CN106937517A - A kind of heat abstractor for rack server chip - Google Patents
A kind of heat abstractor for rack server chip Download PDFInfo
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- CN106937517A CN106937517A CN201710248845.6A CN201710248845A CN106937517A CN 106937517 A CN106937517 A CN 106937517A CN 201710248845 A CN201710248845 A CN 201710248845A CN 106937517 A CN106937517 A CN 106937517A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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Abstract
The invention discloses a kind of heat abstractor for rack server chip, including：First embedded heat pipe, the second embedded heat pipe, the first cooling box, the second cooling box and rack server；First embedded heat pipe includes：The first evaporator, gas piping long, liquid line long and the first condenser in the first cooling box being sequentially connected；Second embedded heat pipe includes：The second evaporator, short gas piping, short liquid line and the second condenser in the second cooling box being sequentially connected；Rack server includes：It is arranged on the first chip and the second chip inside the rack server；First evaporator and the second evaporator stretch into the inside of rack server, contact and fix with the first chip and the second chip respectively.This invention simplifies radiator structure, radiating efficiency is improve, reduce energy consumption cost and potential safety hazard.
Description
Technical field
The invention belongs to computer room technical field of heat dissipation, more particularly to a kind of heat abstractor for rack server chip.
Background technology
The radiation energy consumption problem of data center's (also known as computer room) is with the increase of data center's scale and rack power density
And increasingly attract attention and pay attention to.The traditional radiating mode of data center is mainly air-conditioning air cooling system and single-phase recirculated water cooling
System.Wherein, air-conditioning air cooling system simple structure, most easily implements, but heat-sinking capability is limited, high energy consumption；Water-cooling system heat radiation energy
Power is strong, but system bulky complex, and is typically located at outside computer room or rack for security consideration water-cooled pipeline.
Hot pipe technique is described as " superconductor of heat ", in recent years in data as a kind of passive type two-phase heat transfer technology
Gains in depth of comprehension have arrived preliminary application, including heat exchange of heat pipe (hot-pipe type air conditioning) and heat pipe backboard etc., are played at energy-saving aspect
Huge effect.
Currently available technology is overall primarily directed to computer room or single rack carries out heat dissipation design, belongs to computer room level and rack
The radiating mode of level, therefore the local heat dissipation problem of countless services device chip in rack cannot be efficiently solved and high power is realized
Effective control of lower operating temperature.And from the point of view of server produces the source angle of heat, the heat that main chip is produced accounts for clothes
More than the 70% of business device heating.Want to solve this problem, adapt to the hair of following high power density rack and high-power server
Exhibition needs, and developing a kind of new computer room radiating mode based on chip-scale radiating mode will be as main flow direction from now on.
Chip-scale radiating mode refers to the chip sites of heat generation that server is directly acted on using advanced cooling technology.Alternatively
Technology include single-phase liquid cooling loop, the hot and cold pipe cooling technology of immersion type liquid etc..Single-phase liquid cooling loop is that liquid is passed through into pipeline
It is delivered directly to euthermic chip surface and takes away heat, it is that chip is directly immersed in liquid that immersion type liquid is cold, however, both
All there is huge auxiliary corollary system, high cost in mode, later maintenance is cumbersome, there is leakage, and be tied
Structure and server inner space limit, and radiating efficiency is limited.
The content of the invention
Technology solve problem of the invention：Overcome the deficiencies in the prior art, there is provided a kind of for rack server chip
Heat abstractor, it is intended to simplify structure, improve radiating efficiency, reducing energy consumption cost and potential safety hazard.
In order to solve the above-mentioned technical problem, the invention discloses a kind of heat abstractor for rack server chip, bag
Include：First embedded heat pipe (1), the second embedded heat pipe (2), the first cooling box (4), the second cooling box (5) and frame service
Device (3)；
First embedded heat pipe (1) includes：The first evaporator (101) for being sequentially connected, gas piping long (102),
Liquid line (103) long and the first condenser (104) in the first cooling box (4)；Wherein, gas piping (102) long
One end is connected with the outlet of the first evaporator (101), and the other end is connected with the entrance of the first condenser (104)；Liquid line long
(103) one end is connected with the entrance of the first evaporator (101), and the other end is connected with the outlet of the first condenser (104)；
Second embedded heat pipe (2) includes：The second evaporator (201) for being sequentially connected, short gas piping (202),
Short liquid line (203) and the second condenser (204) in the second cooling box (5)；Wherein, short gas piping (202)
One end is connected with the outlet of the second evaporator (201), and the other end is connected with the entrance of the second condenser (204)；Short liquid line
(203) one end is connected with the entrance of the second evaporator (201), and the other end is connected with the outlet of the second condenser (204)；
The rack server (3) includes：It is arranged on internal the first chip (301) of the rack server (3) and the
Two chips (302)；Wherein, first evaporator (101) and second embedded heat pipe of first embedded heat pipe (1)
(2) the second evaporator (201) stretches into the inside of rack server (3), respectively with first chip (301) and the second chip
(302) contact and fixed.
