CN106855741A - A kind of heat abstractor and system for blade server chip - Google Patents
A kind of heat abstractor and system for blade server chip Download PDFInfo
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- CN106855741A CN106855741A CN201611244824.9A CN201611244824A CN106855741A CN 106855741 A CN106855741 A CN 106855741A CN 201611244824 A CN201611244824 A CN 201611244824A CN 106855741 A CN106855741 A CN 106855741A
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- 239000007788 liquid Substances 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat abstractor and system for blade server chip, wherein, the heat abstractor includes：First embedded heat pipe and the second embedded heat pipe being arranged on below the first embedded heat pipe, and, blade server；First embedded heat pipe includes：The first evaporator, gas piping long, liquid line long and the first fin condenser being sequentially connected；Second embedded heat pipe includes：The second evaporator, short gas piping, short liquid line and the second fin condenser being sequentially connected；Blade server includes：It is arranged on the first chip and the second chip inside blade server；Wherein, the first evaporator and the second evaporator are contacted and fixed with the first chip (301) and the second chip (302) respectively.This invention simplifies radiator structure, radiating efficiency is improve, reduce equipment cost.
Description
Technical field
The invention belongs to computer room technical field of heat dissipation, more particularly to a kind of heat abstractor for blade server chip and
Cooling system.
Background technology
The radiation energy consumption problem of data center's (also known as computer room) is with the increase of data center's scale and rack power density
And increasingly attract attention and pay attention to.The traditional radiating mode of data center is mainly air-conditioning air cooling system and single-phase recirculated water cooling
System.Wherein, air-conditioning air cooling system simple structure, most easily implements, but heat-sinking capability is limited, high energy consumption；Water-cooling system heat radiation energy
Power is strong, but system bulky complex, and must be arranged in outside computer room for security consideration water-cooled pipeline.
Hot pipe technique is described as " superconductor of heat ", in recent years in data as a kind of passive type two-phase heat transfer technology
Gains in depth of comprehension have arrived preliminary application, including heat exchange of heat pipe (hot-pipe type air conditioning) and heat pipe backboard etc., are played at energy-saving aspect
Huge effect.
Currently available technology is overall primarily directed to computer room or single rack carries out heat dissipation design, belongs to computer room level and rack
The radiating mode of level, therefore the local heat dissipation problem of countless services device chip in rack cannot be efficiently solved and high power is realized
Effective control of lower operating temperature.And from the point of view of server produces the source angle of heat, the heat that main chip is produced accounts for clothes
More than the 70% of business device heating.Want to solve this problem, adapt to the hair of following high power density rack and high-power server
Exhibition needs, and developing a kind of new computer room radiating mode based on chip-scale radiating mode will be as main flow direction from now on.
Chip-scale radiating mode refers to the chip sites of heat generation that server is directly acted on using advanced cooling technology.Alternatively
Technology include single-phase liquid cooling loop, the hot and cold pipe cooling technology of immersion type liquid etc..Single-phase liquid cooling loop is that liquid is passed through into pipeline
It is delivered directly to euthermic chip surface and takes away heat, it is that chip is directly immersed in liquid that immersion type liquid is cold, however, both
All there is huge auxiliary corollary system, high cost in mode, later maintenance is cumbersome, there is leakage, and be tied
Structure and server inner space limit, and radiating efficiency is limited.
The content of the invention
Technology solve problem of the invention：Overcome the deficiencies in the prior art, there is provided a kind of for blade server chip
Heat abstractor and cooling system, it is intended to simplify structure, improve radiating efficiency, reduces cost.
