CN106855741B - Heat dissipation device and system for blade server chip - Google Patents

Abstract

The invention discloses a heat dissipation device and a system for a blade server chip, wherein the heat dissipation device comprises: the system comprises a first embedded heat pipe, a second embedded heat pipe arranged below the first embedded heat pipe and a blade server; the first embedded heat pipe includes: the first evaporator, the long gas pipeline, the long liquid pipeline and the first fin condenser are connected in sequence; the second embedded heat pipe includes: the second evaporator, the short gas pipeline, the short liquid pipeline and the second fin condenser are connected in sequence; the blade server includes: the first chip and the second chip are arranged inside the blade server; wherein the first evaporator and the second evaporator are in contact with and fixed to the first chip (301) and the second chip (302), respectively. The invention simplifies the heat radiation structure, improves the heat radiation efficiency and reduces the equipment cost.

Description

A heat dissipation device and system for blade server chips

Technical field

The invention belongs to the technical field of computer room heat dissipation, and in particular relates to a heat dissipation device and a heat dissipation system for blade server chips.

Background technique

The problem of heat dissipation and energy consumption in data centers (also known as computer rooms) has attracted more and more attention as the scale of data centers and the power density of cabinets increase. The traditional heat dissipation methods in data centers are mainly air-conditioning air cooling systems and single-phase circulating water cooling systems. Among them, the air-conditioning air-cooling system has a simple structure and is the easiest to implement, but has limited heat dissipation capacity and high energy consumption. The water-cooling system has a strong heat dissipation capacity, but the system is large and complex, and the water-cooling pipeline must be arranged outside the computer room for safety reasons.

As a passive two-phase heat exchange technology, heat pipe technology is known as the "hot superconductor". In recent years, it has been initially used in data centers, including heat pipe heat exchangers (heat pipe air conditioners) and heat pipe backplanes. It plays an important role in energy saving. It has played a huge role in reducing consumption.

The current existing technology is mainly designed for heat dissipation of the entire computer room or a single cabinet, which belongs to the computer room-level and cabinet-level heat dissipation modes. Therefore, it cannot effectively solve the local heat dissipation problem of countless server chips in the cabinet and achieve effective control of the operating temperature under high power. . From the perspective of the source of heat generated by the server, the heat generated by the main chip accounts for more than 70% of the heat generated by the server. In order to solve this problem and adapt to the future development needs of high-power density cabinets and high-power servers, developing a new computer room cooling method based on chip-level cooling mode will become the mainstream direction in the future.

Chip-level cooling mode refers to the use of advanced cooling technology to directly act on the heat-generating chip of the server. Alternative technologies include single-phase liquid cooling loop, immersion liquid cooling, heat pipe cooling technology, etc. The single-phase liquid cooling circuit transports liquid directly to the surface of the heating chip through pipelines to take away the heat. Immersion liquid cooling directly immerses the chip in the liquid. However, both methods have large auxiliary supporting systems, high costs, Later maintenance is cumbersome and there are potential safety hazards. Moreover, due to the limitations of the structure and the internal space of the server, the heat dissipation efficiency is limited.

Contents of the invention

The technical problem of the present invention is to overcome the shortcomings of the existing technology and provide a heat dissipation device and heat dissipation system for blade server chips, aiming to simplify the structure, improve heat dissipation efficiency, and reduce costs.

In order to solve the above technical problems, the present invention discloses a heat dissipation device for a blade server chip, which includes: a first embedded heat pipe (1), and a second embedded heat pipe provided below the first embedded heat pipe (1). Type heat pipe (2), and blade server (3);

The first embedded heat pipe (1) includes: a first evaporator (101), a long gas pipeline (102), a long liquid pipeline (103) and a first fin condenser (104) connected in sequence; wherein , one end of the long gas pipeline (102) is connected to the outlet of the first evaporator (101), the pipeline rises along the height direction to a first set height and then turns in the horizontal direction, and after extending in the horizontal direction for a first set distance, The other end of the long gas pipeline (102) is connected to the inlet of the first fin condenser (104); one end of the long liquid pipeline (103) is connected to the outlet of the first fin condenser (104), and the pipeline is connected along the After extending the second set distance in the horizontal direction, the other end of the long liquid pipeline (103) is connected to the inlet of the first evaporator (101);

