CN106973544B - Electronic system - Google Patents
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- CN106973544B CN106973544B CN201610284514.3A CN201610284514A CN106973544B CN 106973544 B CN106973544 B CN 106973544B CN 201610284514 A CN201610284514 A CN 201610284514A CN 106973544 B CN106973544 B CN 106973544B
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- Prior art keywords
- liquid
- connector
- cooled module
- cooling system
- liquid cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000007788 liquid Substances 0.000 claims abstract description 233
- 238000001816 cooling Methods 0.000 claims abstract description 119
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000005086 pumping Methods 0.000 claims description 26
- 239000002826 coolant Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000002360 explosive Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 208000002925 dental caries Diseases 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention discloses a kind of electronic systems, include a radiating seat and an electronic device.Radiating seat includes a pedestal, one first liquid cooling system and at least one first connector.First liquid cooling system and the first connector are set in pedestal.First connector is connected to the first liquid cooling system and exposed from pedestal.Electronic device includes a shell, a liquid cooled module and at least one second connector.Liquid cooled module and the second connector are set in shell.Second connector is connected to liquid cooled module and exposed from shell.When the first connector and the second connector are connected with each other, the first liquid cooling system and liquid cooled module are via the first connector and the second connector one liquid cooling circulation path of formation.
Description
Technical field
The present invention is about a kind of electronic system, espespecially a kind of Department of Electronics radiated using radiating seat to electronic device
System.
Background technique
The development of radiator and electronic device is closely bound up.Due to electric current meeting of the electronic device in running, in circuit
Unnecessary thermal energy is generated because of the influence of impedance, if these thermal energy cannot be excluded effectively and be accumulated inside electronic device
Electronic component on, electronic component is just possible to damage because of continuous raised temperature.Therefore, the superiority and inferiority of radiator influences
The running of electronic device is very huge.
Currently, the most common radiator of electronic device is the electronics member by the way that the end thereof contacts of heat pipe can be generated to heat
Part, the other end connects cooling fin, and is radiated with radiator fan to cooling fin.However, radiator fan institute under high revolving speed
What is generated disturbs people's noise and high power consumption, and often manufacturer is difficult to overcome the problems, such as.Therefore, liquid cooling system just in response to and
It is raw.
In general, liquid cooling system is mainly made of multiple piping connection liquid cooling heads, radiator and pumping.Liquid cooling
System is that coolant liquid is squeezed into liquid cooling head by pumping, coolant liquid absorbs electronic component and produced when radiating to electronic component
Raw heat, then coolant liquid is cooled down by radiator.Due to the increasingly promotion of electronic device efficiency, when electronic device operates
Generated heat is also more and more, so that radiator or the liquid cooling system gradually not deposited use that electronic device is built-in.Therefore,
How to promote the radiating efficiency to electronic device, becomes as the big project in design.
Summary of the invention
The present invention provides a kind of electronic system to radiate using radiating seat to electronic device, to solve above-mentioned ask
Topic.
According to an embodiment, electronic system of the invention includes a radiating seat and an electronic device.Radiating seat includes one
Pedestal, one first liquid cooling system and at least one first connector.First liquid cooling system and the first connector are set in pedestal.
First connector is connected to the first liquid cooling system and exposed from pedestal.Electronic device includes a shell, a liquid cooled module and extremely
Few one second connector.Liquid cooled module and the second connector are set in shell.Second connector be connected to liquid cooled module and from
Shell is exposed.When the first connector and the second connector are connected with each other, the first liquid cooling system and liquid cooled module connect via first
Fitting and the second connector form a liquid cooling circulation path.
According to another embodiment, electronic system of the invention includes a radiating seat and an electronic device.Radiating seat includes
One pedestal and one first liquid cooling system.First liquid cooling system is set in pedestal and includes one first liquid cooled module.First liquid
Cold module is exposed from pedestal.Electronic device includes a shell and one second liquid cooling system.Second liquid cooling system is set to shell
In and include one second liquid cooled module.Second liquid cooled module is exposed from shell.When electronic device is set on radiating seat, first
Liquid cooled module contacts with each other with the second liquid cooled module.