In the above-mentioned heat abstractor for rack server chip, first cooling box (4) includes：First circular hole
And the second circular hole (404) (403)；Wherein,
The other end of the gas piping long (102) is cold with first afterwards through first circular hole (403) of the first cooling box (4)
The entrance connection of condenser (104)；
The other end of the liquid line long (103) is cold with first afterwards through second circular hole (404) of the first cooling box (4)
The outlet connection of condenser (104).
In the above-mentioned heat abstractor for rack server chip, one end and first of the gas piping (102) long
The outlet connection of evaporator (101), pipeline turns round after rising the first setting height along vertical paper direction to vertical direction, along perpendicular
After Nogata is to the first setpoint distance is extended downwardly, the other end of gas piping (102) long is justified through the first of the first cooling box (4)
Entrance of the hole (403) afterwards with the first condenser (104) is connected；
One end of the liquid line long (103) is connected with the entrance of the first evaporator (101), and pipeline is along vertical paper side
Turned round to vertical direction after ramping up the second setting height, after the second setpoint distance is extended vertically downwards, liquid line long
The other end on road (103) passes through outlet of second circular hole (404) of the first cooling box (4) afterwards with the first condenser (104) to be connected.
In the above-mentioned heat abstractor for rack server chip, second cooling box (5) includes：3rd circular hole
And the 4th circular hole (504) (503)；Wherein,
The other end of the short gas piping (202) is cold with second afterwards through the 3rd circular hole (503) of the second cooling box (5)
The entrance connection of condenser (204)；
The other end of the short liquid line (203) is cold with second afterwards through the 4th circular hole (504) of the second cooling box (5)
The outlet connection of condenser (204).
In the above-mentioned heat abstractor for rack server chip, one end and second of the short gas piping (202)
The outlet connection of evaporator (201), pipeline turns round after rising the 3rd setting height along vertical paper direction to vertical direction, along perpendicular
After Nogata is to the 3rd setpoint distance is extended downwardly, the other end of short gas piping (202) is justified through the 3rd of the second cooling box (5)
Entrance of the hole (503) afterwards with the second condenser (204) is connected；
One end of the short liquid line (203) is connected with the entrance of the second evaporator (201), and pipeline is along vertical paper side
Turned round to vertical direction after ramping up the 4th setting height, after extending the 4th setpoint distance vertically downwards, short liquid line
The other end on road (203) passes through outlet of the 4th circular hole (504) of the second cooling box (5) afterwards with the second condenser (204) to be connected.
In the above-mentioned heat abstractor for rack server chip, first cooling box (4) includes：First entrance
And first outlet (402) (401)；Second cooling box (5) includes：Second entrance (501) and second outlet (502)；Wherein,
The first entrance (401) and the first outlet (402), for entering and flowing out first cooling box for cooled liquid stream
(4)；The second entrance (501) and second outlet (502), for entering and flowing out second cooling box for cooled liquid stream
(5)。
In the above-mentioned heat abstractor for rack server chip, perpendicular to paper direction, first evaporator
(101) upper surface of the bottom surface with first chip (301) and fixation；Wherein, first evaporator (101)
Upper surface area of the bottom surface area more than or equal to first chip (301)；
Perpendicular to paper direction, the upper table of the bottom surface of second evaporator (201) and second chip (302)
Face contacts and fixes；Wherein, the bottom surface area of second evaporator (201) is more than or equal to second chip (302)
Upper surface area；
The volume of first evaporator (101) and second evaporator (201) is respectively less than or equal to 60cm3, hanging down
The straight height in paper direction is less than or equal to 1.5cm；
It is cavity structure inside first evaporator (101) and second evaporator (201)；Wherein, the cavity
Structure includes：Wick structure and gas-liquid isolating structure.