In order to solve the above-mentioned technical problem, the invention discloses a kind of heat abstractor for blade server chip, bag
Include：First embedded heat pipe (1), and the second embedded heat pipe (2) being arranged on below first embedded heat pipe (1), with
And, blade server (3)；
First embedded heat pipe (1) includes：The first evaporator (101) for being sequentially connected, gas piping long (102),
Liquid line (103) long and the first fin condenser (104)；Wherein, one end of gas piping (102) long and the first evaporator
(101) outlet connection, pipeline turns round after rising the first setting height along short transverse to horizontal direction, horizontally extending
After first setpoint distance, the other end of gas piping (102) long is connected with the entrance of the first fin condenser (104)；Liquid long
One end of pipeline (103) is connected with the outlet of the first fin condenser (104), horizontally extending second setpoint distance of pipeline
Afterwards, the other end of liquid line (103) long is connected with the entrance of the first evaporator (101)；
Second embedded heat pipe (2) includes：The second evaporator (201) for being sequentially connected, short gas piping (202),
Short liquid line (203) and the second fin condenser (204)；Wherein, one end of short gas piping (202) and the second evaporator
(201) outlet connection, pipeline turns round after rising the second setting height along short transverse to horizontal direction, horizontally extending
After 3rd setpoint distance, the other end of short gas piping (202) is connected with the entrance of the second fin condenser (204)；Short liquid
One end of pipeline (203) is connected with the outlet of the second fin condenser (204), horizontally extending 4th setpoint distance of pipeline
Afterwards, the other end of short liquid line (203) is connected with the entrance of the second evaporator (201)；
The blade server (3) includes：It is arranged on internal the first chip (301) of the blade server (3) and the
Two chips (302)；Wherein, first evaporator (101) and second embedded heat pipe of first embedded heat pipe (1)
(2) the second evaporator (201) stretches into the inside of blade server (3), respectively with the first chip of the blade server (3)
(301) contacted and fixed with the second chip (302).
In the above-mentioned heat abstractor for blade server chip,
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) arrival end
When, first embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on the blade server (3) outside, are close to knife
The side of piece server (3) arrival end；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) port of export
When, first embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on the blade server (3) outside, are close to knife
The side of piece server (3) port of export.
In the above-mentioned heat abstractor for blade server chip,
The heat abstractor, also includes：First closed channel (401), the second closed channel (402) and the 3rd closed channel
(403)；
First closed channel (401) and the second closed channel (402) are separately positioned on the two of blade server (3)
Side；Wherein, first closed channel (401) is positioned close to the side of blade server (3) arrival end, with rack (7) even
Connect and communicate；Second closed channel (402) is positioned close to the side of blade server (3) port of export, is connected with rack (7)
Communicate；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) arrival end
When, the 3rd closed channel (403) is disposed adjacent with the first closed channel (401), be connected with the first closed channel (401) but
Isolation sealing；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) port of export
When, the 3rd closed channel (403) is disposed adjacent with the second closed channel (402), be connected with the second closed channel (402) but
Isolation sealing.
In the above-mentioned heat abstractor for blade server chip,
First fin condenser (104) and the second fin condenser (204) are fixed in the 3rd closed channel；
First fin condenser (104) is identical with the second fin condenser (204) structure, is internally provided with working medium stream
Dynamic passage；
Upper surface of the lower surface of first fin condenser (104) higher than the second fin condenser (204)；
First fin condenser (104) is less than the blade server with the height summation of the second fin condenser (204)
(3) total height；
Perpendicular to paper direction, the total thickness of the gross thickness less than blade server (3) of the first fin condenser (104)
Degree, the gross thickness of the gross thickness less than blade server (3) of the second fin condenser (204).
In the above-mentioned heat abstractor for blade server chip,
First entrance (501) is provided with below first closed channel (401)；
First outlet (601) is provided with above second closed channel (402)；
Second entrance (502), top are provided with below 3rd closed channel (403) be provided with second outlet (602)；
Wherein, the first entrance (501) and second entrance (502) are separately positioned on the outlet position of computer room ground end cold airflow
Put place.
In the above-mentioned heat abstractor for blade server chip,
Length of the total length of first embedded heat pipe (1) more than second embedded heat pipe (2)；
Wherein, first fin condenser (104) and the second fin condenser (204) staggered setting.
In the above-mentioned heat abstractor for blade server chip,
The setting of first fin condenser (104) is highly more than or equal to the setting of the first evaporator (101) highly；
The setting of second fin condenser (204) is highly more than or equal to the setting of the second evaporator (201) highly.
In the above-mentioned heat abstractor for blade server chip,
Area of the area of evaporator bottom surface more than or equal to chip upper surface；
The volume of evaporator is less than or equal to 60cm3, 1.5cm is less than or equal in the thickness perpendicular to paper direction；
Evaporator inside is cavity structure, including：Wick structure and gas-liquid isolating structure；
Wherein,
Perpendicular to paper direction, the upper table of the bottom surface of first evaporator (101) and first chip (301)
Face contacts and fixes, and the upper surface of the bottom surface of the second evaporator (201) and second chip (302) is simultaneously fixed.