In conclusion radiating seat is respectively provided with electronic device can the first connector interconnected in an embodiment
With the second connector, wherein the first connector is connected to the first liquid cooling system in radiating seat, and the second connector is connected to electricity
Liquid cooled module in sub-device.When electronic device because long-time uses the problem of heat dissipation deficiency occurs when, user can be by the
A connection piece and the second connector are connected with each other, so that the first liquid cooling system and liquid cooled module connect via the first connector and second
Fitting forms liquid cooling circulation path.At this point, the first liquid cooling system of radiating seat can carry out auxiliary heat dissipation to electronic device.In another
In one embodiment, radiating seat can have the first liquid cooling system, and electronic device can have the second liquid cooling system.When the second liquid cooling system
When system can not exclude in time heat caused by electronic device, electronic device can be set on radiating seat by user, make first
Liquid cooled module contacts with each other with the second liquid cooled module.At this point, heat caused by electronic device can be passed via the second liquid cooled module
It is directed at the first liquid cooled module, and then carries out auxiliary heat dissipation using the first liquid cooling system of radiating seat.
It can be obtained further by detailed description of the invention below and institute's accompanying drawings about the advantages and spirit of the present invention
Solution.
Detailed description of the invention
Fig. 1 is the schematic diagram according to the electronic system of one embodiment of the invention.
Fig. 2 is the explosive view of the electronic system in Fig. 1.
Fig. 3 is the explosive view of the radiating seat in Fig. 1.
Fig. 4 is the explosive view of the electronic device in Fig. 1.
Fig. 5 is the explosive view according to the electronic device of another embodiment of the present invention.
Fig. 6 is the schematic diagram according to the electronic system of another embodiment of the present invention.
Fig. 7 is the explosive view of the electronic system in Fig. 6.
Fig. 8 is the explosive view of the radiating seat in Fig. 6.
Fig. 9 is the radiating seat in Fig. 6 in the explosive view at another visual angle.
Figure 10 is the explosive view of the electronic device in Fig. 6.
Figure 11 is the schematic diagram according to the electronic system of another embodiment of the present invention.
Figure 12 is the explosive view of the electronic system in Figure 11.
Figure 13 is the electronic system in Figure 11 in the explosive view at another visual angle.
Figure 14 is the explosive view of the radiating seat in Figure 11.
Figure 15 is the explosive view of the electronic device in Figure 11.
Wherein, appended drawing reference:
1,3,5 electronic system
10,30,50 radiating seat
12, the electronic device of 12', 32,52
100,300,500 pedestal
102,302,502 first liquid cooling system
The first connector of 104a, 104b
120,320,520 shell
122 liquid cooled modules
The second connector of 124a, 124b
126,322,522 second liquid cooling system
128 radiating modules
304,504 first liquid cooled module
306 support frames
308 elastic components
324,524 second liquid cooled module
1020,1260,3020,3220,5020,5220 pumping
1022,1262,3022,3222,5022,5222 radiator
1024,1264,1286,3024,3224,5024,5224 fan
1026,1266,3026,3226,5026,5226 pipeline
1280 heat-conducting plates
1282 heat pipes
1284 radiating fin combinations
3060 limiting sections
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Fig. 1 is according to the schematic diagram of the electronic system 1 of one embodiment of the invention referring to FIG. 1 to FIG. 4, and Fig. 2 is in Fig. 1
Electronic system 1 explosive view, Fig. 3 be Fig. 1 in radiating seat 10 explosive view, Fig. 4 be Fig. 1 in electronic device 12 explosion
Figure.As shown in Figures 1 and 2, electronic system 1 includes a radiating seat 10 and an electronic device 12.In practical application, electronics dress
Setting 12 can be an integral type (All-in-One, AIO) computer, a notebook computer, a projector or a light supply apparatus.
As shown in Figure 2 and Figure 3, radiating seat 10 includes a pedestal 100, one first liquid cooling system 102 and at least one first
Connector.In the present embodiment, radiating seat 10 has the first connector 104a and 104b, and only the present invention is not limited thereto.The
One liquid cooling system 102 and the first connector 104a and 104b are set in pedestal 100.First connector 104a, 104b is connected to
First liquid cooling system 102 and exposed from pedestal 100.In this embodiment, the first liquid cooling system 102 may include a pumping 1020,
One radiator 1022 and a fan 1024, wherein first connector 104a, 104b, pumping 1020 are with radiator 1022 via pipe
Road 1026 is connected with each other, and fan 1024 is set to the side of radiator 1022.