In the above-mentioned heat abstractor for rack server chip, condenser is closed cavity, inside the condenser
It is cavity runner and the fin structure of reinforcing condensing heat-exchange；Or, the condenser is round coil structure.
In the above-mentioned heat abstractor for rack server chip, in the height placement perpendicular to paper direction, institute
State the height of the height summation less than the rack server (3) of the first cooling box (4) and second cooling box (5)；Perpendicular
Upwards, the length of cooling box is less than or equal to 7cm to Nogata；In the horizontal direction, the length of cooling box is less than or equal to 7cm；It is cold
But the cumulative volume of box is less than or equal to 120cm3；The cooling box is square or circle.
In the above-mentioned heat abstractor for rack server chip, the rack server (3) also includes：It is arranged on wind
The first fan (304) and the second fan (305) on fan wall.
The present invention has advantages below：
(1) heat abstractor for rack server chip of the present invention, innovatively devises a kind of quick, high
Effect, embedded heat pipe that is convenient and transmitting chip heat at a distance, evaporator, pipeline of the embedded heat pipe comprising contact chip
It is an overall structure with three parts of condenser, the working medium in heat pipe occurs in the sealing closing space of these three parts
Gas-liquid two-phase phase transformation and circulate, the heat that directly can be produced chip is quick, efficient, convenient and is transferred at a distance
Outside rack server, base plate and cooled plate, the heat transfer efficiency of the embedded heat pipe are coupled compared to simple pipe heat pipe
Higher, overall thermal resistance is then substantially reduced, and the radiating temperature control level to chip greatly improved.
(2) in the heat abstractor for rack server chip of the present invention, a kind of cooling box is devised, is cooled down
The condenser of embedded heat pipe is placed in box, cooling liquid can flow through condenser outer surface in cooling box and be exchanged heat, this
Sample, with the cold heat-removal modalities being combined of cooling box liquid, realizes hot tube high-efficiency heat transfer and the cold fast endothermic of liquid by embedded heat pipe
The organic coupling of two ways, compared to single-phase liquid cooling loop, on the one hand it ensure that radiating efficiency, on the other hand be existed by liquid
Take away the heat that heat pipe is passed out outside server, it is to avoid liquid server internal leakage electronic chip is brought it is serious after
Really, substantially increase the safety and reliability of heat abstractor, really by the radiating mode of data center from traditional computer room level,
The high level of chip-scale has been arrived in cabinet-level lifting.
(3) fan cooling mode is added compared to the fin on existing rack server chip, embedded heat pipe of the invention
The endotherm area of evaporator, thickness and volume all significantly reduce, so that the space availability ratio in rack server is further carried
Rise, the structure optimization and performance boost of rack server create more preferable steric requirements after being.
(4) using heat abstractor of the invention, the fan wall of one side rack server can reduce the quantity of fan, very
The fan of more than half can extremely be removed；On the other hand the fan in existing chip air cooling fin structure, therefore band are also eliminated
The direct yield come has two, and one is that the fan noise of server can be greatly reduced, and two is that the power consumption of server is obtained
Reduce, so as to reducing the energy consumption of server.
(5) present invention can efficiently solve the hot-spot of chip and the problem of thermo-field thoery, be taken compared to existing frame
Air cooling fin on business device chip, it reduces chip operating temperature or the ability of control chip temperature is stronger, therefore uses this hair
The income that oolemma comes also has two aspects, and one is to ensure that server work is not in " machine of delaying " phenomenon, server chips it is effective
Utilization rate is improved；Two is on the premise of the chip maximum operating temperature upper limit is met, the air-supply temperature of computer room can be significantly increased
The liquid-inlet temperature of degree and cooling box, so as to significantly reduce the energy consumption of computer room refrigeration system.
Brief description of the drawings
Fig. 1 is a kind of overlooking the structure diagram of heat abstractor for rack server chip in the embodiment of the present invention；
Fig. 2 is a kind of backsight knot of the cooling box in heat abstractor for rack server chip in the embodiment of the present invention
Structure schematic diagram；
Fig. 3 is a kind of one kind circle of the condenser in heat abstractor for rack server chip in the embodiment of the present invention
Shape coil arrangement schematic diagram；
Fig. 4 is a kind of a kind of envelope of the condenser in heat abstractor for rack server chip in the embodiment of the present invention
Closed chamber body structural representation；
Fig. 5 is other of the condenser in a kind of heat abstractor for rack server chip in the embodiment of the present invention
Plant closed cavity structural representation.
