TW200733856A - Composite heat-dissipating module - Google Patents

Composite heat-dissipating module

Info

Publication number
TW200733856A
TW200733856A TW095105598A TW95105598A TW200733856A TW 200733856 A TW200733856 A TW 200733856A TW 095105598 A TW095105598 A TW 095105598A TW 95105598 A TW95105598 A TW 95105598A TW 200733856 A TW200733856 A TW 200733856A
Authority
TW
Taiwan
Prior art keywords
heat
pump
impeller
dissipation unit
dissipating
Prior art date
Application number
TW095105598A
Other languages
Chinese (zh)
Inventor
Alex Horng
Masaharu Miyahara
Original Assignee
Sunonwealth Electr Mach Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunonwealth Electr Mach Ind Co filed Critical Sunonwealth Electr Mach Ind Co
Priority to TW095105598A priority Critical patent/TW200733856A/en
Priority to US11/432,368 priority patent/US20070193720A1/en
Priority to JP2006184890A priority patent/JP2007227869A/en
Priority to KR1020060063717A priority patent/KR20070083157A/en
Priority to DE102006033550A priority patent/DE102006033550A1/en
Publication of TW200733856A publication Critical patent/TW200733856A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A composite heat-dissipating module includes a heat-dissipating member, an impeller, and a pump. The heat-dissipating member is provided with at least one heat-dissipation unit and a fluid-circulation channel. The at least one heat-dissipation unit connects with at least one side of the impeller, and connects with at least one heat-generating element. The impeller and the pump are arranged to constitute a module. In heat-dissipating operation, the impeller drives an air flow to cool heats of the heat-dissipation unit conducted from the heat-generating element. Meanwhile, the pump dispenses a liquid coolant to circulate it from the pump to the heat-dissipation unit along the fluid-circulation channel.
TW095105598A 2006-02-20 2006-02-20 Composite heat-dissipating module TW200733856A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095105598A TW200733856A (en) 2006-02-20 2006-02-20 Composite heat-dissipating module
US11/432,368 US20070193720A1 (en) 2006-02-20 2006-05-12 Composite heat-dissipating module
JP2006184890A JP2007227869A (en) 2006-02-20 2006-07-04 Combined heat-dissipating module
KR1020060063717A KR20070083157A (en) 2006-02-20 2006-07-07 Composite heat-dissipating module
DE102006033550A DE102006033550A1 (en) 2006-02-20 2006-07-20 Composite heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095105598A TW200733856A (en) 2006-02-20 2006-02-20 Composite heat-dissipating module

Publications (1)

Publication Number Publication Date
TW200733856A true TW200733856A (en) 2007-09-01

Family

ID=38319974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105598A TW200733856A (en) 2006-02-20 2006-02-20 Composite heat-dissipating module

Country Status (5)

Country Link
US (1) US20070193720A1 (en)
JP (1) JP2007227869A (en)
KR (1) KR20070083157A (en)
DE (1) DE102006033550A1 (en)
TW (1) TW200733856A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615088B (en) * 2016-01-14 2018-02-11 訊凱國際股份有限公司 Electronic system
TWI657334B (en) * 2018-05-04 2019-04-21 微星科技股份有限公司 Portable electronic device