As shown in Fig. 2 and Fig. 4, electronic device 12 includes a shell 120, a liquid cooled module 122 and at least one second company
Fitting.In the present embodiment, electronic device 12 has the second connector 124a and 124b, and only the present invention is not limited thereto.In
In practical application, liquid cooled module 122 can be temperature-uniforming plate, liquid cooling head or other cavitys for accommodating coolant liquid.Liquid cooled module 122 with
Second connector 124a, 124b is set in 120 shells.Second connector 124a, 124b is connected to liquid cooled module 122 and from shell
Body 120 is exposed.In this embodiment, electronic device 12 additionally comprises one second liquid cooling system 126.Second liquid cooling system 126 can wrap
Containing one pumping 1260, at least one radiator 1262, at least a fan 1264 and liquid cooled module 122, wherein liquid cooled module 122,
Second connector 124a, 124b, pumping 1260 are connected with each other with radiator 1262 via pipeline 1266, and fan 1264 is set to
The side of radiator 1262.
In this embodiment, one of the first connector 104a and the second connector 124a can be a public fast access head, and
First connector 104a and the second connector 124a is wherein another for a female fast joint.In other words, the present invention can connect first
Fitting 104a and the second connector 124a is designed as mutually matched public fast access head and female fast joint, so that the first connector 104a
With the second connector 124a can quickly be advantageously connected with each other or separate.In practical application, the first liquid cooling system 102, liquid
Coolant liquid (for example, water or other liquid) is accommodated in cold module 122 and the second liquid cooling system 126, therefore, in some embodiments
In, it is connect fastly or the structure of Quick Release for realizing that the fast joint of the first connector 104a and the second connector 124a can have, and
And the structure that there is the first connector 104a and the second connector 124a to prevent coolant liquid from leaking in engagement or disassembly.Another
In outer some embodiments, the first connector 104a and the second connector 124a can also be designed in a manner of screwing togather.It needs to illustrate
, the structure design of the first connector 104b and the second connector 124b is approximately identical to the first connector 104a and the second company
The structure of fitting 124a designs, and details are not described herein.
In general, the electronic component that the liquid cooled module 122 of electronic device 12 is attached inside electronic device 12 (is not shown
Show) on, generated heat when absorbing electronic component running.When electronic device 12 is not yet set on radiating seat 10, also that is,
When a connection piece 104a, 104b and second connector 124a, 124b are not yet connected with each other, electronic device 12 is by the second liquid cooling system
126 pairs of liquid cooled modules 122 of uniting radiate.
When electronic device 12 because long-time use due to occurs the second liquid cooling system 126 radiate deficiency problem when, user
Electronic device 12 can be set on radiating seat 10, and by first connector 104a, 104b and second connector 124a, 124b phase
It connects, so that the first liquid cooling system 102 of radiating seat 10 and the liquid cooled module 122 of electronic device 12 are via the first connector
104a, 104b and second connector 124a, 124b form liquid cooling circulation path.At this point, the first liquid cooling system 102 of radiating seat 10
Can liquid cooled module 122 to electronic device 12 carry out auxiliary heat dissipation, to promote the radiating efficiency to electronic device 12.It is being not required to
When being radiated using radiating seat 10 to electronic device 12, as long as first connector 104a, 104b is connect by user with second
Part 124a, 124b separation.It prevents from cooling down since first connector 104a, 104b and second connector 124a, 124b has
The structure that liquid leaks, therefore, when first connector 104a, 104b and second connector 124a, 124b is separated from each other, first connects
Fitting 104a, 104b can prevent the first liquid cooling system 102 to be formed by with liquid cooled module 122 with second connector 124a, 124b
Coolant liquid in liquid cooling circulation path leaks.
