CN210168376U - Data center water-cooling heat dissipation rack - Google Patents

Data center water-cooling heat dissipation rack Download PDF

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Publication number
CN210168376U
CN210168376U CN201822201119.1U CN201822201119U CN210168376U CN 210168376 U CN210168376 U CN 210168376U CN 201822201119 U CN201822201119 U CN 201822201119U CN 210168376 U CN210168376 U CN 210168376U
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China
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water
cooling
cabinet
layer
cooling board
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CN201822201119.1U
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Chinese (zh)
Inventor
朱成
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HuaiAn Power Supply Co of State Grid Jiangsu Electric Power Co Ltd
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Individual
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Abstract

The utility model provides a data center water-cooling heat dissipation rack, it includes the rack, the rack built-in a plurality of water-cooling board, the water-cooling board include heat-conducting layer, overflowing layer and bearing layer, be equipped with the honeycomb duct between the adjacent water-cooling board, adjacent overflowing layer of honeycomb duct connection, the server is placed in the heat-conducting layer top, the water-cooling board of below passes through the water piping connection water tank, the water tank in be equipped with the cooling water, the mouth of pipe of drain pipe is located the top of the cooling water surface of water, the water-cooling board of top passes through the water piping connection water tank, the inlet tube stretch into the below of the cooling water surface of water, be equipped with. The utility model discloses a water-cooling board absorbs the server heat, simple structure, and the radiating effect is good, has guaranteed the operation of server safety efficient.

Description

Data center water-cooling heat dissipation rack
Technical Field
The utility model belongs to the technical field of radiator equipment for large-scale electrical equipment, especially, data center water-cooling heat dissipation rack.
Background
The data center stores thousands of energy consuming devices, such as high density servers, blade servers, and mass storage devices. Manufacturers of these devices typically require operating environments below 45 degrees. How to provide a good operating environment for these devices becomes a big issue for data centers. In the traditional mode, a server is generally the core of IT industry operation, the operation and the sealing performance of the server are rapidly heated, if the safe operation temperature is exceeded, system breakdown or service life damage can be caused, and a proper cooling system is very important. Most of servers in the prior art adopt a fan to exhaust air to dissipate heat, so that the efficiency is low and the heat dissipation speed is low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a data center water-cooling rack that dispels heat, through the water-cooling board absorption server heat, simple structure, the radiating effect is good, has guaranteed the operation of server safety efficient.
The technical scheme of the utility model is that:
the utility model provides a data center water-cooling heat dissipation rack, it includes the rack, the rack built-in a plurality of water-cooling board, the water-cooling board include heat-conducting layer, overflowing layer and bearing layer, be equipped with the honeycomb duct between the adjacent water-cooling board, adjacent overflowing layer of honeycomb duct connection, the server is placed in the heat-conducting layer top, the water-cooling board of below passes through the water piping connection water tank, the water tank in be equipped with the cooling water, the mouth of pipe of drain pipe is located the top of the cooling water surface of water, the water-cooling board of top passes through the water piping connection water tank, the inlet tube stretch into the below of the cooling water surface of water, be equipped with.
Furthermore, a refrigerating pump is also arranged in the water tank.
Further, the water-cooling board of the top is through two inlet tube connection water tanks, two inlet tubes on respectively establish a water pump, water pump top all be equipped with the valve.
Further, the heat conduction layer is a metal ceramic layer.
Furthermore, a fan is arranged below the bearing layer, the fan is arranged on the right side of the bearing layer, and an air outlet of the fan is horizontally arranged leftwards.
Furthermore, an air exhaust hole is formed in the right wall of the cabinet; in the exhaust holes on the right wall of the cabinet, the density of the upper exhaust holes is less than that of the lower exhaust holes.
The utility model has the advantages that:
the utility model discloses a combine water cooling and forced air cooling dual mode to refrigerate the cabinet body, improved the refrigeration effect greatly, the server is direct and the contact of water-cooling board, can transmit the heat of server more effectively, reduce its temperature, realize the circulation of cooling water between the water-cooling board through honeycomb duct, water tank and water pump, guarantee that the cooling water is in the low temperature state always, two water pumps can work alternately, the work burden of the water pump that reduces, two water pumps work simultaneously for the circulation of cooling water improves the radiating efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the water-cooled panel.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
The utility model provides a data center water-cooling heat dissipation rack, it includes rack 1, 1 built-in a plurality of water-cooling board 2 of rack, water-cooling board 2 include heat-conducting layer 201, overflow layer 202 and bearing layer 203, be equipped with honeycomb duct 3 between the adjacent water-cooling board 2, honeycomb duct 3 connect adjacent overflow layer 202, the server is placed in heat-conducting layer 201 top, the water-cooling board 2 of below passes through drain pipe 4 and connects water tank 5, water tank 5 in be equipped with cooling water 6, the mouth of pipe of drain pipe 4 is located the top of the 6 surfaces of water of cooling water, the water-cooling board 2 of the top passes through inlet tube 7 and connects water tank 5, inlet tube 7 stretch into the below of the 6 surfaces of water of cooling water, be equipped with water pump 8 on the.
Further, a refrigerating pump 9 is arranged in the water tank.
Further, the water-cooling board 2 of the top connects water tank 5 through two inlet tubes 7, two inlet tubes 7 on respectively establish a water pump 8, water pump 8 top all be equipped with valve 10.
Further, the heat conduction layer 201 is a metal ceramic layer.
Further, a fan 11 is arranged below the bearing layer 203, the fan 11 is arranged on the right side of the bearing layer 203, and an air outlet of the fan 11 is horizontally arranged to the left.
Further, the right wall of the cabinet 1 is provided with an air exhaust hole.
Furthermore, in the exhaust holes on the right wall of the cabinet, the density of the upper exhaust holes is less than that of the lower exhaust holes.
The utility model discloses a combine water cooling and forced air cooling dual mode to refrigerate the cabinet body, improved the refrigeration effect greatly, the server is direct and the contact of water-cooling board, can transmit the heat of server more effectively, reduce its temperature, realize the circulation of cooling water between the water-cooling board through honeycomb duct, water tank and water pump, guarantee that the cooling water is in the low temperature state always, two water pumps can work alternately, the work burden of the water pump that reduces, two water pumps work simultaneously for the circulation of cooling water improves the radiating efficiency.
The utility model discloses the part that does not relate to all is the same with prior art or can adopt prior art to realize.