The second embedded heat pipe (2) includes: a second evaporator (201), a short gas pipeline (202), a short liquid pipeline (203) and a second fin condenser (204) connected in sequence; wherein , one end of the short gas pipeline (202) is connected to the outlet of the second evaporator (201), the pipeline rises along the height direction for a second set height, then turns in the horizontal direction, and after extending along the horizontal direction for a third set distance, The other end of the short gas pipeline (202) is connected to the inlet of the second fin condenser (204); one end of the short liquid pipeline (203) is connected to the outlet of the second fin condenser (204), and the pipeline is connected along the After extending the fourth set distance in the horizontal direction, the other end of the short liquid pipeline (203) is connected to the inlet of the second evaporator (201);

The blade server (3) includes: a first chip (301) and a second chip (302) disposed inside the blade server (3); wherein the first evaporation of the first embedded heat pipe (1) The evaporator (101) and the second evaporator (201) of the second embedded heat pipe (2) extend into the interior of the blade server (3), and are respectively connected with the first chip (301) and the first chip (301) of the blade server (3). The second chip (302) is contacted and fixed.

In the above-mentioned heat dissipation device for blade server chips,

When the first chip (301) and the second chip (302) are disposed on the side close to the inlet end of the blade server (3), the first embedded heat pipe (1) and the second embedded heat pipe (2) are disposed On the side outside the blade server (3) and close to the entrance end of the blade server (3);

When the first chip (301) and the second chip (302) are disposed on the side close to the outlet end of the blade server (3), the first embedded heat pipe (1) and the second embedded heat pipe (2) are disposed Outside the blade server (3), on the side close to the outlet end of the blade server (3).

In the above-mentioned heat dissipation device for blade server chips,

The heat dissipation device also includes: a first closed channel (401), a second closed channel (402) and a third closed channel (403);

The first closed channel (401) and the second closed channel (402) are respectively disposed on both sides of the blade server (3); wherein the first closed channel (401) is disposed near the entrance end of the blade server (3). One side is connected and communicated with the cabinet (7); the second closed channel (402) is provided on the side close to the outlet end of the blade server (3) and is connected and communicated with the cabinet (7);

When the first chip (301) and the second chip (302) are disposed on a side close to the entrance end of the blade server (3), the third closed channel (403) is disposed adjacent to the first closed channel (401) , connected to the first closed channel (401) but isolated and sealed;

When the first chip (301) and the second chip (302) are disposed on the side close to the outlet end of the blade server (3), the third closed channel (403) is disposed adjacent to the second closed channel (402) , connected to the second closed channel (402) but isolated and sealed.

In the above-mentioned heat dissipation device for blade server chips,

The first fin condenser (104) and the second fin condenser (204) are fixed in the third closed channel;

The first fin condenser (104) and the second fin condenser (204) have the same structure, and are provided with a working medium flow channel inside;

The lower surface of the first fin condenser (104) is higher than the upper surface of the second fin condenser (204);

The sum of the heights of the first fin condenser (104) and the second fin condenser (204) is less than the total height of the blade server (3);

In the direction perpendicular to the paper surface, the total thickness of the first fin condenser (104) is less than the total thickness of the blade server (3), and the total thickness of the second fin condenser (204) is less than the total thickness of the blade server (3) .

In the above-mentioned heat dissipation device for blade server chips,

A first entrance (501) is provided below the first closed channel (401);

A first outlet (601) is provided above the second closed channel (402);

The third closed channel (403) is provided with a second entrance (502) below and a second outlet (602) above;

Wherein, the first inlet (501) and the second inlet (502) are respectively provided at the outlet positions of the cold air flow under the machine room.

In the above-mentioned heat dissipation device for blade server chips,

The total length of the first embedded heat pipe (1) is greater than the length of the second embedded heat pipe (2);

Wherein, the first fin condenser (104) and the second fin condenser (204) are arranged in a staggered manner.

In the above-mentioned heat dissipation device for blade server chips,

The installation height of the first fin condenser (104) is greater than or equal to the installation height of the first evaporator (101);

The installation height of the second fin condenser (204) is greater than or equal to the installation height of the second evaporator (201).

