CN205665634U - Liquid cooling's rack -mounted server - Google Patents

Abstract

The utility model discloses a liquid cooling's rack -mounted server belongs to the server radiation field, and how the technical problem that solve is for realizing that low noise, the radiating server of high efficiency and this cooling system take up space for a short time, its structure includes quick -witted case and sets up the mainboard module at quick -witted incasement, the hard disk, integrated circuit board module and power module, still including setting up the roof at quick -witted incasement, the mainboard cold drawing of setting in the mainboard module, the hard disk cold drawing of setting on the hard disk, integrated circuit board cold drawing and setting the power cold drawing on power module of setting in the integrated circuit board module, the mainboard cold drawing, the hard disk cold drawing, integrated circuit board cold drawing and power cold drawing all are connected to the roof, be provided with heat radiating water pipe in the roof, heat radiating water pipe distributes in the roof with snakelike mode, be provided with the coolant liquid in the heat radiating water pipe, heat radiating water pipe's a port is the water inlet, another port of heat radiating water pipe is the delivery port, the intercommunication has coolant liquid circulating device between water inlet and the delivery port.

Description

A rack server with water cooling and heat dissipation

technical field

The utility model relates to the field of server heat dissipation, in particular to a water-cooled heat dissipation rack server.

Background technique

At present, servers include computing servers and storage servers. Computing servers and storage servers usually use air cooling for heat dissipation. There are a large number of fans in the chassis. A large number of fans suck cold air from one side of the chassis, and then absorb the hot air The air is blown out from the other side of the chassis, thereby realizing the heat dissipation of the server. This heat dissipation method has low heat dissipation efficiency and high noise. A technical problem that needs to be solved when how to realize high-efficiency heat dissipation and low-noise server heat dissipation.

The Chinese patent with the publication number CN104582442 A published on April 29, 2015 proposes a cooling system and a server system, including a heat pipe containing a refrigerant inside, and is structured as follows: a hot end, a liquid outlet pipe, a cold end, and a liquid inlet The tubes are connected end-to-end in order to form a cooling circulation loop; and a water-cooled plate thermally coupled with the cold end. When in use, the hot end of the cooling system is set on the bottom or top surface of the CPU to cool the CPU, and the cold end of the heat pipe exchanges heat with the water-cooled plate. When performing heat dissipation, it is necessary to install a corresponding heat pipe on each component. This requires multiple heat pipes, which results in a large number of heat pipes in the chassis and takes up a large space. Due to the limited space in the chassis, it is not conducive to the wiring and heat pipes in the chassis. arranged.

How to effectively use the internal space of the chassis to set up the water-cooling system in the server to achieve high-efficiency, low-noise heat dissipation in the server and the small space occupied by the cooling system is a technical problem that needs to be solved.

Contents of the invention

The technical task of the utility model is to provide a water-cooled and heat-dissipating rack server to solve the problem of how to realize low-noise, high-efficiency heat dissipation of the server and the small space occupied by the heat dissipation system.

The technical scheme that the utility model solves its technical problem adopts is:

A water-cooled and heat-dissipating rack server includes a chassis and a main board module, a hard disk, a board module and a power supply module arranged in the case, and also includes a top plate arranged in the case, a main board cold plate arranged on the main board module, a set The hard disk cold plate on the hard disk, the board cold plate set on the board module, and the power supply cold plate set on the power supply module, the motherboard cold plate, the hard disk cold plate, the board cold plate and the power supply cold plate are all connected to the top plate , the top plate is provided with cooling water pipes, the cooling water pipes are distributed in the top plate in a serpentine manner, the cooling liquid is arranged in the cooling water pipes, one port of the cooling water pipe is the water inlet, the other port of the cooling water pipe is the water outlet, the water inlet and the outlet There is a coolant circulation device connected between the water ports;

The top plate is located above the cold plate of the main board, the cold plate of the hard disk, the cold plate of the card and the cold plate of the power supply.

The shell of the chassis is an aluminum alloy shell.

Compared with the prior art, a water-cooled and heat-dissipating rack server of the utility model has the following beneficial effects:

1. The main board module, hard disk, board module and power module in the chassis of the utility model are all provided with cold plates, and the cold plates are respectively the main board cold plate absorbing the heat of the main board module, the hard disk cold plate absorbing the heat of the hard disk, and the absorbing plate The cold plate of the card module and the cold plate of the power supply absorb the heat of the power module. The coolant in the chassis is absorbed and exported, that is, the heat of the heating element is dissipated by water cooling, which has the advantages of high heat dissipation efficiency and low noise, and realizes a low-noise and high-efficiency heat dissipation environment in the chassis;

2. In the utility model, the heat dissipation water pipes are distributed in the top plate in a serpentine manner, which increases the flow of cooling liquid in the top plate and improves the heat dissipation efficiency;

3. In the utility model, the top plate is in direct contact with the cold plate of the main board, the cold plate of the hard disk, the cold plate of the board card and the cold plate of the power supply to conduct heat conduction respectively, and there is no need for the cold plate of the main board, the cold plate of the hard disk, the cold plate of the board card and the cold plate of the power supply The heat is exchanged with the outside alone, and there is no need to set up heat transfer devices between the top plate and the main board cold plate, hard disk cold plate, board card cold plate and power supply cold plate, which saves the space in the chassis and saves the cost.