Claims (7)

1. The utility model provides a data center water-cooling heat dissipation rack, its characterized in that, it includes rack (1), rack (1) built-in a plurality of water-cooling board (2), water-cooling board (2) include heat-conducting layer (201), overflow layer (202) and bearing layer (203), be equipped with honeycomb duct (3) between adjacent water-cooling board (2), honeycomb duct (3) connect adjacent water-cooling board (2) overflow layer (202), the server is placed in heat-conducting layer (201) top, water-cooling board (2) of the below pass through drain pipe (4) and connect water tank (5), water tank (5) in be equipped with cooling water (6), the mouth of pipe of aforementioned drain pipe (4) is located the top of cooling water (6) surface of water, the water-cooling board (2) of the top passes through inlet tube (7) and connects water tank (5), inlet tube (7) stretch into the below of cooling water (6) surface of water, a water pump (8) is arranged on the water inlet pipe (7).
2. The cabinet as claimed in claim 1, wherein a refrigeration pump (9) is further disposed in the water tank.
3. The cabinet as claimed in claim 1, wherein the uppermost water-cooling plate (2) is connected to the water tank (5) through two water inlet pipes (7), each of the two water inlet pipes (7) is provided with a water pump (8), and a valve (10) is arranged above each water pump (8).
4. The cabinet as claimed in claim 1, wherein the heat conducting layer (201) is a cermet layer.
5. The cabinet as claimed in claim 1, wherein a fan (11) is disposed below the bearing layer (203), the fan (11) is disposed on the right side of the bearing layer (203), and the outlet of the fan (11) is horizontally towards the left.
6. The cabinet with the water-cooling heat dissipation function for the data center as claimed in claim 5, wherein the right wall of the cabinet (1) is provided with air exhaust holes.
7. The cabinet with the water-cooling heat dissipation function for the data center as claimed in claim 6, wherein the density of the upper exhaust holes is less than that of the lower exhaust holes in the right wall of the cabinet (1).
CN201822201119.1U 2018-12-26 2018-12-26 Data center water-cooling heat dissipation rack Active CN210168376U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822201119.1U CN210168376U (en) 2018-12-26 2018-12-26 Data center water-cooling heat dissipation rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822201119.1U CN210168376U (en) 2018-12-26 2018-12-26 Data center water-cooling heat dissipation rack

Publications (1)

Publication Number Publication Date
CN210168376U true CN210168376U (en) 2020-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822201119.1U Active CN210168376U (en) 2018-12-26 2018-12-26 Data center water-cooling heat dissipation rack

Country Status (1)

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CN (1) CN210168376U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113115565A (en) * 2021-04-01 2021-07-13 宁波格澜特电器有限公司 Integrated machine room with cold circulation system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113115565A (en) * 2021-04-01 2021-07-13 宁波格澜特电器有限公司 Integrated machine room with cold circulation system

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20201117

Address after: 223001 No. 134 Huaihai South Road, Qing Jiangpu District, Jiangsu, Huaian

Patentee after: HUAI'AN POWER SUPPLY BRANCH OF STATE GRID JIANGSU ELECTRIC POWER Co.,Ltd.

Address before: 211600, No. 2, Jianshe East Road, Jinhu County, Jiangsu, Huaian

Patentee before: Zhu Cheng

TR01 Transfer of patent right