TWI615088B - Electronic system - Google Patents

Abstract

An electronic system includes a heat sink and an electronic device. The heat sink includes a body, a first liquid cooling system, and at least one first connecting member. The first liquid cooling system and the first connecting member are disposed in the base. The first connecting member is connected to the first liquid cooling system and exposed from the seat. The electronic device includes a casing, a liquid-cooled module, and at least one second connecting member. The liquid cooling module and the second connecting member are disposed in the casing. The second connecting member is connected to the liquid cooling module and is exposed from the casing. When the first connection member and the second connection member are connected to each other, the first liquid cooling system and the liquid cooling module form a liquid cooling circulation path through the first connection member and the second connection member.

Description

electronic system

The present invention relates to an electronic system, and more particularly to an electronic system that uses a heat sink to dissipate electronic devices.

The heat sink is closely related to the development of electronic devices. As the electronic device is in operation, the current in the circuit will generate unnecessary thermal energy due to the influence of the impedance. If this thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic device, the electronic components may be continuously raised. Temperature. Therefore, the pros and cons of the heat dissipation device greatly affect the operation of the electronic device.

At present, the most common heat dissipation device for electronic devices is to contact one end of a heat pipe with an electronic component that generates heat, the other end is connected to a heat sink, and a heat sink is used to dissipate the heat sink. However, the disturbing noise and high power consumption generated by the cooling fan at high speeds are often difficult problems for manufacturers to overcome. Therefore, the liquid cooling system was born.

Generally speaking, a liquid cooling system is mainly composed of a plurality of pipes connected to a liquid cooling head, a radiator and a pump. When the liquid cooling system dissipates heat to the electronic components, the cooling liquid is driven into the liquid cooling head by the pump, the cooling liquid absorbs the heat generated by the electronic components, and then the cooling liquid is cooled by the radiator. Due to the increasing performance of electronic devices, more and more heat is generated during the operation of electronic devices, which makes the built-in heat sink or liquid cooling system of electronic devices gradually inadequate. Therefore, how to improve the heat dissipation efficiency of electronic devices has become a major issue in design.

The present invention provides an electronic system that uses a heat sink to dissipate electronic devices to solve the above problems.

According to an embodiment, the electronic system of the present invention includes a heat sink and an electronic device. The heat sink includes a body, a first liquid cooling system, and at least one first connecting member. The first liquid cooling system and the first connecting member are disposed in the base. The first connecting member is connected to the first liquid cooling system and exposed from the seat. The electronic device includes a casing, a liquid-cooled module, and at least one second connecting member. The liquid cooling module and the second connecting member are disposed in the casing. The second connecting member is connected to the liquid cooling module and is exposed from the casing. When the first connection member and the second connection member are connected to each other, the first liquid cooling system and the liquid cooling module form a liquid cooling circulation path through the first connection member and the second connection member.

According to another embodiment, the electronic system of the present invention includes a heat sink and an electronic device. The heat sink comprises a body and a first liquid cooling system. The first liquid cooling system is disposed in the base and includes a first liquid cooling module. The first liquid cooling module is exposed from the seat. The electronic device includes a casing and a second liquid cooling system. The second liquid cooling system is disposed in the casing and includes a second liquid cooling module. The second liquid cooling module is exposed from the casing. When the electronic device is disposed on the heat sink, the first liquid cooling module and the second liquid cooling module are in contact with each other.

In summary, in one embodiment, the heat sink and the electronic device have first and second connectors that can be connected to each other, wherein the first connector is connected to the first liquid cooling system in the heat sink, and The second connecting member is connected to the liquid cooling module in the electronic device. When the electronic device suffers from insufficient heat dissipation due to long-term use, the user can connect the first connection member and the second connection member to each other, so that the first liquid cooling system and the liquid cooling module pass through the first connection member and the second The connection piece forms a liquid-cooled circulation path. At this time, the first liquid cooling system of the heat sink can perform auxiliary heat dissipation for the electronic device. In another embodiment, the heat sink can have a first liquid cooling system, and the electronic device can have a second liquid cooling system. When the second liquid cooling system cannot remove the heat generated by the electronic device in time, the user can set the electronic device on the heat sink to make the first liquid cooling module and the second liquid cooling module contact each other. At this time, the heat generated by the electronic device is conducted to the first liquid cooling module through the second liquid cooling module, and the first liquid cooling system of the heat sink is used for auxiliary heat dissipation.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Please refer to FIG. 1 to FIG. 4. FIG. 1 is a schematic diagram of the electronic system 1 according to an embodiment of the present invention, FIG. 2 is an exploded view of the electronic system 1 in FIG. 1, and FIG. FIG. 4 is an exploded view of the heat sink 10 in FIG. 4. FIG. 4 is an exploded view of the electronic device 12 in FIG. 1. As shown in FIG. 1 and FIG. 2, the electronic system 1 includes a heat sink 10 and an electronic device 12. In practical applications, the electronic device 12 may be an All-in-One (AIO) computer, a notebook computer, a projector, or a light source device.