Specific embodiment
It is public to the present invention below in conjunction with accompanying drawing to make the object, technical solutions and advantages of the present invention clearer
Implementation method is described in further detail.
Reference picture 1, shows a kind of vertical view knot of heat abstractor for rack server chip in the embodiment of the present invention
Structure schematic diagram.In the present embodiment, the heat abstractor for rack server chip, including：First embedded heat pipe 1,
Second embedded heat pipe 2, the first cooling box 4, the second cooling box 5 and rack server 3.Such as Fig. 1, the one kind between each part can
Capable locations of structures relation can be as follows：Second embedded heat pipe 2 is arranged on the left side of first embedded heat pipe 1；Institute
State the second cooling box 5 and be arranged on the lower left of the first cooling box 4.
In the present embodiment, such as Fig. 1, first embedded heat pipe 1 includes：The first evaporator 101, the length being sequentially connected
Gas piping 102, liquid line long 103 and the first condenser 104 in the first cooling box 4.Wherein, gas piping long
102 one end is connected with the outlet of the first evaporator 101, and the other end is connected with the entrance of the first condenser 104；Liquid line long
103 one end is connected with the entrance of the first evaporator 101, and the other end is connected with the outlet of the first condenser 104.
In the preferred embodiment of the present invention, reference picture 2, one kind is for frame service in showing the embodiment of the present invention
The backsight structural representation of the cooling box in the heat abstractor of device chip.Preferably, first cooling box 4 can include：The
One circular hole 403 and the second circular hole 404.In the present embodiment, the other end of the gas piping long 102 can specifically pass through first
It is connected with the entrance of the first condenser 104 after first circular hole 403 of cooling box 4.The other end of the liquid line long 103 is specific
It is connected with the outlet of the first condenser 104 after the second circular hole 404 that the first cooling box 4 can be passed through.
It is further preferred that the pipe-line layout of the gas piping long 102 and the liquid line long 103 can be as follows：
One end of the gas piping long 102 is connected with the outlet of the first evaporator 101, and pipeline rises first and sets along vertical paper direction
The fixed backward vertical direction of height turns round, after the first setpoint distance is extended vertically downwards, the other end of gas piping long 102
It is connected with the entrance of the first condenser 104 after through the first circular hole 403 of the first cooling box 4.The one of the liquid line long 103
End is connected with the entrance of the first evaporator 101, and pipeline is turned after rising the second setting height along vertical paper direction to vertical direction
It is curved, after the second setpoint distance is extended vertically downwards, the other end of liquid line long 103 through the first cooling box 4 the
Outlet after two circular holes 404 with the first condenser 104 is connected.
Such as Fig. 1, second embedded heat pipe 2 includes：The second evaporator 201 for being sequentially connected, short gas piping 202,
Short liquid line 203 and the second condenser 204 in the second cooling box 5.Wherein, one end of short gas piping 202 and the
The outlet connection of two evaporators 201, the other end is connected with the entrance of the second condenser 204；One end of short liquid line 203 and the
The entrance connection of two evaporators 201, the other end is connected with the outlet of the second condenser 204.
In the preferred embodiment of the present invention, such as Fig. 2, it is preferred that second cooling box 5 can include：3rd circle
The circular hole 504 of hole 503 and the 4th.In the present embodiment, the other end of the short gas piping 202 specifically can be through the second cooling
It is connected with the entrance of the second condenser 204 after 3rd circular hole 503 of box 5.The other end of the short liquid line 203 specifically can be with
It is connected with the outlet of the second condenser 204 after through the 4th circular hole 504 of the second cooling box 5.
It is further preferred that the pipe-line layout of the short gas piping 202 and the short liquid line 203 can be as follows：
One end of the short gas piping 202 is connected with the outlet of the second evaporator 201, and pipeline rises the 3rd and sets along vertical paper direction
The fixed backward vertical direction of height turns round, after extending the 3rd setpoint distance vertically downwards, the other end of short gas piping 202
It is connected with the entrance of the second condenser 204 after through the 3rd circular hole 503 of the second cooling box 5.The one of the short liquid line 203
End is connected with the entrance of the second evaporator 201, and pipeline is turned after rising the 4th setting height along vertical paper direction to vertical direction
It is curved, after extending the 4th setpoint distance vertically downwards, the other end of short liquid line 203 through the second cooling box 5 the
Outlet after four circular holes 504 with the second condenser 204 is connected.