In the above-mentioned heat dissipation device for blade server chips,

The area of the lower bottom surface of the evaporator is greater than or equal to the area of the upper surface of the chip;

The volume of the evaporator is less than or equal to 60cm ³ , and the thickness in the direction perpendicular to the paper surface is less than or equal to 1.5cm;

The interior of the evaporator is a cavity structure, including: capillary wick structure and gas-liquid isolation structure;

in,

In the direction perpendicular to the paper surface, the lower bottom surface of the first evaporator (101) is in contact with and fixed on the upper surface of the first chip (301), and the lower bottom surface of the second evaporator (201) is in contact with the second The upper surface of the chip (302) is contacted and fixed.

In the above-mentioned heat dissipation device for blade server chips,

The heat dissipation device also includes: a heat insulation protective layer (8);

The thermal insulation protective layer (8) is wrapped around the outer surfaces of the first evaporator (101), the long gas pipeline (102) and the long liquid pipeline (103), and the second evaporator (201 ), the outer surface of the short gas line (202) and the short liquid line (203).

The invention also discloses a heat dissipation system for blade server chips, including: a plurality of the above heat dissipation devices;

Wherein, the plurality of heat dissipation devices are arranged in two dimensions: a height direction and a direction perpendicular to the paper surface.

The invention has the following advantages:

(1) The present invention innovatively designs an embedded heat pipe that transfers chip heat quickly, efficiently, conveniently and over long distances. The embedded heat pipe includes an evaporator, pipes and fin condenser that contact the chip, and is an integral structure. , the heat generated by the chip can be directly transferred to the outside of the blade server quickly, efficiently, conveniently and over a long distance. Compared with the simple round tube heat pipe coupling base plate and fin heat exchange plate, the heat transfer efficiency of the embedded heat pipe is Higher, the overall thermal resistance is greatly reduced, greatly improving the heat dissipation and temperature control level of the chip.

(2) The present invention uses embedded heat pipes to replace the air-cooling fins on the chip in the limited space of the existing blade server. Compared with air-cooling fins, the heat dissipation area of the fin condenser of the embedded heat pipe placed in the closed channel is larger. Larger, the air flows through the fin condenser more smoothly, and because the fin condenser is approximately an isothermal body, the fin rib efficiency is also higher, resulting in stronger heat dissipation and temperature control capabilities.

(3) Compared with the air-cooling fins on existing blade server chips, the heat absorption area, thickness and volume of the evaporator of the embedded heat pipe of the present invention are greatly reduced, so that the blade server can be made thinner and more compact. Compact, the space utilization of a single cabinet is further improved, and the server power density of a single cabinet can be further improved.

(4) Based on the structural scheme of the embedded heat pipe, the present invention realizes the coupling with the existing air cooling system in the computer room. The heat generated by the chip is quickly, efficiently, conveniently and long-distance transferred to the closed channel, making full use of the computer room. The existing air cooling system greatly improves the heat dissipation efficiency of air cooling, effectively solves the heat dissipation and chip overheating problems of high-power density cabinets or high-power servers, and has the characteristics of safety, cleanliness, efficiency and strong implementability; it meets the requirements of The needs of real server engineering applications and actual promotion have upgraded the cooling mode of data centers from the traditional computer room level and cabinet level to the high level of chip level.

(5) Since most of the heat of the blade server is transferred into the closed channel through the embedded heat pipe, the fan power and fan volume within the blade server can be greatly reduced, so that the blade server can be made thinner and the server fan noise can be reduced It is significantly reduced, the space utilization of a single cabinet is further improved, and the server power density of a single cabinet can be further improved.

(6) The present invention retains and makes full use of the existing precision air conditioning and underground air supply modes, and makes little changes to the traditional air-cooling mode machine room. The entire device structure can realize modular design, installation, and maintenance, and the project has strong implementability. It is easy to promote and apply, is safer and more reliable than the water cooling mode, and is cleaner and safer than the fresh air mode.

(7) The present invention can effectively solve the problem of local overheating and ultra-high temperature of the chip. Compared with the air-cooling fins on the existing blade server chips, the present invention has a stronger ability to reduce the chip operating temperature or control the chip temperature. Therefore, it adopts There are two benefits brought by the invention. First, it ensures that the server will not work "downtime" and the effective utilization rate of the server is improved. Second, on the premise of meeting the upper limit of the maximum working temperature of the chip, the underground floor of the computer room can be appropriately raised. Supply air temperature and server inlet cold air temperature, thereby reducing the energy consumption of precision air conditioning in the computer room.