In the above-mentioned heat abstractor for blade server chip,
The heat abstractor also includes：Heat-barrier coating (8)；
The heat-barrier coating (8) is wrapped in first evaporator (101), gas piping long (102) and liquid line long
The outer surface on road (103), and, outside second evaporator (201), short gas piping (202) and short liquid line (203)
Surface.
The invention also discloses a kind of cooling system for blade server chip, including：Multiple above-mentioned heat abstractors；
Wherein, the multiple heat abstractor is arranged along short transverse and perpendicular to two, paper direction dimension.
The present invention has advantages below：
(1) present invention innovatively devises a kind of quick, efficient, convenient and transmission chip heat at a distance embedded
Heat pipe, evaporator of the embedded heat pipe comprising contact chip, pipeline and fin condenser, are an overall structure, can be direct
The heat that chip is produced is quick, efficient, convenient and is transferred to outside blade server at a distance, compared to simple pipe heat pipe
Coupling base plate and fin heat exchanger plates, the heat transfer efficiency of the embedded heat pipe are higher, and overall thermal resistance is then substantially reduced, significantly
Improve the radiating temperature control level to chip.
(2) present invention uses embedded heat pipe to substitute the air cooling fin in the existing blade server confined space on chip,
Compared to air cooling fin, the area of dissipation bigger, air of the fin condenser of the embedded heat pipe being placed in closed channel flows through wing
Piece condenser is more smoothly, and because fin condenser is similar to an isothermal body, therefore, fin rib effect is also higher, so as to radiate
It is stronger with temperature control ability.
(3) compared to the air cooling fin on existing blade server chip, the suction of the evaporator of embedded heat pipe of the invention
Hot area, thickness and volume all significantly reduce, so that blade server can be made thinner, more compact, the sky of single rack
Between utilization rate further lifted, the server power density of single rack can be lifted further.
(4) present invention realizes the coupling with the existing air cooling system of computer room on the basis of the organization plan of embedded heat pipe
Close, chip produce heat it is quick, efficient, convenient and at a distance transfer closed channel in, take full advantage of the existing wind of computer room
Cooling system, greatly improves air-cooled radiating efficiency, effectively solves radiating and the core of high power density rack or high-power server
Piece overheat overtemperature problem, with safety, cleaning, efficiently and exploitativeness it is strong the characteristics of；Meeting real server engineering should
With the demand with actual popularization, by the radiating mode of data center from traditional computer room level, cabinet-level lifting to chip-scale
High level.
(5) because most of heat of blade server is all transferred in closed channel by embedded heat pipe, therefore knife
Fan power and fan volume in piece server can significantly reduce, so that blade server can be made thinner, server
Fan noise can be greatly reduced, and the space availability ratio of single rack is further lifted, the server power density of single rack
Can further be lifted.
(6) present invention retains and takes full advantage of existing precision air conditioner and underground air supply pattern, to traditional air-cooled pattern
Computer room changes smaller, and whole device structure can realize modularized design, installation, safeguard that engineering exploitativeness is strong, it is easy to promote
Using, it is more safe and reliable compared to water-cooled pattern, compared to introducing fresh air pattern more sanitary safe.
(7) present invention can efficiently solve the hot-spot of chip and the problem of thermo-field thoery, be taken compared to existing blade
Air cooling fin on business device chip, it reduces chip operating temperature or the ability of control chip temperature is stronger, therefore uses this hair
The income that oolemma comes also has two aspects, and one is to ensure that server work is not in " machine of delaying " phenomenon, effective utilization of server
Rate is improved；Two be on the premise of the chip maximum operating temperature upper limit is met, can properly increase computer room ground end wind pushing temperature and
Server import cold wind temperature, so as to reduce the energy consumption of precise machine room air conditioner.
Brief description of the drawings
Fig. 1 is a kind of structural representation of heat abstractor for blade server chip in the embodiment of the present invention；
Fig. 2 is the structural representation of another heat abstractor for being used for blade server chip in the embodiment of the present invention；
Fig. 3 is a kind of structural representation of cooling system for blade server chip in the embodiment of the present invention.