, wherein it is desired to explanation, the first setting height, the second setting height, the 3rd setting height, the 4th setting are high
The specific value of degree, the first setpoint distance, the second setpoint distance, the 3rd setpoint distance and the 4th setpoint distance can be according to reality
Situation is set.Additionally, above-mentioned pipeline structure layout and size are only a kind of exemplary illustrations, should not be used as to limit of the invention
System.In other words, in the present embodiment, the length of gas piping and liquid line, arrangement and trend can be according to rack servers 3
The position of interior electronic device and the actual conditions of remaining space and be adjusted and flexural deformation, flexible arrangement degree is high, restrictive
Few, the present embodiment is not restricted to this.
Such as Fig. 1, the rack server 3 includes：The first chip 301 being arranged on inside the rack server 3 and
Two chips 302.Wherein, the second of the first evaporator 101 of first embedded heat pipe 1 and second embedded heat pipe 2
Evaporator 201 stretches into the inside of rack server 3, is contacted with the chip 302 of first chip 301 and second respectively and fixed.
In the present embodiment, perpendicular to paper direction, the bottom surface of first evaporator 101 and first chip
301 upper surface is simultaneously fixed；Wherein, the bottom surface area of first evaporator 101 is more than or equal to first core
The upper surface area of piece 301.Perpendicular to paper direction, the bottom surface of second evaporator 201 and second chip 302
Upper surface and fixed；Wherein, the bottom surface area of second evaporator 201 is more than or equal to second chip
302 upper surface area., wherein it is desired to explanation, the structure of the first evaporator 101 and the second evaporator 201, size can be with
Identical, the profile of evaporator can be the shape for arbitrarily matching with chip such as square or circular, the present embodiment to this not
It is restricted.
Preferably, the volume of first evaporator 101 and second evaporator 201 is respectively less than or equal to 60cm3,
Height perpendicular to paper direction is less than or equal to 1.5cm.
Preferably, first evaporator 101 and the inside of second evaporator 201 are cavity structure.Wherein, the sky
Cavity configuration includes：Wick structure and gas-liquid isolating structure.
Preferably, in embodiments of the present invention, condenser can be a closed cavity, and inside is cavity runner and reinforcing
The fin structure of condensing heat-exchange；It can also be round coil structure.By taking the first embedded heat pipe 1 as an example, when the first chip 301
In 60-180W, the preferably circular coil arrangement of structure of the first condenser 104, referring to Fig. 3, shows of the invention real power
Apply a kind of a kind of round coil structural representation of the condenser in example in heat abstractor for rack server chip.It is described
The number of round coil is 1-3, and is increased with the increase of power；When the power of the first chip 301 is in 180-300W,
The structure of the first condenser 104 is preferably closed cavity structure, referring to shown in Fig. 4 and Fig. 5.It should be noted that in Fig. 4 and Tu
Arrow show flow direction of the heat-pipe working medium in the first condenser 104 in 5.Second condenser of the second embedded heat pipe 2
204 structure choice is identical with the first condenser 104 of the first embedded heat pipe 1.Wherein, Fig. 4, shows of the invention real
Apply a kind of a kind of closed cavity structural representation of the condenser in example in heat abstractor for rack server chip；Fig. 5
Show a kind of another closing of the condenser in the embodiment of the present invention in heat abstractor for rack server chip
Cavity body structure schematic diagram.
In the preferred embodiment of the present invention, as illustrated in fig. 1 and 2, first cooling box 4 can also include：First
Entrance 401 and first outlet 402；Second cooling box 5 can also include：Second entrance 501 and second outlet 502.Wherein,
The first entrance 401 and the first outlet 402, for entering and flowing out first cooling box 4 for cooled liquid stream；It is described
Second entrance 501 and second outlet 502, for entering and flowing out second cooling box 5 for cooled liquid stream.