Description of the drawings

Figure 1 is a schematic structural diagram of a heat dissipation device for a blade server chip in an embodiment of the present invention;

Figure 2 is a schematic structural diagram of another heat dissipation device for a blade server chip in an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a heat dissipation system for a blade server chip in an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention clearer, the common embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

Referring to FIG. 1 , a schematic structural diagram of a heat dissipation device for a blade server chip in an embodiment of the present invention is shown. In this embodiment, the heat dissipation device for a blade server chip includes: a first embedded heat pipe 1, and a second embedded heat pipe 2 disposed below the first embedded heat pipe 1, and a blade Server 3.

As shown in Figure 1, the first embedded heat pipe 1 includes: a first evaporator 101, a long gas pipeline 102, a long liquid pipeline 103 and a first fin condenser 104 connected in sequence.

In this embodiment, the specific connection structure between the components in the first embedded heat pipe 1 is as follows: one end of the long gas pipeline 102 is connected to the outlet of the first evaporator 101, and the pipeline rises along the height direction of the first device. After a certain height, it turns in the horizontal direction and extends a first set distance in the horizontal direction. The other end of the long gas pipeline 102 is connected to the inlet of the first fin condenser 104; one end of the long liquid pipeline 103 is connected to the first fin condenser 104. The outlet of the sheet condenser 104 is connected. After the pipeline extends in the horizontal direction for a second set distance, the other end of the long liquid pipeline 103 is connected to the inlet of the first evaporator 101 .

The second embedded heat pipe 2 includes: a second evaporator 201, a short gas pipeline 202, a short liquid pipeline 203 and a second fin condenser 204 connected in sequence.

In this embodiment, the specific connection structure between the components in the second embedded heat pipe 2 is as follows: one end of the short gas pipeline 202 is connected to the outlet of the second evaporator 201, and the pipeline rises along the height direction of the second device. After a certain height, it turns in the horizontal direction and extends a third set distance in the horizontal direction. The other end of the short gas pipeline 202 is connected to the inlet of the second fin condenser 204; one end of the short liquid pipeline 203 is connected to the second fin condenser 204. The outlet of the sheet condenser 204 is connected. After the pipeline extends a fourth set distance in the horizontal direction, the other end of the short liquid pipeline 203 is connected to the inlet of the second evaporator 201 .

Among them, it should be noted that the first set height, the second set height, and the first set distance, the second set distance, the third set distance and the fourth set distance can be determined according to the actual situation. The values can be the same or different. In other words, the length, arrangement and direction of the gas pipeline and the liquid pipeline can be adjusted, bent and deformed according to the position of the electronic devices in the blade server 3 and the actual conditions of the remaining space. It has high flexibility and few constraints, and this embodiment does not impose any restrictions on this.

The blade server 3 includes: a first chip 301 and a second chip 302 disposed inside the blade server 3 .

In this embodiment, the first evaporator 101 of the first embedded heat pipe 1 and the second evaporator 201 of the second embedded heat pipe 2 extend into the interior of the blade server 3 and are connected to the blade server 3 respectively. The first chip 301 and the second chip 302 are in contact and fixed.

Among them, it should be noted that in this embodiment, the placement position of the chip in the blade server 3 can be various. As shown in Figure 1, the first chip 301 and the second chip 302 can be placed close to the blade server 3. side of the entrance. In addition, the first chip 301 and the second chip 302 can also be disposed on the side close to the outlet end of the blade server 3, as shown in Figure 2, wherein Figure 2 shows another chip for the blade server in the embodiment of the present invention. Structural diagram of the chip’s heat dissipation device.

Preferably, as shown in Figure 1, when the first chip 301 and the second chip 302 are disposed on the side close to the entrance end of the blade server 3, the first embedded heat pipe 1 and the second embedded heat pipe 2 can be disposed The side outside the blade server 3 and close to the entrance end of the blade server 3 is convenient for installation and maintenance.

Preferably, as shown in Figure 2, when the first chip 301 and the second chip 302 are disposed on the side close to the outlet end of the blade server 3, the first embedded heat pipe 1 and the second embedded heat pipe 2 are disposed on The side outside the blade server 3 and close to the outlet end of the blade server 3 is convenient for installation and maintenance.