In this embodiment, when first connector 104a, 104b and second connector 124a, 124b is separated from each other, electricity
Sub-device 12 carries out liquid-cooling heat radiation to liquid cooled module 122 by the second liquid cooling system 126.However, when the first connector 104a,
When 104b and second connector 124a, 124b are connected with each other, the present invention can detect the by mechanical and/or electronic type design
A connection piece 104a, 104b have been connected with each other with second connector 124a, 124b, and control the pumping of the first liquid cooling system 102
1020 open, and the pumping 1260 for controlling the second liquid cooling system 126 is closed, so that the first liquid cooling system 102 is to liquid cooled module 122
Liquid-cooling heat radiation is carried out, and the second liquid cooling system 126 stops carrying out liquid-cooling heat radiation to liquid cooled module 122.It should be noted that when first
When connector 104a, 104b and second connector 124a, 124b are connected with each other, the present invention also can control the first liquid cooling system 102
Pumping 1020 and the pumping 1260 of the second liquid cooling system 126 open simultaneously so that the first liquid cooling system 102 and the second liquid cooling system
System 126 carries out liquid-cooling heat radiation to liquid cooled module 122 simultaneously.
Referring to Fig. 5, Fig. 5 is the explosive view according to the electronic device 12' of another embodiment of the present invention.Electronic device 12'
It is in place of the main difference of above-mentioned electronic device 12, electronic device 12' additionally comprises a radiating module 128, and with heat dissipation
Module 128 replaces the pumping 1260 of the second above-mentioned liquid cooling system 126, radiator 1262 and fan 1264.As shown in figure 5, dissipating
Thermal modules 128 are set in shell 120, and liquid cooled module 122 is set on radiating module 128.In this embodiment, radiating mould
Block 128 may include a heat-conducting plate 1280, an at least heat pipe 1282, at least a radiating fin combination 1284 and an at least fan
1286.Liquid cooled module 122 may be disposed on heat-conducting plate 1280, and two ends of heat pipe 1282 are separately connected heat-conducting plate 1280 and heat radiating fin
Piece combination 1284, fan 1286 is then set to the side of radiating fin combination 1284.Whereby, the heat that liquid cooled module 122 is absorbed
It can conduct via heat-conducting plate 1280 and heat pipe 1282 to radiating fin combination 1284, then generating air-flow by fan 1286 will be tropical
It walks.It should be noted that in Fig. 5 label identical as shown in Fig. 4 element, action principle is roughly the same, and details are not described herein.
Fig. 6 to Figure 10 is please referred to, Fig. 6 is according to the schematic diagram of the electronic system 3 of another embodiment of the present invention, Fig. 7 Fig. 6
In electronic system 3 explosive view, Fig. 8 be Fig. 6 in radiating seat 30 explosive view, Fig. 9 be Fig. 6 in radiating seat 30 in another
The explosive view at visual angle, Figure 10 are the explosive view of the electronic device 32 in Fig. 6.As shown in Figures 6 and 7, electronic system 3 includes one scattered
Hot seat 30 and an electronic device 32.In practical application, electronic device 32 can be an integral type (All-in-One, AIO) electricity
Brain, a notebook computer, a projector or a light supply apparatus.
As shown in Figure 7 to 9, radiating seat 30 include a pedestal 300, one first liquid cooling system 302, a support frame 306 with
An and at least elastic component 308.First liquid cooling system 302, support frame 306 and elastic component 308 are set in pedestal 300.First liquid
Cooling system 302 includes one first liquid cooled module 304.First liquid cooled module 304 is exposed from pedestal 300.First liquid cooled module 304 can
It is movably set in support frame 306.Two ends of elastic component 308 are connected to the first liquid cooled module 304 and support frame 306.
Support frame 306 has a limiting section 3060, and wherein limiting section 3060 limits the first liquid cooled module 304 and is detached from support frame 306.Yu Shi
In the application of border, the first liquid cooled module 304 can be temperature-uniforming plate, liquid cooling head or other cavitys for accommodating coolant liquid, and elastic component 308
It can be spring or other elastomers.In this embodiment, the first liquid cooled module 304 can be made of copper, and but not limited to this.In this
In embodiment, the first liquid cooling system 302 can additionally comprise a pumping 3020, a radiator 3022 and a fan 3024, wherein pumping
Pu 3020, radiator 3022 and the first liquid cooled module 304 are connected with each other via pipeline 3026, and fan 3024 is set to radiator
3022 side.In practical application, accommodated in the first liquid cooling system 302 and the first liquid cooled module 304 coolant liquid (for example,
Water or other liquid).