In the present embodiment, such as Fig. 1, the first condenser 104 is placed in the first cooling box 4, the inwall of the first cooling box 4
There is certain interval and the outer wall of the first condenser 104 between, can flow for liquid：Cooling liquid is from first entrance 401
Into after the first cooling box 4, the outer wall of the first condenser 104 can be flowed through, the first condenser 104 with the first embedded heat pipe 1
Heat exchange is carried out, cooling liquid flows out the first cooling box 4 after absorbing the liberated heat of the first condenser 104 from first outlet 402,
So as to take away the heat that the first embedded heat pipe 1 absorbs from the first chip 301.In order to prevent the cooling in the first cooling box 4
Liquid is not revealed in flow process, first circular hole 403 and the second circular hole 404 of the first cooling box 4 and gas piping long
102 and the corresponding infall of liquid line long 103 need to carry out encapsulation process respectively.Similar, the second condenser 204 is placed on the
In two cooling boxes 5, there is certain interval between the outer wall of the inwall of the second cooling box 5 and the second condenser 204, can be with feed flow
Body flows：After cooling liquid enters the second cooling box 5 from second entrance 501, the outer wall of the second condenser 204 can be flowed through, with the
Second condenser 204 of two embedded heat pipes 2 carries out heat exchange, after cooling liquid absorbs the liberated heat of the second condenser 204
The second cooling box 5 is flowed out from second outlet 502, so as to take away the heat that the second embedded heat pipe 2 absorbs from the second chip 302
Amount.In order to prevent the cooling liquid in the second cooling box 5 from not revealed in flow process, the 3rd circle of the second cooling box 5
The circular hole 504 of hole 503 and the 4th needs to be sealed respectively with the corresponding infall of short gas piping 202 and short liquid line 203
Treatment.
In the present embodiment, cooling box can be according in rack server 3 in the height placement perpendicular to paper direction
The present position of portion's electronic device and height carry out flexible modulation.Preferably, when the first chip 101 is exported to rack server 3
Between electronic device height it is higher when, and the second chip 201 to rack server 3 export between electronic device height
When relatively low, the height of the first cooling box 4 can be more than the height of the second cooling box 5；When the first chip 101 to rack server 3
Electronic device between outlet it is highly relatively low when, and second chip 201 to rack server 3 export between electronic device
When height is higher, the height of the second cooling box 5 can be more than the height of the first cooling box 4；When the first chip 101 and the second chip
When the height of 201 electronic devices arrived between the outlet of rack server 3 is all relatively low, the height of still applicable first cooling box 4 is big
In the height of the second cooling box 5.For the convenience installed and safeguard, the height summation of the first cooling box 4 and the second cooling box 5
Less than the height of the rack server 3.
Preferably, in the vertical direction, the length of cooling box is less than or equal to 7cm, cooling box away from rack server 3 away from
From can set according to actual needs；In the horizontal direction, the length of cooling box is less than or equal to 7cm；The cumulative volume of cooling box
Less than or equal to 120cm3；The profile of cooling box can be square or circle.
Preferably, in a direction perpendicular to the plane of the paper, top of the upper level of the first cooling box 4 less than rack server 3
Lid height, is easy to the opening and server of server lamina tecti to safeguard.It should be noted that the first cooling box 4 and the second cooling
The structure of box 5, size can be with identical, and the profile of cooler can be the shape such as square or circular, the present embodiment to this not
It is restricted.Explanation is needed further exist for, the first cooling box 4 and the second cooling box 5 can make a large scale cooling box, greatly
The height of size cooling box is the height sum of the first cooling box 4 and the second cooling box 5, large scale cooling box in the vertical direction
Length be less than or equal to 7cm, length in the horizontal direction is less than or equal to the first cooling box 4 and the length of the second cooling box 5
Degree sum.
In the preferred embodiment of the present invention, the rack server 3 also includes：It is arranged on the first wind on fan wall
The fan 305 of fan 304 and second.Such as Fig. 1, the fan 305 of first fan 304 and second sets near the inner surface of rack server 3
Put.In the present embodiment, it is possible to use two fans (the first fan 304 and the second fan 305) replace existing multi-fan knot
Structure, ensures that heat abstractor has preferable heat dispersion while structure is simplified.For example, traditional radiator structure include according to
Four fans of secondary setting, and in the present embodiment, two of which fan can be removed, only retain the first fan 304 and second
Fan 305, you can meet radiating requirements.
, wherein it is desired to explanation, in the present embodiment, the type of embedded heat pipe can with but be not limited only to be：Loop
Type heat pipe or divergence type gravity assisted heat pipe.In other words, perpendicular to paper direction, the setting height of the first condenser 104 can be with
More than or equal to the first evaporator 101 setting highly, the setting of the second condenser 204 is highly more than or equal to the second evaporator
201 setting is highly.When condenser is when setting highly more than the setting height of evaporator, can be by embedded heat pipe selection
Divergence type gravity assisted heat pipe or loop circuit heat pipe；When condenser is when setting the setting height for being highly equal to evaporator, can be by insertion
The selection of formula heat pipe is loop heat pipe.In the present embodiment, select embedded heat pipe housing and working material when, can with but
It is not limited only to be selected as follows：The combination of aluminium alloy and liquefied ammonia, the combination of aluminium alloy and acetone, copper alloy and steaming
Combination of combination, copper alloy and freon of distilled water etc., the present embodiment is not restricted to this.