In a preferred embodiment of the present invention, the heat dissipation device may further include: a first closed channel 401, a second closed channel 402, and a third closed channel 403.

Preferably, the first closed channel 401 and the second closed channel 402 are respectively provided on both sides of the blade server 3 . The first closed channel 401 is provided on the side close to the inlet end of the blade server 3 and is connected to the cabinet 7; the second closed channel 402 is provided on the side close to the outlet end of the blade server 3 and connected to the cabinet 7.

Further, when the first chip 301 and the second chip 302 are disposed on the side close to the entrance end of the blade server 3, as shown in Figure 1, the third closed channel 403 is disposed adjacent to the first closed channel 401, Connected to the first closed channel 401 but isolated and sealed. When the first chip 301 and the second chip 302 are disposed on the side close to the outlet end of the blade server 3, as shown in Figure 2, the third closed channel 403 is disposed adjacent to the second closed channel 402, and is adjacent to the second closed channel 402. The closed channel 402 is connected but insulated and sealed. Among them, the third closed channel 403 only allows the gas pipeline and liquid pipeline of the embedded heat pipe to pass through it.

Referring to FIG. 1 or 2 , it can be seen that the first fin condenser 104 and the second fin condenser 204 are fixed in the third closed channel 403 . Preferably, the first fin condenser 104 and the second fin condenser 204 can be installed and fixed in the third closed channel 403 in any appropriate manner, for example, the first fin condenser 104 and the second The fin condenser 204 can be fixed and installed through the elongated beam in the third closed channel 403, which will not be described in detail in this embodiment.

In this embodiment, the first fin condenser 104 and the second fin condenser 204 have the same structure, and a working medium flow channel is provided inside. The lower surface of the first fin condenser 104 is higher than the upper surface of the second fin condenser 204 ; the sum of the heights of the first fin condenser 104 and the second fin condenser 204 is smaller than the height of the blade server 3 Total height; in the direction perpendicular to the paper surface, the total thickness of the first fin condenser 104 is less than the total thickness of the blade server 3, and the total thickness of the second fin condenser 204 is less than the total thickness of the blade server 3.

Preferably, in this embodiment, a first inlet 501 can be provided below the first closed channel 401; a first outlet 601 can be provided above the second closed channel 402; and a second outlet 601 can be provided below the third closed channel 403. The entrance 502 has a second exit 602 above it. Wherein, the first inlet 501 and the second inlet 502 are respectively provided at the outlet positions of the cold air flow under the machine room.

In this embodiment, the cold air flow under the machine room flows into the first closed channel 401 and the third closed channel 403 along the first inlet 501 and the second inlet 502 respectively; the cold air flow flowing into the first closed channel 401 flows through the blade server 3 The heat absorbed becomes a hot air flow, which flows out from the first outlet 601 of the second closed channel 402; the cold air flow flowing into the third closed channel 403 flows through the first fin condenser 104 and the second fin condenser 204 and then absorbs heat. It becomes a hot air flow and flows out from the second outlet 602 of the third closed channel 403 . Based on each closed channel, the coupling between the heat dissipation device of the present invention and the existing air cooling system in the computer room is realized, making full use of the existing air cooling system in the computer room, greatly improving the heat dissipation efficiency of the existing air cooling system in the computer room, and effectively It solves the problems of heat dissipation and chip overheating in high-power density cabinets or high-power servers. It has the characteristics of safety, cleanliness, efficiency and strong implementability.

In a preferred embodiment of the present invention, referring to Figure 1, the total length of the first embedded heat pipe 1 is greater than the length of the second embedded heat pipe 2, and further, the first fin condenser 104 and the second fin condenser The devices 204 can be arranged in a staggered arrangement, which increases the flow area of the air flow and improves the heat dissipation efficiency. At the same time, the staggered arrangement saves space.

It should be noted that in this embodiment, the type of the embedded heat pipe may be, but is not limited to: a loop heat pipe or a separated gravity heat pipe. In other words, the installation height of the first fin condenser 104 may be greater than or equal to the installation height of the first evaporator 101 , and the installation height of the second fin condenser 204 may be greater than or equal to the installation height of the second evaporator 201 . When the installation height of the fin condenser is greater than the installation height of the evaporator, the embedded heat pipe can be regarded as a separated gravity heat pipe; when the installation height of the fin condenser is equal to the installation height of the evaporator, the embedded heat pipe can be regarded as a separate gravity heat pipe. Considered as a loop type heat pipe.