As shown in FIG. 2 and FIG. 3, the heat sink 10 includes a base body 100, a first liquid cooling system 102, and at least one first connecting member. In this embodiment, the heat sink 10 has first connecting members 104a and 104b, but the invention is not limited thereto. The first liquid cooling system 102 and the first connecting members 104 a and 104 b are disposed in the base 100. The first connecting members 104 a and 104 b are connected to the first liquid cooling system 102 and are exposed from the seat 100. In this embodiment, the first liquid cooling system 102 may include a pump 1020, a radiator 1022, and a fan 1024, where the first connectors 104a, 104b, the pump 1020, and the radiator 1022 are connected to each other via a pipe 1026. The fan 1024 is connected to one side of the radiator 1022.

As shown in FIG. 2 and FIG. 4, the electronic device 12 includes a casing 120, a liquid cooling module 122, and at least one second connecting member. In this embodiment, the electronic device 12 has second connecting members 124a and 124b, but the invention is not limited thereto. In practical applications, the liquid-cooling module 122 may be a temperature equalizing plate, a liquid-cooling head, or other cavity capable of containing a cooling liquid. The liquid cooling module 122 and the second connecting members 124a and 124b are disposed in a 120 case. The second connecting members 124 a and 124 b are connected to the liquid cooling module 122 and are exposed from the casing 120. In this embodiment, the electronic device 12 further includes a second liquid cooling system 126. The second liquid cooling system 126 may include a pump 1260, at least one radiator 1262, at least one fan 1264, and a liquid cooling module 122. The liquid cooling module 122, the second connecting members 124a, 124b, the pump 1260, and heat dissipation The fans 1262 are connected to each other via a pipe 1266, and the fan 1264 is provided on one side of the radiator 1262.

In this embodiment, one of the first connecting member 104a and the second connecting member 124a may be a male quick connector, and the other of the first connecting member 104a and the second connecting member 124a may be a female quick connector. In other words, in the present invention, the first connecting member 104a and the second connecting member 124a can be designed as a male and female quick connector that cooperate with each other, so that the first connecting member 104a and the second connecting member 124a can be quickly and conveniently connected to each other or Separation. In practical applications, the first liquid cooling system 102, the liquid cooling module 122, and the second liquid cooling system 126 contain a cooling liquid (for example, water or other liquid). Therefore, in some embodiments, it is used to implement the first The quick joint of one connecting piece 104a and the second connecting piece 124a may have a quick connection or quick release structure, and has a structure that prevents the cooling liquid from leaking out when the first connecting piece 104a and the second connecting piece 124a are engaged or disassembled. In other embodiments, the first connecting member 104a and the second connecting member 124a may also be designed by screwing. It should be noted that the structural design of the first connecting member 104b and the second connecting member 124b is substantially the same as the structural design of the first connecting member 104a and the second connecting member 124a, and details are not described herein again.

Generally speaking, the liquid-cooling module 122 of the electronic device 12 is attached to an electronic component (not shown) inside the electronic device 12 to absorb heat generated during the operation of the electronic component. When the electronic device 12 is not yet disposed on the heat sink 10, that is, the first connecting members 104a, 104b and the second connecting members 124a, 124b have not been connected to each other, the electronic device 12 is liquid cooled by the second liquid cooling system 126. The module 122 performs heat dissipation.