As shown in Fig. 7 and Figure 10, electronic device 32 includes a shell 320 and one second liquid cooling system 322.Second liquid cooling
System 322 is set in shell 320 and includes one second liquid cooled module 324.Second liquid cooled module 324 is exposed from shell 320.In
In practical application, the second liquid cooled module 324 can be temperature-uniforming plate, liquid cooling head or other cavitys for accommodating coolant liquid.In this implementation
In example, the second liquid cooled module 324 can be made of copper, and but not limited to this.In this embodiment, the second liquid cooling system 322 can be another
Comprising a pumping 3220, at least one radiator 3222 and at least fan 3224, wherein pumping 3220, radiator 3222 and the
Two liquid cooled modules 324 are connected with each other via pipeline 3226, and fan 3224 is set to the side of radiator 3222.In practical application
In, coolant liquid (for example, water or other liquid) is accommodated in the second liquid cooling system 322 and the second liquid cooled module 324.
In general, the second liquid cooled module 324 of electronic device 32 is attached at the electronic component inside electronic device 32 (not
Display) on, generated heat when absorbing electronic component running.Then, then by the second liquid cooling system 322 to the second liquid cooling mould
Block 324 radiates.When the second liquid cooling system 322 can not exclude in time heat caused by the electronic component of electronic device 32
When, electronic device 32 can be set on radiating seat 30 by user, make the first liquid cooled module 304 and electronic device of radiating seat 30
32 the second liquid cooled module 322 contacts with each other.At this point, heat caused by the electronic component of electronic device 32 i.e. can be via the second liquid
The conduction of cold module 322 to radiating seat 30 the first liquid cooled module 304, then by radiating seat 30 the first liquid cooling system 302 to first
Liquid cooled module 304 radiates, to promote the radiating efficiency to electronic device 32.
As shown in figure 9, the first liquid cooled module 304 is held between the limiting section 3060 of support frame 306 and elastic component 308.
When electronic device 32 is set on radiating seat 30, the second liquid cooled module 322 of electronic device 32 can be by the first of radiating seat 30
Liquid cooled module 304 pushes.At this point, elastic component 308 can generate upward the first liquid cooled module of pushing tow 304 of elastic force, and then ensure electricity
Second liquid cooled module 322 of sub-device 32 can smooth the first liquid cooled module 304 in radiating seat 30.
Figure 11 to Figure 15 is please referred to, Figure 11 is according to the schematic diagram of the electronic system 5 of another embodiment of the present invention, Tu12Wei
The explosive view of electronic system 5 in Figure 11, Figure 13 are the electronic system 5 in Figure 11 in the explosive view at another visual angle, and Figure 14 is figure
The explosive view of radiating seat 50 in 11, Figure 15 are the explosive view of the electronic device 52 in Figure 11.As shown in Figure 11 to Figure 13, electronics
System 5 includes a radiating seat 50 and an electronic device 52.In practical application, electronic device 52 can for notebook computer or its
Its electronic device.
As shown in Figure 12 and Figure 14, radiating seat 50 includes a pedestal 500 and one first liquid cooling system 502.In this implementation
In example, the first liquid cooling system 502 may include that one first liquid cooled module 504, one pumps 5020, one radiator 5022 and a fan
5024, wherein pumping 5020, radiator 5022 and the first liquid cooled module 504 are connected with each other via pipeline 5026, and fan 5024
It is set to the side of radiator 5022.It should be noted that the structure of pumping 5020, radiator 5022 and the first liquid cooled module 504
Design and action principle and the design of the structure of above-mentioned pumping 3020, radiator 3022 and the first liquid cooled module 304 and effect are former
Manage roughly the same, details are not described herein.
As shown in Figure 13 and Figure 15, electronic device 52 includes a shell 520 and one second liquid cooling system 522.In this reality
Apply in example, the second liquid cooling system 522 may include one second liquid cooled module 524, one pump 5220, at least one radiator 5222 and
An at least fan 5224, wherein pumping 5220, radiator 5222 and the second liquid cooled module 524 are connected with each other via pipeline 5226,
And fan 5224 is set to the side of radiator 5222.It should be noted that pumping 5220, radiator 5222 and the second liquid cooled module
524 structure design is designed with action principle and the structure of above-mentioned pumping 3220, radiator 3222 and the second liquid cooled module 324
Roughly the same with action principle, details are not described herein.