Specific embodiment
It is public to the present invention below in conjunction with accompanying drawing to make the object, technical solutions and advantages of the present invention clearer
Implementation method is described in further detail.
Reference picture 1, shows that a kind of structure of heat abstractor for blade server chip in the embodiment of the present invention is shown
It is intended to.In the present embodiment, the heat abstractor for blade server chip, including：First embedded heat pipe 1, and, if
The second embedded heat pipe 2 below first embedded heat pipe 1 is put, and, blade server 3.
Such as Fig. 1, the first embedded heat pipe 1 includes：The first evaporator 101, gas piping long 102, the liquid long being sequentially connected
The fin condenser 104 of body pipeline 103 and first.
In the present embodiment, the specific attachment structure in the first embedded heat pipe 1 between each parts is as follows：Flue long
The one end on road 102 is connected with the outlet of the first evaporator 101, pipeline along short transverse rise the first setting height after to level side
To turn, after horizontally extending first setpoint distance, the other end of gas piping long 102 and the first fin condenser 104
Entrance connection；One end of liquid line long 103 is connected with the outlet of the first fin condenser 104, and pipeline prolongs in the horizontal direction
After stretching the second setpoint distance, the other end of liquid line long 103 is connected with the entrance of the first evaporator 101.
Second embedded heat pipe 2 includes：The second evaporator 201, short gas piping 202, the short liquid line being sequentially connected
203 and second fin condenser 204.
In the present embodiment, the specific attachment structure in the second embedded heat pipe 2 between each parts is as follows：Short flue
The one end on road 202 is connected with the outlet of the second evaporator 201, pipeline along short transverse rise the second setting height after to level side
To turn, after horizontally extending 3rd setpoint distance, the other end of short gas piping 202 and the second fin condenser 204
Entrance connection；One end of short liquid line 203 is connected with the outlet of the second fin condenser 204, and pipeline prolongs in the horizontal direction
After stretching the 4th setpoint distance, the other end of short liquid line 203 is connected with the entrance of the second evaporator 201.
, wherein it is desired to explanation, the first setting height, the second setting height, and, the first setpoint distance, second set
Set a distance, the 3rd setpoint distance and the 4th setpoint distance can determine that value can be the same or different according to actual conditions,
In other words, the length of gas piping and liquid line, arrangement and trend can be according to the positions of electronic device in blade server 3
With the actual conditions of remaining space and be adjusted and flexural deformation, flexible arrangement degree is high, and binding character is few, the present embodiment to this not
It is restricted.
Blade server 3 includes：It is arranged on the first chip 301 and the second chip 302 inside the blade server 3.
In the present embodiment, first evaporator 101 and second embedded heat pipe 2 of first embedded heat pipe 1
The second evaporator 201 stretch into the inside of blade server 3, respectively with the first chip 301 and second of the blade server 3
Chip 302 is contacted and fixed.
, wherein it is desired to explanation, in the present embodiment, set location of the chip in blade server 3 can have many
The situation of kind, as shown in figure 1, the first chip 301 and the second chip 302 can be positioned close to the one of the arrival end of blade server 3
Side.Additionally, the first chip 301 and the second chip 302 can also be positioned close to the side of the port of export of blade server 3, such as Fig. 2
It is shown, wherein, Fig. 2 shows that the structure of another heat abstractor for being used for blade server chip in the embodiment of the present invention is shown
It is intended to.
Preferably, as shown in figure 1, when the chip 302 of first chip 301 and second is positioned close to blade server 3
During the side of arrival end, the embedded heat pipe 2 of first embedded heat pipe 1 and second can be arranged on the blade server 3
Outside, the side near the arrival end of blade server 3, are easily installed and safeguard.
Preferably, as shown in Fig. 2 when the chip 302 of first chip 301 and second is positioned close to blade server 3
During the side of the port of export, the embedded heat pipe 2 of first embedded heat pipe 1 and second be arranged on the outside of the blade server 3,
Near the side of the port of export of blade server 3, it is easily installed and safeguards.
In the preferred embodiment of the present invention, the heat abstractor can also include：First closed channel 401, second
The closed channel 403 of closed channel 402 and the 3rd.