When the electronic device 12 suffers from insufficient heat dissipation of the second liquid cooling system 126 due to long-term use, the user can set the electronic device 12 on the heat sink 10, and connect the first connecting members 104a, 104b and the second connecting member. 124a and 124b are connected to each other, so that the first liquid cooling system 102 of the heat sink 10 and the liquid cooling module 122 of the electronic device 12 form a liquid cooling circulation path through the first connections 104a, 104b and the second connections 124a, 124b. At this time, the first liquid cooling system 102 of the heat sink 10 can perform auxiliary heat radiation to the liquid cooling module 122 of the electronic device 12 to improve the heat radiation efficiency of the electronic device 12. When the electronic device 12 is not required to be radiated by using the heat sink 10, the user only needs to separate the first connecting members 104 a and 104 b from the second connecting members 124 a and 124 b. Since the first connecting members 104a, 104b and the second connecting members 124a, 124b have a structure to prevent the leakage of the cooling liquid, when the first connecting members 104a, 104b and the second connecting members 124a, 124b are separated from each other, the first connection The pieces 104a, 104b and the second connecting pieces 124a, 124b can prevent the cooling liquid in the liquid cooling circulation path formed by the first liquid cooling system 102 and the liquid cooling module 122 from leaking out.

In this embodiment, when the first connecting members 104 a and 104 b and the second connecting members 124 a and 124 b are separated from each other, the electronic device 12 performs liquid-cooling and heat-radiation on the liquid-cooling module 122 through the second liquid-cooling system 126. However, when the first connecting members 104a, 104b and the second connecting members 124a, 124b are connected to each other, the present invention can detect the first connecting members 104a, 104b and the second connecting member through mechanical and / or electronic design. 124a, 124b are connected to each other, and the pump 1020 controlling the first liquid cooling system 102 is turned on, and the pump 1260 controlling the second liquid cooling system 126 is turned off, so that the first liquid cooling system 102 performs liquid cooling on the liquid cooling module 122 The heat is cooled, and the second liquid cooling system 126 stops the liquid cooling of the liquid cooling module 122. It should be noted that when the first connecting members 104a, 104b and the second connecting members 124a, 124b are connected to each other, the present invention can also control the pump 1020 of the first liquid cooling system 102 and the pump of the second liquid cooling system 126 1260 is turned on at the same time, so that the first liquid cooling system 102 and the second liquid cooling system 126 perform liquid cooling and heat dissipation on the liquid cooling module 122 at the same time.

Please refer to FIG. 5, which is an exploded view of an electronic device 12 ′ according to another embodiment of the present invention. The main difference between the electronic device 12 ′ and the above-mentioned electronic device 12 is that the electronic device 12 ′ further includes a heat dissipation module 128, and the heat dissipation module 128 replaces the pump 1260 of the second liquid cooling system 126, heat dissipation器 1262 and fan 1264. As shown in FIG. 5, the heat dissipation module 128 is disposed in the housing 120, and the liquid cooling module 122 is disposed on the heat dissipation module 128. In this embodiment, the heat dissipation module 128 may include a heat conducting plate 1280, at least one heat pipe 1282, at least one heat dissipation fin combination 1284, and at least one fan 1286. The liquid cooling module 122 may be disposed on the heat conducting plate 1280. The two ends of the heat pipe 1282 are respectively connected to the heat conducting plate 1280 and the heat dissipation fin combination 1284, and the fan 1286 is arranged on one side of the heat dissipation fin combination 1284. Thereby, the heat absorbed by the liquid-cooling module 122 can be conducted to the heat-dissipating fin combination 1284 through the heat-conducting plate 1280 and the heat pipe 1282, and then the fan 1286 generates airflow to take the heat away. It should be noted that the elements with the same reference numerals as shown in FIG. 5 and FIG. 4 have roughly the same working principles, and will not be repeated here.

Please refer to FIGS. 6 to 10. FIG. 6 is a schematic diagram of the electronic system 3 according to another embodiment of the present invention. FIG. 7 is an exploded view of the electronic system 3 in FIG. 6. An exploded view of the heat sink 30 in the figure, FIG. 9 is an exploded view of the heat sink 30 in FIG. 6 from another perspective, and FIG. 10 is an exploded view of the electronic device 32 in FIG. 6. As shown in FIGS. 6 and 7, the electronic system 3 includes a heat sink 30 and an electronic device 32. In practical applications, the electronic device 32 may be an All-in-One (AIO) computer, a notebook computer, a projector, or a light source device.