Description of drawings

Below in conjunction with accompanying drawing, the utility model is further described.

Accompanying drawing 1 is a schematic structural diagram of the heat dissipation principle of a water-cooled rack server;

In the figure: 1. Top plate, 2. Heat dissipation water pipe, 3. Water inlet, 4. Coolant circulation device, 5. Water outlet, 6. Chassis, 7. Power module, 8. Power cold plate, 9. Board module, 10. Board cold plate, 11. Hard disk, 12. Hard disk cold plate, 13. Main board module, 14. Main board cold plate;

The direction of the arrow in the figure indicates the flow direction of the coolant.

detailed description

Below in conjunction with accompanying drawing and specific embodiment the utility model is further described.

Example

A water-cooled and heat-dissipating rack server of the present utility model comprises a chassis 6, the casing of the chassis 6 is an aluminum alloy casing, and the chassis 6 is provided with a main board module 13, a hard disk 11, a board module 9, a power supply module 7 and a top plate 1 , the mainboard module 13 is provided with a mainboard cold plate 14, the hard disk 11 is provided with a hard disk cold plate 12, the board module 9 is provided with a board cold plate 10, the power module 7 is provided with a power supply cold plate 8, and a mainboard cold plate 14 , the hard disk cold plate 12, the card cold plate 10 and the power cold plate 8 are all connected to the top plate 1, and the top plate 1 is provided with a heat dissipation water pipe 2, and the heat dissipation water pipe 2 is distributed in the top plate 1 in a serpentine manner, and the heat dissipation water pipe 2 is provided with For cooling liquid, one port of the cooling water pipe 2 is a water inlet 3, and the other port of the cooling water pipe 2 is a water outlet 5, and a cooling liquid circulation device 4 is communicated between the water inlet 3 and the water outlet 5. The cooling liquid circulation device 4 injects low-temperature cooling liquid into the water inlet 3 of the heat dissipation water pipe 2. The cooling liquid flows in the heat dissipation water pipe 2 and absorbs the heat of the top plate 1. After absorbing the heat, the coolant flows into the cooling water through the water outlet 5 of the heat dissipation water pipe 2. The liquid circulation device 4, so that the cooling liquid can absorb and export the heat of the top plate 1. In this embodiment, water is selected as the cooling liquid, and a circulating water pump is selected as the cooling liquid circulation device 4 .

Wherein, top plate 1 is positioned at the top of motherboard cold plate 14, hard disk cold plate 12, board card cold plate 10 and power supply cold plate 8, effectively utilizes the space in the case, saves top plate, main board cold plate, hard disk cold plate, board card The space occupied by the cold plate and the power cold plate.

The heat dissipation method of a water-cooled and heat-dissipating rack server of the present utility model is as follows:

Main board module 13, hard disk 11, board module 9, power module 7 all can generate heat in the case 6 work, main board cold plate 14 absorbs the heat of the main board module 13 that contacts with it, hard disk cold plate 12 absorbs the heat of the hard disk 11 that contacts with it Heat, the board cold plate 10 absorbs the heat of the board module 9 in contact with it, the power supply cold plate 8 absorbs the heat of the power module 7 in contact with it, the motherboard cold plate 14, the hard disk cold plate 12, the board card cold plate 10 and the power supply cold plate The board 8 conducts the heat it absorbs to the top board 1, and the heat of the top board 1 is absorbed and exported by the cooling liquid, that is, the heat generated by the motherboard module 13, the hard disk 11, the card module 9 and the power module 7 is dissipated by water cooling. .

Through the above specific implementation methods, those skilled in the art can easily realize the utility model. However, it should be understood that the present utility model is not limited to the specific implementation manners described above. On the basis of the disclosed embodiments, those skilled in the art can arbitrarily combine different technical features, so as to realize different technical solutions.

Claims (3)

1. a rack server of water cooling and heat dissipation, comprising a chassis and a main board module, a hard disk, a board module and a power supply module arranged in the case, it is characterized in that it also includes a top plate arranged in the case, a top board arranged on the main board module The main board cold plate, the hard disk cold plate arranged on the hard disk, the board card cold plate arranged on the card module and the power supply cold plate arranged on the power supply module, the main board cold plate, the hard disk cold plate, the board card cold plate and the power supply cold plate The plates are all connected to the top plate, and the top plate is provided with cooling water pipes, which are distributed in the top plate in a serpentine manner, and cooling liquid is arranged in the cooling water pipes, one port of the cooling water pipe is the water inlet, and the other port of the cooling water pipe is the water outlet , A coolant circulation device is communicated between the water inlet and the water outlet. 2 . The water-cooled and heat-dissipating rack server according to claim 1 , wherein the top plate is located above the cold plate of the main board, the cold plate of the hard disk, the cold plate of the card and the cold plate of the power supply. 3 . 3. A water-cooled and heat-dissipating rack server according to claim 1, characterized in that the casing of the chassis is an aluminum alloy casing.