Preferably, the closed channel 402 of first closed channel 401 and second is separately positioned on the two of blade server 3
Side.Wherein, first closed channel 401 is positioned close to the side of the arrival end of blade server 3, is connected with rack 7 and communicated；
Second closed channel 402 is positioned close to the side of the port of export of blade server 3, is connected with rack 7 and communicated.
Further, when the chip 302 of first chip 301 and second is positioned close to the arrival end of blade server 3
During side, as shown in figure 1, the 3rd closed channel 403 is disposed adjacent with the first closed channel 401, with the first closed channel
401 connections but isolation sealing.When the chip 302 of first chip 301 and second is positioned close to the port of export of blade server 3
During side, as shown in Fig. 2 the 3rd closed channel 403 is disposed adjacent with the second closed channel 402, with the second closed channel
402 connections but isolation sealing.Wherein, the gas piping and liquid line of 403 permission embedded heat pipes of the 3rd closed channel are worn
Cross wherein.
Understood shown in reference picture 1 or 2, the first fin condenser 104 and the second fin condenser 204 are fixed on the 3rd closing
In passage 403.Preferably, the first fin condenser 104 and the second fin condenser 204 can use any one appropriate side
Formula is fixed in the 3rd closed channel 403, for example, the first fin condenser 104 and the second fin condenser 204 can
To realize fixed by the elongate beam in the 3rd closed channel 403 and install, the present embodiment is not described further.
In the present embodiment, the first fin condenser 104 is identical with the structure of the second fin condenser 204, is internally provided with
Working fluid flow passage.Wherein, upper surface of the lower surface of the first fin condenser 104 higher than the second fin condenser 204；First
Total height of the height summation of the fin condenser 204 of fin condenser 104 and second less than the blade server 3；Vertical
In paper direction, the gross thickness of the gross thickness less than blade server 3 of the first fin condenser 104, the second fin condenser 204
Gross thickness less than blade server 3 gross thickness.
Preferably, in the present embodiment, the lower section of the first closed channel 401 can be provided with first entrance 501；Second envelope
The top of closed walk 402 can be provided with first outlet 601；The lower section of the 3rd closed channel 403 be provided with second entrance 502,
Top is provided with second outlet 602.Wherein, the first entrance 501 and second entrance 502 are separately positioned on computer room ground end cold air
The exit position of stream.
In the present embodiment, computer room ground end cold airflow flows into first and closes along first entrance 501 and second entrance 502 respectively
The closed channel 403 of passage 401 and the 3rd；Heat absorption after the cold airflow in the first closed channel 401 flows through blade server 3 is flowed into become
Into thermal current, flowed out from the first outlet 601 of the second closed channel 402；The cold airflow flowed into the 3rd closed channel 403 flows through
Heat absorption becomes thermal current after first fin condenser 104 and the second fin condenser 204, from the second of the 3rd closed channel 403
Outlet 602 is flowed out.Realized between heat abstractor of the present invention and the existing air cooling system of computer room based on each closed channel
Coupling, take full advantage of the existing air cooling system of computer room, substantially increase the radiating efficiency of the existing air cooling system of computer room, effectively solution
The certainly problem of the radiating of high power density rack or high-power server and chip overheating overtemperature, with safety, cleaning, efficiently and
The characteristics of exploitativeness is strong.
In the preferred embodiment of the present invention, reference picture 1, the total length of the first embedded heat pipe 1 is more than described second
The length of embedded heat pipe 2, and then, the first fin condenser 104 and the second fin condenser 204 can with staggered setting,
The flow area of air-flow is increased, radiating efficiency is improve, meanwhile, space has been saved in staggered setting.
, wherein it is desired to explanation, in the present embodiment, the type of embedded heat pipe can with but be not limited only to be：Loop
Type heat pipe or divergence type gravity assisted heat pipe.In other words, the setting height of the first fin condenser 104 can be more than or equal to first
Highly, the setting height of the second fin condenser 204 is more than or equal to the setting of the second evaporator 201 for the setting of evaporator 101
Highly.When fin condenser is when setting highly more than the setting height of evaporator, embedded heat pipe can be considered as separating
Type gravity assisted heat pipe；When fin condenser is when setting the setting height for being highly equal to evaporator, embedded heat pipe can be considered as
It is loop heat pipe.