As shown in FIGS. 7 to 9, the heat sink 30 includes a base 300, a first liquid cooling system 302, a support frame 306, and at least one elastic member 308. The first liquid cooling system 302, the supporting frame 306 and the elastic member 308 are disposed in the base 300. The first liquid cooling system 302 includes a first liquid cooling module 304. The first liquid cooling module 304 is exposed from the base 300. The first liquid cooling module 304 is movably disposed in the support frame 306. Two ends of the elastic member 308 are respectively connected to the first liquid cooling module 304 and the supporting frame 306. The supporting frame 306 has a limiting portion 3060, wherein the limiting portion 3060 restricts the first liquid cooling module 304 from being separated from the supporting frame 306. In practical applications, the first liquid-cooling module 304 may be a temperature equalizing plate, a liquid-cooling head, or other cavity capable of containing a cooling liquid, and the elastic member 308 may be a spring or other elastic body. In this embodiment, the first liquid cooling module 304 may be made of copper, but is not limited thereto. In this embodiment, the first liquid cooling system 302 may further include a pump 3020, a radiator 3022, and a fan 3024. The pump 3020, the radiator 3022, and the first liquid cooling module 304 are connected through the pipeline 3026. The fans 3024 are connected to each other, and the fan 3024 is disposed on one side of the radiator 3022. In practical applications, the first liquid cooling system 302 and the first liquid cooling module 304 contain a cooling liquid (for example, water or other liquids).

As shown in FIGS. 7 and 10, the electronic device 32 includes a casing 320 and a second liquid cooling system 322. The second liquid cooling system 322 is disposed in the housing 320 and includes a second liquid cooling module 324. The second liquid cooling module 324 is exposed from the casing 320. In practical applications, the second liquid-cooling module 324 may be a temperature equalizing plate, a liquid-cooling head, or other cavity capable of containing a cooling liquid. In this embodiment, the second liquid cooling module 324 may be made of copper, but is not limited thereto. In this embodiment, the second liquid cooling system 322 may further include a pump 3220, at least one radiator 3222, and at least one fan 3224. The pump 3220, the radiator 3222, and the second liquid cooling module 324 are connected through a pipe. The circuits 3226 are connected to each other, and the fan 3224 is disposed on one side of the radiator 3222. In practical applications, the second liquid cooling system 322 and the second liquid cooling module 324 contain a cooling liquid (for example, water or other liquid).

Generally, the second liquid-cooling module 324 of the electronic device 32 is attached to an electronic component (not shown) inside the electronic device 32 to absorb heat generated during the operation of the electronic component. Then, the second liquid cooling module 324 is radiated by the second liquid cooling system 322. When the second liquid cooling system 322 cannot remove the heat generated by the electronic components of the electronic device 32 in a timely manner, the user may set the electronic device 32 on the heat sink 30 so that the first liquid cooling module 304 of the heat sink 30 and The second liquid cooling modules 322 of the electronic device 32 are in contact with each other. At this time, the heat generated by the electronic components of the electronic device 32 will be conducted to the first liquid cooling module 304 of the heat sink 30 through the second liquid cooling module 322, and then the first liquid cooling system 302 of the heat sink 30 will The first liquid cooling module 304 performs heat dissipation to improve the heat dissipation efficiency of the electronic device 32.

As shown in FIG. 9, the first liquid cooling module 304 is clamped between the limiting portion 3060 of the support frame 306 and the elastic member 308. When the electronic device 32 is disposed on the heat sink 30, the second liquid cooling module 322 of the electronic device 32 presses down the first liquid cooling module 304 of the heat sink 30. At this time, the elastic member 308 will generate elastic force to push the first liquid cooling module 304 upward, thereby ensuring that the second liquid cooling module 322 of the electronic device 32 can be flatly attached to the first liquid cooling module 304 of the heat sink 30.

Please refer to FIGS. 11 to 15. FIG. 11 is a schematic diagram of the electronic system 5 according to another embodiment of the present invention. FIG. 12 is an exploded view of the electronic system 5 in FIG. 11. An exploded view of the electronic system 5 in the figure from another perspective, FIG. 14 is an exploded view of the heat sink 50 in FIG. 11, and FIG. 15 is an exploded view of the electronic device 52 in FIG. 11. As shown in FIGS. 11 to 13, the electronic system 5 includes a heat sink 50 and an electronic device 52. In practical applications, the electronic device 52 may be a notebook computer or other electronic devices.

As shown in FIGS. 12 and 14, the heat sink 50 includes a body 500 and a first liquid cooling system 502. In this embodiment, the first liquid cooling system 502 may include a first liquid cooling module 504, a pump 5020, a radiator 5022, and a fan 5024. The pump 5020, the radiator 5022, and the first liquid cooling The modules 504 are connected to each other via a pipeline 5026, and the fan 5024 is disposed on one side of the radiator 5022. It should be noted that the structural design and function principle of the pump 5020, the radiator 5022, and the first liquid cooling module 504 are the same as the structural design and function of the pump 3020, the radiator 3022, and the first liquid cooling module 304 described above. The principle is about the same, so I won't repeat it here.