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US7688589B2 (en) * 2007-11-01 2010-03-30 Asia Vital Components Co., Ltd. Water cooled heat dissipation module for electronic device
US20090277614A1 (en) * 2008-05-12 2009-11-12 Shih-Yuan Lin Heat dissipating device and heat conduction structure thereof
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
EP2259310B1 (en) * 2009-06-05 2020-04-08 Siemens Gamesa Renewable Energy A/S Integrated heat exchanger
US20130273399A1 (en) * 2012-04-17 2013-10-17 GM Global Technology Operations LLC Integrated and Optimized Battery Cooling Blower and Manifold
CN103458655B (en) * 2012-06-01 2016-08-03 华硕电脑股份有限公司 Radiating module
GB2512874A (en) * 2013-04-09 2014-10-15 Richard Weatherley Cooling system
US20150330718A1 (en) * 2013-08-28 2015-11-19 Hamilton Sundstrand Corporation Integrated blower diffuser-fin single phase heat exchanger
CN105263301B (en) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 A kind of liquid cooling heat radiation system and its liquid radiating row
CN105929915A (en) * 2016-04-08 2016-09-07 吉首大学 CPU temperature monitoring and heat dissipation device
CN106285079A (en) * 2016-07-29 2017-01-04 安徽华斯源新能源科技有限公司 A kind of integrated tank-type self-contained Design of Machine Room method
US10058007B2 (en) * 2016-09-26 2018-08-21 Asia Vital Components Co., Ltd. Water-cooling radiator unit and water-cooling module using same
CN108174571B (en) * 2016-12-08 2019-11-05 研能科技股份有限公司 Be gas-cooled radiator
TWM545940U (en) * 2017-03-10 2017-07-21 Evga Corp Wireless monitoring device for display card
CN107613719B (en) * 2017-08-21 2019-08-02 中国科学院长春光学精密机械与物理研究所 A kind of space camera focal plane air cooling mechanism
CN108054661B (en) * 2018-01-05 2019-09-24 山东广域科技有限责任公司 A kind of electric power box automatic heat radiator
CN108459680B (en) * 2018-03-30 2020-12-08 陈天文 Computer cabinet
TWM609012U (en) * 2020-02-13 2021-03-11 大陸商深圳市研派科技有限公司 Liquid cooling system
TWI804768B (en) * 2020-11-06 2023-06-11 建準電機工業股份有限公司 Liquid cooling module and electronic device including the same
AU2023200259B2 (en) * 2022-02-11 2024-09-26 Getac Technology Corporation Electronic device assembly, expansion component thereof, and heat dissipation module
CN118655740A (en) * 2024-08-16 2024-09-17 深圳小象光显有限公司 LCD module with heat radiation system and projector

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US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6208512B1 (en) * 1999-05-14 2001-03-27 International Business Machines Corporation Contactless hermetic pump
US6263957B1 (en) * 2000-01-13 2001-07-24 Lucent Technologies Inc. Integrated active cooling device for board mounted electric components
US6377458B1 (en) * 2000-07-31 2002-04-23 Hewlett-Packard Company Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
JP2002099356A (en) * 2000-09-21 2002-04-05 Toshiba Corp Cooling device for electronic equipment and electronic equipment
DE10132874A1 (en) * 2001-07-06 2003-01-23 Zdenko Knezevic Cooling system comprises a cooling circuit with a cooler, a fan, a pump and a temperature sensor/reducer, a cooling medium and means for fixing the cooling circuit
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
JP3673249B2 (en) * 2002-08-27 2005-07-20 株式会社東芝 Electronic equipment and cooling device
JP3609809B2 (en) * 2002-08-30 2005-01-12 株式会社東芝 Electronic device and method for cooling electronic device
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
JP2004251474A (en) * 2003-02-18 2004-09-09 Matsushita Electric Ind Co Ltd Cooling device of electronic apparatus
US6827131B1 (en) * 2003-07-21 2004-12-07 Neng Chao Chang Apparatus of water-cooled heat sink
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
US6906919B2 (en) * 2003-09-30 2005-06-14 Intel Corporation Two-phase pumped liquid loop for mobile computer cooling
US7599626B2 (en) * 2004-12-23 2009-10-06 Waytronx, Inc. Communication systems incorporating control meshes
US7292438B2 (en) * 2005-02-25 2007-11-06 Delta Electronics, Inc. Liquid-cooling heat dissipation module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615088B (en) * 2016-01-14 2018-02-11 訊凱國際股份有限公司 Electronic system
TWI657334B (en) * 2018-05-04 2019-04-21 微星科技股份有限公司 Portable electronic device

Also Published As

Publication number Publication date
JP2007227869A (en) 2007-09-06
US20070193720A1 (en) 2007-08-23
KR20070083157A (en) 2007-08-23
DE102006033550A1 (en) 2007-08-30

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