In general, the second liquid cooled module 524 of electronic device 52 is attached at the electronic component inside electronic device 52 (not
Display) on, generated heat when absorbing electronic component running.Then, then by the second liquid cooling system 522 to the second liquid cooling mould
Block 524 radiates.When the second liquid cooling system 522 can not exclude in time heat caused by the electronic component of electronic device 52
When, electronic device 52 can be set on radiating seat 50 by user, make the first liquid cooled module 504 and electronic device of radiating seat 50
52 the second liquid cooled module 522 contacts with each other.At this point, heat caused by the electronic component of electronic device 52 i.e. can be via the second liquid
The conduction of cold module 522 to radiating seat 50 the first liquid cooled module 504, then by radiating seat 50 the first liquid cooling system 502 to first
Liquid cooled module 504 radiates, to promote the radiating efficiency to electronic device 52.
In conclusion radiating seat is respectively provided with electronic device can the first connector interconnected in an embodiment
With the second connector, wherein the first connector is connected to the first liquid cooling system in radiating seat, and the second connector is connected to electricity
Liquid cooled module in sub-device.When electronic device because long-time uses the problem of heat dissipation deficiency occurs when, user can be by the
A connection piece and the second connector are connected with each other, so that the first liquid cooling system and liquid cooled module connect via the first connector and second
Fitting forms liquid cooling circulation path.At this point, the first liquid cooling system of radiating seat can carry out auxiliary heat dissipation to electronic device.In another
In one embodiment, radiating seat can have the first liquid cooling system, and electronic device can have the second liquid cooling system.When the second liquid cooling system
When system can not exclude in time heat caused by electronic device, electronic device can be set on radiating seat by user, make first
Liquid cooled module contacts with each other with the second liquid cooled module.At this point, heat caused by electronic device can be passed via the second liquid cooled module
It is directed at the first liquid cooled module, and then carries out auxiliary heat dissipation using the first liquid cooling system of radiating seat.
The foregoing is merely presently preferred embodiments of the present invention, all equivalent changes done according to scope of the present invention patent with
Modification, is all covered by the present invention.
Claims (16)
1. a kind of electronic system, characterized by comprising:
One radiating seat, include a pedestal, one first liquid cooling system and at least one first connector, first liquid cooling system with should
First connector is set in the pedestal, which is connected to first liquid cooling system and exposed from the pedestal；And
One electronic device, comprising a shell, a liquid cooled module and at least one second connector, the liquid cooled module and second company
Fitting is set in the shell, which is connected to the liquid cooled module and exposed from the shell；
Wherein, when first connector and second connector are connected with each other, first liquid cooling system and the liquid cooled module are passed through
One liquid cooling circulation path is formed by first connector and second connector, at this point, first liquid cooling system of the radiating seat
Auxiliary heat dissipation can be carried out to the electronic device.
2. electronic system according to claim 1, which is characterized in that first connector and second connector wherein it
One is a public fast access head, and it is a female fast joint that first connector and second connector are wherein another.
3. electronic system according to claim 1, which is characterized in that when first connector and second connector are mutual
When separation, which can prevent the coolant liquid in the liquid cooling circulation path from leaking with second connector.
4. electronic system according to claim 1, which is characterized in that first liquid cooling system includes a pumping, a heat dissipation
Device and a fan.
5. electronic system according to claim 1, which is characterized in that the electronic device additionally comprises one second liquid cooling system,
Second liquid cooling system is set in the shell and includes a pumping, at least a radiator, at least a fan and the liquid cooling mould
Block.
6. electronic system according to claim 5, which is characterized in that when first connector and second connector are mutual
When separation, which carries out liquid-cooling heat radiation to the liquid cooled module；When first connector and the second connector phase
When connecting, which carries out liquid-cooling heat radiation to the liquid cooled module, and second liquid cooling system stops to the liquid cooling
Module carries out liquid-cooling heat radiation.
7. electronic system according to claim 5, which is characterized in that when first connector and second connector are mutual
When separation, which carries out liquid-cooling heat radiation to the liquid cooled module；When first connector and the second connector phase
When connecting, first liquid cooling system and second liquid cooling system carry out liquid-cooling heat radiation to the liquid cooled module simultaneously.
8. electronic system according to claim 1, which is characterized in that the electronic device additionally comprises a radiating module, this is dissipated
Thermal modules are set in the shell, which is set on the radiating module.