As shown in FIGS. 13 and 15, the electronic device 52 includes a casing 520 and a second liquid cooling system 522. In this embodiment, the second liquid cooling system 522 may include a second liquid cooling module 524, a pump 5220, at least one radiator 5222, and at least one fan 5224. The pump 5220, the radiator 5222, and the second The liquid cooling module 524 is connected to each other via a pipe 5226, and the fan 5224 is disposed on one side of the radiator 5222. It should be noted that the structural design and function principle of the pump 5220, the radiator 5222 and the second liquid cooling module 524 are the same as the structural design and function of the pump 3220, the radiator 3222 and the second liquid cooling module 324 described above The principle is about the same, so I won't repeat it here.

Generally speaking, the second liquid-cooling module 524 of the electronic device 52 is attached to an electronic component (not shown) inside the electronic device 52 to absorb heat generated during the operation of the electronic component. Next, the second liquid cooling module 524 is radiated by the second liquid cooling system 522. When the second liquid cooling system 522 cannot remove the heat generated by the electronic components of the electronic device 52 in time, the user can set the electronic device 52 on the heat dissipation base 50 so that the first liquid cooling module 504 of the heat dissipation base 50 and The second liquid cooling modules 522 of the electronic device 52 are in contact with each other. At this time, the heat generated by the electronic components of the electronic device 52 will be conducted to the first liquid cooling module 504 of the heat sink 50 through the second liquid cooling module 522, and then the first liquid cooling system 502 of the heat sink 50 will The first liquid-cooling module 504 performs heat dissipation to improve the heat dissipation efficiency of the electronic device 52.

In summary, in one embodiment, the heat sink and the electronic device have first and second connectors that can be connected to each other, wherein the first connector is connected to the first liquid cooling system in the heat sink, and The second connecting member is connected to the liquid cooling module in the electronic device. When the electronic device suffers from insufficient heat dissipation due to long-term use, the user can connect the first connection member and the second connection member to each other, so that the first liquid cooling system and the liquid cooling module pass through the first connection member and the second The connection piece forms a liquid-cooled circulation path. At this time, the first liquid cooling system of the heat sink can perform auxiliary heat dissipation for the electronic device. In another embodiment, the heat sink can have a first liquid cooling system, and the electronic device can have a second liquid cooling system. When the second liquid cooling system cannot remove the heat generated by the electronic device in time, the user can set the electronic device on the heat sink to make the first liquid cooling module and the second liquid cooling module contact each other. At this time, the heat generated by the electronic device is conducted to the first liquid cooling module through the second liquid cooling module, and the first liquid cooling system of the heat sink is used for auxiliary heat dissipation. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

1, 3, 5‧‧‧ electronic systems
10, 30, 50‧‧‧ Radiator
12, 12 ', 32, 52‧‧‧ electronic devices
100, 300, 500‧‧‧ seat
102, 302, 502‧‧‧ first liquid cooling system
104a, 104b‧‧‧First connector
120, 320, 520‧‧‧ shell
122‧‧‧Liquid cooling module
124a, 124b‧‧‧Second connection
126, 322, 522‧‧‧‧Second liquid cooling system
128‧‧‧ Thermal Module
304, 504‧‧‧‧The first liquid cooling module
306‧‧‧Support
308‧‧‧Elastic piece
324, 524‧‧‧Second liquid cooling module
1020, 1260, 3020, 3220, 5020, 5220‧‧‧pump
1022, 1262, 3022, 3222, 5022, 5222‧‧‧ radiators
1024, 1264, 1286, 3024, 3224, 5024, 5224‧‧‧ fans
1026, 1266, 3026, 3226, 5026, 5226‧‧‧
1280‧‧‧ heat transfer plate
1282‧‧‧heat pipe
1284‧‧‧Cooling Fin Combination
3060‧‧‧Limiting Department

FIG. 1 is a schematic diagram of an electronic system according to an embodiment of the present invention. Figure 2 is an exploded view of the electronic system in Figure 1. Figure 3 is an exploded view of the heat sink in Figure 1. FIG. 4 is an exploded view of the electronic device in FIG. 1. FIG. 5 is an exploded view of an electronic device according to another embodiment of the present invention. FIG. 6 is a schematic diagram of an electronic system according to another embodiment of the present invention. Figure 7 is an exploded view of the electronic system in Figure 6. Figure 8 is an exploded view of the heat sink in Figure 6. FIG. 9 is an exploded view of the heat sink in FIG. 6 from another perspective. FIG. 10 is an exploded view of the electronic device in FIG. 6. FIG. 11 is a schematic diagram of an electronic system according to another embodiment of the present invention. Figure 12 is an exploded view of the electronic system in Figure 11. Figure 13 is an exploded view of the electronic system in Figure 11 from another perspective. Figure 14 is an exploded view of the heat sink in Figure 11. FIG. 15 is an exploded view of the electronic device in FIG. 11.