In the preferred embodiment of the present invention, as shown in figure 1, the area of evaporator bottom surface is more than or equal on chip
The area on surface；The volume of evaporator is less than or equal to 60cm3, 1.5cm is less than or equal in the thickness perpendicular to paper direction；Evaporation
Device inside is cavity structure, including：Wick structure and gas-liquid isolating structure.Preferably, a kind of feasible evaporator is specific
Structure is referred to the patent of Application No. 201610286818.3, will not be repeated here.
Wherein, perpendicular to paper direction, the bottom surface of first evaporator 101 is upper with first chip 301
Surface contacts and fixes, and the upper surface of the bottom surface of the second evaporator 201 and second chip 302 is simultaneously fixed.Need
Illustrate, the first evaporator 101 and the structure of the second evaporator 201, size can be with identical, and the profile of evaporator can be with
It is the shape for arbitrarily matching with chip such as square or circular, the present embodiment is not restricted to this.
Additionally, in the present embodiment, it is preferred that the heat abstractor for blade server chip can also include：
Heat-barrier coating 8.Heat-barrier coating 8 can be the insulation material of low thermal conductivity, and the heat-barrier coating 8 can be wrapped in institute
The outer surface of the first evaporator 101, gas piping long 102 and liquid line long 103 is stated, and, second evaporator 201,
The outer surface of short gas piping 202 and short liquid line 203, realizes to evaporator and the thermal insulation protection of pipeline.
In the present embodiment, select embedded heat pipe housing and working material when, can with but be not limited only to according to such as
Under type is selected：Combination, the copper of the combination of aluminium alloy and liquefied ammonia, the combination of aluminium alloy and acetone, copper alloy and distilled water
Combination of alloy and freon etc., the present embodiment is not restricted to this.
On the basis of above-described embodiment, the embodiment of the invention also discloses a kind of radiating for blade server chip
System.Reference picture 3, shows a kind of structural representation of cooling system for blade server chip in the embodiment of the present invention
Figure.In the present embodiment, the cooling system for blade server chip can include：Described in multiple above-described embodiments
Heat abstractor, the first heat abstractor 100 as shown in Figure 3, the second heat abstractor 200 etc..Wherein, each radiating
The structure of device is identical, and its concrete structure is referred to the description in above-described embodiment, will not be repeated here.
In the present embodiment, each heat abstractor in cooling system can realize modularization peace as an entirety
Dress, improves installation effectiveness, and be conveniently replaceable and safeguard.Preferably, multiple heat abstractors can along short transverse and perpendicular to
Two, paper direction dimension is extended arrangement：Any an appropriate number of extension is carried out along short transverse, and, along perpendicular to paper
Face direction carries out any an appropriate number of extension.And, as it was previously stated, the fin condenser staggered row in two embedded heat pipes
Cloth, it is ensured that do not have Steric clashes between each heat abstractor, arranges tightr.
In sum, the present invention innovatively devises a kind of quick, efficient, convenient and transmission chip heat at a distance
Embedded heat pipe, evaporator of the embedded heat pipe comprising contact chip, pipeline and fin condenser, are an overall structure, can
It is quick, efficient, convenient and be transferred to outside blade server at a distance with the heat for directly producing chip, compared to simple circle
Pipe heat pipe couples base plate and fin heat exchanger plates, and the heat transfer efficiency of the embedded heat pipe is higher, and overall thermal resistance then drops significantly
It is low, the radiating temperature control level to chip greatly improved.
Secondly, the air cooling fin in the existing blade server confined space on chip is substituted using embedded heat pipe, is compared
Air cooling fin, the area of dissipation bigger, air of the fin condenser of the embedded heat pipe being placed in closed channel flows through fin cold
Condenser is more smoothly, and because fin condenser is similar to an isothermal body, therefore, fin rib effect is also higher, so as to radiate and control
Warm ability is stronger.And, compared to the air cooling fin on existing blade server chip, the evaporator of embedded heat pipe of the invention
Endotherm area, thickness and volume all significantly reduce, thus blade server can be made it is thinner, more compact, single rack
Space availability ratio is further lifted, and the server power density of single rack can be lifted further.