9. electronic system according to claim 8, which is characterized in that the radiating module includes a heat-conducting plate, at least one heat
Pipe, at least a radiating fin combination and an at least fan.
10. electronic system according to claim 1, which is characterized in that the electronic device is an integral computer, a notes
Type computer, a projector or a light supply apparatus.
11. a kind of electronic system, characterized by comprising:
One radiating seat, includes a pedestal and one first liquid cooling system, which is set in the pedestal and includes
One first liquid cooled module, first liquid cooled module are exposed from the pedestal；And
One electronic device, includes a shell and one second liquid cooling system, which is set in the shell and wraps
Containing one second liquid cooled module, second liquid cooled module is exposed from the shell；
Wherein, when the electronic device is set on the radiating seat, first liquid cooled module and the second liquid cooled module phase mutual connection
Touching, at this point, heat caused by the electronic device can be conducted to first liquid cooled module, Jin Erli via second liquid cooled module
Auxiliary heat dissipation is carried out with first liquid cooling system of the radiating seat.
12. electronic system according to claim 11, which is characterized in that first liquid cooling system additionally comprises a pumping, one
Radiator and a fan.
13. electronic system according to claim 11, which is characterized in that second liquid cooling system additionally comprises a pumping, extremely
A few radiator and an at least fan.
14. electronic system according to claim 11, which is characterized in that first liquid cooled module and second liquid cooled module
It is made of copper.
15. electronic system according to claim 11, which is characterized in that the radiating seat additionally comprises a support frame and at least
One elastic component, at least an elastic component is set in the pedestal support frame with this, which has a limiting section, first liquid
Cold module is movably arranged in the support frame, two ends of an at least elastic component be connected to first liquid cooled module with
The support frame, the limiting section limit first liquid cooled module and are detached from the support frame.
16. electronic system according to claim 11, which is characterized in that the electronic device is an integral computer, one
Note type computer, a projector or a light supply apparatus.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662278472P | 2016-01-14 | 2016-01-14 | |
| US62/278,472 | 2016-01-14 |
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| TW (1) | TWI615088B (en) |
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| CN201515582U (en) * | 2009-09-24 | 2010-06-23 | 微星科技股份有限公司 | External radiator and related electronic device thereof |
| CN201557360U (en) * | 2009-11-20 | 2010-08-18 | 英业达股份有限公司 | Cooling fan device and electronic computing system thereof |
| CN104349648A (en) * | 2013-08-09 | 2015-02-11 | 技嘉科技股份有限公司 | Composite type heat radiating assembly |
| CN204425880U (en) * | 2015-03-09 | 2015-06-24 | 讯凯国际股份有限公司 | Portable electronic devices and detachable auxiliary heat dissipation module thereof |
| CN204761925U (en) * | 2015-05-27 | 2015-11-11 | 奇鋐科技股份有限公司 | Water cooling plant that can buckle |
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|---|---|---|---|---|
| TW200733856A (en) * | 2006-02-20 | 2007-09-01 | Sunonwealth Electr Mach Ind Co | Composite heat-dissipating module |
| CN101802748B (en) * | 2007-09-13 | 2014-07-16 | 富士通株式会社 | Liquid cooling unit and electronic device |
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- 2016-04-29 CN CN201610284514.3A patent/CN106973544B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201515582U (en) * | 2009-09-24 | 2010-06-23 | 微星科技股份有限公司 | External radiator and related electronic device thereof |
| CN201557360U (en) * | 2009-11-20 | 2010-08-18 | 英业达股份有限公司 | Cooling fan device and electronic computing system thereof |
| CN104349648A (en) * | 2013-08-09 | 2015-02-11 | 技嘉科技股份有限公司 | Composite type heat radiating assembly |
| CN204425880U (en) * | 2015-03-09 | 2015-06-24 | 讯凯国际股份有限公司 | Portable electronic devices and detachable auxiliary heat dissipation module thereof |
| CN204761925U (en) * | 2015-05-27 | 2015-11-11 | 奇鋐科技股份有限公司 | Water cooling plant that can buckle |
Also Published As
| Publication number | Publication date |
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| CN106973544A (en) | 2017-07-21 |
| TW201725962A (en) | 2017-07-16 |
| TWI615088B (en) | 2018-02-11 |
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