In the present embodiment, evaporator, three parts of pipeline and condenser comprising contact chip of embedded heat pipe, are one
There is gas-liquid two-phase phase transformation and recycle stream in the sealing closing space of these three parts in individual overall structure, the working medium in heat pipe
Dynamic, the heat that directly can be produced chip is quick, efficient, convenient and is transferred to outside rack server at a distance, compared to letter
Single pipe heat pipe coupling base plate and cooled plate, the heat transfer efficiency of the embedded heat pipe is higher, and overall thermal resistance is then significantly
Reduce, the radiating temperature control level to chip greatly improved.Secondly, heat abstractor of the invention is by embedded heat pipe and cooling box
As an overall structure, it is possible to achieve its modularization on rack server is installed, and improves installation effectiveness, and be easy to more
Change and safeguard.
The above, optimal specific embodiment only of the invention, but protection scope of the present invention is not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
Should all be included within the scope of the present invention.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (10)
1. a kind of heat abstractor for rack server chip, it is characterised in that including：First embedded heat pipe (1), second
Embedded heat pipe (2), the first cooling box (4), the second cooling box (5) and rack server (3)；
First embedded heat pipe (1) includes：The first evaporator (101), gas piping long (102), the liquid long being sequentially connected
Body pipeline (103) and the first condenser (104) in the first cooling box (4)；Wherein, one end of gas piping (102) long
Outlet with the first evaporator (101) is connected, and the other end is connected with the entrance of the first condenser (104)；Liquid line (103) long
One end be connected with the entrance of the first evaporator (101), the other end is connected with the outlet of the first condenser (104)；
Second embedded heat pipe (2) includes：The second evaporator (201), short gas piping (202), the short liquid being sequentially connected
Body pipeline (203) and the second condenser (204) in the second cooling box (5)；Wherein, one end of short gas piping (202)
Outlet with the second evaporator (201) is connected, and the other end is connected with the entrance of the second condenser (204)；Short liquid line (203)
One end be connected with the entrance of the second evaporator (201), the other end is connected with the outlet of the second condenser (204)；
The rack server (3) includes：It is arranged on the rack server (3) internal the first chip (301) and the second core
Piece (302)；Wherein, first evaporator (101) of first embedded heat pipe (1) and second embedded heat pipe (2)
Second evaporator (201) stretches into the inside of rack server (3), respectively with first chip (301) and the second chip (302)
Contact and fix.
2. heat abstractor according to claim 1, it is characterised in that first cooling box (4) includes：First circular hole
And the second circular hole (404) (403)；Wherein,
The other end of the gas piping long (102) through the first cooling box (4) the first circular hole (403) afterwards with the first condenser
(104) entrance connection；
The other end of the liquid line long (103) through the first cooling box (4) the second circular hole (404) afterwards with the first condenser
(104) outlet connection.
3. heat abstractor according to claim 2, it is characterised in that
One end of the gas piping long (102) is connected with the outlet of the first evaporator (101), and pipeline is along vertical paper direction
Turned round to vertical direction after rising the first setting height, after the first setpoint distance is extended vertically downwards, gas piping long
(102) the other end passes through entrance of first circular hole (403) of the first cooling box (4) afterwards with the first condenser (104) to be connected；
One end of the liquid line long (103) is connected with the entrance of the first evaporator (101), and pipeline is along vertical paper direction
Turned round to vertical direction after rising the second setting height, after the second setpoint distance is extended vertically downwards, liquid line long
(103) the other end passes through outlet of second circular hole (404) of the first cooling box (4) afterwards with the first condenser (104) to be connected.
4. heat abstractor according to claim 1, it is characterised in that second cooling box (5) includes：3rd circular hole
And the 4th circular hole (504) (503)；Wherein,
The other end of the short gas piping (202) through the second cooling box (5) the 3rd circular hole (503) afterwards with the second condenser
(204) entrance connection；
The other end of the short liquid line (203) through the second cooling box (5) the 4th circular hole (504) afterwards with the second condenser
(204) outlet connection.
