described opening, described first heat abstractor has:
One body;
One first fan, is installed in described body also in the face of described opening;
One first heating panel, is installed in a side of described body, and described first heating panel has at least one groove; And
At least one pump, is contained in the described groove of described first heating panel, and described pump has one first water inlet and one first delivery port, is expose outside described first heating panel; And
One second heat abstractor, is arranged on described adapter, and described second heat abstractor has:
One coldplate, there is a relative first surface and one second, one first surface have multiple fins that interval is erect, to form multiple runner, described coldplate has one second water inlet and one second delivery port, be connected to described multiple runner, wherein said second water inlet and described second delivery port are through described casing and expose outside described casing;
One second heating panel, be attached to described second of described coldplate with a wherein side, described second heating panel is fitted in described adapter with relative another side; And
One first lid, is arranged on the described side of described second heating panel, and covers residence and state coldplate, to form an airtight chamber.
2. combined radiating component according to claim 1, it is characterized in that, also comprise a water-cooling type radiator, be sticked on an electronic components of described circuit board, described water-cooling type radiator has one the 3rd water inlet and one the 3rd delivery port, and two pipelines pass described casing and are connected to described 3rd water inlet and described 3rd delivery port.
3. combined radiating component according to claim 1, is characterized in that, the material of described second heating panel and described coldplate is copper alloy.
4. combined radiating component according to claim 1, is characterized in that, described second heating panel and described coldplate be combined with each other with welding manner.
5. a combined radiating component, be useful in an electronic installation, the adapter that described electronic installation has a casing, is arranged on the circuit board in described casing and is electrically plugged on described circuit board, the wherein side mask of described casing has an opening, it is characterized in that, described combined radiating component comprises:
One first heat abstractor, is arranged on the described side of described casing, and corresponding described opening, described first heat abstractor has:
One body;
One first fan, is installed in described body also in the face of described opening;
One first heating panel, is installed in a side of described body, and described first heating panel has at least one groove; And
At least one pump, is contained in the described groove of described first heating panel, and described pump has one first water inlet and one first delivery port, is expose outside described first heating panel; And
One second heat abstractor, is arranged on described adapter, and described second heat abstractor has:
One coldplate, there is a relative first surface and one second, one first surface has multiple runner, described coldplate has one second water inlet and one second delivery port, be connected to described multiple runner, wherein said second water inlet and described second delivery port are through described casing and expose outside described casing; And
One second heating panel, cover the described first surface of described coldplate with a wherein side, to form an airtight chamber, and described second heating panel is fitted in described adapter with relative another side.
6. combined radiating component according to claim 5, it is characterized in that, also comprise a water-cooling type radiator, be sticked on an electronic components of described circuit board, described water-cooling type radiator has one the 3rd water inlet and one the 3rd delivery port, and two pipelines pass described casing and are connected to described 3rd water inlet and described 3rd delivery port.
7. combined radiating component according to claim 5, it is characterized in that, described second heat abstractor also comprises a radiating fin group, one second fan and one second lid, described radiating fin group is attached on described second of described coldplate, described second fan is arranged in described radiating fin group, and described second lid covers described coldplate, described second heating panel, described radiating fin group and described second fan.
8. combined radiating component according to claim 5, is characterized in that, the material of described second heating panel and described coldplate is copper alloy.
9. combined radiating component according to claim 5, is characterized in that, described second heating panel and described coldplate be combined with each other with welding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310345083.3A CN104349648B (en) | 2013-08-09 | 2013-08-09 | Combined radiating component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310345083.3A CN104349648B (en) | 2013-08-09 | 2013-08-09 | Combined radiating component |
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| CN104349648A true CN104349648A (en) | 2015-02-11 |
| CN104349648B CN104349648B (en) | 2017-03-01 |
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| CN201310345083.3A Active CN104349648B (en) | 2013-08-09 | 2013-08-09 | Combined radiating component |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105975018A (en) * | 2016-06-13 | 2016-09-28 | 安徽四创电子股份有限公司 | Expandable processing device |
| CN106973544A (en) * | 2016-01-14 | 2017-07-21 | 讯凯国际股份有限公司 | Electronic system |
| CN108806349A (en) * | 2018-06-29 | 2018-11-13 | 重庆电子工程职业学院 | computer network teaching platform and system |
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| CN1266213A (en) * | 1999-11-01 | 2000-09-13 | 董广计 | Microcomputer heat radiation system |
| US20030117770A1 (en) * | 2001-12-20 | 2003-06-26 | Intel Corporation | Carbon nanotube thermal interface structures |
| CN101311879A (en) * | 2007-05-24 | 2008-11-26 | 华硕电脑股份有限公司 | Radiating module and electronic device possessing the radiating module |
| CN202771361U (en) * | 2012-09-14 | 2013-03-06 | 哈尔滨学院 | Circulating liquid-cooled server cooling system |
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| CN1266213A (en) * | 1999-11-01 | 2000-09-13 | 董广计 | Microcomputer heat radiation system |
| US20030117770A1 (en) * | 2001-12-20 | 2003-06-26 | Intel Corporation | Carbon nanotube thermal interface structures |
| CN101311879A (en) * | 2007-05-24 | 2008-11-26 | 华硕电脑股份有限公司 | Radiating module and electronic device possessing the radiating module |
| CN202771361U (en) * | 2012-09-14 | 2013-03-06 | 哈尔滨学院 | Circulating liquid-cooled server cooling system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106973544A (en) * | 2016-01-14 | 2017-07-21 | 讯凯国际股份有限公司 | Electronic system |
| CN106973544B (en) * | 2016-01-14 | 2019-03-15 | 讯凯国际股份有限公司 | Electronic system |
| CN105975018A (en) * | 2016-06-13 | 2016-09-28 | 安徽四创电子股份有限公司 | Expandable processing device |
| CN108806349A (en) * | 2018-06-29 | 2018-11-13 | 重庆电子工程职业学院 | computer network teaching platform and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104349648B (en) | 2017-03-01 |
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