In a preferred embodiment of the present invention, as shown in Figure 1, the area of the lower bottom surface of the evaporator is greater than or equal to the area of the upper surface of the chip; the volume of the evaporator is less than or equal to ^60cm3 , and the thickness in the direction perpendicular to the paper surface is less than or equal to 1.5cm; the inside of the evaporator is a cavity structure, including: capillary wick structure and gas-liquid isolation structure. Preferably, the specific structure of a feasible evaporator can be referred to the patent application number 201610286818.3, which will not be described again here.

Wherein, in the direction perpendicular to the paper surface, the lower bottom surface of the first evaporator 101 is in contact with and fixed on the upper surface of the first chip 301, and the lower bottom surface of the second evaporator 201 is in contact with the upper surface of the second chip 302. Surface contact and fixation. It should be noted that the structure and size of the first evaporator 101 and the second evaporator 201 can be exactly the same, and the shape of the evaporator can be any shape that matches the chip, such as square or circular, which is not limited in this embodiment. .

In addition, in this embodiment, preferably, the heat dissipation device for a blade server chip may further include: a heat insulation protective layer 8 . The thermal insulation protective layer 8 may be an insulation material with a low thermal conductivity. The thermal insulation protective layer 8 may be wrapped around the outer surfaces of the first evaporator 101, the long gas pipeline 102 and the long liquid pipeline 103, and, The outer surfaces of the second evaporator 201, the short gas pipeline 202 and the short liquid pipeline 203 achieve thermal insulation protection for the evaporator and pipelines.

In this embodiment, when selecting the shell and working fluid materials of the embedded heat pipe, you can, but are not limited to, choose in the following ways: a combination of aluminum alloy and liquid ammonia, a combination of aluminum alloy and acetone, a combination of copper alloy and distilled water The combination, the combination of copper alloy and Freon, etc. is not limited in this embodiment.

Based on the above embodiments, embodiments of the present invention also disclose a heat dissipation system for blade server chips. Referring to FIG. 3 , a schematic structural diagram of a heat dissipation system for a blade server chip in an embodiment of the present invention is shown. In this embodiment, the heat dissipation system for blade server chips may include: multiple heat dissipation devices described in the above embodiments, such as the first heat dissipation device 100 and the second heat dissipation device 200 as shown in Figure 3. ··wait. The structure of each heat dissipation device is the same. For its specific structure, reference can be made to the description in the above embodiments, and details will not be described again here.

In this embodiment, each heat dissipation device in the heat dissipation system can be treated as a whole, achieving modular installation, improving installation efficiency, and facilitating replacement and maintenance. Preferably, the plurality of heat dissipation devices can be expanded and arranged in two dimensions: the height direction and the direction perpendicular to the paper surface: any appropriate number of expansions in the height direction, and any appropriate number of expansions in the direction perpendicular to the paper surface. Moreover, as mentioned above, the fin condensers in the two embedded heat pipes are arranged in a staggered manner, ensuring that there is no spatial conflict between the heat dissipation devices and the arrangement is closer.

To sum up, the present invention innovatively designs an embedded heat pipe that transfers chip heat quickly, efficiently, conveniently and over long distances. The embedded heat pipe includes an evaporator, a pipeline and a fin condenser that contact the chip. It is an The overall structure can directly transfer the heat generated by the chip to the outside of the blade server quickly, efficiently, conveniently and over a long distance. Compared with the simple round tube heat pipe coupled to the base plate and fin heat exchange plate, the embedded heat pipe's transmission The thermal efficiency is higher, the overall thermal resistance is greatly reduced, and the heat dissipation and temperature control level of the chip is greatly improved.