5. heat abstractor according to claim 4, it is characterised in that
One end of the short gas piping (202) is connected with the outlet of the second evaporator (201), and pipeline is along vertical paper direction
Turned round to vertical direction after rising the 3rd setting height, after extending the 3rd setpoint distance vertically downwards, short gas piping
(202) the other end passes through entrance of the 3rd circular hole (503) of the second cooling box (5) afterwards with the second condenser (204) to be connected；
One end of the short liquid line (203) is connected with the entrance of the second evaporator (201), and pipeline is along vertical paper direction
Turned round to vertical direction after rising the 4th setting height, after extending the 4th setpoint distance vertically downwards, short liquid line
(203) the other end passes through outlet of the 4th circular hole (504) of the second cooling box (5) afterwards with the second condenser (204) to be connected.
6. heat abstractor according to claim 1, it is characterised in that first cooling box (4) includes：First entrance
And first outlet (402) (401)；Second cooling box (5) includes：Second entrance (501) and second outlet (502)；Wherein,
The first entrance (401) and the first outlet (402), for entering and flowing out first cooling box for cooled liquid stream
(4)；The second entrance (501) and second outlet (502), for entering and flowing out second cooling box for cooled liquid stream
(5)。
7. heat abstractor according to claim 1, it is characterised in that
Perpendicular to paper direction, the bottom surface of first evaporator (101) connects with the upper surface of first chip (301)
Touch and fix；Wherein, the bottom surface area of first evaporator (101) is upper more than or equal to first chip (301)
Surface area；
Perpendicular to paper direction, the bottom surface of second evaporator (201) connects with the upper surface of second chip (302)
Touch and fix；Wherein, the bottom surface area of second evaporator (201) is upper more than or equal to second chip (302)
Surface area；
The volume of first evaporator (101) and second evaporator (201) is respectively less than or equal to 60cm3, perpendicular to paper
The height in face direction is less than or equal to 1.5cm；
It is cavity structure inside first evaporator (101) and second evaporator (201)；Wherein, the cavity structure
Including：Wick structure and gas-liquid isolating structure.
8. heat abstractor according to claim 1, it is characterised in that condenser is closed cavity, inside the condenser
It is cavity runner and the fin structure of reinforcing condensing heat-exchange；Or, the condenser is round coil structure.
9. heat abstractor according to claim 1, it is characterised in that
In the height placement perpendicular to paper direction, the height of first cooling box (4) and second cooling box (5) is total
With the height less than the rack server (3)；In the vertical direction, the length of cooling box is less than or equal to 7cm；In level side
Upwards, the length of cooling box is less than or equal to 7cm；The cumulative volume of cooling box is less than or equal to 120cm3；The cooling box is side
Shape or circle.
10. heat abstractor according to claim 1, it is characterised in that the rack server (3) also includes：It is arranged on
The first fan (304) and the second fan (305) on fan wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710248845.6A CN106937517B (en) | 2017-04-17 | 2017-04-17 | Heat abstractor for be used for frame server chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710248845.6A CN106937517B (en) | 2017-04-17 | 2017-04-17 | Heat abstractor for be used for frame server chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106937517A true CN106937517A (en) | 2017-07-07 |
| CN106937517B CN106937517B (en) | 2023-09-29 |
Family
ID=59438429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710248845.6A Active CN106937517B (en) | 2017-04-17 | 2017-04-17 | Heat abstractor for be used for frame server chip |
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| Country | Link |
|---|---|
| CN (1) | CN106937517B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109244051A (en) * | 2018-10-30 | 2019-01-18 | 中国航天空气动力技术研究院 | A kind of parallel heat radiation device for loop heat pipe for server chips heat dissipation |
| CN113163683A (en) * | 2021-04-02 | 2021-07-23 | 西安易朴通讯技术有限公司 | Liquid cooling heat dissipation equipment, cabinet and system |
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| US20120180993A1 (en) * | 2009-09-29 | 2012-07-19 | Minoru Yoshikawa | Heat conveying structure for electronic device |
| CN202632192U (en) * | 2011-04-25 | 2012-12-26 | 谷歌公司 | Thermosiphon system for electronic equipment and server support sub-assembly |
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| CN113163683A (en) * | 2021-04-02 | 2021-07-23 | 西安易朴通讯技术有限公司 | Liquid cooling heat dissipation equipment, cabinet and system |
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| Publication number | Publication date |
|---|---|
| CN106937517B (en) | 2023-09-29 |
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