1‧‧‧ electronic system

10‧‧‧ Radiator

12‧‧‧ electronic device

100‧‧‧ seat

104a, 104b‧‧‧First connector

120‧‧‧shell

124a, 124b‧‧‧Second connection

Claims (16)

An electronic system includes: a heat sink, including a body, a first liquid cooling system, and at least a first connection member, the first liquid cooling system and the first connection member are disposed in the seat body, the first The connecting member is connected to the first liquid cooling system and is exposed from the seat; and an electronic device including a casing, a liquid cooling module and at least one second connecting member, the liquid cooling module is connected to the second Parts are disposed in the housing, the second connecting piece is connected to the liquid cooling module and is exposed from the housing; wherein when the first connecting piece and the second connecting piece are connected to each other, the first liquid cooling The system and the liquid cooling module form a liquid cooling circulation path through the first connection member and the second connection member. The electronic system according to claim 1, wherein one of the first connecting member and the second connecting member is a male quick connector, and the other of the first connecting member and the second connecting member is a female quick connector. Connector. The electronic system according to claim 1, wherein when the first connecting member and the second connecting member are separated from each other, the first connecting member and the second connecting member can prevent a cooling liquid in the liquid cooling circulation path Leaked. The electronic system according to claim 1, wherein the first liquid cooling system includes a pump, a radiator, and a fan. The electronic system according to claim 1, wherein the electronic device further includes a second liquid cooling system, the second liquid cooling system is disposed in the casing and includes a pump, at least one radiator, at least one fan, and The liquid cooling module. The electronic system according to claim 5, wherein when the first connection member and the second connection member are separated from each other, the second liquid cooling system performs liquid cooling and heat dissipation of the liquid cooling module; when the first connection member When interconnected with the second connector, the first liquid cooling system performs liquid cooling and heat radiation on the liquid cooling module, and the second liquid cooling system stops liquid cooling and heat radiation on the liquid cooling module. The electronic system according to claim 5, wherein when the first connection member and the second connection member are separated from each other, the second liquid cooling system performs liquid cooling and heat dissipation of the liquid cooling module; when the first connection member When interconnected with the second connecting member, the first liquid cooling system and the second liquid cooling system perform liquid cooling and heat dissipation of the liquid cooling module at the same time. The electronic system according to claim 1, wherein the electronic device further includes a heat dissipation module, the heat dissipation module is disposed in the housing, and the liquid cooling module is disposed on the heat dissipation module. The electronic system according to claim 8, wherein the heat dissipation module comprises a heat conducting plate, at least one heat pipe, at least one heat dissipation fin combination, and at least one fan. The electronic system according to claim 1, wherein the electronic device is an integrated computer, a notebook computer, a projector, or a light source device. An electronic system includes: a heat sink including a body and a first liquid cooling system, the first liquid cooling system is disposed in the base and includes a first liquid cooling module, the first liquid cooling module Exposed from the seat; and an electronic device including a casing and a second liquid cooling system, the second liquid cooling system is disposed in the casing and includes a second liquid cooling module, the second liquid cooling The module is exposed from the housing; wherein, when the electronic device is disposed on the heat sink, the first liquid cooling module and the second liquid cooling module are in contact with each other. The electronic system according to claim 11, wherein the first liquid cooling system further comprises a pump, a radiator and a fan. The electronic system according to claim 11, wherein the second liquid cooling system further comprises a pump, at least one radiator and at least one fan. The electronic system according to claim 11, wherein the first liquid cooling module and the second liquid cooling module are made of copper. The electronic system according to claim 11, wherein the heat sink further includes a support frame and at least one elastic member, the support frame and the at least one elastic member are disposed in the base body, and the support frame has a limiting portion, The first liquid cooling module is movably disposed in the support frame, and two ends of the at least one elastic member are respectively connected to the first liquid cooling module and the support frame, and the limiting portion restricts the first liquid cooling The module is detached from the support frame. The electronic system according to claim 11, wherein the electronic device is an integrated computer, a notebook computer, a projector, or a light source device.