Secondly, embedded heat pipes are used to replace the air-cooling fins on the chip in the limited space of the existing blade server. Compared with air-cooling fins, the fin condenser of the embedded heat pipe placed in a closed channel has a larger heat dissipation area and air-cooling fins. The flow through the fin condenser is smoother, and because the fin condenser is similar to an isothermal body, the fin rib efficiency is also higher, resulting in stronger heat dissipation and temperature control capabilities. Moreover, compared with the air-cooling fins on existing blade server chips, the heat absorption area, thickness and volume of the evaporator of the embedded heat pipe of the present invention are greatly reduced, so that the blade server can be made thinner and more compact. , the space utilization of a single cabinet is further improved, and the server power density of a single cabinet can be further improved.

Thirdly, based on the structural solution of the embedded heat pipe, the present invention realizes the coupling with the existing air cooling system in the computer room. The heat generated by the chip is quickly, efficiently, conveniently and long-distance transferred to the closed channel, making full use of the existing air cooling system in the computer room. There is an air cooling system, which greatly improves the heat dissipation efficiency of air cooling, effectively solves the problems of heat dissipation and chip overheating in high-power density cabinets or high-power servers, and has the characteristics of safety, cleanliness, efficiency and strong implementability; it meets the needs of real-life The needs of server engineering applications and actual promotion have upgraded the cooling mode of data centers from the traditional computer room level and cabinet level to the high level of chip level. Moreover, since most of the heat of the blade server is transferred into the closed channel through the embedded heat pipe, the fan power and fan volume in the blade server can be greatly reduced, so that the blade server can be made thinner and the server fan noise can be greatly reduced. Reduced, the space utilization of a single cabinet is further improved, and the server power density of a single cabinet can be further improved. .

In addition, the present invention retains and makes full use of the existing precision air conditioning and underground air supply modes, and makes little changes to the traditional air-cooling mode machine room. The entire device structure can realize modular design, installation, and maintenance, and the project is highly implementable and easy to implement. Promoted and applied, it is safer and more reliable than the water-cooling mode, and cleaner and safer than the fresh air mode.

Finally, the present invention can effectively solve the problem of local overheating and ultra-high temperature of the chip. Compared with the air-cooling fins on the existing blade server chips, the present invention has a stronger ability to reduce the working temperature of the chip or control the chip temperature. Therefore, this invention is adopted There are two benefits brought by the invention. First, it ensures that the server will not work "downtime" and the effective utilization rate of the server is improved. Second, on the premise of meeting the upper limit of the maximum working temperature of the chip, the underground power supply in the computer room can be appropriately increased. The air temperature and the server inlet cold air temperature are reduced, thereby reducing the energy consumption of precision air conditioning in the computer room.

The above are only the best specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of changes or modifications within the technical scope disclosed in the present invention. All substitutions are within the scope of the present invention.

Contents not described in detail in the specification of the present invention belong to the well-known techniques of those skilled in the art.

Claims (7)

1. A heat sink for a blade server chip, comprising: a first embedded heat pipe (1), a second embedded heat pipe (2) arranged below the first embedded heat pipe (1), and a blade server (3);

the first embedded heat pipe (1) comprises: the device comprises a first evaporator (101), a long gas pipeline (102), a long liquid pipeline (103) and a first fin condenser (104) which are connected in sequence; one end of the long gas pipeline (102) is connected with an outlet of the first evaporator (101), the pipeline rises by a first set height along the height direction and turns to the horizontal direction, and after the pipeline extends by a first set distance along the horizontal direction, the other end of the long gas pipeline (102) is connected with an inlet of the first fin condenser (104); one end of a long liquid pipeline (103) is connected with an outlet of the first fin condenser (104), and after the pipeline extends for a second set distance along the horizontal direction, the other end of the long liquid pipeline (103) is connected with an inlet of the first evaporator (101);

the second embedded heat pipe (2) comprises: a second evaporator (201), a short gas pipeline (202), a short liquid pipeline (203) and a second fin condenser (204) which are connected in sequence; one end of the short gas pipeline (202) is connected with an outlet of the second evaporator (201), the pipeline rises to a second set height along the height direction and turns to the horizontal direction, and after the pipeline extends to a third set distance along the horizontal direction, the other end of the short gas pipeline (202) is connected with an inlet of the second fin condenser (204); one end of a short liquid pipeline (203) is connected with an outlet of the second fin condenser (204), and after the pipeline extends for a fourth set distance along the horizontal direction, the other end of the short liquid pipeline (203) is connected with an inlet of the second evaporator (201);