Again, the present invention is realized and the existing air cooling system of computer room on the basis of the organization plan of embedded heat pipe
Coupling, chip produce heat it is quick, efficient, convenient and at a distance transfer closed channel in, take full advantage of computer room existing
Air cooling system, greatly improves air-cooled radiating efficiency, effectively solve high power density rack or high-power server radiating and
The problem of chip overheating overtemperature, with safety, cleaning, efficiently and exploitativeness it is strong the characteristics of；Meet real server engineering
Using the demand with actual popularization, by the radiating mode of data center from traditional computer room level, cabinet-level lifting to chip-scale
High level.And, because most of heat of blade server is all transferred in closed channel by embedded heat pipe, therefore knife
Fan power and fan volume in piece server can significantly reduce, so that blade server can be made thinner, server
Fan noise can be greatly reduced, and the space availability ratio of single rack is further lifted, the server power density of single rack
Can further be lifted..
Additionally, the present invention retains and takes full advantage of existing precision air conditioner and underground air supply pattern, to traditional air-cooled pattern
Computer room change smaller, whole device structure can realize modularized design, installations, maintenance, and engineering exploitativeness is strong, it is easy to push away
Wide application, it is more safe and reliable compared to water-cooled pattern, compared to introducing fresh air pattern more sanitary safe.
Finally, the present invention can efficiently solve the hot-spot of chip and the problem of thermo-field thoery, compared to existing blade
Air cooling fin on server chips, it reduces chip operating temperature or the ability of control chip temperature is stronger, therefore using this
The income that inventive belt is come also has two aspects, and one is to ensure that server work is not in " machine of delaying " phenomenon, effective profit of server
Improved with rate；Two is that on the premise of the chip maximum operating temperature upper limit is met, can properly increase computer room ground end wind pushing temperature
With server import cold wind temperature, so as to reduce the energy consumption of precise machine room air conditioner.
The above, optimal specific embodiment only of the invention, but protection scope of the present invention is not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
Should all be included within the scope of the present invention.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (10)
1. a kind of heat abstractor for blade server chip, it is characterised in that including：First embedded heat pipe (1), and set
The second embedded heat pipe (2) below first embedded heat pipe (1) is put, and, blade server (3)；
First embedded heat pipe (1) includes：The first evaporator (101), gas piping long (102), the liquid long being sequentially connected
Body pipeline (103) and the first fin condenser (104)；Wherein, one end of gas piping (102) long and the first evaporator (101)
Outlet connection, pipeline along short transverse rise the first setting height after to horizontal direction turn round, horizontally extending first
After setpoint distance, the other end of gas piping (102) long is connected with the entrance of the first fin condenser (104)；Liquid line long
(103) one end is connected with the outlet of the first fin condenser (104), after horizontally extending second setpoint distance of pipeline,
The other end of liquid line (103) long is connected with the entrance of the first evaporator (101)；
Second embedded heat pipe (2) includes：The second evaporator (201), short gas piping (202), the short liquid being sequentially connected
Body pipeline (203) and the second fin condenser (204)；Wherein, one end of short gas piping (202) and the second evaporator (201)
Outlet connection, pipeline along short transverse rise the second setting height after to horizontal direction turn round, the horizontally extending 3rd
After setpoint distance, the other end of short gas piping (202) is connected with the entrance of the second fin condenser (204)；Short liquid line
(203) one end is connected with the outlet of the second fin condenser (204), after horizontally extending 4th setpoint distance of pipeline,
The other end of short liquid line (203) is connected with the entrance of the second evaporator (201)；
The blade server (3) includes：It is arranged on the blade server (3) internal the first chip (301) and the second core
Piece (302)；Wherein, first evaporator (101) of first embedded heat pipe (1) and second embedded heat pipe (2)
Second evaporator (201) stretches into the inside of blade server (3), respectively with first chip (301) of the blade server (3)
Contacted with the second chip (302) and fixed.
2. heat abstractor according to claim 1, it is characterised in that
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) arrival end,
First embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on the blade server (3) outside, are close to blade
The side of server (3) arrival end；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) port of export,
First embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on the blade server (3) outside, are close to blade
The side of server (3) port of export.