the blade server (3) includes: a first chip (301) and a second chip (302) disposed inside the blade server (3); the first evaporator (101) of the first embedded heat pipe (1) and the second evaporator (201) of the second embedded heat pipe (2) extend into the blade server (3) and are respectively contacted and fixed with a first chip (301) and a second chip (302) of the blade server (3);

the total length of the first embedded heat pipe (1) is larger than the length of the second embedded heat pipe (2); the first fin condensers (104) and the second fin condensers (204) are arranged in a staggered manner;

the arrangement height of the first fin condenser (104) is greater than or equal to the arrangement height of the first evaporator (101); the setting height of the second fin condenser (204) is larger than or equal to the setting height of the second evaporator (201);

the area of the lower bottom surface of the evaporator is larger than or equal to the area of the upper surface of the chip; the volume of the evaporator is less than or equal to 60cm ³ The thickness of the paper is less than or equal to 1.5cm in the direction vertical to the paper surface; the inside cavity structure that is of evaporimeter includes: a wick structure and a gas-liquid separation structure; wherein, in the direction perpendicular to the paper surface, the lower bottom surface of the first evaporator (101) is contacted with and fixed to the upper surface of the first chip (301)The lower bottom surface of the second evaporator (201) is fixed in contact with the upper surface of the second chip (302).

2. The heat sink of claim 1, wherein,

when the first chip (301) and the second chip (302) are arranged on one side close to the inlet end of the blade server (3), the first embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on one side, outside the blade server (3), close to the inlet end of the blade server (3);

when the first chip (301) and the second chip (302) are arranged on one side close to the outlet end of the blade server (3), the first embedded heat pipe (1) and the second embedded heat pipe (2) are arranged on one side, outside the blade server (3), close to the outlet end of the blade server (3).

3. The heat sink of claim 2, further comprising: a first closed channel (401), a second closed channel (402) and a third closed channel (403);

the first closed channel (401) and the second closed channel (402) are respectively arranged at two sides of the blade server (3); the first closed channel (401) is arranged at one side close to the inlet end of the blade server (3) and is communicated with the cabinet (7); the second closed channel (402) is arranged at one side close to the outlet end of the blade server (3) and is communicated with the cabinet (7);

when the first chip (301) and the second chip (302) are arranged on one side close to the inlet end of the blade server (3), the third closed channel (403) is arranged adjacent to the first closed channel (401), and is connected with the first closed channel (401) but isolated and sealed;

when the first chip (301) and the second chip (302) are arranged on one side close to the outlet end of the blade server (3), the third closed channel (403) is arranged adjacent to the second closed channel (402), and is connected with the second closed channel (402) but sealed in a sealing way.

4. A heat sink as in claim 3, wherein,

the first fin condenser (104) and the second fin condenser (204) are fixed in a third closed channel;

the first fin condenser (104) and the second fin condenser (204) have the same structure, and a working medium flow channel is arranged in the first fin condenser and the second fin condenser;

the lower surface of the first fin condenser (104) is higher than the upper surface of the second fin condenser (204);

the sum of the heights of the first fin condenser (104) and the second fin condenser (204) is smaller than the total height of the blade server (3);

in a direction perpendicular to the paper surface, the total thickness of the first fin condenser (104) is smaller than the total thickness of the blade server (3), and the total thickness of the second fin condenser (204) is smaller than the total thickness of the blade server (3).

5. A heat sink as in claim 3, wherein,

a first inlet (501) is arranged below the first closed channel (401);

a first outlet (601) is arranged above the second closed channel (402);

a second inlet (502) is arranged below the third closed channel (403), and a second outlet (602) is arranged above the third closed channel;

wherein the first inlet (501) and the second inlet (502) are respectively arranged at the outlet position of the machine room ground cold air flow.

6. The heat sink of claim 1, further comprising: a heat-insulating protective layer (8);

the heat insulation protection layer (8) wraps the outer surfaces of the first evaporator (101), the long gas pipeline (102) and the long liquid pipeline (103), and the outer surfaces of the second evaporator (201), the short gas pipeline (202) and the short liquid pipeline (203).

7. A heat dissipation system for a blade server chip, comprising: a plurality of heat dissipating devices as defined in any one of claims 1-6;

wherein the plurality of heat dissipating devices are arranged in two dimensions in a height direction and a direction perpendicular to the paper surface.