3. heat abstractor according to claim 2, it is characterised in that the heat abstractor, also includes：First closed channel
(401), the second closed channel (402) and the 3rd closed channel (403)；
First closed channel (401) and the second closed channel (402) are separately positioned on the both sides of blade server (3)；Its
In, first closed channel (401) is positioned close to the side of blade server (3) arrival end, and phase is connected with rack (7)
It is logical；Second closed channel (402) is positioned close to the side of blade server (3) port of export, and phase is connected with rack (7)
It is logical；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) arrival end,
3rd closed channel (403) is disposed adjacent with the first closed channel (401), be connected with the first closed channel (401) but every
Top secret envelope；
When first chip (301) and the second chip (302) are positioned close to the side of blade server (3) port of export,
3rd closed channel (403) is disposed adjacent with the second closed channel (402), be connected with the second closed channel (402) but every
Top secret envelope.
4. heat abstractor according to claim 3, it is characterised in that
First fin condenser (104) and the second fin condenser (204) are fixed in the 3rd closed channel；
First fin condenser (104) is identical with the second fin condenser (204) structure, is internally provided with Working fluid flow and leads to
Road；
Upper surface of the lower surface of first fin condenser (104) higher than the second fin condenser (204)；
First fin condenser (104) is less than the blade server (3) with the height summation of the second fin condenser (204)
Total height；
Perpendicular to paper direction, the gross thickness of the first fin condenser (104) is less than the gross thickness of blade server (3), the
Gross thickness of the gross thickness of two fin condensers (204) less than blade server (3).
5. heat abstractor according to claim 3, it is characterised in that
First entrance (501) is provided with below first closed channel (401)；
First outlet (601) is provided with above second closed channel (402)；
Second entrance (502), top are provided with below 3rd closed channel (403) be provided with second outlet (602)；
Wherein, the first entrance (501) and second entrance (502) are separately positioned on the outlet port of computer room ground end cold airflow
Place.
6. heat abstractor according to claim 1, it is characterised in that
Length of the total length of first embedded heat pipe (1) more than second embedded heat pipe (2)；
Wherein, first fin condenser (104) and the second fin condenser (204) staggered setting.
7. heat abstractor according to claim 1, it is characterised in that
The setting of first fin condenser (104) is highly more than or equal to the setting of the first evaporator (101) highly；
The setting of second fin condenser (204) is highly more than or equal to the setting of the second evaporator (201) highly.
8. heat abstractor according to claim 1, it is characterised in that
Area of the area of evaporator bottom surface more than or equal to chip upper surface；
The volume of evaporator is less than or equal to 60cm3, 1.5cm is less than or equal in the thickness perpendicular to paper direction；
Evaporator inside is cavity structure, including：Wick structure and gas-liquid isolating structure；
Wherein,
Perpendicular to paper direction, the bottom surface of first evaporator (101) connects with the upper surface of first chip (301)
Touch and fix, the upper surface of the bottom surface of the second evaporator (201) and second chip (302) is simultaneously fixed.
9. heat abstractor according to claim 1, it is characterised in that the heat abstractor also includes：Heat-barrier coating
(8)；
The heat-barrier coating (8) is wrapped in first evaporator (101), gas piping long (102) and liquid line long
(103) outer surface, and, the appearance of second evaporator (201), short gas piping (202) and short liquid line (203)
Face.
10. a kind of cooling system for blade server chip, it is characterised in that including：Multiple the claims 1-9 appoint
Heat abstractor described in meaning item；
Wherein, the multiple heat abstractor is arranged along short transverse and perpendicular to two, paper direction dimension.
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| CN201611244824.9A CN106855741B (en) | 2016-12-29 | 2016-12-29 | Heat dissipation device and system for blade server chip |
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|---|---|---|---|
| CN201611244824.9A CN106855741B (en) | 2016-12-29 | 2016-12-29 | Heat dissipation device and system for blade server chip |
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| CN110366360A (en) * | 2019-08-06 | 2019-10-22 | 紫光股份有限公司 | A kind of water-cooling heat radiating device for blade server central processing element |
| WO2021189726A1 (en) * | 2020-03-23 | 2021-09-30 | 青岛海尔空调器有限总公司 | Radiator and air conditioner outdoor unit |
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